保温时间对钙钡硼硅复相陶瓷性能的影响

通过对钙钡硼硅玻璃与氧化铝的混合物进行烧结,制备了可用于低温共烧陶瓷基板的硼硅酸盐玻璃/α-Al2O3系复相陶瓷。研究了保温时间对所制复相陶瓷的微观结构、烧结性能和介电性能的影响。结果表明:随着保温时间的延长,所制复相陶瓷的体积密度、吸水率和介电常数先增大后减小,而介质损耗则是先减小后增大。于850℃烧结、保温20 min制得的复相陶瓷的性能最佳,其体积密度为3.12 g.cm–3,吸水率为0.11%,10 MHz下的相对介电常数和介质损耗分别为7.88和1.0×10–3。     

共蒸发方法制备GaSb多晶薄膜

We report optical and electrical properties of polycrystalline GaSb thin films which were successfully grown by co-evaporation on soda-lime glass substrates. The thin films have preferential orientation of the （111） direction. SEM results indicate that the average grain size of GaSb thin film is 500 nm with the substrate temperature of 560 ℃. The average reflectance of GaSb thin film is about 30% and the absorption coefficient is of the order of 10^4 cm^-1. The optical bandgap of GaSb thin film is 0.726 eV. The hole concentration shows a clear increasing trend as the Ga-evaporation-temperature/Sb-evaporation-temperature （TGa/Tsb） ratio increases. When the Ga crucible temperature is 810 ℃ and the antinomy crucible temperature is 415 ℃, the hole concentration of polycrystalline GaSb is 2 × 10^17 cm^-3 and the hole mobility is 130 cm^2/（V·s）. These results suggest that polycrystalline GaSb thin film is a good candidate for the use as a cheap material in TPV cells.