HgCdTe focal plane arrays for dual-color mid- and long-wavelength infrared detection

Raytheon Vision Systems (RVS, Goleta, CA) in collaboration with HRL Laboratories (Malibu, CA) is contributing to the maturation and manufacturing readiness of third-generation, dual-color, HgCdTe infrared staring focal plane arrays (FPAs). This paper will highlight data from the routine growth and fabrication of 256×256 30-μm unit-cell staring FPAs that provide dual-color detection in the mid-wavelength infrared (MWIR) and long wavelength infrared (LWIR) spectral regions. The FPAs configured for MWIR/MWIR, MWIR/LWIR, and LWIR/LWIR detection are used for target identification, signature recognition, and clutter rejection in a wide variety of space and ground-based applications. Optimized triple-layer heterojunction (TLHJ) device designs and molecular beam epitaxy (MBE) growth using in-situ controls has contributed to individual bands in all dual-color FPA configurations exhibiting high operability (>99%) and both performance and FPA functionality comparable to state-of-the-art, single-color technology. The measured spectral cross talk from out-of-band radiation for either band is also typically less than 10%. An FPA architecture based on a single-mesa, single-indium bump, and sequential-mode operation leverages current single-color processes in production while also providing compatibility with existing second-generation technologies.     

High-Performance M/LWIR Dual-Band HgCdTe/Si Focal-Plane Arrays

Mercury cadmium telluride (HgCdTe) grown on large-area silicon (Si) substrates allows for larger array formats and potentially reduced focal-plane array (FPA) cost compared with smaller, more expensive cadmium zinc telluride (CdZnTe) substrates. In this work, the use of HgCdTe/Si for mid- wavelength/long-wavelength infrared (M/LWIR) dual-band FPAs is evaluated for tactical applications. A number of M/LWIR dual-band HgCdTe triple-layer n-P-n heterojunction device structures were grown by molecular-beam epitaxy (MBE) on 100-mm (211)Si substrates. Wafers exhibited low macrodefect densities (< 300 cm^?2). Die from these wafers were mated to dual-band readout integrated circuits to produce FPAs. The measured 81-K cutoff wavelengths were 5.1 μm for band 1 (MWIR) and 9.6 μm for band 2 (LWIR). The FPAs exhibited high pixel operability in each band with noise-equivalent differential temperature operability of 99.98% for the MWIR band and 98.7% for the LWIR band at 81 K. The results from this series are compared with M/LWIR FPAs from 2009 to address possible methods for improvement. Results obtained in this work suggest that MBE growth defects and dislocations present in devices are not the limiting factor for detector operability, with regards to infrared detection for tactical applications.     

Long wavelength infrared, molecular beam epitaxy, HgCdTe-on-Si diode performance

In the past several years, we have made significant progress in the growth of CdTe buffer layers on Si wafers using molecular beam epitaxy (MBE) as well as the growth of HgCdTe onto this substrate as an alternative to the growth of HgCdTe on bulk CdZnTe wafers. These developments have focused primarily on mid-wavelength infrared (MWIR) HgCdTe and have led to successful demonstrations of high-performance 1024×1024 focal plane arrays (FPAs) using Rockwell Scientific’s double-layer planar heterostructure (DLPH) architecture. We are currently attempting to extend the HgCdTe-on-Si technology to the long wavelength infrared (LWIR) and very long wavelength infrared (VLWIR) regimes. This is made difficult because the large lattice-parameter mismatch between Si and CdTe/HgCdTe results in a high density of threading dislocations (typically, >5E6 cm⁻²), and these dislocations act as conductive pathways for tunneling currents that reduce the R_oA and increase the dark current of the diodes. To assess the current state of the LWIR art, we fabricated a set of test diodes from LWIR HgCdTe grown on Si. Silicon wafers with either CdTe or CdSeTe buffer layers were used. Test results at both 78 K and 40 K are presented and discussed in terms of threading dislocation density. Diode characteristics are compared with LWIR HgCdTe grown on bulk CdZnTe.     

中波红外与长波红外推扫成像性能分析

基于长线阵中波红外和长波红外探测器的推扫成像技术,是实现高空间分辨率和高温度分辨率卫星对地观测的技术途径之一。随着长线阵红外探测器的发展,该技术受到高度关注,并已在一些领域得到应用。介绍了中波红外和长波红外谱段成像特点以及基于长线阵中波红外和长波红外探测器的卫星推扫成像技术发展现状。重点根据中波红外和长波红外谱段的波长、温度为300 K 目标的辐射强度以及光学系统和探测器参数,分析了它们的成像性能,包括调制传递函数(MTF)、地面像元分辨率(GSD)和噪声等效温差(NETD)。对于常温目标,在积分时间足够长的情况下,保持相同的MTF,中波红外比长波红外推扫成像可实现更高的空间分辨率和温度分辨率。结合分析结果,对充分发挥这两个谱段的成像性能提出了建议。     

As注入长波碲镉汞红外探测器工艺研究

p-on-n结构的碲镉汞红外探测器具有长的少子寿命、低暗电流、高R0A值等优点,是高温器件、长波甚长波器件发展的重要器件结构.而国内还鲜有砷注入掺杂p-on-n长波HgCdTe探测器的相关报道,为了满足军事、航天等领域对高性能长波探测器迫切的应用需求,针对As离子注入的长波p-on-n碲镉汞红外探测器退火工艺技术进行研...     

HgCdTe/Si materials for long wavelength infrared detectors

The heteroepitaxial growth of HgCdTe on large-area Si substrates is an enabling technology leading to the production of low-cost, large-format infrared focal plane arrays (FPAs). This approach will allow HgCdTe FPA technology to be scaled beyond the limitations of bulk CdZnTe substrates. We have already achieved excellent mid-wavelength infrared (MWIR) and short wavelength infrared (SWIR) detector and FPA results using HgCdTe grown on 4-in. Si substrates using molecular beam epitaxy (MBE), and this work was focused on extending these results into the long wavelength infrared (LWIR) spectral regime. A series of nine p-on-n LWIR HgCdTe double-layer heterojunction (DLHJ) detector structures were grown on 4-in. Si substrates. The HgCdTe composition uniformity was very good over the entire 4-in. wafer with a typical maximum nonuniformity of 2.2% at the very edge of the wafer; run-to-run composition reproducibility, realized with real-time feedback control using spectroscopic ellipsometry, was also very good. Both secondary ion mass spectrometry (SIMS) and Hall-effect measurements showed well-behaved doping and majority carrier properties, respectively. Preliminary detector results were promising for this initial work and good broad-band spectral response was demonstrated; 61% quantum efficiency was measured, which is very good compared to a maximum allowed value of 70% for a non-antireflection-coated Si surface. The R₀A products for HgCdTe/Si detectors in the 9.6-μm and 12-μm cutoff range were at least one order of magnitude below typical results for detectors fabricated on bulk CdZnTe substrates. This lower performance was attributed to an elevated dislocation density, which is in the mid-10⁶ cm⁻² range. The dislocation density in HgCdTe/Si needs to be reduced to <10⁶ cm⁻² to make high-performance LWIR detectors, and multiple approaches are being tried across the infrared community to achieve this result because the technological payoff is significant.     

Quantum Dot Based Infrared Focal Plane Arrays

In the past decade, there has been active research on infrared detectors based on intersubband transitions in self-assembled quantum dots (QDs). In the past two years, at least four research groups have independently demonstrated focal plane arrays based on this technology. In this paper, the progress from the first raster scanned image obtained with a QD detector to the demonstration of a 640 512 imager based on self-assembled QDs is reviewed. In particular, emphasis will be placed on a novel quantum dots-in-a-well (DWELL) design, which represents a hybrid between a conventional quantum-well infrared photodetector (QWIP) and a quantum-dot infrared photodetector (QDIP). In the DWELL detectors, the active region consists of InAs quantum dots embedded in an InGaAs quantum well. Like QDIPs, the DWELL detectors have 3-D confinement and display normal incidence operation while demonstrating reproducible ldquodial-in recipesrdquo for control over the operating wavelength, like QWIPs. Moreover, the DWELL detectors also have demonstrated bias-tunability and multicolor operation in the midwave infrared (MWIR, 3-5 ), long-wave infrared (LWIR, 8-12 ), and very long wave infrared (VLWIR, ) regimes. Recently midformat 320 256 and 640 512 focal plane arrays (FPAs) with an NETD of 40 mK at have been reported. The paper will conclude with a perspective on the future directions on the research on QDIP FPA including enhanced functionality and higher operating temperatures.     

Status of LWIR HgCdTe-on-Silicon FPA Technology

The use of silicon as an alternative substrate to bulk CdZnTe for epitaxial growth of HgCdTe for infrared detector applications is attractive because of potential cost savings as a result of the large available sizes and the relatively low cost of silicon substrates. However, the potential benefits of silicon as a substrate have been difficult to realize because of the technical challenges of growing low-defect-density HgCdTe on silicon where the lattice mismatch is ∼19%. This is especially true for long-wavelength infrared (LWIR) HgCdTe detectors where the performance can be limited by the high (∼5 × 10⁶ cm⁻²) dislocation density typically found in HgCdTe grown on silicon. The current status of LWIR (9 μm to 11 μm at 78 K) HgCdTe on silicon focal-plane arrays (FPAs) is reviewed. Recent progress is covered including improvements in noise equivalent differential temperature (NEDT) and array operability. NEDT of <25 mK and NEDT operability >99% are highlighted for 640 × 480 pixel, 20-μm-pitch FPAs.     

中波和长波红外双波段消热差光学系统设计

为了有效提高目标的红外探测与识别能力,设计了能同时对高温和常温目标成像的中波和长波红外双波段消热差光学系统。所设计的光学系统采用柯克型结构,视场、有效焦距和相对孔径分别为5.5°×4.4°、100 mm和F/2,工作波段覆盖中波红外(波长3～5μm)和长波红外(8～12μm)。通过采用光学被动消热差方法,优化设计的镜头可工作于-60～80℃的环境温度,奈奎斯特频率处的调制传递函数(MTF)值变化小于0.05。该镜头使用Ge、ZnSe和ZnS 3种红外材料,具有后工作距大、100%冷光阑效率等特点。     

LWIR HgCdTe Detectors Grown on Ge Substrates

Long-wavelength infrared (LWIR) HgCdTe p-on-n double-layer heterojunctions (DLHJs) for infrared detector applications have been grown on 100 mm Ge (112) substrates by molecular beam epitaxy (MBE). The objective of this current work was to grow our baseline p-on-n DLHJ detector structure (used earlier on Si substrates) on 100 mm Ge substrates in the 10 μm to 11 μm LWIR spectral region, evaluate the material properties, and obtain some preliminary detector performance data. Material characterization techniques included are X-ray rocking curves, etch pit density (EPD) measurements, compositional uniformity determined from Fourier-transform infrared (FTIR) transmission, and doping concentrations determined from secondary-ion mass spectroscopy (SIMS). Detector properties include resistance-area product (RoA), spectral response, and quantum efficiency. Results of LWIR HgCdTe detectors and test structure arrays (TSA) fabricated on both Ge and silicon (Si) substrates are presented and compared. Material properties demonstrated include X-ray full-width of half-maximum (FWHM) as low as 77 arcsec, typical etch pit densities in mid 10⁶ cm⁻² and wavelength cutoff maximum/minimum variation <2% across the full wafer. Detector characteristics were found to be nearly identical for HgCdTe grown on either Ge or Si substrates.     

Recent developments of high-complexity HgCdTe focal plane arrays at leti infrared laboratory

In this article, we present recent developments of the research in France at LETI infrared laboratory in the field of complex third-generation HgCdTe IRCMOS focal plane arrays (FPAs). We illustrate this with three prototypes of FPAs made at LETI, which have involved some technological improvements from the standard process today in production at Sofradir. We present, using molecular-beam epitaxy (MBE) growth, a 128 × 128 dual-band infrared (photodetector)-complementary metal oxide semiconductor (IRCMOS) with a pitch of 50 μm operating within 2–5 μm. Using the more conventional liquid-phase epitaxy (LPE) growth, we show a new generation of high-performance long linear arrays (1500 × 2; pitch, 30 μm) operating in medium-wavelength infrared (MWIR) or long-wavelength infrared (LWIR) bands based on a modular architecture of butted HgCdTe detection circuit and SiCMOS multiplexers. Finally, we present for the first time a megapixel (1000 × 1000) FPA with a pitch of 15 μm operating in the MWIR band that exhibits a very high performance and pixel operability.     

Physical structure of molecular-beam epitaxy growth defects in HgCdTe and their impact on two-color detector performance

The flexible nature of molecular-beam epitaxy (MBE) growth is beneficial for HgCdTe infrared-detector design and allows for tailored growths at lower costs and larger focal-plane array (FPA) formats. Control of growth dynamics gives the MBE process a distinct advantage in the production of multicolor devices, although opportunities for device improvement still exist. Growth defects can inhibit pixel performance and reduce the operability in FPAs, so it is important to understand and evaluate their properties and impact on detector performance. The object of this paper is to understand and correlate the effects of macrodefects on two-color detector performance. We observed the location of single-crystal and polycrystalline regions on planar and cross-sectioned surfaces of two-color device structures when void defects were viewed by scanning electron microscopy (SEM). Compositional analysis via energy dispersive x-ray analysis (EDXA) of voids in the cross section showed elevated Te and reduced Hg when compared to defect-free growth areas. The second portion of this study examined the correlation of macrodefects with pixel operability and diode current-voltage (I–V) characteristics in mid-wavelength infrared (MWIR)/MWIR (M/M) and long wavelength infrared (LWIR)/LWIR (L/L) two-color devices. The probability of diode failure when a void is present is 98% for M/M and 100% for L/L. Voids in two-color detectors also impact diodes neighboring their location; the impact is higher for L/L detectors than M/M detectors. All void-containing diodes showed early breakdown in the I–V characteristics in one or both bands. High dislocation densities were observed surrounding voids; the high density spread further from the void for L/L detectors compared to M/M detectors.     

Improvements of MCT MBE Growth on GaAs

In recent years, continuous progress has been published in the development of HgCdTe (MCT) infrared (IR) focal plane arrays (FPAs) fabricated by molecular beam epitaxy on GaAs substrates. In this publication, further characterization of the state-of-the art 1280 × 1024 pixel, 15-μm pitch detector fabricated from this material in both the mid-wavelength (MWIR) and long-wavelength (LWIR) IR region will be presented. For MWIR FPAs, the percentage of defective pixel remains below 0.5% up to an operating temperature (T _OP) of around 100 K. For the LWIR FPA, an operability of 99.25% was achieved for a T _OP of 76 K. Additionally, the beneficial effect of the inclusion of MCT layers with a graded composition region was investigated and demonstrated on current–voltage (IV) characteristics on test diodes in a MWIR FPA.     

Molecular beam epitaxy growth of HgCdTe on Ge for third-generation infrared detectors

The Leti-Lir has studied II–VI compounds for infrared (IR) detection for more than 20 years. The need to reduce the production cost of IR focal plane arrays (FPAs) sparked the development of heteroepitaxy on large-area substrates. Germanium has been chosen as the heterosubstrate for the third generation of IR detectors. First, we report on the progress achieved in HgCdTe growth on 3-in. and 4-in. (211)B CdTe/Ge. Then, we discuss the choice of a new machine for larger size and better homogeneity. Finally, we present the latest results on third-generation IR multicolor and megapixel devices. First-time results regarding a middle wavelength infrared (MWIR) dual-band FPA, with a reduced pitch of 25 μm, and a MWIR 1,280×1,024 FPA will be shown. Both detectors are based on molecular beam epitaxy (MBE)-grown HgCdTe on Ge. The results shown validate the choice of Ge as the substrate for third-generation detectors.     

High-Performance MWIR/LWIR Dual-Band 640 × 480 HgCdTe/Si FPAs

HgCdTe grown on large-area Si substrates allows for larger array formats and potentially reduced focal-plane array (FPA) cost compared with smaller, more expensive CdZnTe substrates. The goal of this work is to evaluate the use of HgCdTe/Si for mid-wavelength/long-wavelength infrared (MWIR/LWIR) dual-band FPAs. A series of MWIR/LWIR dual-band HgCdTe triple-layer n-P-n heterojunction (TLHJ) device structures were grown by molecular-beam epitaxy (MBE) on 100-mm (211)Si substrates. The wafers showed low macrodefect density (<300 cm⁻²) and was processed into 20-μm-unit-cell 640 × 480 detector arrays which were mated to dual-band readout integrated circuits (ROICs) to produce FPAs. The measured 80-K cutoff wavelengths were 5.5 μm for MWIR and 9.4 μm for LWIR, respectively. The FPAs exhibited high pixel operabilities in each band, with noise equivalent differential temperature (NEDT) operabilities of 99.98% for the MWIR band and 99.6% for the LWIR band demonstrated at 84 K.     

1/f Noise in HgCdTe Focal-Plane Arrays

Characterization of mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) HgCdTe focal-plane arrays (FPAs) indicates that limitations on operability at elevated temperatures are due to detector dark current and excess 1/f noise. Dark-current models in HgCdTe are well established and understood; however, the same cannot be said for 1/f noise. In this paper we propose two models for separate sources of 1/f noise in HgCdTe photodiodes based upon charge fluctuations out of McWhorter-like surface traps. The two 1/f noise components are designated as (1) systemic, being associated with passivated external surfaces of the diodes, and (2) isolated defect, being, it is proposed, associated with the internal surfaces of built-in physical defects such as dislocations. The models are utilized to explain data measured on LWIR and MWIR test-diode structures, and predictions are made regarding the performance of MWIR and LWIR FPAs at elevated temperatures.     

Molecular beam epitaxy grown long wavelength infrared HgCdTe on Si detector performance

The use of silicon as a substrate alternative to bulk CdZnTe for epitaxial growth of HgCdTe for infrared (IR) detector applications is attractive because of potential cost savings as a result of the large available sizes and the relatively low cost of silicon substrates. However, the potential benefits of silicon as a substrate have been difficult to realize because of the technical challenges of growing low defect density HgCdTe on silicon where the lattice mismatch is ∼19%. This is especially true for LWIR HgCdTe detectors where the performance can be limited by the high (∼5×10⁶ cm⁻²) dislocation density typically found in HgCdTe grown on silicon. We have fabricated a series of long wavelength infrared (LWIR) HgCdTe diodes and several LWIR focal plane arrays (FPAs) with HgCdTe grown on silicon substrates using MBE grown CdTe and CdSeTe buffer layers. The detector arrays were fabricated using Rockwell Scientific’s planar diode architecture. The diode and FPA and results at 78 K will be discussed in terms of the high dislocation density (∼5×10⁶ cm²) typically measured when HgCdTe is grown on silicon substrates.     

VSWIR to VLWIR MBE grown HgCdTe material and detectors for remote sensing applications

The molecular beam epitaxy (MBE) growth technology is inherently flexible in its ability to change the Hg_1−xCd_xTe material’s bandgap within a growth run and from growth run to growth run. This bandgap engineering flexibility permits tailoring the device architecture to the various specific requirements. Material with active layer x values ranging from ∼0.198 to 0.570 have been grown and processed into detectors. This wide range in x values is perfectly suited for remote sensing applications, specifically the National Polar Orbiting Environmental Satellite System (NPOESS) program that requires imaging in a multitude of infrared spectral bands, ranging from the 1.58 to 1.64 μm VSWIR (very short wave infrared) band to the 11.5 to 12.5 μm LWIR (longwave infrared) band and beyond. These diverse spectral bands require high performance detectors, operating at two temperatures; detectors for the VSWIR band operate near room temperature while the SWIR, MWIR (mid wave infra red), LWIR and VLWIR (very long wave infrared) detectors operate near 100K, because of constraints imposed by the cooler for the NPOESS program. This paper uses material parameters to calculate theoretical detector performance for a range of x values. This theoretical detector performance is compared with median measured detector optical and electrical data. Measured detector optical and electrical data, combined with noise model estimates of ROIC performance are used to calculate signal to noise ratio (SNR), for each spectral band. The SNR are compared with respect to the meteorological NPOESS system derived focal plane. The derived system focal plane requirements for NPOESS are met in all the spectral bands.     

Time-based pixel-level ADC with wide dynamic range for 2-D LWIR applications

A readout circuit involving a time-based pixel-level ADC is studied for two-dimensional long wavelength infrared focal plane arrays (2-D LWIR FPAs). The integration time of each pixel can be optimised individually and automatically. Using a time-based pixel-level ADC with two-step background suppression, the signal-to-noise ratio and dynamic range can be improved to 88.8 and 95.1 dB, respectively.     

Au掺杂碲镉汞长波探测器技术研究

昆明物理研究所多年来持续开展了对Au掺杂碲镉汞材料、器件结构设计、可重复的工艺开发等研究,突破了Au掺杂碲镉汞材料电学可控掺杂、器件暗电流控制等关键技术,将n-on-p型碲镉汞长波器件品质因子(R₀A)从31.3Ω·cm²提升到了363Ω·cm²(λcutoff=10.5μm@80 K),器件暗电流较本征汞空位n-on-p型器件降低了一个数量级以上。研制的非本征Au掺杂长波探测器经历了超过7年的时间贮存,性能无明显变化,显示了良好的长期稳定性。基于Au掺杂碲镉汞探测器技术,昆明物理研究所实现了256×256 (30μm pitch)、640×512 (25μm pitch)、640×512 (15μm pitch)、1 024×768 (10μm pitch)等规格的长波探测器研制和批量能力,实现了非本征Au掺杂长波碲镉汞器件系列化发展。