Reduction of defect states of tantalum oxide thin films with additive elements

Electrical properties of tantalum oxide (Ta₂O₅) thin films formed by metalorganic decomposition have been studied with respect to their defect states. A shallow band of defect states, which are the origin of hole traps, is detected by thermally stimulated current. The defect states in the Ta₂O₅ films are fully suppressed with additive elements such as TiO₂ and WO₃. It is considered that oxygen vacancies are fully compensated by Ti⁴⁺ ions or W⁶⁺ ions that are substitutionally incorporated into Ta⁵⁺ sites.     

Influence of rapid thermal annealing on morphological and electrical properties of RF sputtered AlN films

Aluminum nitride films were deposited, at 200 °C, on silicon substrates by RF sputtering. Effects of rapid thermal annealing on these films, at temperatures ranging from 400 to 1000 °C, have been studied. Fourier transform infrared spectroscopy (FTIR) revealed that the characteristic absorption band of Al–N, around 684 cm⁻¹, became prominent with increased annealing temperature. X-ray diffraction (XRD) patterns exhibited a better, c-axis, (0 0 2) oriented AlN films at 800 °C. Significant rise in surface roughness, from 2.1 to 3.68 nm, was observed as annealing temperatures increased. Apart from these observations, micro-cracks were observed at 1000 °C. Insulator charge density increased from 2×10¹¹ to 7.7×10¹¹ cm⁻² at higher temperatures, whereas, the interface charge density was found minimum, 3.2×10¹¹ eV⁻¹cm⁻², at 600 °C.     

Effect of tantalum doping on the structural and optical properties of RF magnetron sputtered indium oxide thin films

Tantalum doped indium oxide films are prepared by RF magnetron sputtering technique and the films are annealed in air at 300 °C. The effect of Ta doping on the structural, morphological, and optical properties of the annealed films are studied using techniques like X-ray diffraction (XRD), atomic force microscopy (AFM), field emission scanning electron microscopy (FESEM), EDX analysis, micro-Raman, UV–visible and photoluminescence spectroscopy and electrical measurements. The XRD patterns present a cubic bixbyite structure for all the films with preferred orientation along the (222) plane. The lattice constant estimation presents a reduction in lattice size with Ta doping. The W–H plot shows a tensile strain for all the films and also indicates the presence of strain induced broadening of the XRD peaks. The Raman spectra present all the characteristic modes of In₂O₃ cubic bixbyite phase. FESEM and AFM images show the uniform and dense distribution of smaller grains in the films. All the films show high transmittance (above 85%) in the 400–900 nm region. Electrical measurement shows a systematic increase of carrier concentration and electrical conductivity with increase in Ta doping concentration. Band gap energy increases with increase in Ta doping concentration. All the films show intense PL emission in the UV region.     

Thickness dependence of the structural and electrical properties of copper films deposited by dc magnetron sputtering technique

This paper addresses the influences of film thickness on structural and electrical properties of dc magnetron sputter-deposited copper (Cu) films on p-type silicon. Cu films with thicknesses of 130-1050 nm were deposited from Cu target at sputtering power of 125 W in argon ambient gas pressure of 3.6 mTorr at room temperature. The electrical and structural properties of the Cu films were investigated by four-point probe, atomic force microscopy (AFM) as well as X-ray diffraction (XRD). Results from our experiment show that the grain grows with increasing film thickness, along with enhanced film crystallinity. The root mean square (RMS) roughness as well as the lateral feature size increase with the Cu film thickness, which is associated with the increase in the grain size. On the other hand, the Cu film resistivity decreases to less than 5 μΩ-cm for 500 nm thick film, and further increase in the film thickness has no significant effects on the film resistivity. Possible mechanisms of film thickness dependent microstructure formation of these Cu films are discussed in the paper, which explain the interrelationship of grain growth and film resistivity with increasing Cu film thickness.     

Electrical properties of zinc oxide sputtered thin films

ZnO thin films were deposited on silicon substrate by rf magnetron sputtering from metallic zinc target. The electrical properties of ZnO are currently being studied. In this work, measurements of the ac conductivity properties of ZnO sandwich structures with silver and platinum electrodes are reported. The frequency dependence of both the ac conductivity and dielectric constant of thin films of ZnO have been investigated in the frequency range 5 kHz-13 MHz. It is shown that the total ac conductivity σ(ω), obeys the equation σ(ω)=Aω^S where s is an index which increases with frequency and decreases with temperature. It appears that for ZnO films, the conduction mechanism is thermally activated and both the overlap large polaron tunnelling and the correlated barrier-hopping of charge carrier over localized states fit the experimental data. The dielectric constant, ε_r, lies in the range 8-9 at room temperature and is independent of the frequency in the dielectric thin films.     

Low temperature processed hafnium oxide: Structural and electrical properties

In this work hafnium oxide (HfO₂) was deposited by r.f. magnetron sputtering at room temperature and then annealed at 200 °C in forming gas (N₂+H₂) and oxygen atmospheres, respectively for 2, 5 and 10 h. After 2 h annealing in forming gas an improvement in the interface properties occurs with the associated flat band voltage changing from −2.23 to −1.28 V. This means a reduction in the oxide charge density from 1.33×10¹² to 7.62×10¹¹ cm⁻². After 5 h annealing only the dielectric constant improves due to densification of the film. Finally, after 10 h annealing we notice a degradation of the electrical film's properties, with the flat band voltage and fixed charge density being −2.96 V and 1.64×10¹² cm⁻², respectively. Besides that, the leakage current also increases due to crystallization. On the other hand, by depositing the films at 200 °C or annealing it in an oxidizing atmosphere no improvements are observed when comparing these data to the ones obtained by annealing the films in forming gas. Here the flat band voltage is more negative and the hysteresis on the C–V plot is larger than the one recorded on films annealed in forming gas, meaning a degradation of the interfacial properties.     

Effect of thickness on the structural,optical and electrical properties of RF magnetron sputtered GZO thin films

Gallium-doped zinc oxide (GZO) thin films with very high conductivity and transparency were successfully deposited by RF magnetron sputtering at a substrate temperature of 400 °C. The dependence of the film properties over the thickness was investigated. X-ray diffraction (XRD) results revealed the polycrystalline nature of the films with hexagonal wurtzite structure having preferential orientation along [001] direction normal to the substrate. The lowest resistivity obtained from electrical studies was 5.4×10⁻⁴ Ω cm. The optical properties were studied using a UV–vis spectrophotometer and the average transmittance in the visible region (400–700 nm) was found to be 92%, relative to the transmittance of a soda–lime glass reference for a GZO film of thickness 495 nm and also the transparency of the films decreases in the near IR region of the spectra. The mobility of the films showed a linear dependence with crystallite size. GZO film of thickness 495 nm with the highest figure of merit indicates that the GZO film is suitable as an ideal transparent conducting oxide (TCO) material for solar cell applications.     

The annealing effect for structural, optical and electrical properties of dysprosium–manganese oxide films grown on Si substrate

Samples of (Dy–Mn) oxide thin films were prepared on quartz and Si(p) substrates for optical and electrical investigations. These samples were annealed at different temperatures and characterised by UV–VIS absorption spectroscopy, X-ray fluorescence (XRF) and X-ray diffraction (XRD). The XRF spectrum was used to determine the weight fraction ratio of Mn to Dy in the prepared samples. The XRD shows that Dy oxide and Mn oxide prevent each other to crystallise alone or making a solid solution even at 600 °C. However, compound of DyMnO₃ was formed through the solid-state reaction for T > 800 °C. The ac-conductance and capacitance were studied, as a function of frequency and gate voltage and the fixed and interface charge densities were determined. It was found that the “correlated barrier hopping” CBH model controls the frequency dependence of the conductivity, while the Kramers–Kronig (KK) relations explain the frequency dependence of the capacitance. The parameters of CBH model were determined and show that the ac-conduction in crystalline (Dy–Mn) oxide is realised by bipolaron mechanism, where the barrier height of hopping is equal to the bandgap determined the UV–VIS absorption spectroscopy.     

Effects of substrate temperature on electrical and structural properties of copper thin films

This paper addresses the effects of substrate temperature on electrical and structural properties of dc magnetron sputter-deposited copper (Cu) thin films on p-type silicon. Copper films of 80 and 500 nm were deposited from Cu target in argon ambient gas pressure of 3.6 mTorr at different substrate temperatures ranging from room temperature to 250 °C. The electrical and structural properties of the Cu films were investigated by four-point probe and atomic force microscopy. Results from our experiment show that the increase in substrate temperature generally promotes the grain growth of the Cu films of both thicknesses. The RMS roughness as well as the lateral feature size increase with the substrate temperature, which is associated with the increase in the grain size. On the other hand, the resistivity for 80 nm Cu film decreases to less than 5 μΩ-cm at the substrate temperature of 100 °C, and further increase in the substrate temperature has not significantly decreased the film resistivity. For the 500 nm Cu films, the increase in the grain size with the substrate temperature does not conform to the film resistivity for these Cu films, which show no significant change over the substrate temperature range. Possible mechanisms of substrate-temperature-dependent microstructure formation of these Cu films are discussed in this paper, which explain the interrelationship of grain growth and film resistivity with elevated substrate temperature.     

Effects of annealing in O2 and N2 on the electrical properties of tantalum oxide thin films prepared by electron cyclotron resonance plasma enhanced chemical vapor deposition

The tantalum oxide thin films with a thickness of 14 nm were deposited at 95°C by electron cyclotron resonance plasma enhanced chemical vapor deposition (ECRPECVD), and annealed at various temperatures (700∼850°C) in O₂ and N₂ ambients. The microstructure and composition of the tantalum oxide thin films and the growth of interfacial silicon oxide layer were investigated and were related to the electrical characteristics of the film. Annealing in an O₂ ambient led to a high dielectric constant (ε_r(Ta₂O₅) = 24) as well as a small leakage current (E_bd = 2.3 MV/cm), which were due to the improved stoichiometry and the decreased impurity carbon content. Annealing in an N₂ ambient resulted in poor and nonuniform leakage current characteristics. The as-deposited tantalum oxide films were crystallized into δ-Ta₂O₅ after annealing at above 750°C regardless of the ambient. The leakage current of the film abruptly increased after annealing at 850°C probably because of the stress caused by thermal expansion or contraction.     

Effect of processing parameter on structural,optical and electrical properties of photovoltaic chalcogenide nanostructured RF magnetron sputtered thin absorbing films

The aim of this work was to develop high quality of CuIn_1−xGa_xSe₂ thin absorbing films with x (Ga/In+Ga)<0.3 by sputtering without selenization process. CuIn_0.8Ga_0.2Se₂ (CIGS) thin absorbing films were deposited on soda lime glass substrate by RF magnetron sputtering using single quaternary chalcogenide (CIGS) target. The effect of substrate temperature, sputtering power & working pressure on structural, morphological, optical and electrical properties of deposited films were studied. CIGS thin films were characterised by X-ray diffraction (XRD), Field emission scanning electron microscope (FE-SEM), Energy dispersive X-ray spectroscopy (EDAX), Atomic force microscopy (AFM), UV–vis–NIR spectroscopy and four probe methods. It was observed that microstructure, surface morphology, elemental composition, transmittance as well as conductivity of thin films were strongly dependent on deposition parameters. The optimum parameters for CIGS thin films were obtained at a power 100 W, pressure 5 mT and substrate temperature 500 °C. XRD revealed that thin film deposited at above said parameters was polycrystalline in nature with larger crystallite size (32 nm) and low dislocation density (0.97×10¹⁵ lines m⁻²). The deposited film also showed preferred orientation along (112) plane. The morphology of the film depicted by FE-SEM was compact and uniform without any micro cracks and pits. The deposited film exhibited good stoichiometry (Ga/In+Ga=0.19 and In/In+Ga=0.8) with desired Cu/In+Ga ratio (0.92), which is essential for high efficiency solar cells. Transmittance of deposited film was found to be very low (1.09%). The absorption coefficient of film was ~10⁵ cm⁻¹ for high energy photon. The band gap of CIGS thin film evaluated from transmission data was found to be 1.13 eV which is optimum for solar cell application. The electrical conductivity (7.87 Ω⁻¹ cm⁻¹) of deposited CIGS thin film at optimum parameters was also high enough for practical purpose.     

Properties of conducting zinc oxide films prepared by R.F. Sputtering

An effective method of dopant incorporation in rf sputtered ZnO film is reported. The electrical, optical and structural properties of zinc doped ZnO films are investigated. Electron mobility of∼10 cm² /V-sec and electron concentration of∼10¹⁹ cm⁻³ have been measured at room temperature. X-ray diffraction data obtained on films prepared on Corning 7059 glass show (002) peak, dominating. The high electrical conductivity and transmission makes ZnO films very attractive as a component for heterojunction solar cells.     

Properties of ZnO/Cu/ZnO multilayer films deposited by simultaneous RF and DC magnetron sputtering at different substrate temperatures

ZnO/Cu/ZnO transparent conductive multilayer films are prepared by simultaneous RF sputtering of ZnO and DC sputtering of Cu. The properties of the multilayer films are studied at different substrate temperatures. Sheet resistance of the multilayer film decreased initially with increase of substrate temperature and increased further with increase of substrate temperature beyond 100 °C. However, transmittance of the multilayer film increased with increase of substrate temperature. Good transparent conductive film of sheet resistance 9.3 Ω/sq and transmittance of 85% was found at a substrate temperature of 100 °C. The performance of the multilayer film was evaluated using a figure of merit. The observed property of the multilayer film is suitable for the application of transparent conductive electrodes.     

Rapid thermal annealing of cerium dioxide thin films sputtered onto silicon (111) substrates: Influence of heating rate on microstructure and electrical properties

The impact of the heating rate (HR) of a Rapid Thermal Annealing (RTA) on the crystallinity and on the morphology of CeO₂ thin films has been investigated by Raman Spectroscopy (RS), Photoluminescence (PL), Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS), and tapping mode Atomic Force Microscopy (AFM). The electrical properties of CeO₂ thin films have also been studied with the Conductive AFM mode. This paper highlights the importance of the heating rate value used during an RTA on crystalline quality, morphology and on the electrical properties of the CeO₂ layer. In fact, the best crystallinity with a good morphology and a high resistivity has been obtained for a CeO₂ layer sputtered on (111) Si substrate and post-annealed at 1000 °C for 30 s with an HR of 25 °C/s.     

Frequency effects on the dielectric properties of AlN film deposited by radio frequency reactive magnetron sputtering

Applications insulated metal substrates (IMS) for high-density and high-power mounting are greatly extending with miniaturizing of electronic components. Recently, aluminum nitride film has been used as a potential insulator and/or passivation material in insulated metal substrate because of its high intrinsic thermal conductivity, low thermal expansion coefficient, low dielectric constant and high electric resistivity. In this investigation, AlN films were deposited on Al substrates by radio frequency (RF) reactive magnetron sputtering. The metal-interfacial insulator layer-metal (Al/AlN/Al MIM) structures were obtained with AlN layer on Al substrates. Electrical properties of the MIM structures were investigated by meaning of C-V and C-f characteristics in the frequency range of 100 Hz-500 kHz and voltage range of −4 V to 4 V. Experimental results show that the dielectric constant of this structure decreases gradually with increasing frequency. While the dielectric loss tangent was tested from low frequency to high frequency, it is found that the dielectric loss tangent decreases from 0.03375, reaches a minimum (0.00424) at approximately 65 kHz and then increases sharply. These results are in accordance with modified model of Goswami and Goswami for such structure. The dielectric dispersion is observed due to distribution of interface states as well as ionized space charge carriers such as the oxygen atoms, nitrogen vacancies and defects. The AC conductivity results show that the electrical resistance decreases as the frequency increasing due to hopping type conduction.     

Influence of annealing temperature on the phase composition and optical properties of CuInS2 films

We studied the growth of CuInS₂ thin films by single-source evaporation of CuInS₂ powder in a high-vacuum system with a base pressure of 10^?3 Pa. After evaporation, the films were annealed in a sulfur atmosphere at temperatures from 200 to 500 °C for 1 h. XRD curves and Raman spectra of the films demonstrated that chalcopyrite CuInS₂ was the major crystalline phase. The morphology of Cu_xS exhibited a star-like structure, which we report for the first time. The phase composition and optical properties of our polycrystalline thin films were effectively modified by annealing in S. For films annealed at 200 and 350 °C, a secondary CuIn₁₁S₁₇ phase appeared, which may be related to solid-state reaction in the S atmosphere. This secondary CuIn₁₁S₁₇ phase has not been widely reported in previous studies. After annealing at 500 °C, only a chalcopyrite phase was detected, with bandgap energy of 1.46 eV, which is nearly identical to the optimal bandgap energy (1.5 eV) of single-crystal CuInS₂. This indicates that the composition of the CuInS₂ film annealed at 500 °C was nearly stoichiometric. The bandgap of the samples first increased and then decreased with increasing annealing temperature, which may be attributed to an increase in grain size, the secondary CuIn₁₁S₁₇ phase, and deviation from stoichiometry.     

Structural properties of FeTe2 thin films synthesized by tellurization of amorphous iron oxide thin films

This paper deals with the structural properties of FeTe₂ thin films obtained using a simple and non-toxic experimental procedure. First, iron oxide thin films have been prepared by the spray pyrolysis technique from an aqueous solution containing FeCl₃6H₂O (0.03 M) as a precursor onto glass substrates heated at 623 K. Second, these films were subjected to a heat treatment under tellurium atmosphere at various temperatures (723–803 K) for 24 h. XRD analysis revealed that FeTe₂-ortorombic phase films were obtained at a heat treatment of the order of 773 K. This film has a good crystalline state with a preferential orientation of the crystallites along (111) direction. Moreover, AFM as well as SEM morphological observations show a relatively perturbed surface state.To date, this simple and low cost route process to obtained FeTe₂ thin films has not yet been used.     

Influence of oxygen flow rate on microstructural,electrical and optical properties of indium tin tantalum oxide films

Indium tin oxide (ITO) and indium tin tantalum oxide (ITTO) films were deposited on glass substrates by magnetron sputtering technology with one or two targets. Properties of ITO and ITTO films deposited at different oxygen flow rates were contrastively studied. Ta-doping strengthens along the orientation of (400) plane and leads to better crystalline structure as well as to a decrease in surface roughness. The increase in oxygen flow rate increases sheet resistance and reduces carrier concentration, and ITTO films show higher carrier concentration. Certain oxygen flow rates can improve the visible light transmittance of films, but excessive oxygen can worsen the optical properties. The carrier concentration has an important influence on near-IR reflection, near-UV absorption and optical band gap. The optical band gap decreases with the increasing of oxygen flow rate, and ITTO films show wider optical band gap than ITO films. ITTO films prepared by co-sputtering reveal better optical–electrical properties and chemical and thermal stability than ITO films.     

AZO透明导电薄膜的结构与光电性能

采用射频溅射工艺制备了Zn1-xAlxO透明导电薄膜。通过XRD、UV透射和电学性能测试等分析手段,研究了Al浓度对薄膜的组织结构和光电性能的影响规律。结果表明:薄膜具有c轴择优取向,随着Al浓度的增加,(002)衍射峰向高角度移动,峰强度逐渐减弱,x(Al)为15%掺杂极限浓度。x(Al)为2%时,薄膜电阻率是3.4×10–4Ω.cm。随着掺杂量x(Al)从0增加到20%,薄膜的禁带宽度从3.34 eV增加到4.0 eV。     

Structural, electrical and optical properties of zinc oxide produced by oxidation of zinc thin films

We have investigated the effects of oxidation temperature on the physical properties of polycrystalline zinc oxide thin films. Zinc thin films are oxidized at different temperatures in air. We have found that increasing the oxidation temperature deteriorates the preferred c-axis orientation. Also, increasing the oxidation temperature enlarges the crystal size and increases the number of needle-shaped crystals on the surface of the ZnO samples. By increasing the oxidation temperature, more than zinc melting point, tensile stresses start to build up in the films. Also by increasing temperature, sheet resistance of the films decreases, while photoluminescence intensity ratio (green to orange) increases. Increasing the oxidation temperature reduces the transparency of the films, too. It is proposed that either an increase in the number of oxygen vacancies or a decrease in the volume of grain boundaries, is responsible for the observed behavior of the films at higher oxidation temperatures.