共查询到14条相似文献,搜索用时 15 毫秒
1.
M. Dubosc S. Casimirius C. Cardinaud J.-L. Duvail T. Minéa J. Torres 《Microelectronic Engineering》2007,84(11):2501-2505
This article reports on carbon nanotubes (CNT) grown on TiN/Cu stacks by plasma enhanced chemical vapor deposition (PECVD) at 450 °C. Ni catalyst was deposited by two techniques - physical vapor deposition (PVD) and electrochemical deposition (ECD). First, the influence of the catalyst thickness and the catalyst deposition technique on grown CNTs is investigated. Second, the enhancement of the CNTs growth by use of electrodeposited catalysts is emphasized. 相似文献
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3.
Jie Sun Devin A. Mourey Dalong Zhao Thomas N. Jackson 《Journal of Electronic Materials》2008,37(5):755-759
We report undoped ZnO films deposited at low temperature (200°C) using plasma-enhanced chemical vapor deposition (PECVD).
ZnO thin-film transistors (TFTs) fabricated using ZnO and Al2O3 deposited in situ by PECVD with moderate gate leakage show a field-effect mobility of 10 cm2/V s, threshold voltage of 7.5 V, subthreshold slope <1 V/dec, and current on/off ratios >104. Inverter circuits fabricated using these ZnO TFTs show peak gain magnitude (dV
out/dV
in) ~5. These devices appear to be strongly limited by interface states and reducing the gate leakage results in TFTs with lower
mobility. For example, ZnO TFTs fabricated with low-leakage Al2O3 have mobility near 0.05 cm2/V s, and five-stage ring-oscillator integrated circuits fabricated using these TFTs have a 1.2 kHz oscillation frequency
at 60 V, likely limited by interface states. 相似文献
4.
为了解决MEMS封装过程中易对微致动件造成损伤的问题,提出了一种低成本、与CMOS工艺兼容的晶圆级薄膜封装技术,用等离子体增强化学气相淀积(PECVD)法制备的低应力SiC作为封装和密封材料。此材料的杨氏模量为460 GPa,残余应力为65 MPa,可使MEMS器件悬浮时封装部位不变形。与GaAs,Si半导体材料相比,SiC具有较佳的物理稳定性,较高的杨氏模量等性能优势。将PECVD薄膜封装技术用于表面微结构和绝缘膜上Si(SOI)微结构部件(如射频开关、微加速度计等)封装中,不仅减小了封装尺寸,降低了芯片厚度,简化了封装工艺,而且封装芯片还与CMOS工艺兼容。较之晶圆键合封装方式,此晶圆级薄膜封装成本可降低5%左右。 相似文献
5.
凡金星 施正荣 张光春 杨健 陈如龙 李果华 Fan Jinxing Shi Zhengrong Zhang Guangchun Yang Jian Chen Rulong Li Guohua 《半导体技术》2012,37(3):192-196
提出了一种简单有效的制备双层SiNx薄膜的方法,其薄膜具有良好的减反射钝化特性。采用等离子体增强化学气相沉积(PECVD)的方法,通过控制SiH4和NH3气体流量比,在p型多晶硅衬底上生长单层及双层SiNx膜。随后使用薄膜测试分析仪测量了薄膜的厚度、折射率及反射率,并用Semilab WT-2000测量少数载流子寿命,通过测量量子效率,对单、双层膜电池进行了比较。实验结果表明:相比单层减反射钝化膜,采用双层SiNx膜,少数载流子寿命可以得到更好的改善,开路电压可提高约2 mV,短路电流可提高约40 mA,电池效率能提高0.15%。 相似文献
6.
简要介绍了纳米晶硅薄膜的微结构表征方法,重点讨论了PECVD制备方法中工艺参数对薄膜结构的影响,并探讨了氢在薄膜形成和生长中的作用。通过优化氢稀释率、衬底温度、反应气压、激励功率和激发频率等工艺参数可提高纳米晶硅薄膜的晶化率并改善薄膜质量。结合喇曼光谱、X射线衍射谱、傅里叶红外光谱和高分辨透射电镜等表征方法可深入研究薄膜形成机理,对进一步探索薄膜光电特性有重要意义。分析了等离子体化学气相沉积(PECVD)制备方法中各工艺参数对薄膜质量和沉积速率的影响,指出其存在的问题,并探寻了今后的研究方向。 相似文献
7.
W. Hu Florence Y. M. Chan D. P. Webb Y. C. Chan Y. W. Lam 《Journal of Electronic Materials》1996,25(12):1837-1840
The optical properties of hydrogenated amorphous silicon thin films prepared by a new thermocatalytic plasma enhanced chemical
vapor deposition (PECVD) method are here reported for the first time. The transmission spectrum of the film, deposited at
a rate of 1.5 nm/s, was measured between 500 and 1100 nm. The envelopes of the transmission spectrum interference maxima and
minima were analyzed to reveal the absorption coefficient α(λ@#@), the refractive indexn(λ), the average thickness of the film (791 nm) and the variation of the thickness (11.4 nm), using an analysis which takes into
account film inhomogeneity. The modified Newton's method of numerical analysis was used to obtain the optical parameters.
The optical band gap ε0} was determined to be 1.69 eV from the absorption coefficient spectrum, commensurate with values quoted for lower deposition
rate PECVD films. The value for ε0}, the small variation of the film thickness, and a value for the defect density of 3.7 x 1015}cm-3} determined for similar material in other work indicate that the thermocatalytic PECVD method can produce acceptable quality
films at a high deposition rate. 相似文献
8.
等离子增强化学气相淀积(PECVD)法制备的氮化硅薄膜具有沉积温度低、生长速率高和残余应力可调节等特点,研究其力学特性对研制MEMS器件和系统具有重要意义。采用HQ-2型PECVD淀积台,在沉积温度为350℃,NH3流量为30cm3/min的条件下,通过改变氩气稀释至5%的SiH4流量和射频功率大小,制备了具有压应力、微应力和张应力的多种氮化硅薄膜样品。采用纳米压痕仪Nanoidenter-G200对淀积薄膜的杨氏模量和硬度进行测试,结果表明,在较小的SiH4流量和较高的射频功率条件下,淀积的氮化硅薄膜具有更高的杨氏模量和硬度。 相似文献
9.
Silicon oxide films have been deposited between room temperature and 300°C using disilane and nitrous oxide by plasma enhanced
chemical vapor deposition. Film deposition was investigated as a function of the gas flow ratio of nitrous oxide to disilane,
the substrate temperature, the total gas flow rate, the radio frequency discharge power, and the process pressure. The stoichiometric
SiO2 films were obtained when the gas ratio of nitrous oxide to disilane was in the range of 50-150. The deposition was found
to be nearly temperature independent indicating the mass transport limited regime. 相似文献
10.
Byung Lyul Park Dae-Hong Ko Young Sun Kim Jung Min Ha Young Wook Park Sang In Lee Hyeon-Deok Lee Myoung Bum Lee U. In Chung Young Bum Koh Moon Yong Lee 《Journal of Electronic Materials》1997,26(2):L1-L5
We have developed tungsten nitride (W-Nitride) films grown by plasma enhanced chemical vapor deposition (PECVD) for barrier
material applications in ultra large scale integration DRAM devices. As-deposited W-Nitride films show an amorphous structure,
which transforms into crystalline, β-W2N and α-W phases upon annealing at 800°C. The resistivity of the as-deposited films grown at the NH3/WF6 gas flow ratio of 1 is about 160 μω-cm, which decreases to 50 μω-cm after an rapid thermal annealing treatment at 800°C.
In the contact holes with the size of 0.35 μm and aspect ratio of 3.5, the bottom step coverage of the tungsten nitride films
is about 60%, which is about three times higher than that of collimated-TiN films. We obtained contact resistance and leakage
current with the tungsten nitride barrier layer comparable to those with conventional collimated TiN films. The contact resistance
and leakage current are stable upon thermal stressing at 450°C up to 48 h. 相似文献
11.
采用射频等离子体增强化学气相沉积(RF-PECVD),以Fe作为催化剂,在Si基片上生长了碳纳米管(CNT),采用扫描电子显微镜(SEM),高分辨透射电子显微镜(HR TEM)以及显微Raman光谱等对制备的CNT的形貌及结构进行了表征.结果表明:700℃和800℃温度下生长的CNT均取向无序、弯曲缠结,由整齐排列的圆... 相似文献
12.
M. N. van den Donker B. Rech F. Finger L. Houben W. M. M. Kessels M. C. M. van de Sanden 《Progress in Photovoltaics: Research and Applications》2007,15(4):291-301
This paper addresses the plasma deposition of highly efficient microcrystalline silicon (μc‐Si:H) p‐i‐n solar cells under conditions of high SiH4 utilization and low H2 dilution. It was established that the transient depletion of the initially present SiH4 source gas induces the formation of an amorphous incubation layer that prevents successful crystallite nucleation in the i‐layer and leads to poor solar cell performance. The effect of this transient depletion induced incubation layer on solar cells was made visible through dedicated solar cell deposition series and selected area electron diffraction measurements. Applying a gas flow procedure at plasma ignition it was succeeded to prepare state‐of‐the‐art μc‐Si:H material and solar cells under low hydrogen dilution conditions, highlighted by μc‐Si:H solar cells of up to 9·5% efficiency prepared using an undiluted source gas flow consisting solely of SiH4. Copyright © 2007 John Wiley & Sons, Ltd. 相似文献
13.
Yoon-Bong Hahn Jong-Wha Kim Chang-Joo Youn In-Sun Lee 《Journal of Electronic Materials》1997,26(12):1394-1400
Dielectric PbTiO3-thin films were prepared on p-Si(100) substrate by plasma enhanced metalorganic chemical vapor deposition using high purity
Ti(O-i-C3H7)4, Pb(tmhd)2, and oxygen. As-deposited films were post-treated by rapid thermal annealing method, and the effect of annealing was examined
under various conditions. The deposition process was controlled by mixed-control scheme at temperatures lower than 350°C,
but controlled by heterogeneous surface reaction at temperatures greater than 350°C. The as-deposited films showed PbO structure
at 350∼400°C, but (100) and (101) PbTiO3 orientations started to appear at 450°C. The deposition rate was increased with rf power due to the enhanced dissociation
of Ti and Pb precursors. It was found that the concentration of oxygen plays an important role in crystallization of PbTiO3 during the rapid thermal annealing. A linear relationship was obtained between the dielectric constant of PbTiO3 films and the annealing temperature. However, the surface roughness and leakage current density increased mainly due to the
defects caused by volatilization of lead and the interface layer formed during the high temperature annealing. 相似文献
14.
The growth of heavily carbon dopedp-InGaAs (~6.5xl019cm-3) lattice-matched to InP is reported. Growth is achieved by low pressure metalorganic chemical vapor deposition (LP-MOCVD)
using all methyl metalorganic sources and liquid CC14. The impact of growth temperature and CC14 flow rates on growth rate reduction and alloy compositional change was investigated. Post-growth isothermal and isochronal
annealing experiments were performed on the carbon doped InGaAs layers and a quantitative analysis of carrier activation is
presented using Hall and secondary ion mass spectroscopy measurements. Reduced self-compensation by carbon displacement from
indium to arsenic site, as well as, reduced hydrogen passivation are suggested as possible mechanisms responsible for carrier
activation upon thermal annealing. 相似文献