(2 0 0)-Texture and microstructure of MgO films by rf-magnetron sputtering in Ar plus N2 atmosphere

Intensity of the (2 0 0) peak in the X-ray diffraction pattern of the MgO film increases as N₂ is added to Ar gas during MgO deposition. The optimum flow rate ratio of N₂ to Ar in order to obtain maximum intensity of the MgO (2 0 0) peak is 2:5. As introducing N₂ gas, no residual nitrogen atoms are found in the MgO films, which are confirmed by AES and ESCA analysis. On the other hand, the TEM dark field image shows that the average grain size of MgO film increases with increasing the flow rate ratio of N₂ to Ar. This is due to that the deposition rate of MgO film is decreased with increasing the flow rate ratio of N₂ to Ar.     

Growth of FeSb2 thin films by magnetron sputtering

The detailed growth of FeSb₂ films formed on quartz (0001) substrates by magnetron sputtering is reported. FeSb₂ films with different orientations and compositions can be produced by adjusting the Ar working gas pressure and the substrate temperature. By employing FeSb₂ thin layers produced at different substrate temperatures as templates, < 101>-, < 120>- and < 002>-textured FeSb₂ films were produced under identical growth conditions. The thermoelectric properties of film samples grown at different temperatures were measured and the effects of Sb and FeSb impurities were investigated.     

Optical characterization of BCN films deposited at various N2/Ar gas flow ratios by RF magnetron sputtering

We present the deposition and optical characterization of amorphous thin films of boron carbonitride (BCN). The BCN thin films were deposited in a radio frequency magnetron sputtering system using a B₄C target. Films of different compositions were deposited by varying the ratio of argon and nitrogen gas in the sputtering ambient. X-ray photoelectron spectroscopy was used to perform surface characterization of the deposited films and a change in composition with nitrogen flow ratio was observed. The effect of gas flow ratios on the optical properties of the films was also investigated. It was found that the transmittance of the films increases with nitrogen incorporation. The optical band gap of the films ranged from 2.0 eV to 3.1 eV and increased with N₂/Ar gas flow ratio except at the highest ratio.     

The influence of CH4 addition on composition, structure and optical characteristics of SiCN thin films deposited in a CH4/N2/Ar/hexamethyldisilazane microwave plasma

Amorphous silicon carbonitride (a-SiCN) thin films were synthesized in a microwave plasma assisted chemical vapor deposition system using N₂, Ar, CH₄ and hexamethyldisilazane vapor (HMDSN). Composition, morphology and optical constants of the layers have been studied as a function of CH₄ rate in the range 0 to 9%. It was found that films are mainly composed of silicon nitride like compound whatever the CH₄ rate. However, CH₄ addition leads to less hydrogenated and denser films. In addition, a refractive index augmentation from 1.7 to 2.0 and a Tauc gap decrease from 5.2 eV to 4.8 eV is measured with CH₄ rate increase. It is believed that the refractive index augmentation is due to higher thin film density whereas hydrogen bonds decrease is assumed to contribute to the band gap narrowing. Besides, CH₄ addition to the gaseous mixture increases thin film oxidation resistance. These results show the ability of varying composition, structure and optical constants of a-SiCN films by modifying CH₄ rate in a N₂/Ar/HMDSN plasma.     

Deposition of amorphous carbon nitride films using Ar/N2 supermagnetron sputter

Amorphous carbon nitride (a-CN_x) films were formed by supermagnetron sputter deposition using N₂ and/or Ar gases. Supplying rf power with a substrate-holding electrode (bias sputter) and lowering the gas pressure were found to be effective at decreasing the optical band gap and increasing the hardness. Nitrogen concentrations of bias sputtered films were about 32-35 mass% (30-100 mTorr). The a-CN_x films deposited for electron field emission showed a low-threshold electric field (E_TH). With the decrease of gas pressure, admixture of Ar to N₂ or the use of pure Ar, and the use of bias sputter, the E_TH of a-CN_x films largely decreased to 11 V/μm (30 mTorr Ar/N₂ bias sputter).     

Spectroscopic ellipsometry and positron annihilation investigation of sputtered HfO2 films

Hafnium oxide (HfO₂) films were prepared using a pulsed sputtering method and different O₂/(O₂ + Ar) ratios, deposition pressures, and sputtering powers. Spectroscopic ellipsometry (SE) and positron annihilation spectroscopy (PAS) were used to investigate the influence of the deposition parameters on the number of open volume defects (OVDs) in the HfO₂ films. The results reveal that a low O₂/(O₂ + Ar) ratio is critical for obtaining films with a dense structure and low OVDs. The film density increased and OVDs decreased when the deposition pressure was increased. The film deposited at high sputtering power showed a denser structure and lower OVDs. Our results suggest that SE and PAS are effective techniques for studying the optical properties of and defects in HfO₂ and provide an insight into the fabrication of high-quality HfO₂ thin films for optical applications.     

Atomic layer deposition of Ru thin film using N2/H2 plasma as a reactant

Ruthenium (Ru) thin films were grown by atomic layer deposition using IMBCHRu [(η6-1-Isopropyl-4-MethylBenzene)(η4-CycloHexa-1,3-diene)Ruthenium(0)] as a precursor and a nitrogen-hydrogen mixture (N₂/H₂) plasma as a reactant, at the substrate temperature of 270 °C. In the wide range of the ratios of N₂ and total gas flow rates (fN₂/N₂ + H₂) from 0.12 to 0.70, pure Ru films with negligible nitrogen incorporation of 0.5 at.% were obtained, with resistivities ranging from ~ 20 to ~ 30 μΩ cm. A growth rate of 0.057 nm/cycle and negligible incubation cycle for the growth on SiO₂ was observed, indicating the fast nucleation of Ru. The Ru films formed polycrystalline and columnar grain structures with a hexagonal-close-packed phase. Its resistivity was dependent on the crystallinity, which could be controlled by varying the deposition parameters such as plasma power and pulsing time. Cu was electroplated on a 10-nm-thick Ru film. Interestingly, it was found that the nitrogen could be incorporated into Ru at a higher reactant gas ratio of 0.86. The N-incorporated Ru film (~ 20 at.% of N) formed a nanocrystalline and non-columnar grain structure with the resistivity of ~ 340 μΩ cm.     

Optimization of deposition temperature and atmosphere for pulsed laser deposited Sr2FeMoO6 thin films

Double perovskite Sr₂FeMoO₆ films were deposited by pulsed laser deposition at a wide temperature range and different atmospheres. The best films with T_C = 340-370 K and low temperature magnetization of around 2.2 μ_B/f.u. were deposited at 1050 °C with 9 Pa Ar/5%H₂ atmosphere. X-ray diffraction showed no impurities and full texturization of all the films. Atomic force microscopy revealed increasing surface roughness with increasing deposition temperature.     

Effect of density and thickness on H2-gas sensing property of sputtered SnO2 films

Undoped and Pd-doped SnO₂ films were deposited under various conditions for the investigation of the effect of Pd doping, porosity, and thickness on their H₂ gas sensing properties. The temperature of the substrate and the pressure of the discharge gas were varied. All films formed were composed of columns with thicknesses between 20 and 30 nm. The film density decreased as the discharge gas pressure increased and the substrate temperature decreased. It showed values between 4.2×10³ and 7.0×10³ kg/m³ depending on the deposition condition. Low film density and Pd doping resulted in high sensitivity and fast response. The largest sensitivity was observed for a Pd-doped film with a low density of 4.7×10³ kg/m³ and a thickness of 20 nm.     

Atmospheric pressure PECVD of SiO2 thin film at a low temperature using HMDS/O2/He/Ar

SiO₂-like thin films were deposited at a low temperature (< 50 °C) by a remote-type, atmospheric pressure plasma enhanced chemical vapor deposition (AP-PECVD) using a pin-to-plate-type, dielectric barrier discharge with gas mixtures containing hexamethyldisilazane (HMDS)/O₂/He/Ar. The film characteristics were investigated according to the HMDS and O₂ flow rates. To obtain a more SiO₂-like thin film, an adequate combination of HMDS and oxygen flow rates was required to remove the -(CH₃)_x bonding in the HMDS and to oxidize the Si in HMDS effectively. At the optimized flow rates, the surface roughness of the SiO₂-like thin film was also the lowest. By using HMDS (50 sccm) and O₂ (500 sccm) flow rates in the gas mixture of HMDS/O₂/He (2 slm)/Ar (600 sccm), SiO₂-like thin films with a low impurity (< 6.35% C) were obtained at a deposition rate of approximately 10.7 nm/min.     

Ion beam deposition of α-Ta films by nitrogen addition and improvement of diffusion barrier property

Ta thin films were deposited on Si (100) substrates by an ion beam deposition method at various substrate bias voltages under Ar + N₂ atmosphere with different pressure ratios of Ar and N₂. The effects of nitrogen pressure in the plasma gas and the substrate bias voltage on the surface morphology, crystalline microstructure, electrical resistivity and diffusion barrier property were investigated. It was found that the fraction of a metastable β-phase in the Ta film deposited at the substrate bias voltage of − 50 V films decreased by adding nitrogen gas, while the α-Ta phase became dominant. As a result, the Ta films deposited at the substrate bias voltage of − 50 V under Ar (9 Pa) + N₂ (3 Pa) atmosphere showed a dominant α-phase with good surface morphology, low resistivity, and superior thermal stability as a diffusion barrier.     

Effect of N2O/SiH4 flow ratios on properties of amorphous silicon oxide thin films deposited by inductively-coupled plasma chemical vapor deposition with application to silicon surface passivation

Silicon oxide (SiO_x) thin films have been deposited at a substrate temperature of 300 °C by inductively-coupled plasma chemical vapor deposition (ICP-CVD) using N₂O/SiH₄ plasma. The effect of N₂O/SiH₄ flow ratios on SiO_x film properties and silicon surface passivation were investigated. Initially, the deposition rate increased up to the N₂O/SiH₄ flow ratio of 2/1, and then decreased with the further increase in N₂O/SiH₄ flow ratio. Silicon oxide films with refractive indices of 1.47-2.64 and high optical band-gap values (>3.3 eV) were obtained by varying the nitrous oxide to silane gas ratios. The measured density of the interface states for films was found to have minimum value of 4.3 × 10¹¹ eV⁻¹ cm⁻². The simultaneous highest τ_eff and lowest density of interface states indicated that the formation of hydrogen bonds at the SiO_x/c-Si interface played an important role in surface passivation of p-type silicon.     

Properties of polyimide/Al2O3 and Si3N4 deposited thin films

Polyimide (PI) nanocomposites with different proportions of Al₂O₃ were prepared via two-step reaction. Silicon nitride (Si₃N₄) was deposited on PI composite films by a RF magnetron sputtering system and used as a gas barrier to investigate the water vapor transmission rate (WVTR). The thermal stability and mechanical properties of a pure PI film can be improved obviously by adding adequate content of Al₂O₃. At lower sputtering pressure (4 mTorr), the PI/Al₂O₃ hybrid film deposited with Si₃N₄ barrier film exhibits denser structure and lower root mean square (RMS) surface roughness (0.494 nm) as well as performs better in preventing the transmission of water vapor. The lowest WVTR value was obtained from the sample, 4 wt.%Al₂O₃-PI hybrid film deposited with Si₃N₄ barrier film with the thickness of 100 nm, before and after bending test. The interface bonding, Al-N and Al-O-Si, was confirmed with the XPS composition-depth profile.     

Structural and mechanical properties of ZrN films prepared by ion beam sputtering with varying N2/Ar ratio and substrate temperature

Zirconium nitride (ZrN) films were deposited by ion beam sputtering technique on stainless steel 304 substrates using a mix of (Ar+N₂) gas. In this paper, the effects of N₂/(N₂+Ar) flow ratio (F(N₂)) and substrate temperature on the microstructure and microscopic properties of the deposited films were investigated. The phase and the morphology were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM) respectively; moreover, the composition depth profile of ZrN was obtained using secondary ion mass spectroscopy (SIMS). In a wide range of F(N₂) (10-54%), the intensity of (1 1 1) peak increased which was the preferred orientation, while for F(N₂) more than 54% the ZrN peak intensity was decreased and the amorphous structure was formed at 95%. The XRD patterns presented a texture change due to the processing temperature, which was varied within the range 200-550 °C. At 400 °C, the (1 1 1) crystalline plane intensity was higher than the other ones, leading to the presence of a preference for this orientation. Good planarity of the deposited films was confirmed by SEM, it did not reveal any undulations, fractures, or cracking. The Vickers micro-hardness tester with a load of 25 g was used to measure the hardness of the films. The results showed that the structural and mechanical properties were strongly influenced by nitrogen ratio and substrate temperature.     

Structural, optical and electrical properties of reactively sputtered Ag2Cu2O3 films

Ag₂Cu₂O₃ thin films were deposited on glass substrates by RF magnetron sputtering of an equiatomic silver-copper target (Ag_0.5Cu_0.5) in reactive Ar-O₂ mixtures. The reactive sputtering was done at varying power, oxygen flow rate and deposition temperature to study the influence of these parameters on the deposition of Ag₂Cu₂O₃ films. The film structure was determined by X-ray diffraction, while the optical properties were examined by spectrophotometry (UV-vis-NIR) and photoluminescence. Furthermore, the film thickness and resistivity were measured by tactile profilometry and 4-point probe, respectively. Additional mobility, resistivity and charge carrier density Hall effect measurements were done on a few selected samples. The best films in terms of stoichiometry and crystallography were achieved with a sputtering power of 100 W, oxygen and argon flow rates of 20 sccm (giving a deposition pressure of 1.21 Pa) and a deposition temperature of 250 °C. The optical transmittance and photoluminescence spectra of films deposited with these parameters indicate several band gaps, most prominently, a direct one of around 2.2 eV. Electrical characterization reveals charge carrier concentrations and mobilities in the range of 10²¹-10²² cm^− 3 and 0.01-0.1 cm²/Vs, respectively.     

Effects of oxygen concentration on the properties of sputtered SnO2:Sb films deposited at low temperature

Antimony doped tin oxide (SnO₂:Sb) films have been prepared by d.c. magnetron sputtering and the properties of the films depend on deposition conditions, such as O₂ gas ratio, were investigated. The gas composition was found to affect the properties of the films. With the incorporation additional oxygen, the electrical and optical properties of films significantly improved. The minimum value of resistivity of the films was 4.9 × 10^− 3 Ω cm at the oxygen concentration of 30% and the optical transmittance was over 80%.     

Effect of N2/H2 plasma treatment on the moisture adsorption of MOCVD-TiN films

In the application of contact glue layer for semiconductor devices, a nitrogen/hydrogen (N₂/H₂) plasma treatment is usually used to reduce the amount of C and O impurities of metallorganic chemical vapor deposition titanium nitride (MOCVD-TiN) films. This study found that the sheet resistance of as-deposited MOCVD-TiN film without N₂/H₂ plasma treatment dramatically increased with exposure time due to moisture adsorption. Increasing plasma treatment power and time was able to retard the increase in sheet resistance. From residue gas analysis at 200 °C, it was found that the amount of H₂O outgases from the MOCVD-TiN films decreased with increasing plasma treatment power and time. TEM images reveal that the surface of the MOCVD-TiN films became compact as it received more plasma treatment energy, making it difficult for the external moisture to diffuse into and react with the MOCVD-TiN films.     

Characteristics of nano-crystalline diamond films prepared in Ar/H2/CH4 microwave plasma

Characteristics of nano-crystalline diamond (NCD) thin films prepared with microwave plasma chemical vapor deposition (CVD) were studied in Ar/H₂/CH₄ gas mixture with a CH₄ gas ratio of 1-10% and H₂ gas ratio of 0-15%. From the Raman measurements, a pair of peaks at 1140 cm^− 1 and 1473 cm^− 1 related to the trans-polyacetylene components peculiar to nano-crystalline diamond films was clearly observed when the H₂ gas ratio of 5% was added in Ar/H₂/CH₄ mixture. With an increase of H₂ gas content up to 15%, their peaks decreased, while a G-peak at roughly 1556 cm^− 1 significantly increased. The degradation of NCD film quality strongly correlates with the decrease of C₂ optical emission intensity with the increase of hydrogen gas contents. From the surface analysis with atomic force microscopy (AFM), it was found that grain sizes of NCD films were typically of 10-100 nm in case of 5% H₂ gas addition.     

Characterization of ZnO-In2O3 transparent conducting films by pulsed laser deposition

Transparent conducting oxide (TCO) films in the ZnO-In₂O₃ system were prepared by a pulsed laser deposition method. A target that consists of the mixture of ZnO and In₂O₃ powders was used. Influences of the target composition x (x = [Zn]/([Zn] + [In])) and heater temperature on structural, electrical and optical properties of the TCO films were examined. Introduction of oxygen gas into the chamber during the deposition was necessary for improvement in the transparency of the deposited films. The amorphous phase was observed for a wide range of x = 0.20-0.60 at 110 °C. Minimum resistivity was 2.65 × 10⁻⁴ Ω cm at x = 0.20. The films that showed the minimum resistivity had an amorphous structure and the composition shifted toward larger x, as the substrate temperature increased. The films were enriched in indium compared to the target composition and the cationic In/Zn ratio increased as the substrate temperature was increased.     

Growth and characterization of Bi2Se3 thin films by pulsed laser deposition using alloy target

Bi₂Se₃ thin films were deposited on the (100) oriented Si substrates by pulsed laser deposition technique at different substrate temperatures (room temperature −400 °C). The effects of the substrate temperature on the structural and electrical properties of the Bi₂Se₃ films were studied. The film prepared at room temperature showed a very poor polycrystalline structure with the mainly orthorhombic phase. The crystallinity of the films was improved by heating the substrate during the deposition and the crystal phase of the film changed to the rhombohedral phase as the substrate temperature was higher than 200 °C. The stoichiometry of the films and the chemical state of Bi and Se elements in the films were studied by fitting the Se 3d and the Bi 4d5/2 peaks of the X-ray photoelectron spectra. The hexagonal structure was seen clearly for the film prepared at the substrate temperature of 400 °C. The surface roughness of the film increased as the substrate temperature was increased. The electrical resistivity of the film decreased from 1 × 10⁻³ to 3 × 10⁻⁴ Ω cm as the substrate temperature was increased from room temperature to 400 °C.