快速固化环氧胶用聚酰胺固化剂的合成及性能

采用熔融缩聚法合成新型聚酰胺,以二乙烯三胺、三乙烯四胺、二酸为原料制备聚酰胺,并对聚合产物结构进行了红外表征。讨论了反应温度、反应时间、原料配比对产物性能的影响,研究环氧树脂固化剂的最佳制备工艺,最后将文章合成的聚酰胺固化剂与二氨基二苯砜配制成复合固化剂。重点讨论复合固化剂的最佳配比及使用复合固化剂制备胶粘剂时,其最佳固化剂配比,通过实验方法确定胶膜在(150-170)℃下,10min内可完全固化。结果表明:当酸胺的物质量的配比为1:2时,酰胺化反应在180℃反应2h,所得固化剂的性能最好;复合固化剂4,4’一二氨基二苯砜(DDS):聚酰胺(PA)最佳配比为1:5时,环氧树脂与复合固化剂的质量比为10:1时,制备的环氧快速固化包封膜在(150-170)℃下,10min固化条件下,剥离强度为1.35N/mm,性能优良。制备的快速固化环氧包封膜固化速度快,综合性能良好,具有较高的剥离强度、合适的溢胶量、良好的耐焊性和耐酸碱性能,满足FPC生产的要求。     

覆铜板技术（6）

3.9环氧树脂的固化剂(Hardner for EpoxyResin) 环氧树脂通过固化剂进行交联、固化。固化剂不同于催化剂,它与环氧树脂相互交联,成为树脂的组成部分。在环氧树脂固化过程中,固化剂起到架桥剂(交联固化)和催化剂(促进固化)的双重作用。     

FR-4型覆铜板层压成型技术探讨

覆铜板压制成型是在层压机上完成的,粘结变为粘流态。随着温度逐步升高,树脂开始发生固化反应,粘度逐步增大。当到达凝胶点时,粘度迅速增大。双氰胺是一种潜状型固化剂,在有促进剂存在下60℃开始缓慢和环氧树脂起固化反应,到达120℃以后,反应速度加快,到150～155℃反应达高峰。在此过程中,高分子物逐步交联固化,高分子物由粘流态转     

扩链剂对光固化水性聚氨酯性能的影响

本研究通过向体系中引入有机胺类化合物,合成新型的光固化水性聚氨酯。对异佛尔酮二胺(IPDA)、二乙烯三胺(DETA)、乙二胺(EDA)三种扩链剂的耐水性、机械性能进行了研究,并应用与纸张表面,对纸张性能进行了讨论,探究出性能最优的扩链剂。     

浅谈紫外光(UV)涂料在手机上的应用

随着近年来无线通讯的长足发展,手机的款式层出不穷,不光功能越来越强大,外观也越做越靓,或光彩夺目,或清爽怡人,或纤尘不染、光可鉴人,或典雅含蓄、极富质感,让人目不暇接。这些变化,得益于紫外光(UV)固化涂料在手机生产上的应用。 什么是紫外光(UV)固化涂料? 紫外光固化高分子涂料(Ultraviolet Curing Coating)简称UV涂料,它是利用紫外光作为固化能源,在常温下引发涂料不同组份分子间发生化学反应,而在瞬间快速交联成膜的一种新型高分子环保涂料。产品不含有机溶剂,主要成份属于高分子树脂或单体脂类,     

FR-4覆铜板生产技术(连载三)

(二)环氧树脂的环氧值与环氧当量环氧树脂是一种热塑性树脂,它必须加入固化剂以后才能固化成为我们需要的产品。产品的性能与环氧树脂的种类,所选固化剂的种类、固化剂的使用量及固化工艺条件密切相关。固化剂的用量通常应用当量定律,按同化剂的胺当量和环氧当量进行等当量反应,通过环氧树脂的环氧值或环氧当量,来计算配方中选用的环氧树脂的用量和固化剂的     

光固化时间对白光LED光学性能影响

在贴片式白光LED封装中的荧光粉涂覆环节采用光固化的方法,研究UV固化时间对LED光学性能的影响。实验选取了九种固化时间,对封装出来的样品进行外观物理特性的观察测试并对完全固化的样品进行恒流老化和光度色度参数测试。结果表明:固化时间大于120 s时胶体基本固化;不同固化时间样品的峰值波长、色温、显色指数的最大值与最小值分别平均相差约1.2 nm、200 K、1.3个单位;固化时间大于210 s时,光通量的衰减率明显大于其他固化时间。该光固化胶在106.6 mW/cm2的紫外光功率密度下,固化120~180 s较为合适。从光学的角度探讨固化时间对LED性能的影响,对光固化技术在LED封装上的应用具有指导意义。     

一种中温固化环氧覆盖膜的制备

文章介绍了一种中温固化环氧胶粘剂,其特征在于选择两种混合环氧树脂为基体树脂,丁腈橡胶作为该胶粘剂的增韧剂,选用自制的对甲苯双胍作为环氧树脂固化剂。通过差式扫描热分析(DSC)分析表明,该胶粘剂能在1 30℃完全固化;热重分析仪(TG)分析显示该胶粘剂的固化物的性能有较好的耐热性和一定的阻燃性。将该胶粘剂用于覆盖膜中,储存期实验表明该环氧胶覆盖膜有较好的室温储存期;性能测试实验表明,该环氧胶覆盖膜有较好的综合性能,是一种有一定实用性的中温固化环氧覆盖膜。     

精细电路连接用紫外光固化各向异性导电胶

为适应高密度超细线路连接的需要,研究了紫外光固化各向异性导电胶。得到了可以用UV(紫外光)有效固化的各向异性导电胶(ACA)。通过对固化过程和应用于氧化铟锡连接实验的分析,研究了各组分在体系中的作用和添加量对导电胶的连接性能和导电性能的影响。结果表明,紫外光固化各向异性导电胶为液晶显示(LCD)和电致发光显示(ELD)技术提供了一种新的连接方式。     

固化剂对环氧模塑料固化反应的影响研究

本文以邻甲酚醛环氧树脂(EOCN)和三种不同性质线型酚醛树脂PN-A,PN-B和PN-C制备成的环氧模塑料(EMC)为研究对象。通过分析这三种性质不同的固化剂对环氧模塑料性能的影响,并用差热扫描量热仪(DSC)对整个固化反应过程进行了研究。结果表明:环氧模塑料的性能不仅受到固化剂的影响,还受到整个固化反应过程中反应焓的影响。     

Curing Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package Process

Temporary bonding adhesives for a three-dimensional (3D) multichip package process have been synthesized. To enhance the thermal stability, the adhesives used a fluorinated silicon urethane acrylic binder and ultraviolet (UV) curing for crosslinked network structures. Focusing on different photoinitiator contents and UV doses, the UV-curing behaviors and thermal stability were studied using Fourier-transform infrared spectroscopy attenuated total reflectance, gel fraction, swelling ratio, shrinkage, and thermogravimetric analyses.     

活性酯固化环氧基高介电常数覆铜板的研制简

当前各界对于天线设计的重点在于小型化、结构简单化及多频或宽带。高介电常数基板可以缩小微波辐射波长,达到天线小型化的目的。采用活性酯作为环氧树脂的固化剂,活性酯固化剂分子中有两个或多个具有较高活性的酯基,可以同环氧树脂进行固化反应。在同环氧树脂反应时形成不含仲醇羟基的网架,所以固化后的环氧树脂具有低的介电损耗和吸水率。采用高介电常数填料作为功能填料。研制的高介电常数覆铜板具有低的热膨胀系数、低的介电损耗和低的吸水率。     

Ultrafast UV-Curable Adhesives for Optical Pick-Ups

This paper describes novel ultraviolet (UV)-curable adhesives with an ultrafast curing rate which are fully cured within 8 s for optical pick-up (OPU) applications. Two kinds of oligomers (novolac epoxy acrylate and urethane acrylate), additives, and inorganic fillers were prepared for the formulation of the adhesives. In addition, three kinds of photo-initiator [2,2-dimethoxy-2-phenylacetophenone and 2-hydroxy-2-methylpropiophenone for surface curing and (2,4,6-trimethylbenzoyl) diphenyl phosphine oxide (TMDPO) for deep curing] were mixed to increase the curing rate. Photo-differential scanning calorimetry (photo-DSC) analyses showed that the newly formulated UV adhesives had faster curing rate than conventional UV adhesives. The UV adhesives were applied to OPUs for DVD/CD-RW, and five kinds of reliability tests, i.e., thermal shock, low-temperature storage, high-temperature storage, high temperature/high humidity, and nonoperation shock tests, were conducted to evaluate the adhesive reliability. According to the results of reliability tests and thermal stress simulations, the UV adhesives with lower storage modulus (E′) showed better thermal shock reliability due to lower thermal stresses. In addition, OPUs assembled using the UV adhesives passed all reliability tests. Consequently, the UV adhesives were successfully applied to OPUs in OPU production lines, contributing to mass production.     

片式电阻用有机聚合物电子浆料研制

通过选择与优化有机树脂、固化剂、溶剂、填料等,开发了片式电阻用的系列有机聚合物电子浆料。该系列浆料包括端涂银导体浆料、包封介质浆料、标志浆料。采用厚膜印刷工艺,200℃固化。浆料中铅含量小于1×10–4。端涂银导体浆料固化膜耐酸性好,附着力高;包封介质浆料固化膜层平整致密,且绝缘电阻≥104MΩ,击穿电压≥500 V;标志浆料细线分辨率好。     

Phase-separated polydimethylsiloxane as a dielectric surface treatment layer for organic field effect transistors

We suggest a novel method for treating the surfaces of dielectric layers in organic field effect transistors (OFETs). In this method, a blend of poly(9,9-dioctylfluorene-alt-bithiophene) (F8T2) and dimethylsiloxane (DMS) with a curing agent is spin coated onto the surface of a dielectric substrate, silicon oxide (SiO₂), and then thermally cured. X-ray photoelectron spectroscopy, contact angle measurements, and morphology analysis were used to show that the hydrophilic DMS layer is preferentially adsorbed on the SiO₂ substrate during the spin coating process. After thermal curing, the bottom DMS layer becomes a hydrophobic PDMS layer. This bottom PDMS layer becomes thinner during curing due to the upward motion of the hydrophobic PDMS molecules. The FET mobility of the cured system was 10^?2 cm²/Vs, which is similar to that of polymeric semiconductors on octadecyltrichlorosilane treated SiO₂ dielectric layers. We also discuss the possibility of using this blend method to increase the air-stability of polymeric semiconductors.     

喷墨打印用超支化聚酯阻焊剂的制备与表征

喷墨打印阻焊剂自研发以来,因树脂油墨剪切变稀和触变性等特点,一直不能有效解决阻焊剂喷墨初始阶段稳定性问题。对此,本研究以BoltornH2O为原料,合戍了一种超支化丙烯酸化合物,在与TMP3EOTA及UV固化剂混合后,可以获得稳定性好的阻焊油墨,在光源照度1w／cm2条件下固化速度低于20S,固化膜的热分解温度超过300℃,阻焊膜的其他性能符合IPC—SM-840C和CPCA4306—2011等相关标准。     

Rapid curing of positive tone photosensitive polybenzoxazole based dielectric resin by variable frequency microwave processing

High performance polymer dielectrics such as polyimides and polybenzoxazoles are used for several applications in the semiconductor industry due to their excellent dielectric and thermomechanical properties. However, these materials require curing at high temperatures for long periods of time in order to achieve the desired properties. High temperature exposure for long periods of time can be detrimental to device characteristics and reliability. In this study, rapid low temperature curing of a positive tone photosensitive polybenzoxazole based dielectric resin by variable frequency microwave (VFM) processing was investigated. The chemical changes occurring in the film during the condensation reaction and the percent conversion achieved as a function of cure condition were monitored by Fourier transform infrared spectroscopy. The effectiveness of rapid VFM curing was studied by characterizing the optical, electrical, and thermomechanical properties of VFM cured films with thermally cured films. The thermal stability of cured films was investigated by thermal gravitational analysis (TGA) and mass spectrometry (MS) studies. The results showed that a higher percent conversion and higher thermal stability can be achieved by using VFM processing than can be obtained using conventional thermal curing at the same cure temperature. However, the complete removal of photopackage related residual products requires slow ramp rates and long cure times.     

多层印制电路板网印内埋电阻技术研究

利用网印导电碳浆的方法制作电阻,通过层压工艺实现电阻在多层印制电路板中的内埋.研究了导电碳浆的固化温度及固化时间与电阻值的关系,分析了导电碳浆固化程度及棕化后烘板对层压工艺可靠性的影响,测试了高温高湿与冷热冲击对内埋电阻阻值稳定性的影响.结果表明:导电碳浆固化条件选择固化温度170℃,固化时间4h,以及棕化后105℃烘...     

Moisture absorption in uncured underfill materials

This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride [methylhexahydrophthalic anhydride (MHHPA)] and epoxy cured with non-acid anhydride curing agent. The influence of absorbed moisture on curing properties, thermomechanical property, and adhesion property of underfill after curing has been investigated. For epoxy cured with non-acid anhydride, the moisture absorption is low, and the absorbed moisture has no significant effect on the properties of cured underfill materials. For epoxy cured with acid anhydride, the moisture absorption before curing can be more than 2.0%, and the absorbed moisture can affect the properties significantly. The absorbed moisture can catalyze the curing reaction between acid anhydride and epoxy. The glass transition temperature of the cured samples is reduced after the underfill absorbs the moisture before curing. The adhesion strength decreases dramatically after the underfill absorbs the moisture before curing.