TMS320C6000系列DSP的Flash引导研究

文中对TI公司的TMS320C6000系列DSP（数字信号处理器）的Flash引导方式进行了研究,详细阐述了DSP Flash引导模式的实现原理及引导过程,链接命令文件的编写,和如何实现基于第二Bootloader的Flash引导。在实际工程应用中,以TMS320C6202B型DSP和SST39VF800A型Flash为目标系统,根据实际使用经验,由浅入深,从简单到复杂,着重强调了C6XOX与其它C6000芯片在内部存储器结构上的不同而导致Flash引导上的差异,并编写了相应的汇编代码程序,成功实现了基于复制表的第二Bootloader Flash引导,系统运行稳定可靠,表明了该引导方法行之有效。     

TMS320VC55x系列DSP在线烧写方法研究

TMS320VC55x系列DSP是TI公司在TMS320C54x基础上推出的新一代低功耗DSP。由于该系列DSP没有片内Flash,所以程序的加载方法是必须解决的问题。阐述了TMS320VC55x系列DSP的片外Flash在线编程方法,给出了系统的硬件连接方法和烧写程序,并研究了自举引导的实现方法。     

TMS320VC55x系列DSP在线烧写方法研究

TMS320VC55x系列DSP是TI公司在TMS320C54x基础上推出的新一代低功耗DSP.由于该系列DSP没有片内Flash.所以程序的加栽方法是必须解决的问题.阐述了TMS320VC55x系列DSP的片外Flash在线编程方法,给出了系统的硬件连接方法和烧写程序,并研究了自举引导的实现方法.     

TMS320VC5501在线烧写FLASH并自举启动方法研究

为了解决C55X系列DSP系统程序代码的保存问题,文中设计了一种利用JTAG接口,在线烧写DSP片外Flash并实现自举启动的方法。这种在线编程方法利用EMIF接口将TMS320VC5501和FLASH芯片相连接,通过搬移程序将应用程序的已初始化段按照C55X系列DSP引导表格式烧写进外部扩展的FLASH存储器中．从而实现自举启动。该方法为DSP系统的软件维护和升级带来了方便,具有实际应用价值。     

一种基于TMS320VC5402扩展外部Flash的方法

介绍了TMS320VC5402内部存储器的组织及其扩展Flash的硬件接口设计。通过TMS320VC5402的并行自举引导功能，介绍了引导装载方法的实现。     

TMS320C6701 DSP的程序引导方法及编程实现

在简要介绍TMS320C6701 DSP常用的程序引导方法的基础上,重点介绍了TMS320C6701DSP程序的ROM引导方法的原理、编译链接时命令文件的编写,以及将编译链接后得到的COFF文件格式转换成DSP外围ROM芯片识别的十六进制文件格式所需的命令文件的编写。在实际工程应用中,以实现TMS320C6701 DSP系统的Flash程序引导为目的,分析了Flash存储器的读写操作,编写了完整DSP Flash引导的程序,成功地实现了TMS320C6701 DSP程序的Flash引导方法,证明了该引导方法的可行性和有效性。     

TMS320VC55x系列DSP的Flash引导方法研究

以实际系统开发为背景,阐述了TMS320C55x系列DSP的Flash在线编程方法,给出了系统的硬件连接和完整的烧写程序,并研究了自举引导的实现方法以及大程序的二次引导方法.     

TMS320C6000系列带中断向量表的二次Bootloader的设计与实现

通过Flash存储器引导DSP(数字信号处理器)系统(Bootloader)是实际应用中常用的一种方式,但随着DSP程序规模的不断扩大,越来越需要更加灵活的引导方式。文中以TI公司高性能DSP芯片TMS320C6000系列为例,介绍了从Flash存储器进行引导、带中断向量表的二次Bootloader的新途径,突破了程序引导的结构障碍,从而为TMS320C6000系列DSP的开发提供了一种新的思路。该方法已在实际工程中得到具体应用,系统运行稳定可靠。     

基于429总线的TMS320F2812程序的远程加载技术

介绍了TI公司数字信号处理器TMS320F2812的引导方式、Flash编程方法、Flash启动流程。在此基础上提出了一种基于429总线的TMS320F2812程序的远程加载方案,并详细阐述了软硬件的实现过程。该方案摆脱了Flash编程时对JTAG接口、RS232接口的依赖,非常适用于军用领域,具有较大的实用价值。     

基于CAN总线的TMS320F2812程序更新技术

介绍了TI公司数字信号处理器TMS320F2812的引导方式、Flash编程方法、Flash启动流程。在此基础上提出了一种基于CAN总线的TMS320F2812程序的远程加载方案,并详细阐述了详细的实现过程。该方案摆脱了Flash编程时对JTAG接口、RS232接口的依赖,非常适用于军用领域,具有较大的实用价值。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks