Deep photo-lithography characterization of SU-8 resist layers

SU-8 layers of different thickness that were formed by spinning and soft baking or a casting process with a solvent content of not more than 4% were used for experimental investigation of deep UV lithography using modified radiation of a mercury lamp. The specific absorbance of the SU-8 layers have been measured in dependence on the wavelength to calculate the power of the absorbed radiation as a function of depth in the resist layer. The resist layers which were formed on a photo-mask have been exposed with a variation of exposure dose to study the residual thickness of the resist. There are threshold exposures for the formation of insoluble SU-8 resist layer and for the disappearance of shrinkage of the resist layer, which depends on the size of the irradiated area, on microstructure topology and on the resist thickness for fixed parameters of pre- and post-exposure baking. It has been shown that exact filtration of a low-intensity band of exposure radiation at 334 nm allows to reduce strong diffraction distortion in the upper layer of the resist. Microstructures with an aspect ratio of 25 in a SU-8 resist layer of 1 mm thickness have been obtained using a 100 m thick SU-8 resist layer as a filter for the UV radiation and with optimal dose of exposure.     

SU-8 as resist material for deep X-ray lithography

 A new negative tone resist for deep X-ray lithography is presented. This resist is a nine parts to one mixture of the EPON SU-8 resin with 2,2-bis-(3,5-dichloro-4-hydroxyphenyl)propane (Tetrachlorobisphenol A, TCBA), the latter acting as the photoinitiator. The resist was irradiated at the synchrotron source of DCI at LURE. It was dried for 7 to 20 days beforehand over silica gel while under a light vacuum (20 mbar). Best results for a 150 μm high resist were obtained with a X-ray bottom dose of 3 kJ cm⁻³ and a post exposure bake at 33 °C. Differential Scanning Calorimetry measurements (DSC) determined the glass transition temperature of the resist. The glass transition for the undried, loose resist was 34.7 °C, and it was 28.7 °C when the resist was pressed on a silicon substrate. For a sample of the dried resist, the glass transition was 33.4 °C for the loose resist and 29.8 °C when it was pressed on a Silicon substrate. CD measurements were made on top surface of a set of 100 μm long columns structures, which were produced in 150 μm of this resist. These structures have a constant 100 μm pitch, and the structures themselves varied in width from 20 to 17 μm. For these structures, the CD was calculated to be 0.15 ± 0.03 μm. Received: 8 February 2000/Accepted: 3 March 2000     

Micro molding for double-sided micro structuring of SU-8 resist

Advances in micro and nano fabrication technologies for MEMS require high-level measurement techniques with regard to sampling and sensitivity. For this purpose at the Institute of Microtechnology (IMT) highly sensitive piezoresistive 3D force sensors based on SU-8 polymer have been developed. In this paper we present an improved micro fabrication process for a double-sided micro structured design. The sensors are produced by multilayer processing techniques such as UV lithography and coating methods. The double-sided micro structured design demands a photoresist application method which simultaneously features a top side structuring and a casting from a mold. We use a new micro molding process to meet the demands. The micro fabrication technology is described, focusing on the development of the molding structure for shaping of the bottom side and a capable release process for the detachment of the molded structures. The fabrication process of the SU-8 mold layer is optimized to fabricate molding structures with heights from a few μm up to 350 μm. Therefore different SU-8 formulations, namely with classification numbers 5, 25, 50, and 100, have been used. The fundamental limitations for the mold design result from the lithography process, which defines the smallest lateral resolution, and from the characteristics of a molding process, e.g. the impossibility to realize an undercut. To allow for reliable release, the molding structures have to be coated with a sacrificial layer. Silicon nitride is deposited onto the substrate with accompanying monitoring of the deposition temperature during the PECVD process.     

Nickel and copper electroplating of proton beam micromachined SU-8 resist

 Proton beam micromachining (PBM) has been shown to be a powerful technique to produce three-dimensional (3D) high-aspect-ratio microstructures (Watt et al., 2000). Potential commercial applications of PBM, which is a fast direct write technique, will become feasible if the fabrication of metallic molds or stamps is realised. Metallic components can be produced by electroplating a master from a microstructure produced in resist. The production of high-aspect-ratio metallic stamps and molds requires a lithographic technique capable of producing smooth and near 90° sidewalls and a one to one conversion of a resist structure to a metallic microstructure. PBM is the only technique capable of producing high-aspect-ratio microstructures with sub-micron details via a direct write process. In PBM, SU-8 (Lorenz et al., 1997) resist structures are produced by exposing the SU-8 resist with a focused MeV proton beam followed by chemical development and a subsequent electroplating step using Ni or Cu. The data presented shows that PBM can successfully produce high-aspect-ratio, sub-micron sized smooth metallic structures with near 90° sidewall profiles. Received: 10 August 2001/Accepted: 24 September 2001     

Process research of high aspect ratio microstructure using SU-8 resist

SU-8 is a negative, epoxy type, near-UV photoresist. This resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications using standard lithography equipment. However, in practice, SU-8 has shown to be very sensitive to process parameter variation. The orthogonal array was used in our experiments in order to improve the lithography quality and analyze the interaction among the parameters. The analyses show that the interaction between the exposure dose and post exposure bake has played an important role in adhesion between SU-8 resist and the substrate. The proposed process conditions are given. The output structure has straight sidewall profile, fine line and good space resolution. The aspect ratio is larger than 20. Moreover, several metallic films are used as substrates. The Ti film with oxidation treatment was found to have the strongest adhesion to the resist. The result will help to open possibilities for low-cost LIGA-type process for MEMS applications.     

Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist

 An innovative method for fabrication and rapid prototyping of high-aspect ratio micromechanical components in photoresist is discussed. The photoresist is an epoxy-negative-tone resist, called SU-8, which can be structured to more than 2 mm in thickness by UV exposure. Small gears of 530 μm in diameter and 200 μm in thickness have been realized in this photoplastic and their functionality has been demonstrated. In addition a process called MIMOTEC^TM (MIcroMOlds TEChnology) has been established for the fabrication of metallic micromolds. MIMOTEC^TM is based on the use of the SU-8 spun on high thicknesses and electrodeposition of nickel. Thermoplastic microcomponents have been injected and mounted in watches. Received: 25 August 1997/Accepted: 23 October 1997     

Fabrication and preliminary testing of X-ray lenses in thick SU-8 resist layers

Deep X-ray lithography processing of SU-8 negative resist layers with thicknesses of up to 1 mm and physical-chemical properties of SU-8 polymer structures were investigated to find the optimum conditions for the fabrication of X-ray refractive lenses. The exposure was carried out at the ANKA storage ring in Karlsuhe, Germany. Experimental tests of the lenses were performed at the ESRF in Grenoble, France. First lenses showed a gain in the range of 20, a full width at half maximum of the focal spot intensity of approximately 2 m to 3 m and unique radiation stability of the optical characteristics.     

Adhesive bonding with SU-8 in a vacuum for capacitive pressure sensors

This paper describes a method for fabricating capacitive pressure sensors through the use of adhesive bonding with SU-8 in a vacuum. The influence of different parameters on the bonding of structured wafers was investigated. It was found that pre-bake time, pumping time, and the thickness of the crosslink layer are the most important factors for successful bonding. Bonding quality was evaluated by inspection through the transparent glass of the sensor and through the use of an SEM photograph, with 90% of the area successfully bonded and an ultimate yield of 70% of the sensors. The measured bonding strength was 17.15 MPa and 19.6 MPa for wafers bonded in 80 °C and 100 °C, respectively. The pressure–capacitance characteristic test results show that this bonding process is a viable micro electro mechanical systems (MEMS) fabrication technology for cavity sealing in a vacuum.     

Simulation of deep UV lithography with SU-8 resist by using 365 nm light source

The deep lithography of thick resist layer is the primary step of LIGA technology. UV Proximity lithography, which is used to fabricate high aspect ratio MEMS normally, is investigated in this paper. The light intensity distribution in the thick photoresist layer mainly depends on the diffraction produced by the gap between mask and wafer in proximity lithography. Fresnel diffraction model is used to simulate lithography process normally, which the thin photoresist layer is used in the lithography process. But it is not accurate in deep lithography process. A correction to the Fresnel diffraction theory is used to simulate the lithography process depending on the scalar diffraction theory of light propagation in this paper. The difference of this two models is given in this paper. The simulation results show that the corrected model can obtain more accurate simulation results than the Fresnel diffraction model. The experiment results and the theory analysis both indicate that: the structure contrast decreases with the increase of the film thickness. The smaller the structure linewidth is, the faster the structure contrast decreases. The linewidth of microstructure is not equivalent from the top to the bottom, broaden in the middle part normally. The theory simulation gives the quantitative analysis.This work was supported by of China 973 Program (No. 1999033109).     

基于SU-8的微流沟道的设计和制作

以SU—8作为结构材料,采用紫外光刻工艺,尤以斜曝光工艺为主,制造一种新型的、小型化的、低成本的、三维的、高深宽比的微流沟道,微流沟道的高度约为1100μm。初步确定出加工此微流沟道结构所需要的曝光计量、前烘时间、后烘时间和显影时间以及工艺方法,为加工其他尺寸的微流沟道提供参考。基于此方法加工的微流沟道可以应用在微型流式细胞仪上,来提供红细胞计数、血色素浓度、血小板计数和红细胞单元指数等参数。     

UV-LIGA interferometer biosensor based on the SU-8 optical waveguide

SU-8 resist was used as a core/cladding waveguide material to fabricate a Mach–Zehnder interferometer (MZI) for biochemical sensing. The refractive index of the SU-8 resist was fine-tuned with a Δn of 0.004 for single-mode transmission. The UV lithography processes of the SU-8 resist were also optimized to pattern the high resolution (1 μm) and high aspect ratio (A_R = 6) Y-branch structure of the optical interferometer. Optical measurements reveal that the SU-8 MZI chip can efficiently transmit the NIR laser (λ = 1310 nm) with a total loss less than 6 dB. When one branch of the MZI is in contact with the analyte, the interfered intensity stabilizes after the soaking time exceeds 5 min. NaCl solution with a concentration of 10⁻⁹ g/l can be detected using the SU-8 MZI chip. In the future, the polymer MZI chip can be mass-produced by molding process (or the LIGA process). The low-cost, label-free, real-time and high-sensitivity MZI chip will benefit many applications related to biological, environmental and industrial detection.     

SU-8: promising resist for advanced direct LIGA applications for high aspect ratio mechanical microparts

A case study of use of negative type SU-8 X-ray sensitive resist for fabrication of advanced, highly precise, ultra tall direct LIGA mechanical microparts is presented in this paper. Using direct LIGA technique, ～1 mm tall highly precise metallic gear wheels are being fabricated, previously using PMMA based process. Starting from a non-optimized non-satisfying SU-8 process, significant process parameters for process optimization were identified using statistical design of experiment. By varying the significant process parameters, SU-8 process was further optimized with respect to critical aspect of sidewall bow and tilt of metallic structures. After the optimization, metallic parts fabricated using SU-8 process showed comparable quality as those fabricated using PMMA based process.     

SU-8 Optical Accelerometers

This paper presents the optimization and characterization of SU-8 quad beam optical accelerometers based on intensity modulation. An applied acceleration causes a misalignment between three waveguides, resulting in variation of losses. Mechanical simulations have focused on the evaluation of sensitivity and the design of a robust junction between the mechanical beams and the inertial mass. Results demonstrate that perfectly rounded structures show at least 4.4 times less stress than L-shaped counterparts. Optical simulation predicts that the optimal configuration in terms of sensitivity is obtained when the waveguides are not completely misaligned, since then losses are insensitive to variations in acceleration. Numerical sensitivities ranging between 11.12 and 32.14 dB/g have been obtained. Fabrication has been simplified, now requiring only two photolithographic steps and electroplating Cu as a sacrificial layer. Experimental results show a reproducible experimental sensitivity of at least 13.1 dB/g     

Design and fabrication of a SU-8 based electrostatic microactuator

Comb-drive microactuator is widely used in MEMS devices and traditionally is made of silicon as structural material using silicon-based fabrication technology. Recent development in UV lithography of SU-8 has made it possible to fabricate the ultra high aspect ratio microstructures with excellent sidewall quality. In this paper, we report a low cost alternative to the silicon-based comb drive by using cured SU-8 polymer as structural material. The microactuator was designed to have a integrated structure without assembly or bonding. A unique integration fabrication process was successfully developed based on UV lithography of SU-8 and selectively metallizing SU-8 polymer structures. Preliminary experimental results have proved the feasibility of the microactuator and the fabrication technology.     

Comparison of PMMA and SU-8 resist moulds for embossing of PZT to produce high-aspect-ratio microstructures using LIGA process

 In this paper results are presented from a range of experiments to explore the feasibility of inserting a ceramic material PZT (lead zirconium titanate) into different kinds of high-aspect-ratio resist moulds. Polymethylmethacrylate (PMMA) and SU-8 on silicon substrates and free-standing SU-8 membranes with micro-cavities or through-holes (defined by X-ray lithography) have been used as moulding medium. Processing conditions for the resist materials including pre-bake, exposure, post-bake, development and stripping have been compared. The advantages of different types of resist mould for the LIGA process has been evaluated. Additionally a comparison of photosensitivity of PMMA and SU-8 has been carried out. Using a range of load pressures (5 to 60 MPa), appropriate conditions for PZT embossing into resist moulds have been determined (ensuring minimum void formation in the final PZT structures). In the final form, SU-8 moulds have been removed by laser ablation. This is the first reporting of high-aspect-ratio ceramic microstructures fabricated using a combination of SU-8 moulds and PZT embossing. Received: 10 August 2001/Accepted: 24 September 2001     

2-DOF vibratory gyroscope fabricated by SU-8 based UV-LIGA process

This paper reports fabrication of 2-DOF vibratory gyroscope using SU-8 based UV-LIGA process. The device structure is designed to be symmetrical in order to match the resonance frequencies of drive and sense mode oscillators and also to minimize their relative temperature dependent drift. The overall arrangement is such that the two vibration modes do not affect each other and therefore, mechanical decoupling is achieved which helps in minimizing bias drift. The design is optimized to be compatible with the UV-LIGA process having 10 μm thick electroformed nickel as structural layer. Photolithography to create 11 μm thick SU-8 molds for electroforming sacrificial copper and structural nickel layer is optimized using multiple exposure technique that ensures near vertical side walls. Since the highly cross-linked SU-8 remaining after development is difficult to remove reliably from high aspect ratio structures without damage or alteration to the electroformed metals, a 2.45 GHz MW plasma etching process is developed with CF₄/O₂ mixes. The fabricated device is checked for off-plane misalignment between the stationary and movable comb fingers using white light interferometry and it is found to be almost negligible. Also, the prototype device is characterized for amplitude and phase spectral responses using Polytec MSA-500 Micro System Analyzer. The drive and sense mode resonance frequencies are observed at 7.3 and 7.1 kHz respectively against the mode matched designed frequency of 7.5 kHz.     

Microfabrication of an electromagnetic power relay using SU-8 based UV-LIGA technology

Most of the MEMS relays reported in the field now are based on silicon fabrication and cannot be used for power applications. In this paper, we report a research effort to microfabricate an electromagnetic relay for power applications using a multilayer UV-LIGA process. A mechanically wrapped coil was used and very simple design for the magnetic circuit was adopted to increase the design flexibility and performances. The broad material selection and the capability of making high aspect ratio microstructures of the UV-LIGA make the technology best suited for fabricating microelectromechanical relays for power applications. The prototype relay has a truly three-dimensional structure and very suitable for large power capacity applications.The research work reported in this paper was made possible by support from National Science Foundation under grant ECS-#0104327; Louisiana Board of Regents, National Aeronautics and Space Administration, and the Louisiana Space Consortium under agreement NASA/LEQSF (2001–2005)-LaSPACE, and NASA/LaSPACE under grant NTG5–40115. The authors would also like to thank the Center for Advanced Microstructures and Devices of LSU for the use of the cleanroom facility.     

In situ fabrication of SU-8 movable parts by using PAG-diluted SU-8 as the sacrificial layer

In this paper we proposed a novel technology to make SU-8 movable parts in situ by using PAG-diluted SU-8 or SU-8R, a SU-8 solution with no photoacid generator (PAG) content, as the sacrificial layer. Since they are not or less sensitive to UV light the unexposed bottom layer in UV lithography will be dissolved to release the movable components during the final develop in PGMEA (Propylene Glycol Monomethyl Ether Acetate). The use of PAG-diluted SU-8 or SU-8R as a sacrificial layer offers several advantages including significant reduction in processing steps. It becomes the simplest technique currently available for in situ fabrication of SU-8 movable parts. In this paper the lithographic sensitivities of SU-8 as a function of the PAG concentration, detailed fabrication process and examples of fabricated SU-8 movable parts will be presented.     

SU-8胶微结构的尺寸公差研究

对SU-8胶微结构的尺寸及其公差进行了定量研究.在考虑了SU-8的吸收系数和折射系数对紫外光刻尺寸精度影响的基础上,根据菲涅耳衍射理论建立了紫外曝光改进模型和尺寸公差模型,对SU-8微结构的尺寸及其公差进行数值模拟.以硅为基底,进行了SU-8胶紫外光刻的实验研究.实验中掩模的特征宽度分别取50 μm、100μm、200μm和400 μm,SU-8胶表面的曝光剂量分别取400mJ/cm2和800mJ/cm2,测量了SU-8胶微结构的顶部线宽、底部线宽和SU-8胶的厚度,数值模拟结果与实验结果基本吻合.可以用本文的模型来预测SU-8微结构的尺寸及其公差.