共查询到3条相似文献,搜索用时 15 毫秒
1.
Tong Hong Wang 《Microelectronic Engineering》2010,87(12):2463-2467
Thermal analysis was performed in this work to compare the thermal performance of a board-level high performance flip-chip ball grid array package equipped with solid Cu or vapor chamber (VC) as the heat spreader and Al-filler gel or In solder as the thermal interface material (TIM). The effect of different heat source sizes was also examined. Numerical results indicate that for the particular test vehicle under a power dissipation of 160 W, the thermal performance is remarkably enhanced by switching TIM from Al-filler gel to In solder while the enhancement by using VC instead of solid Cu heat spreader is only observable when In solder is incorporated. Moreover, the performance of VC gradually enhances then retards as the heat source size decreases. The retardation can be attributed to the more dominant role of die in heat dissipation when the heat source size gradually shrinks. 相似文献
2.
Several flip-chip interconnection methods were compared by measuring interconnect resistance before and after exposure to environments including pre-conditioning, 85°C/85% RH exposure, 150°C storage, and 0–100°C temperature cycling. The goal was to determine an acceptable low-cost, reliable method for bumping and assembling chips to flexible or rigid substrates using flip-chip assembly techniques. Alternative flip-chip bumping methods are compared to a traditional wafer solder bumping method. Flip-chip interconnection methods evaluated included high lead content solder, silver filled conductive adhesive, and gold stud bumps. Under bump metallurgies evaluated included bare aluminum, evaporated Cr/Cr–Cu/Cu, and electroless nickel plating. 相似文献