基片倾斜角度对TbFe薄膜磁致伸缩性能的影响

采用直流磁控溅射法制备了非晶态 TbFe磁致伸缩薄膜,通过基片的倾斜安装研究了基片倾斜角度对TbFe薄膜磁致伸缩性能的影响。结果表明:随着基片倾斜角度的增大 TbFe薄膜的磁致伸缩系数增大,在外加磁场110kA·m-1下基片倾斜角度为 60°时薄膜磁致伸缩系数达到最大值 1.02×10-4,并且随着基片倾斜角度的增大 TbFe薄膜的易磁化方向由垂直膜面方向逐渐转向平行膜面方向。这是由于倾斜基片溅射形成的倾斜的薄膜柱状微结构产生的形状各向异性引起的。     

溅射工艺条件对TbFeCo/Pt薄膜磁性能的影响

采用射频磁控溅射法在玻璃基片上成功制得了TbFeCo/Pt非晶垂直磁化膜,系统研究了溅射工艺参数对TbFeCo薄膜磁性能的影响.振动样品磁强计测量结果表明:Tb含量在补偿成分点附近,采用较低的溅射氩气压与Pt底层,有利于提高TbFeCo薄膜的磁性能;当Tb含量为0.24,溅射功率为300W,溅射气压为0.53Pa,薄膜厚度为140nm时,TbFeCo/Pt薄膜矫顽力达到476kA/m,饱和磁化强度为151kA/m,剩磁矩形比超过0.8,该薄膜有望用作高密度光磁混合记录介质.     

离子束反应溅射ZnO薄膜的晶体结构及光学、电学性质研究

采用离子束反应溅射法在玻璃基片上沉积了一系列ZnO薄膜样品.通过对薄膜样品XRD谱的分析,发现基片温度和溅射氧分压是同时影响ZnO薄膜沿c轴择优取向生长的重要因素.在基片温度350 ℃,氧分压1.3 的溅射条件下,得到了完全沿c轴取向生长的只有(002)晶面的ZnO薄膜.薄膜的吸收光谱测量结果表明,基片温度和氧分压对ZnO薄膜的光学禁带宽度有重要影响.不同氧分压、不同基片温度制备的薄膜电阻率相差很大.     

磁控溅射参数对Al薄膜微观结构及红外特性的影响研究

利用磁控溅射法在Si(100)基片上制备了Al薄膜,采用X射线衍射、扫描电镜、扫描探针显微镜和红外光谱仪研究了基片温度、溅射功率和溅射时间对Al薄膜表面、断面形貌和红外反射率的影响。结果表明:随着基片温度的升高,Al颗粒的尺寸变大,由均匀细颗粒变为不规则形状,并逐渐熔为一个整体,断面形貌变得凹凸不平,表面粗糙度增大,红外反射率呈下降的趋势;随着溅射功率的增大,Al薄膜致密平整,表面粗糙度增大,红外反射率先增大后不变;随着溅射时间的延长,Al薄膜表面粗糙度增大,红外反射率先增大后不变。     

Sm—Fe—Ti薄膜磁体的制备和分析

对于在加热基片上直接晶化的溅射薄膜,就溅射参数作了系统的实验研究,如基片温度、溅射气体压、力、沉积速率及靶与基体间距等。在直接晶化的薄膜中,主相为2-17相,还有几种其他的结晶相,视温度和成份而变。     

基片温度对磁控溅射沉积二氧化硅的影响

本文详细地研究了基片温度对磁控溅射沉积二氧化硅的影响,随着基片温度的增加,溅射沉积速率下降明显,薄膜的折射率也出现上升趋势,薄膜也由低温时的疏松粗糙发展为致密光滑.250℃时的溅射沉积速率仅为室温时的1/3,由此,针对间歇式在大面积玻璃上沉积二氧化硅薄膜,我们采取了沉积完ITO薄膜后,先快速降温,再沉积二氧化硅的工艺.     

离轴磁控溅射法生长1-3维PZT-NFO纳米复合薄膜

采用90°离轴磁控溅射法, 在MgAl₂O₄(001)单晶基片上自组装生长了Pb(Zr_0.52Ti_0.48)O₃-NiFe₂O₄ (PZT-NFO)复合磁电薄膜, 并研究了基片温度、氩氧比和溅射功率等因素对薄膜结构和性能的影响。结果表明, 适合生长PZT-NFO薄膜的条件为基片温度800℃, 氩氧比1:1, 溅射功率160 W。XRD测试显示, PZT-NFO薄膜为外延生长薄膜, 且PZT相与NFO相之间的垂直晶格失配非常小。AFM和SEM结构观察表明, 薄膜具有清晰的1-3维纳米复合结构, 铁磁相NFO纳米柱直径约为80~150 nm。降低氩氧比有助于NFO相的形成, 但溅射功率过大会造成1-3维结构向无规则0-3维结构转变。磁性能测量表明纳米复合薄膜的饱和磁化强度在120~160 kA/m之间, 低于块体的NFO相, 可能是由于两相的界面扩散所造成。     

磁控溅射制备大面积ZnO薄膜性能的研究

通过磁控溅射氧化锌陶瓷靶材的方法在玻璃基片上制备ZnO薄膜,研究了溅射功率、溅射气压以及基片温度对ZnO薄膜相结构、禁带宽度及光学性能的影响.使用X射线衍射仪(XRD)分析了薄膜相结构,使用台阶仪测试薄膜厚度,采用薄膜测试仪测试薄膜的透过率,采用扫描电镜(SEM)观察薄膜表面形貌.结果表明:不同制备条件下均形成具有(0...     

溅射SmCo基永磁薄膜的结构和磁性能研究

以Sm(Co0.62Fe0.25Cu0.1Zr0.03)7.5合金为靶材,采用磁控溅射工艺在单晶Si基片上沉积了SmCo基永磁薄膜。研究了溅射工艺参数对薄膜的晶体结构、微观结构和磁性能的影响。结果表明:溅射气压和溅射功率的改变引起了永磁相变,这主要依赖于溅射工艺条件对薄膜Sm含量的影响。高的溅射压强和溅射功率都会引起薄膜晶粒的粗大化和薄膜表面的粗糙化。薄膜的晶体结构和微观结构随溅射参数的变化决定了薄膜的面内磁学行为。当溅射压强为0.3 Pa和溅射功率为5.1 W/cm2时,制备的退火态SmCo基薄膜为TbCu7单相晶体结构,其面内永磁性能良好。     

Al_2O_3陶瓷基片上Ba_(0.7)Sr_(0.3)TiO_3薄膜可调介电性能的研究

采用磁控溅射方法在Al2O3陶瓷基片上溅射生长Ba0.7Sr0.3TiO3(BST)薄膜,使用光刻工艺制作平板结构的BST薄膜可变电容。研究了溅射条件对BST薄膜可调介电性能和介电损耗的影响。结果表明,在溅射气压为4Pa、O2∶Ar比为30∶70、基片温度800℃下制备的BST薄膜具有较高的介电调谐率(约52%)和较低的损耗(约0.8%),BST薄膜可变电容的品质因素随频率升高而降低,在1~100MHz频率范围内品质因素从125下降为42。     

Al-Mg-B thin films prepared by magnetron sputtering

Hard, nanocomposite aluminum magnesium boride thin films were prepared on Si (100) substrates with a three target magnetron sputtering system. The films were characterized by X-ray diffraction, atomic force microscope, electron micro-probe, Fourier transform infrared spectroscopy and nanoindentation. The results show that the maximum hardness of the as-deposited films is about 30.7 GPa and these films are all X-ray amorphous with smooth surfaces. The influences of substrate temperature and boron sputtering power on the quality of the films are discussed. From the results of this work, magnetron sputtering is a promising method to deposit Al-Mg-B thin films.     

溅射功率对ZnO：Si透明导电薄膜性能的影响

采用直流磁控溅射法在室温玻璃基片上制备出了掺硅氧化锌（ZnO：Si）透明导电薄膜,研究了溅射功率对ZnO：Si薄膜结构、形貌、光学及电学性能的影响,实验结果表明,溅射功率对ZnO：Si薄膜的生长速率、结晶质量及电学性能有很大影响,而对其光学性能影响不大。实验制备的ZnO：LSi薄膜为六方纤锌矿结构的多晶薄膜,且具有垂直于基片方向的c轴择优取向。当溅射功率从45W增加到105W时,薄膜的晶化程度提高、晶粒尺寸增大,薄膜的电阻率减小;当溅射功率为105W时,薄膜的电阻率达到最小值3．83~104n·cm,其可见光透过率为94．41％。实验制备的ZnO：Si薄膜可以用作薄膜太阳能电池和液晶显示器的透明电极。     

直流磁控溅射制备铝薄膜的工艺研究

采用直流磁控溅射方法，以高纯Al为靶材，高纯Ar为溅射气体，在玻璃衬底上成功地制备了铝薄膜，并对铝膜的沉积速率、结构和表面形貌进行了研究。结果表明：A1膜的沉积速率随着溅射功率的增大先几乎呈线性增大而后缓慢增大；随着溅射气压的增加，沉积速率先增大，在一定气压时达到峰值后继续随气压的增大而减小。X射线衍射图谱表明Al膜结构为多晶态；用扫描电子显微镜对薄膜进行表面形貌的观察，溅射功率为2600W，溅射气压为0．4Pa时制备的Al膜较均匀致密。     

Effects of substrate temperature on the surface of polymer thin films prepared by R.F. sputtering with a polyimide target

In this study, we characterized polymer thin films deposited by a conventional radio frequency sputtering apparatus introduced into argon and nitrogen gases with a polyimide target onto copper substrates.Heating effects due to heating the copper substrate at 250 °C in the sputtering on tribological and adhesion properties of thin films were investigated with measuring friction coefficient, wear durability and pull strength. Surface roughness of the nitrogen sputtered thin film decreased by the heating. Friction coefficient of argon and nitrogen sputtered thin films prepared at 250 °C was almost the same level as that prepared at room temperature, respectively. Wear durability of these thin films and adhesion strength between these thin films and copper substrate decreased by the heating.     

Deposition of c-axis orientation aluminum nitride films on flexible polymer substrates by reactive direct-current magnetron sputtering

Aluminum nitride (AlN) piezoelectric thin films with c-axis crystal orientation on polymer substrates can potentially be used for development of flexible electronics and lab-on-chip systems. In this study, we investigated the effects of deposition parameters on the crystal structure of AlN thin films on polymer substrates deposited by reactive direct-current magnetron sputtering. The results show that low sputtering pressure as well as optimized N₂/Ar flow ratio and sputtering power is beneficial for AlN (002) orientation and can produce a highly (002) oriented columnar structure on polymer substrates. High sputtering power and low N₂/Ar flow ratio increase the deposition rate. In addition, the thickness of Al underlayer also has a strong influence on the film crystallography. The optimal deposition parameters in our experiments are: deposition pressure 0.38 Pa, N₂/Ar flow ratio 2:3, sputtering power 414 W, and thickness of Al underlayer less than 100 nm.     

磁控溅射制备ITO薄膜光电性能的研究

采用直流磁控溅射方法在玻璃基底上制备了ITO薄膜.分别用分光光度计和四探针仪测试了所制备ITO薄膜在可见光区域内的透过率和电阻率,研究了溅射气压、氧氩流量比和溅射功率三个工艺参数对ITO薄膜光电性能的影响.研究结果表明,制备ITO薄膜的最佳工艺参数为:溅射气压0.6 Pa,氧氩流量比1:40,溅射功率108 W.采用此工艺参数制备的ITO薄膜在可见光区平均透过率为81.18％,薄膜电阻率为8.9197×10-3Ω·cm.     

Preparation of highly oriented AlN thin films on glass substrates by helicon plasma sputtering and design of experiments

Aluminum nitride (AlN) thin films were deposited by a helicon plasma sputtering system with a radical cell. We investigated the effects of eight sputtering control factors on the crystal orientation of the films by design of experiments and the analysis of variance (ANOVA) in order to prepare highly oriented AlN thin films on silica glass substrates. Consequently, it was proved statistically that the distance between a target and a substrate, the sputtering pressure and the substrate temperature are significant control factors for the crystal orientation of the films. Especially, the distance is the most important factor of the eight control factors, which has not been reported so far. On the other hand, the effects of the cathode r.f. coil power, the radical cell power, the nitrogen concentration, the sputtering time and the cathode power are not statistically significant. Moreover, a detailed investigation of the dependence of the orientation on the three important control factors was carried out to optimize the sputtering conditions. The full width at half-maximum (FWHM) of the X-ray rocking curve of the film deposited under the optimized sputtering conditions is 2.4° (σ=1.3°). This orientation is the highest in the AlN thin films deposited on amorphous substrates reported to our knowledge.     

射频磁控溅射法制备碲化铅薄膜的X射线衍射分析

采用射频磁控溅射法,在单面抛光的Si(111)衬底上制备了PbTe薄膜,利用X射线衍射法分析了溅射工艺参数如溅射功率、溅射时间、衬底温度以及退火温度对PbTe薄膜的结晶质量的影响。结果表明:在溅射功率为30W,溅射时间为10 min,衬底未加热时制备的薄膜具有最好的〈100〉方向的择优取向性;退火处理可以改善薄膜的结晶质量,并且退火温度越高,薄膜的结晶质量越好。     

Dielectric properties of DC reactive magnetron sputtered Al2O3 thin films

Alumina (Al₂O₃) thin films were sputter deposited over well-cleaned glass and Si < 100 > substrates by DC reactive magnetron sputtering under various oxygen gas pressures and sputtering powers. The composition of the films was analyzed by X-ray photoelectron spectroscopy and an optimal O/Al atomic ratio of 1.59 was obtained at a reactive gas pressure of 0.03 Pa and sputtering power of 70 W. X-ray diffraction results revealed that the films were amorphous until 550 °C. The surface morphology of the films was studied using scanning electron microscopy and the as-deposited films were found to be smooth. The topography of the as-deposited and annealed films was analyzed by atomic force microscopy and a progressive increase in the rms roughness of the films from 3.2 nm to 4.53 nm was also observed with increase in the annealing temperature. Al-Al₂O₃-Al thin film capacitors were then fabricated on glass substrates to study the effect of temperature and frequency on the dielectric property of the films. Temperature coefficient of capacitance, AC conductivity and activation energy were determined and the results are discussed.     

Switching properties of vanadium doped TiO2 thin films prepared by magnetron sputtering

In the present work thin films of Ti-Me (where Me: V, Nb, Ta) were deposited onto glass substrates by magnetron sputtering of mosaic target in reactive oxygen plasma. The properties of the prepared thin films were studied by X-ray diffraction (XRD), electron dispersive spectroscopy, temperature-dependent electrical and optical transmission spectroscopy measurements. The structural investigations indicate that thin films were XRD-amorphous. Reversible thermoresistance effect, recorded at 52 ± 1 °C was found from electrical measurements. The prepared coatings were well transparent in the visible part of the light spectrum from ca. 350 nm.