化学镀制备纳米银-石墨烯复合材料及其电化学性能

以葡萄糖为还原剂,采用化学镀原位合成纳米银-石墨烯复合材料(Ag/GR),通过X射线衍射(XRD)、X射线能量色散谱(EDS)、X射线光电子能谱(XPS)、扫描电子显微镜(SEM)和傅里叶红外光谱(FTIR)等方法对材料的结构形态进行表征分析.结果表明,石墨烯表面银的负载形态为预期的单质状态,AgNPs平均粒径约为21 nm.同时,利用循环伏安法(CV)、交流阻抗谱(EIS)、线性伏安扫描法(LSV)和差分脉冲伏安法(DPV)对抗坏血酸(AA)在Ag/GR/GCE电化学传感器上的电化学响应进行研究.电化学测试结果表明,Ag/GR复合材料具有最高的响应电化学信号212.9μA和最低的电荷转移电阻90.5Ω,峰值电流约为石墨烯电极(110μA)的2倍和玻碳电极(42.5μA)的5倍,AgNPs与石墨烯具有良好的协同作用,对AA具有明显的电催化活性.AA的阳极峰电流在5～120μmol/L浓度范围内线性增加.然而,AA的阳极峰电流与浓度范围为50～120μmol/L的自然对数高度相关,检测限为0.06μmol/L.     

化学镀法制备Ag/Al复合粉末

通过化学镀的方法在铝粉表面包覆银,研究了铝粉化学镀银的原理,探讨了氨水、银氨离子、稳定剂、温度和pH对化学镀银的影响。结果表明氨水可以增加镀液稳定性,改善镀层形貌;银氨离子浓度对镀层银含量以及粉末电阻率影响明显;少量稳定剂可以增强镀液稳定性,过量导致镀层疏松多孔;温度和pH的提高可以增加银的析出量,但也会导致镀液的分解。     

Fabrication and actuation of ionic polymer metal composites patterned by combining electroplating with electroless plating

The novel fabrication technique that patterns the multiple electrodes of the ionic polymer metal composite actuators was developed to mimic the swimming and flapping locomotion of a living thing. The developed method is to combine electroplating with the electroless chemical reduction using the patterned mask. The advantages of this fabrication method are that the initial compositing between the polymer and platinum particles can be assured by the chemical reduction method, and the thickness of each electrode can be controlled easily and rapidly by electroplating. By using the fabricated actuator with a multiple degree of freedom, the oscillatory and undulatory waves of the flexible membrane actuator was generated and a twisting motion was also realized to verify the possibility of mimicking the fish-like locomotion. Present results show that this novel method combining electroplating with electroless plating can be a promising technique to easily pattern multiple electrodes and to implement the biomimetic motion of the polymer actuators with good mechanical bending performance.     

Ag包覆SnO_2制备工艺及其性能研究

采用包覆工艺制备了AgSnO_2电接触材料,通过分散剂种类、球磨时间、活化剂种类等工艺参数的优化,制备了性能合格的AgSnO_2电接触材料。实验结果表明,聚乙二醇对SnO_2颗粒具有较好的分散作用,但不能完全消除SnO_2颗粒团聚;液态球磨能获得组织均匀的AgSnO_2材料,但材料的电阻率过高;活化剂Bi_2O_3和CuO的加入能有效地提高材料的致密度和降低电阻率;在加入0.25%Bi_2O_3+0.25%CuO并液态球磨4h后的试样致密度为98.2%,电阻率为2.25μΩ·cm。     

化学镀Ni-Cu-P合金的研究

通过对化学镀Ni-Cu-P合金工艺配方的研究,确定较佳的工艺配方,探讨各种因素对化学镀层的性能的影响.实验结果发现CuSO4的含量对镀层黑度的影响较大.该工艺具有能耗低、工艺简单、不污染环境、成本低等优点.     

镁合金化学镀镍层孔隙率的影响因素

根据基体元素与相应的指示剂显色原理,采用贴试纸法,测定了镁合金化学镀层的孔隙率,研究了镀液参数对孔隙率的影响．结果表明,采用铬黑T作指示剂溶液测定镁合金化学镀层孔隙率的效果最佳,镁试剂I效果次之,茜素磺酸钠指示剂最差;络合剂、缓冲剂、氟化物和稳定剂等镀液参数对化学镀层孔隙率的影响趋势为：先减小,后增加．采用贴试纸法测定化学镀层孔隙率是可行的．     

The preparation of Al/Fe composite powders by electroless plating

The core–shell Al/Fe composite powders were synthesised by electroless plating. The effects of concentration of FeSO₄·7H₂O, pre-treatment method of aluminium powders, and secondary plating on the preparation of core–shell Al/Fe composite powders were studied. The composite powders were analysed by the X-ray diffraction, a scanning electron microscope, and an energy-dispersive spectrometer. The results indicate that the content of iron in the composite powders could be effectively controlled by adjusting the concentration of FeSO₄·7H₂O in the plating solution. The pre-treatment of the raw aluminium powders is also a key factor to form a uniform iron layer on the surface of aluminium particles. Furthermore, the density and iron content of the composite powders prepared by secondary plating have been improved.     

玻璃纤维表面化学镀Ni-P合金涂层的研究

采用化学镀工艺在玻璃纤维表面包覆一层Ni-P合金涂层,用扫描电子显微镜、X射线能谱仪、X射线衍射仪、热震实验对涂层的形貌、组成、结构和性能进行了表征.结果表明,玻璃纤维表面化学镀Ni-P合金涂层由直径为0.1～1μm的颗粒所组成,涂层厚度约为1～1.5μm.涂层与玻璃纤维之间的结合力好,电阻率达到1.25×10-3Ω·cm.化学镀玻璃纤维具有较好的导电性,可作为制备导电高分子材料的填料.     

镍磷-纳米碳管复合镀层的力学性能

采用化学复合镀的方法, 在铜箔基体上进行Ni-P-纳米碳管复合镀。用金相显微镜、扫描电子显微镜、显微硬度计、万能拉伸试验机等实验手段研究复合镀试样的组织和性能。结果表明: 随着镀液中纳米碳管含量的增加, 复合镀层表面的粒度变小, 硬度增加; 最大延伸率、断面收缩率和拉伸断口侧面的裂纹密度增加, 但抗拉强度、断裂强度和弹性模量降低。      

化学沉积RE-Ni-Mo-P-WC复合镀层组织结构及性能研究

研究了化学沉积RE-Ni-Mo-P-WC复合镀层的组织结构及性能.结果发现:加入稀土元素能使镀层表面的晶粒急剧细化,分散性大大加强.镀层结构由非晶态转化为晶态结构.镀层的耐蚀性略有下降.硬度随WC浓度增加而增加,钼酸钠浓度为0.05g/L并经过200 ℃热处理后,显微硬度增大.氧化膜的质量随温度的升高逐渐增加,但在600 ℃以下氧化温度对镀层增重不明显.     

Fabrication of super-hydrophobic nano-sized copper films by electroless plating

Super-hydrophobic nano-sized copper films were fabricated on smooth glass substrates by an improved electroless plating technology. The copper film deposited for 1 min showed extremely high hydrophobicity with a water contact angle of 138.0^o and super-hydrophobicity with a water contact angle of 152.4^o when it was modified with 1-octadecanethiol (CH3-(CH2)17-SH). Such super-hydrophobicity is attributed to the combined roles of the surface hierarchical structure consisting of the micro-sized island-shaped agglomerates that are composed of the nano-sized copper nodules and the low surface energy formed through the chemical modification.     

化学镀法制备核壳型银-铜双金属粉

为改善超细铜粉的高温抗氧化性能,通过热力学数据理论上分析了液相还原反应取代置换反应的可行性,并以水合肼作还原剂,银以稳定性适中的银氨络合物存在,采用化学镀法制备银包覆超细铜粉的新技术,利用SEM、XRD等手段对双金属粉的形貌和晶相组成进行了分析.研究表明,一次包覆铜粉基体表面银的包覆率为40.22%,二次包覆银的包覆率可达94.98%,在铜粉表面形成了连续的银膜,可以认为是表面包覆结构,拓展了超细铜粉的应用领域.     

聚氨酯泡沫表面化学镀镍的研究

采用化学镀方法对聚氨酯泡沫进行处理,在其表面均匀包覆一层镍镀层,达到表面金属化改性的目的.分别用扫描电子显微镜(SEM)、X射线衍射仪(XRD)、红外光谱仪(IR)和热重分析仪(TG)对化学镀镍前后聚氨酯泡沫的形貌、结构及热分解行为进行了表征.结果表明:通过化学镀工艺制备的镍镀层由直径为1～2μm的颗粒组成,且呈一定的取向.化学镀镍后聚氨酯泡沫的X射线衍射强度和红外透过率都有所降低.化学镀镍前后聚氨酯泡沫的TG曲线都由两个失重阶段构成,由于化学镀后聚氨酯泡沫表面的镍镀层被氧化,因此在650～1000℃之间,其TG曲线还呈现一定的上升趋势.     

玻璃纤维化学镀Ni-Fe-P合金的研究

通过化学镀方法在玻璃纤维表面沉积了Ni Fe P合金,所用镀液经钯盐法测试稳定性很好,所得镀合金玻璃纤维热震实验后表面无鼓泡、起皮现象,说明镀层的抗冲击强度高,结合力良好。并利用扫描电镜观察分析了镀层的表面形貌,同时使用 X射线能谱仪对镀层成分含量进行了测定分析,铁的质量百分含量最大可达 21.8%,并得出了镍含量、铁含量对镀层导电性能的影响情况,制备的镀合金玻璃纤维电阻率可为7.32×10-4Ω·cm。最后还对所得 Ni Fe P合金玻璃纤维的电磁参数进行了初步的测定分析,所得镀金属玻璃纤维的磁损耗为0.307;介电损耗为1.44。     

化学镀法制备镍系非晶态合金的研究及应用进展

化学镀法制备的镍系非晶态合金材料以其高催化活性、超强的耐腐蚀性和耐磨性而得到广泛应用.本文概述了化学镀法制备非晶态合金材料的特性,综述了近年来化学镀法制备非晶态合金的研究进展及其在催化、防腐及耐磨材料等领域的应用.阐述了现阶段化学镀废液造成的环境问题及其净化和再利用方面取得的进展,对化学镀法制备非晶态合金的发展进行了展望。     

Application of response surface method for predicting electroless nickel plating

Electroless nickel plating process has been studied considering pure copper (99.99%) as a substrate material. Deposition per unit area has been considered as a response variable and individual as well as combined effects of process parameters on deposited mass have been studied. Regression analysis and Student’s t test have been used to identify the significant influencing process parameters. It has been observed that reducing agent (NaBH₄), source of metal (NiCl₂ · 6H₂O) and temperature significantly affect the deposition. The interactions among various process parameters have also been observed to be significant. Mathematical modeling has been carried out by a second-order response surface model with central composite design (CCD) to take into account the effect of curvature in the predicted response. Equations for response surfaces have been determined for various deposition times using MATLAB software package. Most of the response surfaces show that deposition thickness increases with increased values of process parameters within the adopted range but with different rates. The test for reliability for predicting response surface equations shows that these equations give an excellent fitting to the observed values.     

化学复合镀梯度镀层工艺研究

研究了梯度复合镀层Ni-P／Ni-P-PTFE／Ni-Cu-P-PTFE的形成工艺,探讨了镀液的温度、pH值、阳离子表面活性剂浓度、PTFE浓度以及镀层中的铜含量对Ni-Cu-P-PTFE镀层的沉积速度、组成和耐蚀性的影响,分别用数字测微计和能量分散X射线光谱测量了涂层厚度和组成,Ni-Cu-P-PTFE镀层在HCl和NaCl溶液中的抗蚀性研究表明,Ni-Cu-P-PTFE镀层的耐蚀性优于Ni-P-PTFE镀层和铜．     

Fabrication of conductive copper-coated glass fibers through electroless plating process

A simple electroless copper plating process was employed to prepare copper-coated glass fibers with excellent conductivity. The glass fibers were pretreated by etching, sensitizing, and activating procedures. Disodium ethylenediamine tetra acetate (EDTA-2Na) and hydrazine hydrate (N₂H₄·H₂O) were employed as complex reagent and reductant, respectively. It was found that the copper deposition was greatly influenced by dosage of EDTA-2Na, concentration of sodium hydroxide (NaOH), temperature, and volume of N₂H₄·H₂O. The optimal temperature for electroless copper plating ranged from 40 to 60 °C. The composites were characterized by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy techniques. The result showed that the minimum volume resistivity of 0.0010 Ω cm was obtained for the sample with perfect copper coatings on the surface of glass fibers. This method is simple, low-cost, and large production, and can be extended to fabricate other metal-coated glass fibers with distinct conductivity.