Cure kinetics and catalyzed effect of hydroxyl group of LC diglycidyl ether of bisphenol‐S with aromatic diamines

The curing reactions of liquid crystalline 4,4′‐bis‐(2,3‐epoxypropyloxy)‐sulfonyl‐bis(1,4‐phenylene) (p‐BEPSBP) with 4,4′‐diaminodiphenylmethane (DDM) and 4,4′‐diaminodiphenylsulfone (DDS) were investigated by nonisothermal differential scanning calorimeter (DSC). The relationships of E_a with the conversion α in the curing process were determined. The catalyzed activation of hydroxyl group for curing reaction of epoxy resins with amine in DSC experiment was discussed. The results show that these curing reactions can be described by the autocatalytic ?esták‐Berggren model. The curing technical temperature and parameters were obtained, and the even reaction orders m, n, and ΔS for p‐BEPSBP/DDM and p‐BEPSBP/DDS are 0.35, 0.92, ?81.94 and 0.13, 1.32, ?24.45, respectively. The hydroxyl group has catalyzed activation for the epoxy–amine curing system in the DSC experiment. The average E_a of p‐BEPSBP/DDM is 67.19 kJ mol^?1 and is 105.55 kJ mol^?1 for the p‐BEPSBP/DDS system, but it is different for the two systems; when benzalcohol as hydroxyl group was added to the curing system, the average E_a of p‐BEPSBP/DDM decreases and increases for p‐BEPSBP/DDS. The crystalline phase had formed in the curing process and was fixed in the system. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Curing and Thermal Properties of PEPEB Liquid Crystalline Diepoxide/Aromatic Diamine

The liquid crystalline epoxy resin p-phenylene di[4-2-(2,3-epoxypropyl)ethoxy] benzoate (PEPEB) was synthesized. The curing behavior of the liquid crystalline epoxy resin (LCER) with 4,4-diaminodiphenylmethane (DDM) was studied by fourier transform infrared (FTIR), differential scanning calorimetry (DSC), and torsional braid analysis (TBA). Morphology of curing product was observed by polarized optical microscopy (POM) at different temperatures. Nonisothermal curing kinetics of this system were investigated by DSC. Results show that the PEPEB has a smectic liquid crystalline structure, and the melting point, T _m, is 119°C, the clearing point is 184°C. The cured-system's gel point, T _I , is 83.5°C; cure temperature, T _P , is 111.6°C; and the disposal temperature, T _f , is 145.8°C; activation energy of curing reaction is 4.84 KJ/mol. Observation by POM shows that with the upgrade of initial curing temperature, the filament structure of this system transferred from anisotropy to isotropy.     

Synthesis and thermotropic liquid‐crystalline behavior of novel main‐chain poly(aryl ether ketones)

Novel aromatic poly(ether ketones) containing bulky lateral groups were synthesized via nucleophilic substitution reactions of 4,4′‐biphenol and (4‐chloro‐3‐trifluoromethyl)phenylhydroquinone (CF‐PH) with 1,4‐bis(p‐fluorobenzoyl)benzene. The copolymers were characterized by differential scanning calorimetry (DSC), wide‐angle X‐ray diffraction, and polarized light microscopy observation. Thermotropic liquid‐crystalline behavior was observed in the copolymers containing 40, 50, 60, and 70 mol % CF‐PH. The crystalline–liquid‐crystalline transition [melting temperature (T_m)] and the liquid‐crystalline–isotropic phase transition appeared in the DSC thermograms, whereas the biphenol‐based homopolymer had only a melting transition. The novel poly(aryl ether ketones) had glass‐transition temperatures that ranged from 143 to 151°C and lower T_m's that ranged from 279 to 291°C, due to the copolymerization. The polymers showed high thermal stability, and some exhibited a large range in mesophase stability. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 1347–1350, 2003     

Effect of polyarylene ether nitriles on processing and mechanical behaviors of phthalonitrile‐epoxy copolymers and glass fiber laminated composites

A series of copolymers and glass fiber composites were successfully prepared from 2,2‐bis [4‐(3,4‐dicyanophenoxy) phenyl] propane (BAPh), epoxy resins E‐44 (EP), and polyarylene ether nitriles (PEN) with 4,4′‐diaminodiphenyl sulfone as curing additive. The gelation time was shortened from 25 min to 4 min when PEN content was 0 wt % and 15 wt %, respectively. PEN could accelerate the crosslinking reaction between the phthalonitrile and epoxy. The initial decomposition temperatures (T_i) of BAPh/EP copolymers and glass fiber composites were all more than 350°C in nitrogen. The T_g of 15 wt % PEN glass fiber composites increased by 21.2°C compared with that of in comparison with BAPh/EP glass fiber composite. The flexural strength of the copolymers and glass fiber composites reached 119.8 MPa and 698.5 MPa which increased by 16.6 MPa and 127.3 MPa in comparison with BAPh/EP composite, respectively. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Multifunctional epoxy resins

The curing behavior of epoxy resins prepared by reacting epichlorohydrin with 4,4′-diaminodiphenyl methane (DADPM)/4,4′-diaminodiphenyl ether (DADPE) or 4,4′-diaminodiphenyl sulfone (DDS) was investigated using DDS and tris-(m-aminophenyl)phosphine oxide (TAP) as curing agents. A broad exothermic transition with two maxima were observed in the temperature range of 100–315°C when TAP was used as the curing agent. The effect of varying DDS concentration on curing behavior of epoxy resin was also investigated. Peak exotherm temperature (T_exo) decreased with increasing concentration of DDS, whereas heat of curing (ΔH) increased with an increase in amine concentration up to an optimum value and then decreased. Thermal stability of the resins, cured isothermally at 200°C for 3 h, was investigated using thermogravimetric analysis in a nitrogen atmosphere. Glass fiber-reinforced multifunctional epoxy resin laminates were fabricated and the mechanical properties were evaluated. © 1993 John Wiley & Sons, Inc.     

Curing and Morphology of BPA Epoxy Resin/LC Epoxy Resin PEPEB Composites

Liquid crystalline epoxy resin (LC epoxy resin) – p-phenylene di{4-[2-(2,3-epoxypropyl)ethoxy]benzoate} (PEPEB) was synthesized. The mixture of PEPEB with bisphenol-A epoxy resin (BPAER) was cured with a curing agent 4,4-diamino-diphenylmethane (DDM). The curing process and thermal behavior of this system were investigated by differential scanning calorimeter (DSC) and torsional braid analysis (TBA). The morphological structure was measured by polarizing optical microscope (POM) and scanning electron microscope (SEM). The results show that the initial curing temperature Ticu (gel point) of this system is 68.1°C, curing peak temperature T _pcu is 102.5°C, and the disposal temperature T _fcu is 177.6°C. LC structure was fixed in the cured epoxy resin system. The curing kinetics was investigated by dynamic DSC. Results showed that the curing reaction activation energy of BEPEB/BPAER/DDM system is 22.413 kJ/mol. The impact strength is increased 2.3 times, and temperature of mechanical loss peak is increased to 23°C than the common bisphenol-A epoxy resin, when the weight ratio of BEPEB with BPAER is 6 100.     

Synthesis and thermotropic liquid‐crystalline behaviour of novel main‐chain poly(ether ether ketone ketone)s containing a lateral tert‐butyl group

The synthesis of novel poly(ether ether ketone ketone)s containing a lateral group via the random copolymerization of 4,4′‐biphenol, tert‐butylhydroquinone and 1,4‐bis(p‐fluorobenzoyl)benzene is described. The copolymers were characterized by differential scanning calorimetry (DSC), wide‐angle X‐ray diffraction (WAXD) and polarized optical microscopy (POM) observation. The results showed that the thermotropic liquid‐crystalline properties were achieved in the copolymers containing 30 mol% and 50 mol% tert‐butylhydroquinone, which have relatively lower melting temperatures due to the copolymerization effect. Both the crystalline–liquid‐crystalline transition (T_m) and the liquid‐crystalline–isotropic phase transition (T_i) were observable in the DSC thermograms, while the biphenol‐based poly(aryl ether ketone) has only one melting transition. The hydroquinone‐based polymer was shown to be amorphous. Thermogravimetric analysis (TGA) results showed that these copolymers are all high‐temperature resistant with higher glass transition temperature between 147 and 149 °C, and higher decomposition temperature T_d in the range 480–520 °C. © 2000 Society of Chemical Industry     

Synthesis and polymerization of novel epoxy compounds having an adamantane ring and evaluation of their heat resistance and transparency

Three adamantane derivatives substituted by epoxy groups, 1,3‐bis(glycidyloxy)adamantane ( 2a ), 5,7‐dimethyl‐1,3‐bis(glycidyloxy)adamantane ( 2b ), 1,3,5‐tris(glycidyloxy)adamantane ( 2c ), were synthesized from the corresponding adamantanediol or triol in good yields. These three epoxy compounds were polymerized with an acid anhydride, and the heat resistance of the resulting resins was evaluated. The resin prepared from 2c exhibited high heat resistance with the glass transition temperature (T_g) of 208°C and low degree of coloring by heating. The epoxy compounds were also found to be potentially useful as the precursors of high heat‐resistant resins by thermal homopolymerization. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Low dielectric thermoset. I. Synthesis and properties of novel 2,6‐dimethyl phenol‐dicyclopentadiene epoxy

A 2,6‐dimethyl phenol‐dicyclopentadiene novolac was synthesized from dicyclopentadiene and 2,6‐dimethyl phenol, and the resultant 2,6‐dimethyl phenol‐dicyclopentadiene novolac was epoxidized to 2,6‐dimethyl phenol‐dicyclopentadiene epoxy. The structures of novolac and epoxy were confirmed by Fourier transform infrared spectroscopy (FTIR), elemental analysis, mass spectroscopy (MS), nuclear magnetic resonance spectroscopy (NMR), and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol‐dicyclopentadiene epoxy was then cured with 4,4‐diaminodiphenyl methane (DDM), phenol novolac (PN), 4,4‐diaminodiphenyl sulfone (DDS), and 4,4‐diaminodiphenyl ether (DDE). Thermal properties of cured epoxy resins were studied by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermal gravimetric analysis (TGA). These data were compared with those of the commercial bisphenol A epoxy system. Compared with the bisphenol A epoxy system, the cured 2,6‐dimethyl phenol‐ dicyclopentadiene epoxy resins exhibited lower dielectric constants (～3.0 at 1 MHz and 2.8 at 1 GHz), dissipation factors (～0.007 at 1 MHz and 0.004 at 1 GHz), glass transition temperatures (140–188°C), thermal stability (5% degradation temperature at 382–404°C), thermal expansion coefficients [50–60 ppm/°C before glass‐transition temperature (T_g)], and moisture absorption (0.9–1.1%), but higher modulus (～2 Gpa at 60°C). © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 2607–2613, 2003     

Synthesis and curing of liquid crystalline epoxy resin based on asymmetric mesogen

A novel liquid crystalline epoxy resin (LCER) derived from asymmetric mesogen unit was synthesized. Its structure and liquid crystalline behavior were characterized by hydrogen nuclear magnetic resonance (H‐NMR), differential scanning calorimetry (DSC), polarized optical microscopy (POM). The results indicated that the LCER converted to a nematic phase at 85°C during heating and finally became isotropic at 145°C. The curing behavior and phase behavior of the LCER with 4,4′‐diaminodiphenyl methane and methyl hexahydrophthalic anhydride were also studied by DSC and POM, respectively. Their apparent activation energy (E_a) was evaluated according to the Ozawa's isoconversional method. The results suggested that autocatalytic reaction had occurred in these two systems. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

High‐performance thermosetting films based on an amino‐functionalized poly(ether sulfone)

We have developed a sequence‐dependent synthesis of the amino‐functionalized poly(ether sulfone) P2 . The amino groups of P2 act as reactive sites toward epoxy resins. After curing P2 with diglycidyl ether of bisphenol A (DGEBA) and cresol novolac epoxy (CNE), we obtained the flexible, light‐yellow, transparent, epoxy thermosetting films P2 /DGEBA, and P2 /CNE, respectively, having glass transition temperatures (T_g) of 258 and 274°C, respectively. In addition, we also prepared a flexible film after condensation of the amino groups of P2 with the anhydride groups of 4,4′‐oxydiphthalic anhydride (ODPA); after imidization at 300°C for 1 h, the resulting P2 /ODPA thermosetting film possessed a value of T_g of 340°C. These three thermosetting films also exhibited flame retardancy with a UL‐94 VTM‐0 grade. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40980.     

Preparation,characterization, and polymerization of novel maleimidobenzoxazine containing carboxylic moiety and its cocuring behaviors with epoxy resin

A novel benzoxazine containing maleimide and carboxylic moieties, 1‐[3‐(4‐carboxylphenyl)‐3,4‐dihydro‐2H‐benzo[e][1,3]‐oxazin‐6‐yl]maleimide (Mal‐Bz‐Co), was synthesized and the structure was identified by ¹H‐NMR and FTIR. Mal‐Bz‐Co exhibited good solubility in common organic solvents. The cure behavior of Mal‐Bz‐Co and cocure behavior of Mal‐Bz‐Co with o‐cresol formaldehyde epoxy resin were investigated by differential scanning calorimetry. Results indicated that Mal‐Bz‐Co showed a single curing exothermic peak at about 238.3°C. However, the maximum curing temperature (T_p) decreased to 146.1°C when Mal‐Bz‐Co cocured with o‐cresol formaldehyde epoxy resin in the molar ratio of 1 : 1. The T_p was about 92°C lower than that of Mal‐Bz‐Co. Thermogravimetric analysis showed that high‐decomposition temperature and char yield were observed for the cured resins of Mal‐Bz‐Co and Mal‐Bz‐Co/o‐CFER. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Synthesis and properties of fluoro‐polyetherimides

A series of amorphous fluoro‐polyetherimides based on 2,2′‐bis(3,4‐dicarboxyphenyl) hexafluropropane dianhydride (6FDA) and di‐ether‐containing diamines 4,4′‐bis(3‐aminophenoxy)diphenyl sulfone (m‐SED), 4,4′‐bis(4‐aminophenoxy)diphenyl sulfone (p‐SED), 4,4′‐bis(4‐aminophenoxy)diphenyl propane (BPADE) were synthesized. These melt processable polyetherimide polymers from p‐SED and BPADE showed excellent electrical properties. The dielectric constants, 2.74 and 2.65 at 10 MHz respectively, are lower than commercially available polyetherimide ULTEM® 1000, and polyimide Kapton® H films. In addition, we found that trifluoromethyl groups‐containing polyimides not only show extraordinary electrical properties, but they also exhibit excellent long‐term thermo‐oxidative stability and reduced water absorption relative to non‐fluorinated polyimides. The weight retention of these fluoro‐polyetherimides at 315°C for 300 h in air varies from 93% to 98%. Whereas, their moisture absorption at 100 RH at 50°C was in the range of 0.3% to 1.05%, which is much lower than those of Ultem 1000 and Kapton H. In the case of fluoro‐polyetherimides from p‐SED and m‐SED (para and meta isomers) diamines with ‘ether’ and sulfonyl (‐SO₂‐) spacer groups, the d‐spacing and T_g values decreased from 4.72Å to 4.56Å and 293°C to 244°C respectively. Similarly, the transparency of these polymer films (in the range of 80% to 90%) at 500 nm solar wavelength was higher than Ultem 1000 and Kapton H.     

Synthesis and characterizations of a latent polyhedral oligomeric silsequioxane‐containing catalyst and its application in polybenzoxazine resin

In this article, a novel latent curing agent, octa(paratoluenesulfonic acid ammomium salt) (OPAAS) polyhedral oligomeric silsequioxane was synthesized and used in modifying the polybenzoxazine/2,2′‐(1,3‐phenylene)‐bis(4,5‐dihydro‐oxazoles) (PBO) (PBZ/PBO) resin. The liberated octa(aminophenyl) silsesquioxane and paratoluenesulfonic acid can catalyze the ring‐opening reaction of benzoxazine (BZ) resin. The initial curing temperature (T_i), peak curing temperature (T_p) and the Enthalpy of the curing temperature had significantly decreased with respect to pristine BZ/PBO resin. When the OPAAS amount was 3 wt %, the peak curing temperature decreased from 233.7 to 218.2°C. Also, PBZ/PBO/OPAAS composites exhibited better storage modulus than pure PBZ/PBO resin. Meanwhile, PBZ/PBO/OPAAS composites are more thermally stable than PBZ/PBO resin. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Kinetics and thermal characterization of epoxy‐amine systems

The curing behavior of epoxy resins was analyzed based on a simple kinetic model. We simulated the curing kinetics and found that it fits the experimental data well for both diglycidylether of bisphenol A–4,4′‐methylene dianiline and diglycidylether of bisphenol A–carboxyl‐terminated butadiene acrylonitrile–4,4′‐methylene dianiline systems. The kinetic results showed the curing of epoxy resins involves different reactive process and reaction stages, and the value of activation energy is dependent on the degree of conversion. By analyzing the effect of vitrification, at low curing temperature, we found the curing reaction at the later stage was practically diffusion‐controlled for unmodified resin, and the rubber component did not markedly decrease T_g at the early stage of reaction as would be expected. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 2401–2408, 1999     

Curing kinetics and thermal properties of diglycidylether of bisphenol A with various diamines

To prepare a high‐performance epoxy, we synthesized three types of diamines {N,N′‐(4,4′‐diphenylether)‐bis(4‐aminophthalimide), 4,4′‐bis(p‐aminophenoxy)dibenzalphentaerythriol, and 2,2′‐bis[4‐(p‐aminobenzoyl)phenyl]propane} as epoxy curing agents with a two‐step reaction sequence. The structures of the synthesized diamines were confirmed with Fourier transform infrared and nuclear magnetic resonance spectroscopy. The curing kinetics and thermal stability of the cured epoxy resin with diglycidylether of bisphenol A were estimated with differential scanning calorimetry and thermogravimetric analysis under a nitrogen atmosphere. The kinetics parameters were determined with the Ozawa and Kissinger equations. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 279–284, 2001     

Mesomorphic phase formation of plasticized poly(l‐lactic acid)

The effects of the crystallization temperature, T_c, on the crystal structure as well as its thermal behavior of plasticized poly(l ‐lactic acid) were investigated by means of wide‐angle X‐ray diffraction (WAXD), Fourier‐transform infrared spectroscopy (FTIR), and differential scanning calorimetry (DSC). PLLA blended with succinic acid‐bis[2‐[2‐(2‐methoxyethoxy)ethoxy]ethyl] ester (SAE) showed clear difference in T_c dependence of crystalline form compared to PLLA homopolymer. PLLA with 26 wt % SAE crystallized into orthorhombic α form for T_c above 80°C, while a peculiar disordered structure (mesophase) was obtained for T_c at 40°C. A detailed FTIR analysis of the mesophase of PLLA, focusing on the intra‐ and inter‐chain interaction in the structure, indicated that mesophase had a large degree of disorder in 10/3 helical conformation as well as its packing manner of disordered 10/3 helical chain. Upon heating, mesophase showed a steep exothermic peak at 80°C in DSC thermogram, indicating the phase transformation from mesophase to a form crystal. FTIR results showed that the degree of interchain interaction of C=O in PLLA started to decrease above 60°C, followed by steep increase at 80°C due to the recrystallization into a form. Melt‐recrystallization process in mesophase‐α transformation was clarified. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 39762.     

Alternative monomers for 4,4′-methylenedianiline in thermosetting epoxy resins

4,4′-Methylenedianiline (MDA) is utilized to produce high temperature epoxy resins as well as other high-performance composites; however, MDA is a known carcinogen and liver toxicant. Novel dianilines derived from both petroleum and biomass with different quantities and types of methyl and methoxy substituents on the aromatic ring were prepared and studied to reduce toxicity and carcinogenic aspects of the resulting material while maintaining thermal and mechanical integrity. These dianilines were primarily prepared by coupling commercial anilines using paraformaldehyde under acidic conditions. Another dianiline was prepared by nitration of bisphenol A and subsequent reduction of the nitrates to amines. Structure–toxicity relationships indicate that multiple substituents on the aromatic ring are necessary to reduce the toxicity of the dianiline. Epoxy-amine resins were prepared by blending the dianilines with 50 wt % Epikure W liquid amine curing agent and mixing with a stoichiometric amount of EPON 828 epoxy resin. Methoxy and methyl substituents increase the melting point of the dianilines by as much as 65 °C, thereby worsening the processing of these monomers as liquid thermoset resins. Structure–property relationships show that the addition of a methoxy group to the aromatic ring and moving the amine from the 4,4′ position on the dianiline reduces the glass transition temperature (T _g) by approximately 10 °C. A single methyl group has little effect on T _g and two methyl groups increase the T _g only when both are ortho to the amine, yet this causes a large 14 °C increase in T _g. Thermal degradation profiles are not significantly affected by the dianiline. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 137, 48707.     

Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials

The study synthesized a trifluoromethyl (CF₃) groups with a modified epoxy resin, diglycidyl ether of bisphenol F (DGEBF), using environmental friendly methods. The epoxy resin was cured with 4,4′‐diaminodiphenyl‐methane (DDM). For comparison, this study also investigated curing of commercially available diglycidyl ether of bisphenol A (DGEBA) with the same curing agent by varying the ratios of DGEBF. The structure and physical properties of the epoxy resins were characterized to investigate the effect of injecting fluorinated groups into epoxy resin structures. Regarding the thermal behaviors of the specimens, the glass transition temperatures (T_g) of 50–160°C and the thermal decomposition temperatures of 200–350 °C at 5% weight loss (T_d5%) in nitrogen decreased as amount of DGEBF increased. The different ratios of cured epoxy resins showed reduced dielectric constants (D_k) (2.03–3.80 at 1 MHz) that were lower than those of pure DGEBA epoxy resins. Reduced dielectric constant is related to high electrronegativity and large free volume of fluorine atoms. In the presence of hydrophobic CF₃ groups, the epoxy resins exhibited low moisture absorption and higher contact angles. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012