环氧树脂/三羟甲基丙烷三甲基丙烯酸酯互穿网络聚合物的微观结构和电性能研究

采用新型脂环族环氧树脂（CER）、甲基六氢邻苯二甲酸酐（MeHHPA）和三羟甲基丙烷三甲基丙烯酸酯（TMPTMA）作为基体树脂制备了一种崭新的互穿网络聚合物。由于TMPTMA的自由基聚合反应先于CER和MeHHPA的阳离子聚合反应,得到了一种分步互穿网络聚合物,最终分步互穿网络聚合物没有出现明显微观相分离现象。着重考察了TMPTMA含量对互穿网络聚合物电性能的影响。结果表明,CER/TMPTMA互穿网络聚合物在不同温度下的交流电阻与体系的组成和微观结构有关。随着TMPTMA含量的增加,CER/TMPTMA互穿网络聚合物的击穿强度和形态参数增大,互穿网络聚合物的均匀度逐渐增加,击穿机理趋于一致。     

On-line monitoring of cycloaliphatic epoxy/acrylate interpenetrating polymer networks formation and characterization of their mechanical properties

The novel interpenetrating polymer networks (IPNs) based on cycloaliphatic epoxy resin (CER) containing cyclohexene oxide groups and tri-functional acrylate, trimethylol-1, 1, 1-propane trimethacrylate (TMPTMA) were synthesized. The formation of the IPNs was on-line monitored by means of polarizing optical microscope, time-resolved light scattering and Fourier transform infrared spectroscopy. The morphological and mechanical properties of the resultant IPNs were investigated and evaluated with scanning electron microscopy (SEM) and dynamical thermal mechanical analysis (DTMA), respectively. The on-line monitoring results showed that during the course of the IPNs formation, the TMPTMA component was cured more quickly than the CER component, leading to the formation of the sequential IPNs. During the early curing stage, there were the phase separation phenomena in the CER/TMPTMA system. The SEM results revealed that although there were some slight phase separation phenomena in the CER/TMPTMA system in the early curing stage, the resultant IPNs displayed the homogeneous structures and did not show the apparent phase separation morphology. The DTMA results revealed that the resulting IPNs exhibited rather higher modulus and denser cross-linking network structure than the neat CER system.     

Morphologies and applied properties of free radical/cationic UV‐cured CPUA/TMPTMA/CER composite films

A UV‐cured composite film was prepared by free free‐radical photopolymerization from a blend containing oligomer cycloaliphatic polyurethane acrylate (CPUA) and reactive diluent trimethylolpropane trimethaacrylate (TMPTMA) with the same weight (coded as UT) in the presence of free free‐radical photoinitiator Irgacure 754. It was proved to be a homogeneous system featuring only one phase by means of scanning electron microscopy (SEM). Cycloaliphatic epoxy resin (CER) was introduced to enhance mechanical properties of the UV‐cured UT composite film in the presence of cationic photoinitiator Irgacure 250, and a series of UV‐cured CPUA/TMPTMA/CER composite films with different component ratios were prepared by free radical/cationic hybrid UV UV‐curing technique. Results of conversion curves, SEM, and Fourier‐ transform infrared spectroscopy illustrated that UT was cured faster than CER, leading to dynamically asymmetric photopolymerization‐induced phase ‐separation behaviors. The thermal and mechanical properties were evaluated via thermal degradation analysis, dynamic mechanical analysis, and stress–strain curves. Surface properties such as pencil hardness, pendulum hardness, shrinkage rate, contact angle, flexibility, and glossiness were also studied. All these measurements revealed that component ratios, intermolecular attractions, photopolymerization velocities, and viscosities had remarkably influenced on the morphologies and applied properties of UV‐cured composite films, and interpenetrating polymer network films had better comprehensive performances than other UV‐cured composite films with different microstructures. POLYM. COMPOS., 36:1177–1185, 2015. © 2014 Society of Plastics Engineers     

外电场对CER/TMPTMA IPNs形成过程的在线监测

利用自制装置研究了脂环族环氧树脂(CER)/三羟甲基丙烷三甲基丙烯酸酯(TMPTMA)互穿网络聚合物(IPNs)的固化过程.通过在线测试CER/TMPTMA体系固化过程中的交流电阻和电容,发现电阻和电容的变化反映出CER/TMPTMA体系的固化过程是一个分步IPNs的形成过程,而且电阻和电容变化趋势与体系的粘度、离子浓度以及偶极子的数量息息相关.利用自制电极和装置可以远距离在线监测热固性树脂的固化过程,在外磁场干扰下,利用CER/TMPTMA固化体系的电阻波动可以表征体系的固化反应情况.     

Amino‐capped aniline trimer/epoxy resin intercrosslinked networks

An amino‐capped aniline trimer (ACAT) in emeraldine base form was reacted with an epoxy resin to produce intercrosslinked networks. The quinoid structure of the ACAT was able to crosslink on curing and, thus, led to a very high glass‐transition temperature of the cured resin. The epoxy resin cured with the ACAT showed superior thermal properties over the resins cured with p‐phenylenediamine and 4,4′‐diamino diphenylamine. These findings were based on differential scanning calorimetry, IR, dynamic mechanical analysis, and thermogravimetric analysis data. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 222–226, 2006     

Preparation and characterization of 3,3′‐bis (maleimidophenyl)phenylphosphine oxide (BMI)/polysulfone modified epoxy intercrosslinked matrices

An intercrosslinked network of polysulfone (PSF)—bismaleimide (BMI) modified epoxy matrix system was made by using diglycidyl ether of bisphenol A (DGEBA) epoxy resin, hydroxyl terminated polysulfone and bismaleimide (3,3′‐bis(maleimidophenyl) phenylphosphine oxide) with diaminodiphenylmethane (DDM) as curing agent. BMI–PSF–epoxy matrices were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and heat deflection temperature (HDT) analysis. The matrices, in the form of castings, were characterized for their mechanical properties such as tensile strength, flexural strength, and unnotched Izod impact test as per ASTM methods. Mechanical studies indicated that the introduction of polysulfone into epoxy resin improves the toughness to an appreciable extent with insignificant increase in stress–strain properties. DSC studies indicated that the introduction of polysulfone decreases the glass transition temperature, whereas the incorporation of bismaleimide into epoxy resin influences the mechanical and thermal properties according to its percentage content. DSC thermograms of polysulfone as well as BMI modified epoxy resin show a unimodal reaction exotherm. The thermal stability and flame retardant properties of cured epoxy resins were improved with the introduction of bismaleimide and polysulfone. Water absorption characteristics were studied as per ASTM method and the morphology of the BMI modified epoxy and PSF‐epoxy systems were studied by scanning electron microscope. POLYM. COMPOS., 2008. © 2008 Society of Plastics Engineers     

Novel adamantane‐containing epoxy resin

A novel adamantane‐containing epoxy resin diglycidyl ether of bisphenol‐adamantane (DGEBAda) was successfully synthesized from 1,3‐bis(4‐hydroxyphenyl)adamantane by a one‐step method. The proposed structure of the epoxy resin was confirmed with Fourier transform infrared, ¹H‐NMR, gel permeation chromatography, and epoxy equivalent weight titration. The synthesized adamantane‐containing epoxy resin was cured with 4,4′‐diaminodiphenyl sulfone (DDS) and dicyandiamide (DICY). The thermal properties of the DDS‐cured epoxy were investigated with differential scanning calorimetry and thermogravimetric analysis (TGA). The dielectric properties of the DICY‐cured epoxy were determined from its dielectric spectrum. The obtained results were compared with those of commercially available diglycidyl ether of bisphenol A (DGEBA), a tetramethyl biphenol (TMBP)/epoxy system, and some other associated epoxy resins. According to the measured values, the glass‐transition temperature of the DGEBAda/DDS system (223°C) was higher than that of the DGEBA/DDS system and close to that of the TMBP/DDS system. TGA results showed that the DGEBAda/DDS system had a higher char yield (25.02%) and integral procedure decomposition temperature (850.7°C); however, the 5 wt % degradation temperature was lower than that of DDS‐cured DGEBA and TMBP. Moreover, DGEBAda/DDS had reduced moisture absorption and lower dielectric properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Flame retardancy and dielectric properties of dicyclopentadiene‐based benzoxazine cured with a phosphorus‐containing phenolic resin

A dicyclopentadiene‐based benzoxazine (DCPDBZ) was prepared and separately copolymerized with melamine–phenol formaldehyde novolac or phosphorus‐containing phenolic resin (phosphorus‐containing diphenol) at various molar ratios. Their curing behaviors were characterized by differential scanning calorimetry. The electrical properties of the cured resins were studied with a dielectric analyzer. The glass‐transition temperatures were measured by dynamic mechanical analysis. The thermal stability and flame retardancy were determined by thermogravimetric analysis and a UL‐94 vertical test. These data were compared with those of bisphenol A benzoxazine and 4,4′‐biphenol benzoxazine systems. The effects of the diphenol structure and cured composition on the dielectric properties, moisture resistance, glass‐transition temperature, thermal stability, and flame retardancy are discussed. The DCPDBZ copolymerized with phosphorus‐containing novolac exhibited better dielectric properties, moisture resistance, and flame retardancy than those of the melamine‐modified system. The flame retardancy of the cured benzoxazine/phosphorus‐containing phenolic resins increased with increasing phosphorus content. The results indicate that the bisphenol A and 4,4′‐biphenol systems with a phosphorus content of about 0.6% and the dicyclopentadiene system with a phosphorus content of about 0.8% could achieve a flame‐retardancy rating of UL‐94 V‐0. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Study on the curing reaction,dielectric and thermal performances of epoxy impregnating resin with reactive silicon compounds as new diluents

Two silicon compounds including (3‐glycidoxypropyl)trimethoxysilane (A187) and (3‐glycidoxypropyl)methyldiethoxysilane (W78) were used and studied as reactive diluents for aluminum (III) acetylacetonate (Alacac) accelerated epoxy/anhydride impregnating resin systems. The dielectric performances were studied and characterized by the dielectric dissipation factor, dielectric constant, volume resistivity, and breakdown strength. The curing behaviors and thermal properties of the cured impregnants were studied by Fourier transform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC), and thermogravimetry. The activation energies of different epoxy formulations were determined with Kissinger method. The results showed that W78 was effective to decrease the viscosity and had little influence on the curing reaction. The cured sample of 15 parts‐of‐W78‐containing‐epoxy resin/methyl‐hexahydrophthalic anhydride (MHHPA) accelerated by Alacac exhibits good dielectric and heat resistant performances with a dielectric dissipation factor below 0.04 at 155°C. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Synthesis,formulation, and characterization of siloxane‐modified epoxy‐based anticorrosive paints

Diglycidyl ether of bisphenol A epoxy (E) was modified with hydroxyl‐terminated polydimethylsiloxane through a ring‐opening addition polymerization reaction. The structural elucidation of the siloxane‐modified epoxy resin (ES) was carried out with Fourier transform infrared, ¹H‐NMR, and ¹³C‐NMR spectroscopy techniques. The physicochemical characterization of the synthesized resin (ES) was performed with standard methods. E and ES were subjected to paint formulation with the help of a rutile (TiO₂) pigment. The formulated paint systems were cured at room temperature with 1,6‐diaminohexane (AH) and 1,3‐diaminopropane (AP), which were used as curatives. The E–AH, E–AP, ES–AH, and ES–AP paint systems were applied to mild steel strips. The physicomechanical and anticorrosive performance of the coated panels was evaluated with standard methods. The thermal analysis of these E–amine and ES–amine systems was carried out via thermogravimetric analysis. The effects of siloxane incorporation and amine curatives on the coating properties of the paint systems were also investigated. The ES–AP system exhibited good thermal and corrosion stability performance among all the E and ES paint systems. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 4981–4991, 2006     

Sepiolite‐reinforced epoxy nanocomposites: Thermal,mechanical, and morphological behavior

A bisphenol A‐based epoxy resin was modified with pristine sepiolite and an organically surface‐modified sepiolite and thermally cured using two different curing agents: an aliphatic and a cycloaromatic diamine. The nanocomposites were characterized by dynamic mechanical analysis (DMA), rheology, thermogravimetric analysis (TGA), and electron microscopy. The initial sepiolite–epoxy mixtures show a better dispersion for the sepiolite‐modified system that forms a percolation network structure. Mechanical properties have also been determined. The flexural modulus of the epoxy matrix slightly increases by the incorporation of the organophilic sepiolite. The flexural strength of the sepiolite‐modified resin cured with the aliphatic diamine increased by 10%, while the sepiolite‐modified resin cured with the cycloaromatic diamine resulted in a lower flexural strength, as compared with the unmodified resin. Electron micrographs revealed a better nanodispersion of the sepiolite in the epoxy matrix for the organophilic modified sepiolite nanocomposite. The initial thermal decomposition temperature did not change significantly with the addition of sepiolite, whereas mechanical properties were affected. The reduced flexural strength was attributed to the stress concentrations caused by the sepiolite modifier. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Synthesis and thermal stability of a novel cycloaliphatic epoxy resin system

A novel cycloaliphatic epoxy resin was synthesized from dicyclopentadiene, ethylene glycol, and nadic anhydride. The chemical structures of the resultant epoxy resin and its precursor were characterized with Fourier transform infrared spectroscopy, ¹H‐NMR, and mass spectrographic analyses. The thermal stability of the cured polymer was investigated with differential scanning calorimetry and thermogravimetric analysis. Compared with the thermal stability of the commercial cycloaliphatic epoxy resin 3,4‐epoxy cyclohexyl methyl‐3′,4′‐epoxy cyclohexyl carboxylate, a higher thermal stability for the cured polymer of the novel epoxy resin was observed. The results imply that the novel cycloaliphatic epoxy resin has good potential applications in electronic encapsulation. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Heterocyclic‐based epoxy‐terminated structural adhesive. II. Curing,adhesive strength,and thermal stability

We studied the curing behavior of heterocyclic‐based epoxy‐terminated resins using diaminodiphenyl ether, diaminodiphenyl sulfone, benzophenone tetracarboxylicdianhydride, and the commercial hardener of Ciba‐Geigy's two‐pack Araldite as curing agents. The adhesive strength of the adhesives was measured by various ASTM methods such as lap‐shear, peel, and cohesive tests on metal–metal, wood–wood, and wood–metal interfaces. All of these results were compared with those of an epoxy resin prepared from bisphenol‐A and epichlorohydrin resin with an epoxy equivalent value of 0.519. The thermal stability of both the virgin resin and its cured form was also studied by thermogravimetric analysis. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 3520–3526, 2002     

Thermophysical properties of anhydride‐cured epoxy/nano‐clay composites

Polymer nano‐composites made with a matrix of anhydride‐cured diglycidyl ether of bisphenol A (DGEBA) and reinforced with organo‐montmorillonite clay were investigated. A sonication technique was used to process the epoxy/clay nano‐composites. The thermal properties of the nano‐composites were measured with dynamic mechanical analysis (DMA). The glass transition temperature T_g of the anhydride‐cured epoxy was higher than the room temperature (RT). For samples with 6.25 wt% (4.0 vol%) of clay, the storage modulus at 30°C and at (T_g + 15)°C was observed to increase 43% and 230%, respectively, relative to the value of unfilled epoxy. The clay reinforcing effect was evaluated using the Tandon‐Weng model for randomly oriented particulate filled composites. Transmission electron microscopy (TEM) examination of the nano‐composites prepared by sonication of clays in acetone showed well‐dispersed platelets in the nano‐composites. The clay nano‐platelets were observed to be well‐intercalated/expanded in the anhydride‐cured epoxy resin system. POLYM. COMPOS., 26:42–51, 2005. © 2004 Society of Plastics Engineers.     

Synthesis and properties of fluorinated biphenyl‐type epoxy resin

A novel fluorinated biphenyl‐type epoxy resin (FBE) was synthesized by epoxidation of a fluorinated biphenyl‐type phenolic resin, which was prepared by the condensation of 3‐trifluoromethylphenol and 4,4′‐bismethoxymethylbiphenyl catalyzed in the presence of strong Lewis acid. Resin blends mixed by FBE with phenolic resin as curing agent showed low melt viscosity (1.3–2.5 Pa s) at 120–122°C. Experimental results indicated that the cured fluorinated epoxy resins possess good thermal stability with 5% weight loss under 409–415°C, high glass‐transition temperature of 139–151°C (determined by dynamic mechanical analysis), and outstanding mechanical properties with flexural strength of 117–121 MPa as well as tensile strength of 71–72 MPa. The thermally cured fluorinated biphenyl‐type epoxy resin also showed good electrical insulation properties with volume resistivity of 0.5–0.8 × 10¹⁷ Ω cm and surface resistivity of 0.8–4.6 × 10¹⁶ Ω. The measured dielectric constants at 1 MHz were in the range of 3.8–4.1 and the measured dielectric dissipation factors (tan δ) were in the range of 3.6–3.8 × 10^?3. It was found that the fluorinated epoxy resins have improved dielectric properties, lower moisture adsorption, as well as better flame‐retardant properties compared with the corresponding commercial biphenyl‐type epoxy resins. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Processing and characterization of epoxy–anhydride‐based intercalated nanocomposites

A study of the kinetic and thermal characterization of an epoxy resin (DGEBA) polymerized with a methyl tetrahydrophthalic anhydride reinforced with montmorillonite‐layered silicates is presented. The nanoreinforcement used was compatibilized by exchanging the cations between the silicate layers with alkylammonium salts, containing long hydrocarbon chains. The aim of this study was to develop new nanocomposites based on thermoset resins with improved thermal stability, suitable for electronic applications. Differential scanning calorimetry was used here to produce the polymerization kinetics data, while thermogravimetric analysis was used to evaluate the effects of the nanoreinforcements on the thermal stability and to analyze the degradation kinetics. Unexpected strong effects of the nanocomposite on the polymerization kinetics of the epoxy–anhydride system were detected and evaluated. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 2532–2539, 2003     

Study of dynamically cured PP/MAH‐g‐PP/talc/epoxy composites

In the present study, an epoxy resin was dynamically cured in a polypropylene (PP)/maleic anhydride–grafted PP (MAH‐g‐PP)/talc matrix to prepare dynamically cured PP/MAH‐g‐PP/talc/epoxy composites. An increase in the torque at equilibrium showed that epoxy resin in the PP/MAH‐g‐PP/talc composites had been cured by 2‐ethylene‐4‐methane‐imidazole. Scanning electron microscopy analysis showed that MAH‐g‐PP and an epoxy resin had effectively increased the interaction adhesion between PP and the talc in the PP/talc composites. Dynamic curing of the epoxy resin further increased the interaction adhesion. The dynamically cured PP/MAH‐g‐PP/talc/epoxy composites had higher crystallization peaks than did the PP/talc composites. Thermogravimetric analysis showed that the addition of MAH‐g‐PP and the epoxy resin into the PP/talc composites caused an obvious improvement in the thermal stability. The dynamically cured PP/MAH‐g‐PP/talc/epoxy composites had the best thermal stability of all the PP/talc composites. The PP/MAH‐g‐PP/talc/epoxy composites had better mechanical properties than did the PP/MAH‐g‐PP/talc composites, and the dynamically cured PP/MAH‐g‐PP/talc/epoxy composites had the best mechanical properties of all the PP/talc composites, which can be attributed to the better interaction adhesion between the PP and the talc. The suitable content of epoxy resin in the composites was about 5 wt %. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci, 2006     

Thermal stability and kinetics analysis of rubber‐modified epoxy resin by high‐resolution thermogravimetric analysis

A dynamic heating rate mode of high‐resolution thermogravimetric analysis was used to study the thermal and thermal‐oxidative stability, as well as kinetics analyses, of a model liquid rubber‐modified epoxy resin, Ep/CTBN, made up of bisphenol A diglycidyl ether‐based epoxy and carboxyl‐terminated butadiene acrylonitrile rubber (CTBN). Results show that the thermal degradation of Ep/CTBN resin in nitrogen and air consists of two and three independent steps, respectively. Moreover, Ep/CTBN has a higher initial degradation temperature and higher activation energy than those of pure epoxy resin in both gases, indicating that the addition of CTBN to epoxy can improve the thermal and thermal‐oxidative stability of pristine epoxy resin. Kinetic parameters such as activation energy, reaction order, and preexponential factor of each degradation step of both Ep/CTBN and pure epoxy resins in air and nitrogen were calculated. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 3594–3600, 2003     

Toughening of cycloaliphatic epoxy resins by poly(ethylene phthalate) and related copolyesters

Poly(ethylene phthalate) (PEP) and poly(ethylene phthalate–co‐ethylene terephthalate) were used to improve the brittleness of the cycloaliphatic epoxy resin 3,4‐epoxycyclohexylmethyl 3,4‐epoxycyclohexane carboxylate (Celoxide 2021?), cured with methyl hexahydrophthalic anhydride. The aromatic polyesters used were soluble in the epoxy resin without solvents and effective as modifiers for toughening the cured epoxy resin. For example, the inclusion of 20 wt % PEP (MW, 7400) led to a 130% increase in the fracture toughness (K_IC) of the cured resin with no loss of mechanical and thermal properties. The toughening mechanism is discussed in terms of the morphological and dynamic viscoelastic behaviors of the modified epoxy resin system. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 388–399, 2002; DOI 10.1002/app.10363     

Preparation and characterization of siliconized epoxy‐1,2‐bis(maleimido)ethane intercrosslinked matrix materials

Novel intercrosslinked networks of siliconized epoxy‐1,2‐bis(maleimido)ethane matrix systems are developed. The siliconization of epoxy resin is carried out by using 5–15% hydroxyl‐terminated poly(dimethylsiloxane) with γ‐aminopropyltriethoxysilane as a crosslinking agent and dibutyltin dilaurate as a catalyst. The siliconized epoxy systems are further modified with 5–15% 1,2‐bis(maleimido)ethane and cured by using diaminodiphenylmethane. The prepared neat resin castings are characterized for their mechanical properties. Mechanical studies indicate that the introduction of siloxane into these epoxy resins improves the toughness with a reduction in the stress–strain values, whereas incorporation of bismaleimide (BMI) into the epoxy resin improves the stress–strain properties with a lowering of the toughness. The introduction of both siloxane and BMI into the epoxy resin influences the mechanical properties according to their content percentages. Differential scanning calorimetry (DSC), thermogravimetry, and heat distortion temperature analyses are also carried out to assess the thermal behavior of the matrix materials that are developed. DSC thermograms of the BMI modified epoxy systems show unimodal reaction exotherms. The glass‐transition temperature, thermal degradation temperature, and heat distortion temperature of the cured BMI modified epoxy and siliconized epoxy systems increase with increasing BMI content. The water absorption behavior of the matrix materials is also studied. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 3808–3817, 2003