InP/GaAs异质外延及异变InGaAs光探测器制备

借助超薄低温InP缓冲层,在GaAs衬底上生长出了高质量的InP外延层,在InP外延层中插入了15周期In0.93Ga0.07P/InP应变层超晶格(SLS),进一步阻断了失配位错穿透到晶体表面,提高了外延层的晶体质量,这样2.5 μm厚InP外延层的双晶X射线衍射(DCXRD)ω扫描半高全宽(FWHM)值降低至219 arcsec,该InP外延层的室温光荧光(PL)谱线宽度仅为42 meV.在此基础上,只利用超薄低温InP缓冲层技术就在半绝缘GaAs衬底上成功地制备出了长波长异变In0.53Ga0.47As PIN光电探测器,器件的台面面积为50 μm×50 μm,In0.53Ga0.47As吸收层厚度为300 nm,在3 V反偏压下器件的3 dB带宽达到了6 GHz,在1 550 nm波长处器件的响应度达到了0.12 A/W,对应的外量子效率为9.6%.     

基于MOCVD的InP/GaAs异质外延生长

使用金属有机物气相沉积方法(MOCVD),在GaAs衬底上生长InP外延层.先在GaAs衬底上生长一层低温InP缓冲层,然后再生长InP外延层.通过比较不同缓冲层生长条件下的外延层晶体质量,发现在生长温度为450℃,厚度约15nm的缓冲层上外延所得到的晶体质量最理想;此外,外延层厚度的增加对其晶体质量有明显改善作用.实验在优化生长条件的同时,也考虑了热退火等辅助工艺,最后所获得的外延层的双晶X射线衍射(DCXRD)的ω/2θ扫描外延峰半高全宽(FWHM)值为238.5".     

基于MOCVD的InP/GaAs异质外延生长

使用金属有机物气相沉积方法(MOCVD),在GaAs衬底上生长InP外延层.先在GaAs衬底上生长一层低温InP缓冲层,然后再生长InP外延层.通过比较不同缓冲层生长条件下的外延层晶体质量,发现在生长温度为450℃,厚度约15nm的缓冲层上外延所得到的晶体质量最理想;此外,外延层厚度的增加对其晶体质量有明显改善作用.实验在优化生长条件的同时,也考虑了热退火等辅助工艺,最后所获得的外延层的双晶X射线衍射(DCXRD)的ω/2θ扫描外延峰半高全宽(FWHM)值为238.5".     

基于低温In_xGa_(1-x)P组分渐变缓冲层的InP/GaAs异质外延

采用低温GaAs与低温组分渐变InxGa1-xP作为缓冲层,利用低压金属有机化学气相外延(LP-MOCVD)技术,在GaAs(001)衬底上进行了InP/GaAs异质外延实验。实验中,InxGa1-xP缓冲层选用组分线性渐变生长模式(xIn0.49→1)。通过对InP/GaAs异质外延样品进行双晶X射线衍射(DCXRD)测试,并比较1.2μm厚InP外延层(004)晶面ω扫描及ω-2θ扫描的半高全宽(FWHM),确定了InxGa1-xP组分渐变缓冲层的最佳生长温度为450℃、渐变时间为500s。由透射电子显微镜(TEM)测试可知,InxGa1-xP组分渐变缓冲层的生长厚度约为250nm。在最佳生长条件下的InP/GaAs外延层中插入生长厚度为48nm的In0.53Ga0.47As,并对所得样品进行了室温光致发光(PL)谱测试,测试结果表明,中心波长为1643nm,FWHM为60meV。     

GaAs衬底上InP的直接外延生长及性能表征

用低压金属有机物气相外延(LP-MOCVD)技术,采用低温缓冲层生长法,在GaAs(100)衬底上直接生长了高质量的InP外延层.1.2 μm InP(004)面X射线衍射(XRD) ω-2θ和ω扫描半高全宽(FWHM)分别为373 arcsec和455 arcsec,在外延层中插入10周期Ga0.1In0.9P/InP应变超晶格后,其半高全宽分别下降为338 arcsec和391 arcsec.透射电子显微镜(TEM)测试显示,应变超晶格有效地抑制了失配位错穿进外延层,表明晶体质量得到了较大提高.     

InGaAs/GaAs应变层短周期超晶格的Wannier-Stark效应

本文利用光电流谱方法研究了10—300K温度范围内In_(0.2)Ga_(0.8)As/GaAs应变层短周期超晶格的Wannier-Stark效应,在室温及低温下均观察到明显的吸收边场致“蓝移”现象,并对Stark-ladder激子跃迁的能量位置及振子强度随电场的变化给予详细讨论。实验结果表明,利用In_(0.2)Ga_(0.8)As/GaAs应变层超晶格的Wannier-Stark效应可以制作0.98μm波长范围的电光调制器和自电光双稳器件。     

GaAs/Si异质外延的新进展

本工作从原理和实验技术上证实了氯化物VPE技术可用于CaAs/Si异质外延.CaAs/Si外延层表面平整光亮.对外延层进行了组分测量、高分辨率电镜和X-射线衍射分析.结果表明,外延层是符合化学计量比的CaAs单晶,外延层浓度可控范围为10~(14)～10~(17)cm~(-3),纵向掺杂分布平坦.用这种材料制成MESFET样管,跨导为40mS/mm.     

图案化GaAs衬底外延InP局域表面成核层生长

使用光学显微镜、原子力显微镜和微区喇曼光谱对在纳球光刻图案化GaAs衬底的孔洞区进行金属有机化学气相沉积(MOCVD)进而对InP成核层进行了研究.实验结果表明,该局域表面InP的成核层生长和孔洞的大小、方向、位置关系不大,与MOCVD的生长条件相关.与渐变缓冲层生长相比,在InP的成核层中没有出现穿透位错,其结晶质量随着温度的升高而提高,但其表面粗糙度会随着温度的升高而增加,这个现象可能和它的3D岛状生长有关.AFM测试结果表明,提高Ⅴ/Ⅲ比可以在较低的温度下抑制其表面粗糙度降至纳米量级.微区喇曼光谱测试表明,在适当条件生长下可获得InP成核层的二维生长方式.该研究为进一步基于ART机理在二维图案化GaAs衬底开展InP异质外延研究奠定基础.     

GexSi1—xSi应变层和超晶格及其临界厚度

异质外延层的性能和质量,往往取决于异质结构的特性。文章讨论了Ge_xSi-(1-x)/Si 应变层和应变层超晶格中的应变、位错和临界厚度,并比较了实验结果。     

Electrical Characterization of Different Passivation Treatments for Long-Wave Infrared InAs/GaSb Strained Layer Superlattice Photodiodes

Silicon dioxide (SiO₂), silicon nitride (Si _x N _y ), and zinc sulfide (ZnS) with ammonium sulfide [(NH₄)₂S] as a prepassivation surface treatment were compared as passivants for InAs/GaSb strained layer superlattice detectors with a 0% cutoff wavelength of ∼10 μm. SiO₂ did not show significant improvement and the zero-bias resistance-area product (R ₀ A) was 0.72 Ω-cm² at 77 K. Si _x N _y passivation showed a nominal improvement with an R ₀ A value of 4.1 Ω-cm² at 77 K. ZnS with (NH₄)₂S treatment outperformed others significantly, improving the R ₀ A value to 492 Ω-cm² at 77 K. Variable-area diode measurements indicated a bulk-limited R ₀ A value of 722 Ω-cm². ZnS-passivated diodes exhibited maximum surface resistivity with a value of 2500 Ω-cm.     

Transient-mode liquid phase epitaxy of GaAs on InP and AlGaAs on GaP

Transient-mode liquid epitaxy (TMLE), where a cooler substrate is inserted into a hotter solution, has been used to grow layers on substrates which are mismatched ± 3,7%, Both AlGaAs on GaP and GaAs on InP have been sucessfully deposited. An improved surface morphology is observed in both cases when this technique is employed and is shown by IR transmission and x-ray topography to be caused by a very fine uniformly dispersed initial nucleation, A model for growth in this mode which assumes a diffusion-limited process is derived and is seen to agree well with GaAs experimental data originally presented by Deitch. The work was supported by the Energy Research and Development Administration, Washington DC, under contract E(04-3)-1250.     

利用双低温缓冲层和插入应变超晶格技术制备高质量InP-on-GaAs复合衬底的MOCVD生长

提出一种结合双低温缓冲层和应变超晶格优势的高质量InP-on-GaAs复合衬底制备技术．研究发现LT-InP/LT-GaAs的双低温缓冲层比单一低温InP缓冲层的聚集应变的效果更为显著．并且,双低温缓冲层中的低温GaAs层存在一个最优生长厚度．当低温InP生长厚度一定,低温GaAs层的生长厚度达到优化生长厚度时,LT-InP/LT-GaAs双低温缓冲层能达到调节应变的最佳状态．最后,通过插入InGaP/lnP应变超晶格,并且优化其在外延层中的插入位置．得到了高质量的InP-on-GaAs的复合衬底,2μm厚的lnP外延层XRD-ω/2θ扫描的半高宽小于200．     

利用双低温缓冲层和插入应变超晶格技术制备高质量InP-on-GaAs复合衬底的MOCVD生长

提出一种结合双低温缓冲层和应变超晶格优势的高质量InP-on-GaAs复合衬底制备技术. 研究发现LT-InP/LT-GaAs的双低温缓冲层比单一低温InP缓冲层的聚集应变的效果更为显著. 并且,双低温缓冲层中的低温GaAs层存在一个最优生长厚度. 当低温InP生长厚度一定,低温GaAs层的生长厚度达到优化生长厚度时,LT-InP/LT-GaAs双低温缓冲层能达到调节应变的最佳状态. 最后,通过插入InGaP/InP应变超晶格,并且优化其在外延层中的插入位置,得到了高质量的InP-on-GaAs的复合衬底,2μm厚的InP外延层XRD-ω/2θ扫描的半高宽小于200" .     

形变超晶格的位错模型与粒子的退道效应

引入位错模型讨论粒子的退道效应.把超晶格的沟道偏折等效为位错引起的沟道弯曲,并对刃型位错的退道行为作了具体分析.利用正弦平方势,把粒子运动方程化为具有外力矩的摆方程,用能量法分析了系统的相平面特征,导出了系统的退道系数.     

混合激励与应变超晶格系统沟道运动的临界特征

从势和场的观点出发讨论了带电粒子在应变超晶格中的运动行为.在经典力学框架内和偶极近似下,引入正弦平方势,把粒子运动方程化为具有阻尼项和混合激励项的广义摆方程.利用Melnikov方法讨论了系统的临界性质与混沌行为.结果表明,系统的混沌行为与它的参数有关,适当调节参数,就可以原则上保证系统的稳定性.     

Hydrogen passivation of defects and impurities in GaAs and InP

Hydrogen passivation experiments in GaAs and InP are discussed. For GaAs it is argued that the results of hydrogen passivation of shallow donors, shallow acceptors and deep centers in materials with different Fermi level positions as well as diffusion data for undoped or lightly doped GaAs are consistent with the assumption that hydrogen is neutral or amphoteric (at least at rather high temperatures of treatment). Some new interesting effects are reported such as improvement of GaAs homogeneity as revealed by microcathodoluminescence imaging and also hydrogen passivation of surface states in GaAs. Evidence is presented that hydrogenation in direct plasmas leads to damage region formation at the surface of the GaAs. A new method of hydrogenation is described that is free from that drawback. The marked improvement of Au/n-GaAs Schottky diodes I-V characteristics is reported after using this method. This new technique is also used to hydrogenate InP for which conventional methods encounter very serious problems. In InP the results of hydrogen passivation experiments on shallow donors and acceptors imply that hydrogen is a deep donor. An interesting effect of injection annealing at room temperature of hydrogen-donor complexes inn-InP is observed.