Asymmetric focusing microlens array fabricated using off-axis lithography

An asymmetric microlens with a given inclination angle was fabricated. Two circular pattern masks with different diameters were used to form a metal pattern and photoresist column on the substrate using the photolithography process. The metal pattern on the substrate was used to control the asymmetric microlens profile using thermal reflow. A lift-off process was applied to the first lithography to precisely define the metal pattern. A second lithography used deviation counterpoint exposure to pattern the photoresist column. The photoresist column was converted into a rubbery state when its temperature was increased to its glass transition temperature (Tg) during the thermal reflow. The asymmetric microlens structure was formed by shifting the arc vertex of the microlens toward one direction taking into account the fact that the copper coating surface has superior hydrophobicity to the silicon substrate surface. A 55° asymmetric microlens array was fabricated in this research by properly controlling the copper pattern size and the offset of two centers.     

Fabrication of microlens array with graduated sags using UV proximity printing method

A graduated microlens array is presented in this paper. The proposed device has the same aperture microlens with a gradually increasing sag in the substrate. The design produces gradual decrease in the focal length and intensity when the light passes through the graduated microlens array. This paper presents a new graduated microlens array fabrication method that uses a variable printing gap in the UV lithography process. This method can precisely control the geometric profile of each microlens array without using the thermal reflow process. The angles between the mask and photoresist were placed at 5°, 8°, 10°, 15°, and 20° using a fixture designed in this study. The mask patterns were ellipses with an isosceles triangle arrangement to compensate for the partial geometry.     

New high fill-factor dual-curvature microlens array fabrication using UV proximity printing

A new high fill-factor dual-curvature microlens array fabrication method using lithographic proximity printing process is reported. The proposed technology utilizes UV proximity printing by controlling a printing gap between the mask and substrate. The designed microlens array pattern with high density can produce a high fill-factor dual-curvature microlens array in photoresist. Because the UV light diffraction deflects away from the aperture edges and produces exposure in photoresist material outside the aperture edges, this method can precisely control the geometric profile of a high fill factor dual-curvature microlens array. The experimental results showed that the dual-curvature micro-lens array can be formed automatically in photoresist when the printing gap ranged from 360 to 600 μm. The gapless dual-curvature microlens array will be used to enhance the luminance uniformity for light-emitting diodes (LEDs).     

New high fill-factor triangular microlens array fabrication method using UV proximity printing

A simple and effective method for fabricating a high fill-factor triangular microlens array using the proximity printing in lithography process is reported. The technology utilizes the UV proximity printing by controlling the printing gap between the mask and substrate. The designed approximate triangle microlens array pattern can be fabricated in photoresist. This is because to the UV light diffraction deflects away from the aperture edges and produces a certain exposure in photoresist material outside the aperture edges. This method can precisely control the geometric profile of a high fill-factor triangular microlens array. The experimental results showed that the triangular photoresist microlens array could be formed automatically when the printing gap ranged from 240 to 840 μm. The gapless triangular microlens array will be used to increase the luminance for the backlight module of liquid crystal displays. An erratum to this article can be found at     

AlN陶瓷微热板MEMS传感器阵列设计与工艺实现

针对陶瓷基微热板MEMS器件难以微加工,器件表面加热Pt膜使用普通正性光刻胶难以实现光刻剥离的工艺难点问题,提出了激光微加工和柔性机械剥离相结合的微加工方法。以AlN陶瓷为衬底基片,采用激光微加工技术实现热隔离刻蚀体加工,刻蚀梁宽可达0.2 mm。采用柔性机械剥离工艺制备方法解决普通正性光刻胶形成倒梯形凹槽Pt膜难实现图形化问题,可在复杂表面特性的陶瓷基衬底上实现Pt膜剥离线宽10μm。同时利用有限元法进行传感器阵列设计和热结构仿真,验证设计工艺的可行性。     

Fabrication of a micro-tip array mold using a micro-lens mask with proximity printing

In this study, a mold for a micro-tip array is fabricated using a microlens array mask with proximity exposure. The micro-tip array uses a microlens array mask with geometrical optics. Light passing through a microlens is focused at the focal points. There is microlens on the mask and the pattern that results from the light passing through the mask is directly projected onto the photoresist surface. A concave profile is developed using a positive photoresist and the remaining photoresist microstructures are formed after the development process. By changing the distance between the mask and the photoresist and the radius of curvature of the microlens, various tip shapes can be fabricated. The exposure gap is calculated using the microlens array mask and the geometry of the mold of micro-tip array is established using the irradiance absorption maps for the different levels. These methods respectively use the model of the positive photoresist and optical software. When electroforming a metallic micro-tip copy of the patterned photoresist, masters are created. The metal micro-tip array is used membrane probe card.     

Fabrication and analysis of the reflowed microlens arrays using JSR THB-130 N photoresist with different heat treatments

This paper reports that the fabrication of the reflowed microlens by the negative tone JSR THB-130 N photoresist can be treated with different thermal treatments using hotplate and oven. The different disk or thin cylinder arrays with diameters of 40–70 μm and thickness of about 7.4 μm were patterned using photolithography technology, and baked at 220°C by two kinds of thermal treatments using hotplate and oven to form reflowed microlens arrays. The spot size of the refractive microlens was then measured by optical microscopy and the total focal length of refractive microlens was simulated by curve fitting the lens profiles. The resolution of the microlens arrays approaches to 400 dpi as coated with Hexamethyldisilizane material. The smallest spot size of about 2.72 μm at the nominal 40 μm microlensis is obtained by the oven heat treatment, and the shortest total focal length of about 150 μm at the nominal 40 μm microlens is achieved by the hotplate heat treatment. The reduced spot size and total focal length of the microlens could improve the density and performance of optical devices and imaging systems.     

Fabrication of cone-like microstructure using UV LIGA-like for light guide plate application

The microlens array is usually formed by thermal reflow of polymer disks and can be one microstructure of the light guide plate (LGP). Here, we propose an ultraviolet (UV) backside exposure technology to fabricate the photoresist cone-like microstructure on the PMMA substrate at room temperature and then use UV LIGA-like process to transfer the microstructure for the application of 3.6 in. (72 mm × 57.5 mm) LGP. The electroforming was used to transfer UV master mold to the inverse cone-like microstructure of nickel metal mold and then hot embossing was used for one more pattern transfer to the same cone-like microstructure on PMMA substrate. The optical microscope and alpha-stepper profiler were used to examine the morphology and profile of LGP microstructure. The optical luminance and uniformity of LGP were measured using BM9 luminance meter in comparison with commercial product. The light uniformity and luminance of the cone-like LGP microstructure reach 75–80% and 2,800–3,000 cd/cm², respectively which meet the requirements of commercial LGP.     

Micro-ball lens array fabrication in photoresist using PTFE hydrophobic effect

This paper presents a simple method for fabricating a micro-ball lens and its array. The core technology involves the hydrophobic characteristics of polyterafluoroethylene (PTFE) substrate. High contact angle between the melted photoresist pattern and PTFE generates the micro-ball lens and array. The PTFE thin film is spun onto a silicon wafer and oven dried. Photoresist AZ4620 is used to pattern micro-columns with various diameters; 60, 70 and 80 μm. A thermal reflow process is then applied to melt these micro-column patterns into a micro-ball lens array. The achieved micro-ball lens array has a diameter of 98 μm fabricated using 80 μm diameter patterns. This method provides a simple fabrication process and low material cost.     

A novel fabrication method of micro-needle mold by using the micro-lens mask through contact printing

This study presents a novel and precision process for fabricating a microneedle mold. The process includes a microlens array mask with contact printing in ultraviolet lithography. This method can precisely control the geometric profile of a microneedle array without the use of an etching process. The micro tapered cone microneedle mold utilizes the microlens array mask with geometrical optics. The light passes through the microlens and a hole in a Cr film of a mask, and then radiates onto the photoresist film. The light transmitted through the microlens has an aligned focal point on the photoresist film. An optical system is set up to characterize the optical performance of the machined microneedle, and then compared with theoretical data. The results show that the length of the microneedle from the experiment is close to the derived results. Moreover, the length of the microneedle is significantly influenced by the height and diameter of the microlens. Therefore, this method could also simplify the process and reduce the time needed for the fabrication of the microneedle. The micro cone microneedle has have great potential in the area of the drug delivery applications.     

Modelling and simulation of forming process of the lithographically fabricated out-of-plane microlens using a cellular automata method

Three dimensional (3D) cellular automata (CA) model has been successfully applied in photoresist etching simulation in recent years. In this paper, a simplified 3D CA model is used to simulate the etching process of out-of-plane microlens fabricated on thick SU-8 photoresist. The simulation results are compared with experimental results. This CA model can be developed as a computer-aided design tool to predict the optimum process parameters during the forming of lithographically fabricated microlens.     

Microlens array fabrication by backside exposure using Fraunhofer diffraction

In UV-lithography, a gap between photoresist and UV-mask results in diffraction. Fresnel or near-field diffraction in thick positive and negative resists for microstructures resulting from a small gap in contact or proximity printing has been previously investigated. In this work, Fraunhofer or far-field diffraction is utilized to form microlens arrays. Backside-exposure of SU-8 resist through Pyrex 7740 transparent glass substrate is conducted. The exposure intensity profile on the interface between Pyrex 7740 glass wafer and negative SU-8 resist is modeled taking into account Fraunhofer diffraction for a circular aperture opening. The effects of varying applied UV-doses and aperture diameters on the formation of microlens arrays are described. The simulated surface profile shows a good agreement with the experimentally observed surface profiles of the microstructures. The paper demonstrates the ease with which a microlens array can be fabricated by backside exposure technique using Fraunhofer diffraction.     

Photoresist application for the LIGA process

 Fabrication of high aspect ratio structures requires the use of a photoresist able to form a mold with vertical sidewalls. Thus the photoresist should have a high selectivity between the exposed and the unexposed area in the developer. It should be relatively free from stress when applied in thick layers necessary to make high aspect ratio structures. PMMA (Poly Methyl Methacrylate) is the photoresist of choice in the LIGA process, mainly for its ability to hold vertical sidewalls for tall structures. It is applied to the substrate by a glue-down process in which a pre-cast, high molecular weight, sheet of PMMA is attached to the plating base on a substrate. The applied photoresist is then milled down to the precise height by a fly-cutter prior to pattern transfer by x-ray exposure. The requirement that the applied layer be relatively free from stress dictates the choice of glue-down over casting. The substrate preparation steps, as well as the conditioning of the PMMA sheet prior to the glue-down, are done, in part, to reduce the stress in the glued down sheet of photoresist. The cutting of the PMMA sheet in the fly-cutter requires specific operating conditions as well as particular cutting tools to avoid introducing any stress and the resultant crazing of the photoresist. Received: 25 August 1997/Accepted: 3 September 1997     

选择性化学机械抛光制作微拱形结构

为克服平面微机械结构无法释放残余应力、刚度小、跨度小,平面牺牲层工艺成拱出现非光滑台阶状边缘而造成器件失效或能量泄漏的缺点,改进现有成拱工艺在器件尺寸、结构稳定性及可靠性等方面的不足,提出一种用选择性化学机械抛光技术制作微拱形结构的方法。该方法是在化学机械抛光过程中,加入对牺牲层材料和硅材料抛光速度具有差异性的选择性抛光液,在牺牲层和硅材料的边界处利用滑动摩擦过程中的物理和化学作用,在牺牲层处形成连续平滑的拱形凸起,最后在其上制作微拱形结构。实验结果证实:微拱形结构有一定的曲率,拱起高度约为3.5μm,跨度大于100μm,微拱形表面光滑且为连续的曲面。该方法可为MEMS传感器、微型压电驱动器、薄膜体声波谐振器及滤波器的微拱形结构的制作提供参考。     

New production method of convex microlens arrays for integrated fluorescence microfluidic detection systems

A new method for producing microlens array with large sag heights is proposed for integrated fluorescence microfluidic detection systems. Three steps in this production technique are included for concave microlens array formations to be integrated into microfluidic systems. First, using the photoresist SU-8 to produce hexagonal microchannel array is required. Second, UV curable glue is injected into the hexagonal microchannel array. Third, the surplus glue is rotated by a spinner at high velocity and exposed to a UV lamp to harden the glue. The micro concave lens molds are then finished and ready to produce convex microlens in poly methsiloxane (PDMS) material. This convex microlens in PDMS can be used for detecting fluorescence in microfluidic channels because a convex microlens plays the light convergence role for optical fiber detection.     

Progress in magnetic microactuators

 Magnetic microactuator construction has benefited from two processing extensions: stacking in the vertical and horizontal direction and multiple X-ray mask sacrificial layer LIGA. Vertical stacking requires height control of electroplated structures. This has been achieved by material insensitive lapping and polishing techniques. Structural heights of more than 1 mm have been achieved with 300 μm low-energy exposures. This has resulted in actuators with output forces to 100 mN and throws to 2 mm. Re-planarization after electroplating without photoresist damage enables second layer photoresist application via solvent bonding and fly cutting. Exposure of the substrate with a second X-ray mask becomes useful if the second mask can be aligned to the substrate. This has been accomplished with sufficient accuracy via mechanical techniques. A variety of magnetic actuators have been constructed. All of them use assembled rather than integrated coils. The performance of the assembled coils is adequate for position sensing in linear actuators and has resulted in a closed loop control device. Received: 25 August 1997 / Accepted: 3 November 1997     

Fabrication and flow-sensor application of flexible thermal MEMS device based on Cu on polyimide substrate

A Cu on polyimide (COP) substrate was proposed as a MEMS material, and the fabrication process for a flexible thermal MEMS sensor was developed. The COP substrate application to MEMS devices has the advantage that typical MEMS structures fabricated in a SOI wafer in the past—such as a diaphragm, a beam, a heater formed on a diaphragm—can also be easily produced in the COP substrate in the flexible fashion. These structures can be used as the sensing element in various physical sensors, such as flow, acceleration, and shear stress sensors. A flexible thermal MEMS sensor was produced by using a lift-off process and sacrificial etching of a copper layer on the COP substrate. A metal film working as a flow sensing element was formed on a thin polyimide membrane produced by the sacrificial etching. The fabricated flexible thermal MEMS sensor was used as a flow sensor, and its characteristics were evaluated. The obtained sensor output versus the flow rate curve closely matched the approximate curve derived using King’s law. The rising and falling response times obtained were 0.50 and 0.67 s, respectively.

     

New production method of convex microlens arrays for integrated fluorescence microfluidic detection systems

A new method for producing microlens array with large sag heights is proposed for integrated fluorescence microfluidic detection systems. Three steps in this production technique are included for concave microlens array formations to be integrated into microfluidic systems. First, using the photoresist SU-8 to produce hexagonal microchannel array is required. Second, UV curable glue is injected into the hexagonal microchannel array. Third, the surplus glue is rotated by a spinner at high velocity and exposed to a UV lamp to harden the glue. The micro concave lens molds are then finished and ready to produce convex microlens in poly methsiloxane (PDMS) material. This convex microlens in PDMS can be used for detecting fluorescence in microfluidic channels because a convex microlens plays the light convergence role for optical fiber detection.

     

Releasing high aspect ratio SU-8 microstructures using AZ photoresist as a sacrificial layer on metallized Si substrates

This paper presents a successful method for releasing high aspect ratio SU-8 micro-structures by the use of positive photoresist (AZ 4620) as sacrificial layer. The AZ 4620 photoresist sacrificial layer was dissolved by the SU-8 developer (propylene glycol monomethyl ether acetate). Thus, this process reduces the need for complex microfabrication steps and equipments which are otherwise required in traditional methods using metal sacrificial layers. The current method is both cost-effective and time-effective because no additional releasing method or material is needed to remove the fabricated SU-8 structures. Further, the influence of surface energy on the adhesion between Si and SU-8 was demonstrated and metallic thin layer coating on Si was employed to further reduce the lift-off duration. The results obtained showed that the duration for lift-off of SU-8 structures from metal (Al) coated Si substrate is much lower (approximately 90 % time saving) and the surface morphology of the released structures has lesser micropore concentration compared to the process employing bare Si as the substrate. In both processes AZ 4620 was the sacrificial layer whereas the metalized Si substrate could be re-used.     

Electrochemical process for the lamination of magnetic cores in thin-film magnetic components

The lamination of the core in thin film magnetic components is necessary to reduce the eddy current losses of the structure at high frequencies. The usual way to achieve lamination of the core is by physical vapor deposition (PVD) techniques. These methods are however costly and the deposition of layers is non selective. In this article, an almost entirely aqueous-based electrochemical process for the lamination of magnetic cores is presented. The process uses an electrodepositable photoresist Eagle 2100 ED codeposited with a catalyst (palladium). The Eagle layer is left as an insulator and the catalyst allows the activation of the layer for subsequent metallization. The process can be reproduced as many times as required for producing the multilayers. It is also selective: it does not require multiple photolithography steps. As a demonstration of the multilayer process, a core constituted of two layers of Ni/sub 80/Fe/sub 20/ (6 /spl mu/m each layer), separated by an Eagle insulating layer, electroplated over three-dimensional structures, was produced.