隧道再生半导体激光器的三维稳态热特性研究

针对隧道再生半导体激光器,建立了内部的热源分布模型,利用有限元方法模拟计算得到了两有源区隧道再生半导体激光器稳态三维温度分布.模拟结果表明,靠近衬底的有源区的光出射腔面中心的温度最高.在平行于结的方向上,温升集中在脊形电极内;在垂直于结的方向上,靠近衬底的有源区温度始终高于靠近热沉的有源区的温度;沿腔长方向,在光反射腔面附近温度下降较快.随着注入电流的增大,两有源区的温度升高,温差变大.实验测量了不同注入电流下器件的峰值波长,将其转换为温升,与模拟结果吻合.     

隧道再生半导体激光器热弛豫积累过程研究

针对隧道再生半导体激光器,建立了内部的热源分布模型。利用有限元方法模拟计算得到了两有源区隧道再生半导体激光器在不同占空比下工作时的热弛豫积累过程。模拟结果表明,芯片达到平衡前的热弛豫积累时间和达到热平衡时的温度均随注入电流占空比的增加而增加,热弛豫积累时间小于200ms。芯片内部温度分布表明,靠近衬底的有源区温度略高于靠近热沉的有源区温度,但温度差较小,热效应造成的波长漂移不会造成双峰现象。实验测量了在相同的边界条件下,不同占空比下器件的峰值波长,将其转换为温升,与模拟结果吻合。     

隧道再生大功率半导体激光器瞬态热特性研究

讨论了隧道再生大功率半导体激光器内部的热源分布，利用有限元方法模拟计算了其在脉冲工作下的二维瞬态热分布，同时测量了不同时刻波长的漂移量并换算为温升值，与计算结果进行了比较，二者基本吻合。模拟结果还表明靠近衬底的有源区温度略高于靠近热沉的有源区温度；用金刚石一铜热沉替换铜热沉，还可以很好地降低器件内部温升，使隧道再生大功率半导体激光器能够高效工作。     

半导体激光器线阵的瞬态热特性研究

针对半导体激光器线阵,建立了二维的热传导模型,模拟计算得到了半导体激光器线阵的二维瞬态温度分布.分析表明器件温度随时间的变化过程可分为三个阶段:在加电后几十微秒的时间内,发光单元之间未出现热交叠,不同填充比的线阵器件的温度基本一致;在几十微秒到几十或几百毫秒之间,大填充比结构线阵的发光单元之间先发生了热交叠,温度上升较快;微通道制冷的器件在几十毫秒之后温度达到稳定,平板热传导热沉封装的器件在几百毫秒之后温度才达到稳定.热传导热沉封装时,在相同的注入电流密度下,高填充比器件的发光单元之间出现温差更快.     

隧道带间级联双波长半导体激光器热特性模拟

介绍了隧道带间级联双波长半导体激光器的工作机理,分析了其热量产生的根源,利用有限单元法对热传导方程进行了数值计算,得到了其在脉冲工作下的二维瞬态热分布,结果表明：随着时间的变化,有源区温度逐渐升高,靠近衬底的有源区温度略高一些,这是由于其远离热沉的原因。同时计算了不同占空比下器件内部的温度变化趋势,结果表明随着占空比增大,器件内部热量会逐渐积累,对器件特性会产生影响。     

热沉尺寸对半导体激光器有源区温度的影响

半导体激光器随着输出功率的提高在各领域的应用日益广泛,但芯片温度升高引起的功率饱和问题仍然是目前研究的重点之一。利用ANSYS软件对工作波长为808nm的单芯片半导体激光器的芯片有源区温度与封装热沉尺寸的关系进行了稳态热分析,模拟得出不同热沉参数条件下封装激光器芯片有源区温度的变化曲线,并提出一种散热较好的结构方案。     

百瓦级多芯片半导体激光器稳态热分析

半导体激光器在各领域的广泛应用要求其输出功率不断提高,使得多芯片集成封装大功率半导体激光器的发展成为主流之一。针对典型的12 只芯片以阶梯形式封装的百瓦级激光器,利用ANSYS 软件进行了稳态热分析,模拟得出芯片有源区温度及其热耦合温升与热沉结构尺寸变化的关系曲线,分析了该激光器热特性,进而提出一种使芯片散热较好的热沉结构。     

高可靠高亮度AlGaInP发光二极管

分析了隧道再生双有源区A lG aInP发光二极管的工作原理,测试了不同注入电流下管芯的轴向光强,得到了轴向光强随注入电流的变化关系。20 mA注入电流条件下,发射峰值波长为620 nm的隧道再生双有源区A lG aInP发光二极管,透明封装成视角15°后平均轴向光强达到5.5 cd。对透明封装成15°隧道再生双有源区发光二极管进行了寿命实验,在温度为25°C、30 mA直流电流条件下,隧道再生双有源区A lG aInP发光二极管的寿命超过了1.2×105h。     

不同过渡热沉封装微盘腔半导体激光器热分析

为了降低微盘腔半导体激光器工作时有源区的温度,提升封装的可靠性,基于Ansys Workbench有限元分析分别对AlN,WCu10,SiC,石墨烯,以及CVD金刚石过渡热沉封装的蜗线型微盘腔半导体激光器进行了热特性分析,得到了器件工作时的温度分布以及热应力、热应变分布.结果显示,SiC封装器件的有源区温度较AlN和WCu10封装器件分别降低了 2.18,3.078 C,并在五种过渡热沉封装器件中表现出最低的热应力,器件热应变最小.SiC过渡热沉封装可以有效降低微盘腔半导体激光器工作时的有源区温度,同时减少封装应力与器件应变,从而提高器件的散热能力和可靠性.计算结果对半导体激光器单管散热及阵列集成散热均有指导意义.     

VDMOS全热程的温度分布

本文提出一种VDMOS全热程的电模型,给出用电网络法计算包含有源区、衬底、支座和热沉在内的全热程温度分布。同时在稳态非等温条件下求解一组包括热导方程、泊松方程和连续性方程的偏微分方程组。两种方法所获得的有源区温度分布符合很好。     

Experimentation and modeling of the steady-state and transient thermal performances of a helicoidally grooved cylindrical heat pipe

The thermal management of electronic components is one of the crucial problems in the electronics industry. Heat pipes are promising thermal devices which can be used in cooling systems. An experimental study is realized in order to determine the steady-state and transient thermal performances of a water filled copper cylindrical heat pipe including helicoidal and trapezoidal capillary grooves. A test rig is developed to determine the effects of various parameters on the heat pipe thermal performance. Experiments were carried out for different heat inputs and heat sink temperatures in steady-state and transient regimes. A model is developed in order to simulate the transient thermal response of such heat pipes. The model is based on RC network circuit. The thermal resistances are determined from the steady-state experiments and the thermal capacitances are calculated theoretically. The comparison between the experimental results and the simulated ones shows a good agreement whatever the heat sink temperature and the heat input power.     

Using microchannels to cool microprocessors: a transmission-line-matrix study

As microprocessors components density and clock frequency increase, so do heat dissipation. The heat results from Joule effect due to leakage currents in the components area or active region. This region is only few microns thick and can quickly reach destructing temperatures if heat is not quickly removed. On this critical issue depends the system reliability. The active region is separated from the ventilated heat sink by a silicon substrate and a metal integrated heat spreader, both hundreds of microns thick. This interface region is the microprocessor's heat transfer plate where heat exchange is achieved by conduction. Because of the localized heat source, the thermal spreading resistance of the interface region can be high. A novel way of spreading heat in that region is the use of microchannel arrays where an appropriate thermal compound or a phase change liquid can be trapped to increase heat transfer by conduction or to create micro-heat-pipes. Traditional cooling methods, with conventional and well optimised heat sinks, can then be used with less burden.In this paper, the Transmission-Line-Matrix (TLM) technique is used to simulate the effect of microchannels on the temperature distribution in the active region. To minimize the interface heat resistance various microchannel and patterns are examined. In this part of the work, the microchannels are filled with the heat spreader material copper or aluminium. The results show an improved thermal transient behaviour and a reduced active region temperature in steady state.     

Heat transport and current crowding in IMPATT diodes

The current crowding due to the temperature dependence of avalanche breakdown is analyzed for the steady-state operation of an IMPATT diode mounted on a semi-infinite heat sink. The solution depends on a single new nondimensional number, the "Lambda" number, which we define here. This number can be determined from experimental data, and the current density and temperature distribution can then be determined from the results given in this paper. Experimental measurements of the I-V plot for a laboratory diode are shown to agree with the theoretical predictions. The theoretical model, which is based upon the assumption that the heat is entirely produced at the interface between the diode and the heat sink, is shown to agree with numerical results from a finite-difference program in which heat is introduced into a GaAs diode in a plane 0.5 µm above the interface. It is shown that electrical measurements of thermal resistance are related to an "effective" temperature which is about 15 percent below the temperature on the diode axis.     

基于热管散热的人功率LED热特性测量与分析

提出了一种新型结构的同路热管,建立了回路热管性能测试试验装置.在相同的测试条件下,研究了热负荷、倾角等对回路热管的起动特性和均温特性、热阻等传热性能的影响.试验结果表明,热管散热器的热阻在0.21 K/W～2.6 K/W之间,且整个散热器具有均匀的温度分布.与当前的LED散热器相比,这种结构的热管散热器具有散热效率高、结构紧凑、加工方便、热阻小、重量轻、成本低等特点,可以满足大功率LED散热的要求.     

Comprehensive modeling of diode arrays and broad-area devices withapplications to lateral index tailoring

A numerical model for calculating the emission characteristics of diode laser arrays and broad-area devices operating well above threshold is discussed. This model uses the beam propagation technique for determining the field intensities for several lateral modes, while simultaneously and self-consistently solving for the two-dimensional current flow through the laser structure and the subsequent carrier diffusion in the active region. The active-region temperature distribution is also computed in a self-consistent manner, based on the flow of heat generated in the active region through the layered device structure to a constant-temperature heat sink. The model is applied by investigating the sensitivity of the lasing modes of a broad-area diode laser to variations in the lateral temperature distribution     

Investigations of thermal crosstalk in laser arrays for WDMapplications

Our studies on the thermal crosstalk of laser arrays with integrated thin-film heaters involved theoretical as well as experimental investigations. Comparing the effects of intentional geometrical variations of the device design, we found that the relative thermal crosstalk depends critically on the distance between the active area and the film heater. The most striking result is that a minimization of the thermal resistivity of the device does not always lead to a reduced thermal crosstalk. We demonstrate that an additional heat barrier close to the active region and/or an improved heat transfer between the submount and the heat sink may reduce the relative thermal crosstalk, a result completely unexpected from intuitive considerations