OC-192 transmitter and receiver in standard 0.18-/spl mu/m CMOS

This paper presents the first fully integrated SONET OC-192 transmitter and receiver fabricated in a standard 0.18-/spl mu/m CMOS process. The transmitter consists of an input data register, 16-b-wide first-in-first-out (FIFO) circuit, clock multiplier unit (CMU), and 16:1 multiplexer to give a 10-Gb/s serial output. The receiver integrates an input amplifier for 10-Gb/s data, clock and data recovery circuit (CDR), 1:16 demultiplexer, and drivers for low-voltage differential signal (LVDS) outputs. An on-chip LC-type voltage-controlled oscillator (VCO) is employed by both the transmitter and receiver. The chipset operates at multiple data rates (9.95-10.71 Gb/s) with functionality compatible with the multisource agreement (MSA) for 10-Gb transponders. Both chips demonstrate SONET-compliant jitter characteristics. The transmitter 10.66-GHz output clock jitter is 0.065 UI/sub pp/ (unit interval, peak-to-peak) over a 50-kHz-80-MHz bandwidth. The receiver jitter tolerance is more than 0.4 UI/sub pp/ at high frequencies (4-80 MHz). A high level of integration and low-power consumption is achieved by using a standard CMOS process. The transmitter and receiver dissipate a total power of 1.32 W at 1.8 V and are packaged in a plastic ball grid array with a footprint of 11/spl times/11 mm/sup 2/.     

Low-power fully integrated 10-Gb/s SONET/SDH transceiver in 0.13-/spl mu/m CMOS

Here, we present a low-power fully integrated 10-Gb/s transceiver in 0.13-/spl mu/m CMOS. This transceiver comprises full transmit and receive functions, including 1:16 multiplex and demultiplex functions, high-sensitivity limiting amplifier, on-chip 10-GHz clock synthesizer, clock-data recovery, 10-GHz data and clock drivers, and an SFI-4 compliant 16-bit LVDS interface. The transceiver exceeds all SONET/SDH (OC-192/STM-64) jitter requirements with significant margin: receiver high-frequency jitter tolerance exceeds 0.3 UI/sub pp/ and transmitter jitter generation is 30 mUI/sub pp/. All functionality and specifications (core and I/O) are achieved with power dissipation of less than 1 W.     

A CMOS multichannel 10-Gb/s transceiver

We describe a CMOS multichannel transceiver that transmits and receives 10 Gb/s per channel over balanced copper media. The transceiver consists of two identical 10-Gb/s modules. Each module operates off a single 1.2-V supply and has a single 5-GHz phase-locked loop to supply a reference clock to two transmitter (Tx) channels and two receiver (Rx) channels. To track the input-signal phase, the Rx channel has a clock recovery unit (CRU), which uses a phase-interpolator-based timing generator and digital loop filter. The CRU can adjust the recovered clock phase with a resolution of 1.56 ps. Two sets of two-channel transceiver units were fabricated in 0.11-/spl mu/m CMOS on a single test chip. The transceiver unit size was 1.6 mm /spl times/ 2.6 mm. The Rx sensitivity was 120-mVp-p differential with a 70-ps phase margin for a common-mode voltage ranging from 0.6 to 1.0 V. The evaluated jitter tolerance curve met the OC-192 specification.     

A 0.18-/spl mu/m SiGe BiCMOS receiver and transmitter chipset for SONET OC-768 transmission systems

A 43-Gb/s receiver (Rx) and transmitter (Tx) chip set for SONET OC-768 transmission systems is reported. Both ICs are implemented in a 0.18-/spl mu/m SiGe BiCMOS technology featuring 120-GHz f/sub T/ and 100 GHz f/sub max/. The Rx includes a limiting amplifier, a half-rate clock and data recovery unit, a 1:4 demultiplexer, a frequency acquisition aid, and a frequency lock detector. Input sensitivity for a bit-error rate less than 10/sup -9/ is 40 mV and jitter generation better than 230 fs rms. The IC dissipates 2.4 W from a -3.6-V supply voltage. The Tx integrates a half-rate clock multiplier unit with a 4:1 multiplexer. Measured clock jitter generation is better than 170 fs rms. The IC consumes 2.3 W from a -3.6-V supply voltage.     

A 10-GB/s SONET-compliant CMOS transceiver with low crosstalk and intrinsic jitter

A 4:1 SERDES IC suitable for SONET OC-192 and 10-Gb/s Ethernet is presented. The receiver, which consists of a limiting amplifier, a clock and data recovery unit, and a demultiplexer, locks automatically to all data rates in the range 9.95-10.7 Gb/s. At a bit error rate of less than 10/sup -12/, it has a sensitivity of 20 mV. The transmitter comprises a clock multiplying unit and a multiplexer. The jitter of the transmitted data signal is 0.2 ps RMS. This is facilitated by a novel notched inductor layout and a special power supply concept, which reduces cross-coupling between the transmitter and receiver. Integrated in a 0.13-/spl mu/m CMOS technology, the total power consumption from both 1.2- and 2.5-V supplies is less than 1 W.     

A 10-Gb/s CMOS CDR and DEMUX IC With a Quarter-Rate Linear Phase Detector

This paper presents a 10-Gb/s clock and data recovery (CDR) and demultiplexer IC in a 0.13-mum CMOS process. The CDR uses a new quarter-rate linear phase detector, a new data recovery circuit, and a four-phase 2.5-GHz LC quadrature voltage-controlled oscillator for both wide phase error pulses and low power consumption. The chip consumes 100 mA from a 1.2-V core supply and 205 mA from a 2.5-V I/O supply including 18 preamplifiers and low voltage differential signal (LVDS) drivers. When 9.95328-Gb/s 2³¹-1 pseudorandom binary sequence is used, the measured bit-error rate is better than 10^-15 and the jitter tolerance is 0.5UIpp, which exceeds the SONET OC-192 standard. The jitter of the recovered clock is 2.1 psrms at a 155.52MHz monitoring clock pin. Multiple bit rates are supported from 9.4 Gb/s to 11.3 Gb/s     

A 43-Gb/s full-rate clock transmitter in 0.18-/spl mu/m SiGe BiCMOS technology

A 43-Gb/s full-rate clock transmitter chip for SONET OC-768 transmission systems is reported. The IC is implemented in a 0.18-/spl mu/m SiGe BiCMOS technology featuring 120 GHz f/sub T/ and 100 GHz f/sub max/ HBTs. It consists of a 4:1 multiplexer, a clock multiplier unit, and a frequency lock detector. The IC features clock jitter generation of 260 fs rms and dissipates 2.3 W from a -3.6-V supply voltage. Measurement results are compared to a previously reported half-rate clock transmitter designed using the same technology.     

A 10-Gb/s 16:1 multiplexer and 10-GHz clock synthesizer in0.25-μm SiGe BiCMOS

A 10-Gb/s 16:1 multiplexer, 10-GHz clock generator phase-locked loop (PLL), and 6 × 16 b input data buffer are integrated in a 0.25-μm SiGe BiCMOS technology. The chip multiplexes 16 parallel input data streams each at 622 Mb/s into a 9.953-Gb/s serial output stream. The device also produces a 9.953-GHz output clock from a 622- or 155-MHz reference frequency. The on-board 10-GHz voltage-controlled oscillator (VCO) has a 10% tuning range allowing the chip to accommodate both the SONET/SDH data rate of 9.953 Gb/s and a forward error correction coding rate of 10.664 Gb/s. The 6 × 16 b input data buffer accommodates ±2.4 ns of parallel input data phase drift at 622 Mb/s. A delay-locked loop (DLL) in the input data buffer allows the support of multiple input clocking modes. Using a clock generator PLL bandwidth of 6 MHz, the 9.953-GHz output clock exhibits a generated jitter of less than 0.05 UI_P-P over a 50-kHz to 80-MHz bandwidth and jitter peaking of less than 0.05 dB     

A 10-Gb/s CDR/DEMUX with LC delay line VCO in 0.18-/spl mu/m CMOS

A monolithic 10-Gb/s clock/data recovery and 1:2 demultiplexer are implemented in 0.18-/spl mu/m CMOS. The quadrature LC delay line oscillator has a tuning range of 125 MHz and a 60-MHz/V sensitivity to power supply pulling. The circuit meets SONET OC-192 jitter specifications with a measured jitter of 8 ps p-p when performing error-free recovery of PRBS 2/sup 31/-1 data. Clock and data recovery (CDR) is achieved at 10 Gb/s, demonstrating the feasibility of a half-rate early/late PD (with tri-state) based CDR on 0.18-/spl mu/m CMOS. The 1.9/spl times/1.5 mm/sup 2/ IC (not including output buffers) consumes 285 mW from a 1.8-V supply.     

STS-768 multiplexer with full-rate output data retimer in InP HBT

A 16:1 STS-768 multiplexer IC has been designed and fabricated using the Vitesse Semiconductor VIP-1 process. This IC is part of a complete chip-set solution for a 40-Gb/s STS-768 optical communication transceiver module. The multiplexer IC features a full-rate clock multiplication unit and a data retimer in the output stage to reduce duty-cycle distortion and jitter in the output data eye. Because of its strict timing requirements, this approach needs fast logic gates with a very low gate delay. The Vitesse VIP-1 process, with 150-GHz f/sub t/ and 150-GHz f/sub max/ heterojunction bipolar transistor, is an obvious choice to implement this IC. The multiplexer IC typically dissipates 3.6 W from -3.6-V and -5.2-V power supplies. This paper discusses the design and development of a 40-Gb/s 16:1 multiplexer IC including current-mode logic gate circuit design, divide-by-two, 40-GHz clock tree, voltage-controlled oscillator, clock multiplication unit, and output driver. Layout design and package design are also discussed due to their significant roles in the IC performance.     

Fully electrical 40-Gb/s TDM system prototype based on InP HEMTdigital IC technologies

This paper presents a fully electrical 40-Gb/s time-division-multiplexing (TDM) system prototype transmitter and receiver. The input and output interface of the prototype are four-channel 10-Gb/s signals. The prototype can be mounted on a 300-mm-height rack and offers stable 40-Gb/s operation with a single power supply voltage. InP high-electron mobility transistor (HEMT) digital IC's perform 40-Gb/s multiplexing/demultiplexing and regeneration. In the receiver prototype, unitraveling-carrier photodiode (UTC-PD) generates 1 V_pp output and directly drives the InP HEMT decision circuit (DEC) without any need for an electronic amplifier. A clock recovery circuit recovers a 40-GHz clock with jitter of 220 fs_pp from a 40-Gb/s nonreturn-to-zero (NRZ) optical input. The tolerable dispersion range of the prototype within a 1-dB penalty from the receiver sensitivity at zero-dispersion is as wide as 95 ps/nm, and the clock phase margin is wider than 70° over almost all the tolerable dispersion range. A 100-km-long transmission experiment was performed using the prototype. A high receiver sensitivity [-25.1 dBm for NRZ (2⁷-1) pseudorandom binary sequence (PRBS)] was obtained after the transmission. The 40-Gb/s regeneration of the InP DEC suppressed the deviation in sensitivity among output channels to only 0.3 dB. In addition, four-channel 40-Gb/s wavelength-division-multiplexing (WDM) transmission was successfully performed     

A 20-Gb/s 0.13-/spl mu/m CMOS serial link transmitter using an LC-PLL to directly drive the output multiplexer

A 20-Gb/s transmitter is implemented in 0.13-/spl mu/m CMOS technology. An on-die 10-GHz LC oscillator phase-locked loop (PLL) creates two sinusoidal 10-GHz complementary clock phases as well as eight 2.5-GHz interleaved feedback divider clock phases. After a 2/sup 20/-1 pseudorandom bit sequence generator (PRBS) creates eight 2.5-Gb/s data streams, the eight 2.5-GHz interleaved clocks 4:1 multiplex the eight 2.5-Gb/s data streams to two 10-Gb/s data streams. 10-GHz analog sample-and-hold circuits retime the two 10-Gb/s data streams to be in phase with the 10-GHz complementary clocks. Two-tap equalization of the 10-Gb/s data streams compensate for bandwidth rolloff of the 10-Gb/s data outputs at the 10-GHz analog latches. A final 20-Gb/s 2:1 output multiplexer, clocked by the complementary 10-GHz clock phases, creates 20-Gb/s data from the two retimed 10-Gb/s data streams. The LC-VCO is integrated with the output multiplexer and analog latches, resonating the load and eliminating the need for clock buffers, reducing power supply induced jitter and static phase mismatch. Power, active die area, and jitter (rms/pk-pk) are 165 mW, 650 /spl mu/m/spl times/350 /spl mu/m, and 2.37 ps/15 ps, respectively.     

A 40-43-Gb/s clock and data recovery IC with integrated SFI-5 1:16 demultiplexer in SiGe technology

A fully integrated OC-768 clock and data recovery IC with SFI-5 1:16 demultiplexer is designed in a 120-GHz/100-GHz (f/sub T//f/sub MAX/) SiGe technology. The 16 2.5-Gb/s outputs and additional deskew channel are compliant with the Serdes Framer Implementation Agreement Level 5 specification. The measured bit-error rate is <10/sup -15/. The measured jitter tolerance exceeds the mask specified in G.8251. The IC operates with 1.8-V and -5.2-V supplies and dissipates 7.5 W.     

A PLL-based 2.5-Gb/s GaAs clock and data regenerator IC

A GaAs IC that performs clock recovery and data retiming functions in 2.5-Gb/s fiber-optic communication systems is presented. Rather than using surface acoustic wave (SAW) filter technology, the IC employs a frequency- and phase-lock loop (FPLL) to recover a stable clock from pseudo-random non-return-to-zero (NRZ) data. The IC is mounted on a 1-in×1-in ceramic substrate along with a companion Si bipolar chip that contains a loop filter and acquisition circuitry. At the synchronous optical network (SONET) OC-48 rate of 2.488 Gb/s, the circuit meets requirements for jitter tolerance, jitter transfer, and jitter generation. The data input ambiguity is 25 mV while the recovered clock has less than 2° rms edge jitter. The circuit functions up to 4 Gb/s with a 40-mV input ambiguity and 2° RMS clock jitter. Total current consumption from a single 5.2-V supply is 250 mA     

A robust 43-GHz VCO in CMOS for OC-768 SONET applications

In this paper, we present a 43-GHz LC-VCO in 0.13-/spl mu/m CMOS for use in SONET OC-768 optical networks. A tuned output buffer is used to provide 1.3 V/sub p-p/ (single-ended) into a 90-fF capacitive load as is required when the VCO is used in typical clock and data recovery (CDR) circuits. Phase noise is -90 dBc/Hz at a 1-MHz offset from the carrier; this meets SONET jitter specifications. The design has a tune range of 4.2%. The VCO, including output buffers, consumes 14 mA from a 1-V supply and occupies 0.06 mm/sup 2/ of die area. Modern CMOS process characteristics and the high center frequency of this design mean that the tank loss is not dominated by the integrated inductor, but rather by the tank capacitance. An area-efficient inductor design that does not require any optimization is used.     

Performance-optimized microstrip coupled VCOs for 40-GHz and 43-GHz OC-768 optical transmission

In this paper, we present 40- and 43-GHz voltage-controlled oscillators (VCOs) for use in SONET/SDH optical transmission systems operating at OC-768 rates. SONET system jitter requirements are explained, as are methods for achieving the requisite performance in manufacturable oscillators. We describe in detail a technique for using quadrature-coupled VCOs to achieve a fundamental improvement in jitter power performance. The 40-GHz oscillator has a tuning range of 5 GHz, a single-sideband phase-noise power spectral density of -99 dBc/Hz at 1-MHz offset from the carrier, and consumes 207 mW in the oscillator core. Total power consumption is 363 mW (including biasing and output buffers) from a 3-V supply. The oscillator occupies 0.189 mm/sup 2/ of die area and is implemented in a 120-GHz f/sub T/ SiGe BiCMOS process.     

A 6-b 12-GSamples/s track-and-hold amplifier in InP DHBT technology

This paper presents a 6-b 12-GSample/s track-and-hold amplifier (THA) fabricated in an InP-InGaAs-InP double heterojunction bipolar transistor (DHBT) technology. The THA is intended for the front end of a high-speed analog-to-digital converter in a digital-based electronic polarization-mode dispersion compensation circuit for a 10-Gb/s optical receiver. With a high-speed switched emitter follower and clocked track-to-hold transition operation, it shows the signal bandwidth over 14 GHz and features a total harmonic distortion (THD) compatible with 6-b operation with input frequency of 6 GHz and a sampling frequency of 12 GHz. The THD increases better than -23 dB with a 12-GHz input signal of 1 V/sub pp/, corresponding to a 4-b resolution, under a differential clock of 12 GHz.     

A fully integrated SiGe receiver IC for 10-Gb/s data rate

A silicon germanium (SiGe) receiver IC is presented here which integrates most of the 10-Gb/s SONET receiver functions. The receiver combines an automatic gain control and clock and data recovery circuit (CDR) with a binary-type phase-locked loop, 1:8 demultiplexer, and a 2 ⁷-1 pseudorandom bit sequence generator for self-testing. This work demonstrates a higher level of integration compared to other silicon designs as well as a CDR with SONET-compliant jitter characteristics. The receiver has a die size of 4.5×4.5 mm2 and consumes 4.5 W from -5 V     

A Full On-Chip CMOS Clock-and-Data Recovery IC for OC-192 Applications

In this paper, a fully integrated OC-192 clock-and-data recovery (CDR) architecture in standard 0.18-mum CMOS is described. The proposed architecture integrates the typically large off-chip filter capacitor by using two feed-forward paths configuration to generate zero and pole and satisfies SONET jitter requirements with a total power dissipation (including the buffers) of 290 mW. The measured RMS jitter of the recovered data is 0.74 ps with a bit-error rate less than 10^-12 when the input pseudorandom bit sequence (PRBS) data pattern has a pattern length of 2¹⁵ - 1 and a total horizontal eye closure of 0.54 peak-to-peak unit interval (Ul_pp) due to the added intersymbol interference distortion by passing data through 9-in FR4 printed circuit board trace. The chip exceeds SONET OC-192 jitter tolerance mask, and high-frequency jitter tolerance is over 0.31 Ul_pp by applying PRBS data with a pattern length of 2³¹ - 1.