共查询到20条相似文献,搜索用时 31 毫秒
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Xue-ren Zhang Tong Yan Tee Jing-en Luan 《电子与封装》2006,6(2):10-15,4
<正>Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Array ( LGA ) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled. 相似文献
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Packaging represents a significant and expensive obstacle in commercializing microsystem technology (MST) devices such as microelectromechanical systems (MEMS), microopticalelectromechanical systems (MOEMS), microsensors, microactuators, and other micromachined devices. This paper describes a novel wafer-level protection method for MSTs which facilitate improved manufacturing throughput and automation in package assembly, wafer-level testing of devices, and enhanced device performance. The method involves the use of a wafer-sized microcap array. This array consists of an assortment of small caps molded onto a material with adjustable shapes and sizes to serve as protective structures against the hostile environments associated with packaging. It may also include modifications which enhance its adhesion to the MST wafer or increase the MST device function. Depending on the application, the micromolded cap can be designed and modified to facilitate additional functions, such as optical, electrical, mechanical, and chemical functions, which are not easily achieved in the device by traditional means. The fabrication and materials selection of the microcap device is discussed in this paper. The results of wafer-level microcap packaging demonstrations are also presented. 相似文献
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The effect of packaging on the impact-carrying capacity of micro electro-mechanical systems (MEMS) is investigated, with specific reference to a translational accelerometer. By exploiting the small ratio between the masses of MEMS and package/die (typically 10−3 or less) a decoupled two-scale, finite element approach is adopted: at the package/die length-scale the dynamics of whole device after the impact against a flat target surface is studied; at the sensor length-scale the response of the MEMS to the drop-induced loading is investigated, and MEMS details where the stress state can exceed the tensile strength of polysilicon are identified. Two drop orientations are considered, here termed bottom and top; in the first case, package and die strike the target with their bottom surfaces; in the second case, they fall upside-down, and strike the target with their top surfaces.By comparing the simulation outcomes in terms of maximum attained tensile stress, it results that package does not always lead to benefits in term of capability of the studied sensor to sustain drops. In the bottom drop configuration, e.g. MEMS failure may be triggered by the package. 相似文献
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微机电系统(MEMS)封装残余应力是在封装工艺过程中芯片上产生的残余应力,它对于MEMS器件的热稳定性和长期贮存稳定性有着十分重大的影响,故而对MEMS封装残余应力的高精确度测量有利于封装应力的研究。由于封装残余应力十分微小,因此无法利用目前的测量手段直接测量封装应力,本文针对这个问题提出了一种基于应力放大结构和拉曼光谱法的封装应力测量方法,可以测量出MEMS器件中封装应力的平均水平。基于理论分析建立了原始封装模型与应力放大结构之间的放大关系,并提出应力放大结构的设计原则。接着采用3D有限元(FEM)仿真对一款高精确度MEMS微加速度计的封装应力测量进行了分析,其结果与理论分析具有很高吻合度。最后,针对该微加速度计的封装应力测量,成功制作了应力放大结构的芯片样片,并进行封装,随后拉曼光谱法被用于测量样片中的最大应力,进而计算出待测微加速度计中平均封装应力大小。实验结果与仿真分析具有很好的吻合度,证明本文所提出的测量方法具有相当的可靠性。 相似文献
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Adhesive wafer-level bonding is an excellent solution to meet the stringent requirements in micro-electro-mechanical systems (MEMS) packaging, one of the challenges in MEMS manufacturing, in a steadily growing micro-systems market. A range of bonding processes for commercially available substrate bonders have been developed, which apply global heating during the bonding procedure. This article, however, describes an approach where heating is kept to a minimum by combining the merits of laser joining, a truly localised heating technique, and adhesive wafer-level bonding. This unique bonding technique, which enables the use of temperature-sensitive materials within the package, is demonstrated for bonding of silicon to glass - materials commonly used in MEMS fabrication - with a benzocyclobutene (BCB) intermediate bonding layer. As a proof of concept for wafer-level packaging, bonding of two simplified patterns is demonstrated, one with five individual samples on the same wafer, and the other with nine samples. To verify the influence of this innovative bonding technique on the quality of the seal the devices are shear force tested and the results are compared with those of devices packaged at chip-level. 相似文献
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利用隔振原理,设计了矢量水声传感器系统中一种新型隔振封装结构模型,即加入橡胶减振器的新型封装结构。采用ANSYS软件对封装模型进行模态分析,研究模型结构和几何尺寸对其隔振性能的影响,确定最优隔振封装结构;对模型的几何尺寸及橡胶隔震材料力学参数进行优化,并对优化模型的隔振性能进行实验测试和评估。实验结果表明:所设计的新型橡胶减振结构具有一定的减振效果,隔离了一定程度的核心器件以外的外界振动干扰,提高了原有封装结构矢量水听器的探测灵敏度。再次验证了硅微MEMS仿生矢量水声传感器不但体积小、质量轻、结构简单,而且具有低频灵敏度高等优点。 相似文献
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Chingfu Tsou Hungchung Li Hsing-Cheng Chang 《Advanced Packaging, IEEE Transactions on》2007,30(4):616-621
Some emerging microelectromechanical systems (MEMS) devices such as high-performance inertial sensors and high-speed actuators must be operated in a high vacuum and in order to create this vacuum environment, specific packaging is required. To satisfy this demand, this paper presents a novel method for hermetic and near-vacuum packaging of MEMS devices. We use wafer-level bonding technology to combine with vacuum packaging, simultaneously. For this packaging solution, the wafers with air-guided micro-through-holes were placed on a custom-built design housed in a vacuum chamber maintained at a low-pressure environment of sub-10 mtorr. Packaging structure is then sealed by solder ball reflow process with the lower heating temperature of 300degC to fill up micro-through-hole. Experimental results shown the hermetical packaging technique using solder sealing is adapted to the wafer-level microfabrication process for MEMS devices and can achieve better yield and performance. Thus, this technique is very useful for many applications with high performance and low packaging cost can be obtained due to wafer-level processing. 相似文献
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《Components and Packaging Technologies, IEEE Transactions on》2007,30(2):346-354
In microelectromechanical system (MEMS) devices, the deformation of MEMS structure caused by packaging induced stress is of great concern since it directly affects the performance of the device. In this paper, deformation behavior of the MEMS gyroscope package subjected to temperature change is investigated using a high-sensitivity moire interferometry. Temperature dependent analyses of warpage and extension/contraction of the package are presented. Analysis of the package reveals that global bending deformation occurs due to the mismatch of the coefficient of thermal expansion between the chip, the molding compound, and the printed circuit board. Detailed global and local deformations of the package by temperature change are investigated, and their effect on the frequency shift of the MEMS gyroscope is studied. It is found that package deformation or package induced stress results in the frequency shift of the MEMS gyroscope structure. In order to increase robustness of the structure against deformation, a "crab-leg" type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. This frequency shift is within the tolerance limit of the gyroscope sensor in this work 相似文献
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Zhi-Hao Liang Yu-Ting Cheng Wensyang Hsu Yuh-Wen Lee 《Advanced Packaging, IEEE Transactions on》2006,29(3):513-519
In order to simplify the processing complexity and cut down the manufacturing cost, a new wafer bonding technique using ultraviolet (UV) curable adhesive is introduced here for microelectromechanical systems (MEMS) device packaging and manufacturing applications. UV curable adhesive is cured through UV light exposure without any heating process that is suitable for the packaging of temperature-sensitive materials or devices. A Pyrex 7740 glass is chemically wet etched to form microcavities and utilized as the protection cap substrate. After a UV-curable adhesive is spin-coated onto the glass substrate, the substrate is then aligned and bonded through UV light exposure with a device substrate below. Electrical contact pad opening and die separation are done simultaneously by dicing. Two different testing devices, a dew point sensor and capacitive accelerometer, are built to evaluate the package strength and hermeticity. After the dicing process, no structural damage or stiction phenomenon is found in the packaged parallel capacitor. The acceleration test results also indicate that the package using the Loctite 3491 UV adhesive with 150 /spl mu/m bond width can survive more than 300 days at a 25/spl deg/C and 100% relative humidity working environment. 相似文献
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电子元器件封装技术发展趋势 总被引:1,自引:1,他引:0
晶圆级封装、多芯片封装、系统封装和三维叠层封装是近几年来迅速发展的新型封装方式,在推动更高性能、更低功耗、更低成本和更小形状因子的产品上,先进封装技术发挥着至关重要的作用。晶圆级芯片尺寸封装(WCSP)应用范围在不断扩展,无源器件、分立器件、RF和存储器的比例不断提高。随着芯片尺寸和引脚数目的增加,板级可靠性成为一大挑战。系统封装(SIP)已经开始集成MEMS器件、逻辑电路和特定应用电路。使用TSV的三维封装技术可以为MEMS器件与其他芯片的叠层提供解决方案。 相似文献
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童志义 《电子工业专用设备》2010,39(9):1-8
概述了进入后摩尔时代的MEMS技术,通过TSV技术整合MEMS与CMOS制程,使得半导体与MEMS产业的发展由于技术的整合而出现新的商机。主要介绍了MEMS器件封装所面临的挑战及相应的封装设备。 相似文献
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TPMS IC是TPMS系统模块的关键核心器件,需要采用系统级封装(SiP)技术。对TPMS IC的一种新型SiP封装技术作了研究分析。在引线框架上引入电路板中介层,改善了芯片间电气互连与分布,增大了引入薄膜电阻电容元件的设计弹性。采用预成型模制部分芯片的封装技术,满足了IC与MEMS芯片不同的封装要求,还增强了SiP产品的可测试性和故障可分析性。采用敞口模封、灌装低应力弹性凝胶和传感器校准测试相结合的方法有效避免封装应力对MEMS压力传感器的影响。 相似文献
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《Advanced Packaging, IEEE Transactions on》2008,31(3):594-603
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The interconnection of microelectromechanical systems (MEMS) and other devices to a system-on-chip (SoC) implementation is described. MEMS technology can be used to fabricate both application specific devices and the associated micropackaging system that will allow for the integration of devices or circuits, made with non-compatible technologies, with a SoC environment. In the primary example presented, MEMS technology has been used to develop an acoustical array sensor for a hearing instrument application and also to provide a custom micropackaging solution suitable for in-the-ear canal implantation. A MEMS based modular micropackaging solution consisting of MEMS socket submodules and an insertable/removable microbus card has been developed to provide the necessary packaging and connectivity requirements. The modular socket concept can also be used for many other purposes, such as temporarily connecting a CMOS die to a SoC implementation of a die tester using MEMS based cantilevered bridge-type microspring contacts to provide connectivity to the die under test. 相似文献
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MEMS封装技术的发展及应用 总被引:3,自引:0,他引:3
封装技术在微电子机械系统(MEMS)器件中的地位和作用越来越重要。本文归纳与总结了MEMS封装的特点和发展趋势,重点对MEMS封装技术的应用进行了分析,最后给出一些有益的想法和看法。 相似文献