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粘弹性行为是决定合成抛光革抛光性能的重要因素。在抛光中,抛光革由于温度、抛光度、使用状态等因素将使其粘弹性行为发生变化。本文研究了这种变化对抛光质量和抛光精度的影响 相似文献
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页轮是一种新型抛光工具,具有抛光效率高、质量好、抛光方法简便、成本低等优点,适用于各种轴类、大孔径、大平面等复杂型面零件的抛光加工,可解决因工件超长或超负荷而难以在磨床和珩磨机上进行表面精加工的难题。采用页轮代替砂带进行抛光是近年来国外用于改善工件表面粗糙度的一种新工艺,该工艺在我国的应用还处于起步阶段。我公司从1991年开始试验和应用这项新技术,取得了较好效果,证明页轮抛光是一种投资少、见效快、效益高的超精加工工艺。1 页轮抛光的原理及特点页轮抛光装置如图1所示。根据选用的电机轴配置左、右联接… 相似文献
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单晶硅片的低温抛光技术 总被引:8,自引:1,他引:7
介绍了一种光学材料抛光新技术--低温抛光技术。首先把抛光液冷冻成低温抛光模层,并对单晶硅片做抛光实验,实验结果表明这是一种很好的光学材料抛光方法。 相似文献
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以试验为基础研究了蛇纹石的抛光工艺,并对各种抛光条件对表面光泽度的影响进行了探讨。结果表明,选用合适的抛光剂、抛光时间、预加工光泽度、冷却方式及抛光工具材料,光泽度可达90以上。此抛光工艺简单、经济、高效。 相似文献
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应用于模具自由曲面的新型气囊抛光技术 总被引:16,自引:1,他引:15
为提高模具自由曲面抛光的效率和品质,提出一种基于柔性抛光理念的新型气囊抛光技术。建立相应的机器人抛光系统,研究旋转型膨胀气囊抛光工具及抛光过程中各因素对抛光表面粗糙度的影响。对气囊抛光工具的位置和姿态控制问题以及抛光工具,以一定下陷深度和倾斜角度与被抛工件接触时的接触区域的相关特性进行分析。在机器人抛光系统上进行抛光正交试验和试验数据分析,获取表面粗糙度的不同影响因数的最优参数组合,试验中被抛光曲面平均表面粗糙度达到了0.007 μm。研究结果表明,气囊抛光技术可实现抛光工具与被抛光工件的大面积柔性接触,通过气囊内部气压的调节和机器人抛光系统对抛光工具的运动轨迹和姿态的精确控制,可有效地提升自由曲面抛光的品质和效率。 相似文献
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气囊式抛光是一种极具发展潜力的抛光方法,在精密光学元件的加工领域具有广阔的应用前景.针对现有气囊式抛光磨头加工方法的不足,提出了一种环形气囊抛光技术,设计了气囊式环形抛光磨头的机械结构.基于环形气囊抛光实验平台,利用气囊式环形抛光磨头进行了工艺试验.实验结果表明,此种抛光技术能够实现光学零件高精度表面质量的加工. 相似文献
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陈贵耕 《世界制造技术与装备市场》1994,(4):85-87
本文介绍采用一台精密抛光机床抛光小件模具的几个实例。由于本文的目的是从尽可能广泛的各个方面说明几个加工实例,所以对抛光用铣床本身以及有关抛光工具的说明很少。 相似文献
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模具的抛光现在仍然是一个难题。一般是机械旋转抛光及超声波抛光,但对电化学抛光还比较生疏,缺乏这方面的技术及经验。文中介绍一种电解抛光设备,为模具及复杂工件的抛光探索了一条行之有效的途径。 相似文献
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介绍了一种基于旋转磁性抛光液体的抛光技术。磁性抛光液体在磁力搅拌器的作用下产生旋转运动,利用外加强磁场作用增大磁性液体的粘度和剪切屈服应力,当加工工件放入磁性抛光液体中,磁性抛光液体与之相接触的工件表面发生磨削,从而达到对工件表面的光整加工。实验详细研究了磁性抛光液体抛光后工件的抛光区内表面粗糙度与抛光时间和位置之间的关系,实验结果表明:旋转磁性抛光液体抛光可以用于对工件进行超光滑加工,抛光时间越长,各处粗糙程度越接近,表面粗糙度越好,并且表面粗糙度比单独用研磨抛光膏的效果好。 相似文献
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三维振动台采用振动方法完成对复杂异型曲面工件进行表面强化和抛光处理,为了探讨振动台的固频与振型对强化抛光的影响,本文首先对三维振动台进行Y向与Z向模态试验,得到了三维振动台的各阶模态,为了纵模态分析中确定强化抛光用模态,将模态分析中所得的各阶固频,对三维振动台进行正弦激振,同时将模态分析与正弦激振相结合,获得了适合三维振动台的抛光工艺模态。 相似文献
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Laser polishing is a technology of smoothening the surface of various materials with highly intense laser beams. When these beams impact on the material surface to be polished, the surface starts to be melted due to the high temperature. The melted material is then relocated from the ‘peaks to valleys’ under the multidirectional action of surface tension. By varying the process parameters such as beam intensity, energy density, spot diameter, and feed rate, different rates of surface roughness can be achieved. High precision polishing of surfaces can be done using laser process. Currently, laser polishing has extended its applications from photonics to molds as well as bio-medical sectors. Conventional polishing techniques have many drawbacks such as less capability of polishing freeform surfaces, environmental pollution, long processing time, and health hazards for the operators. Laser polishing on the other hand eliminates all the mentioned drawbacks and comes as a promising technology that can be relied for smoothening of initial topography of the surfaces irrespective of the complexity of the surface. Majority of the researchers performed laser polishing on materials such as steel, titanium, and its alloys because of its low cost and reliability. This article gives a detailed overview of the laser polishing mechanism by explaining various process parameters briefly to get a better understanding about the entire polishing process. The advantages and applications are also explained clearly to have a good knowledge about the importance of laser polishing in the future. 相似文献
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Dependence of pad performance on its texture in polishing mono-crystalline silicon wafers 总被引:1,自引:0,他引:1
Mono-crystalline silicon wafers are important materials in the semiconductor industry for fabricating integrated circuits and micro-electro-mechanical systems. To ensure high surface integrity of polished wafers, the effect of pad texture and its variation on the pad performance needs to be understood. This paper studies experimentally the dependence of pad performance on its texture deterioration by investigating its correlation with polishing time, polishing pressure, and material removal rate. The study concludes that material removal rate decreases as the cylindrical cell structure of a pad is gradually deteriorated, that there is a pad life limit beyond which polishing quality can no longer be maintained, and that the workable pad life can be extended to a certain degree by applying higher polishing pressure. 相似文献
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介绍了超精密抛光机的工作原理及其控制要求,通过控制规则可调整的模糊控制技术解决控制系统非线性与保证控制精度的方法,并应用DSP实现控制系统。 相似文献
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Chemical mechanical polishing (CMP) is an essential process in semiconductor fabrication. The results of CMP process are determined with the selection of consumables and process parameters. The polishing pad transports the slurry to the interface between the polishing pad and wafer and obtains material removal planarity. The mechanical properties of the polishing pad should be studied to analyze the material removal mechanism of CMP because polishing pad deformation is directly related to material removal rate and its uniformity. Various studies have investigated the stress distribution of the CMP process by using the elastic modulus and Poisson’s ratio of the polishing pad. However, these aspects of polishing pad have not been fully elucidated. In this study, we estimated the mechanical properties of commercial polyurethane-impregnated felt pads by comparing the experimentally measured compressive deformation amounts with finite element analysis results. 相似文献
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介绍了激光抛光硬脆材料的研究背景及基本理论模型,探讨了其抛光机理,总结了激光抛光硬脆材料的影响因素及影响规律,并展望了该技术的发展前景。 相似文献