Microstructure and properties of W-15Cu alloys prepared by mechanical alloying and spark plasma sintering process

W-15Cu composite powders prepared by mechanical alloying （MA） of raw powders were consolidated by spark plasma sintering （SPS） process at temperature ranged 1 230-1 300 ℃ for 10 min and under a pressure of 30 MPa. By using high energy milling, particles containing very fine tungsten grains embedded in copper, called composite particles, could be produced. The W grains were homogeneously dispersed in copper phase, which was very important to obtain W-Cu alloy with high mechanical properties, fine and homogeneous microstructure. The microstructure and properties of W-15Cu alloys prepared by SPS processes at different temperature were researched. The results show that W-15Cu alloys consolidated by SPS can reach 99.6 % relative density, and transverse rupture strength （TRS） is 1 400.9 MPa, Rockwell C hardness （HRC） is 45.2, the thermal conductivity is 196 W/m-K at room temperature, the average grain size is less than 2 μm, and W-15Cu alloy with excellent properties, homogeneous and fine microstructure is obtained.     

Preparation and arc erosion resistance of Cf/Cu composite by vacuum melting infiltration

Cf/Cu composite was prepared by vacuum melting infiltration. Ti and Cr were doped to the Cu alloy to improve the wettability between Cu and carbon. The microstrueture was investigated by XRD, SEM and EDS. The arc erosion rate of Cf/Cu composite was investigated in vacuum. The results showed that the Ti and Cr could improve the wettability between Cu and C/C preform and the infiltration ability of Cu into C/ C preform greatly. A TiC interface formed between the fibers and matrix. The good bonding between the fiber and matrix guaranteed that part of the Cu matrix can still be bonded on the fibers even when the material was exposed to the plasma. Consequently, the carbon fibers were protected from the erosion. In comparison, Cu was completely consumed by the arc erosion. Hence, the graphite was eroded and presented a cauliflower-like morphology. Therefore, the prepared C/Cu bad better ability to resist the arc erosion, compared with common Cu-C material.     

Preparation and Arc Erosion Characteristics of Ultrafine Crystalline CuCr50 Alloy by MA-SPS

The ultrafine crystalline CuCr50(Cr 50 wt%) alloys were fabricated by a combination of mechanical alloying and spark plasma sintering process. The effects of milling time on crystallite size and solid solubility of the CuCr50 composite powders were investigated. The results showed that crystallite size of powders decreases gradually and solid solubility of Cr in Cu was extended with increasing milling time. The minimal crystallite size about 10 nm and the maximum solid solubility about 8.4 at%(i e, 7 wt%) were obtained at 60 h. The microstructure of ultrafine crystalline CuCr50 alloy was analyzed by SEM and TEM, which contains two kinds of size scale Cr particles of 2 μm and 50-150 nm, distributing homogeneously in matrix, respectively. The arc erosion characteristics of ultrafine crystalline CuCr50 alloy were investigated by the vacuum contact simulation test device in low D.C. voltage and low current(24 V/10 A). A commercial microcrystalline CuCr50 alloy was also investigated for comparison. Experiments indicate that the cathode mass loss of ultrafine crystalline CuCr50 contact material is higher than that of microcrystalline CuCr50 material, but its eroded surface morphology by the arc is uniform without obvious erosion pits. While the surface of microcrystalline CuCr50 contact is seriously eroded in local area by the arc, an obvious erosion pit occurred in the core part. Therefore, the ability of arc erosion resistance of ultrafine crystalline CuCr50 alloy is improved compared to that of microcrystalline CuCr50 material.     

Contact resistance and arc erosion of tungsten-copper contacts in direct currents

The arc erosion under medium direct currents in the argon flow was tested on tungsten-copper(W-Cu) contacts which were processed by hot extrusion and heat treatment. The scanning electron microscopy(SEM) and transmission electron microscopy(TEM) were used to study the microstructure of the W-Cu powders and compacts. The contact resistance, arcing energy, and arcing time were continuously measured by JF04C contact materials test system. Changes in tungsten-copper contact surface were observed by SEM. The test results showed that the arcing time and arcing energy all increase with current and voltage, but the changes of average contact resistance are more complicated. For a short arcing time, the average contact resistance decreases with increasing current due to the vaporization of Cu. However, for a longer arcing time, it slightly increases due to the formation of high resistant films, compound copper tungsten. The formation of compound copper tungsten was confirmed by the increased Rc kept in the range from 1.1 to 1.6 mΩ. The compound copper tungsten is first exposed with a tungsten and copper-rich surface, and then totally exposed due to evaporation of copper from the surface. At last a stabilized surface is created and the crystals decrease from 8 μm to 2 μm caused by the arc erosion.     

Manufacture of high-dispersed W-Cu composite powder by mechano-thermal process

In order to improve the process of co-reduction of oxide powder, a new mechano-thermal process was designed to produce high-dispersed W-Cu composite powder by high temperature oxidation, short time high-energy milling and reduction at lower temperature. The particle size, oxygen content and their sintering abilities of W-Cu composite powder in different conditions were analyzed. The results show that after a quick milling of the oxide powder for about 3-10 h, the reduction temperature of the W-Cu oxide powder can be lowered to about 650 ℃ from 700-750 ℃ owning to the lowering of particle size of the oxide powder. The average particle size of W-Cu powder after reduction at 650 ℃ is about 0. 5μm smaller than that reduced at 750 ℃. After sintering at 1 200℃ for 1 h in hydrogen atmosphere, the relative density and thermal conductivity of final products (W-20Cu) can attain 99. 5% and 210 W ·m-1· K-1 respectively.     

Fabrication and properties of ZAO powder, sputtering target materials and the related films

Aluminum-doped zinc oxide （ZnO：Al）, abbreviated as ZAO, is a novel and widely used transparent conductive material. The ZAO powder was synthesized by chemical coprecipitation. The ZAO ceramic sputtering target materials were fabricated by sintering in air, and ZAO transparent conductive films were prepared by RF magnetron sputtering on glass substrates. XRD proved that such films had an orientation of （002） crystal panel paralleled to the surface of the glass substrate. The average transmittance of the films in the visible region exceeded 80%.     

Fabrication and densification enhancement of SiC-particulate-reinforced copper matrix composites prepared via the sinter-forging process

The fabrication of copper （Cu） and copper matrix silicon carbide （Cu/SiCp） particulate composites via the sinter-forging process was investigated. Sintering and sinter-forging processes were performed under an inert Ar atmosphere. The influence of sinter-forging time, temperature, and compressive stress on the relative density and hardness of the prepared samples was systematically investigated and subsequently compared with that of the samples prepared by the conventional sintering process. The relative density and hardness of the composites were enhanced when they were prepared by the sinter-forging process. The relative density values of all Cu/SiCp composite samples were observed to decrease with the increase in SiC content.     

Fabrication and Mechanical Properties of 2024 Aluminum AlloyReinforced by FeNiCrCoAl3 High Entropy Particles

This article mainly discussed bulk material lHvl~ared by powder metallurgy, and the commercial 2024 aluminum alloy powder and FeNiCrCoA13 high entropy alloy powder （both produced by argon gas atomization process） were ball-milled for different hours. The prepared powder was consolidated by hot extrusion method. The microstruetures of the milled powder and bulk alloy were examined by X - Ray Diffraction （XRD）, Scanning Electron Microscopy （SEM） and Transmission Electron Microscopy （TEM）. The thermal stability was tested by differential scanning calorimetry （DSC）. Mechanical properties of the extruded alloy were examined by Vickers hardness tester and mechanical testing machine. The results show that after milling, the mixed particle sizes and microstructures of the alloy powder change obviously. The compressive strength of the extruded alloy has reached 580 MPa under certain conditions of milling time and composition.     

Effects of annealing on microstructure, mechanical and electrical properties of AlCrCuFeMnTi high entropy alloy

The multi-component A1CrCuFeMnTi high entropy alloy was prepared using a vacuum arc melting process. Serial annealing processes were subsequently performed at 590 ℃, 750 ℃, 955 ℃ and 1 100 ℃ respectively with a holding time of 4 h at each temperature. The effects of annealing on microstructure, mechanical and electrical properties of as-cast alloy were investigated by using differential thermal analysis （DTA）, X-ray diffraction （XRD）, scanning electron microscopy （SEM） and transmission electron microscopy （TEM）. The experimental results show that two C14 hexagonal structures remain unchanged after annealing the as-cast A1CrCuFeMnTi alloy specimens being heated to 1 100℃. Both annealed and as-cast microstructures show typical cast-dendrite morphology and similar elemental segregation. The hardness of alloys declines as the annealing temperature increases while the strength of as-cast alloy improves obviously by the annealing treatment. The electrical conductivities of annealed and as-cast alloys are influenced by the distribution of interdendrite re~ions which is rich in Cu element.     

Novel Nanosized Adsorbing Composite Cathode Materials for the Next Generational Lithium Battery

A novel carbon-sulfur nano-composite material was synthesized by heating sublimed sulfur and high surface area activated carbon （HSAAC） under certain conditions. The physical and chemical per- formances of the novel carbon-sulfur nano-composite were characterized by scanning electron microscopy （SEM）, Brunauer-Emmett-Teller （BET） and X-ray diffraction （XRD）. The electrochemical performances of nano-composite were characterized by charge-discharge characteristic, cyclic voltammetry and electrochemical impendence spectroscopy （EIS）. The experimental results indicate that the electrochemical capability of nano- composite material was superior to that of traditional S-containing composite material. The cathode made by carbon-sulfur nano-composite material shows a good cycle ability and a high specific charge-discharge capacity. The HSAAC shows a vital role in adsorbing sublimed sulfur and the polysulfides within the cathode and is an excellent electric conductor for a sulfur cathode and prevents the shuttle behavior of the lithium-sulfur battery.     

Microstructure and Properties of W-Cu Alloys Prepared with Mechanically Activated Powder

W-15% Cu (mass fraction) alloys were sintered with mechanically activated powder in order to develop new preparing processes and improve properties of alloys. The microstructures of the activated powder and the sintered alloy were observed. Properties such as density were measured. The results show that through mechanical activation, the particle size of the powder becomes finer to sub-micron or nanometer level, some copper was soluble in tungsten, and high density W-Cu alloys can be obtained by mechanically activated powder for its action to the activation sintering.     

W-Cu高密度合金的制备

高致密度是W-Cu合金性能优良的前提,但是由于W和Cu的不互溶,二者形成的是一种典型的假合金,因此W-Cu合金的制备只有通过粉末冶金的方法来完成以仲钨酸铵和硝酸铜为原料,利用氢还原和烧结技术制备的W-Cu合金,其中w(Cu)=15%,通过SEM、XRD对制备过程中各阶段形成的产物及最终形成的W-Cu合金进行了相分析和组织形貌分析,并进行了性能试验.试验结果表明,通过此工艺制备出的W-Cu复合粉末具有均匀的化学组成和较高的烧结活性,在1220℃烧结2h后,其烧结体密度可达理论密度的98.45%,且在合金中形成了对导热、导电性能具有重要作用的Cu网络结构.     

钨铜合金的制备工艺研究

研究了粉末粒度、成型压力及铜的损耗对钨铜复合材料制备的影响.通过试验进一步提高了钨铜合金的相对致密度,简化了钨铜合金制作工艺.研究发现:随着球磨时间的延长,钨铜粉末发生了明显的细化和圆化,粉末分布更为均匀,烧结活性有较大提高,合金性能和组织结构更加良好,材料致密度有相应的提高.通过对两种不同成型压力烧结的试样进行测试,得到不同压力下的材料致密度和铜含量的变化数据.发现随着成型压力的增大,材料的烧结致密度升高.对铜流失的现象进行了分析,使铜的损耗现象得到一定的控制.     

利用蒸发法和机械合金化法制备纳米Fe-Al金属间化合物

利用两种方法制备了纳米Fe-Al金属间化合物:一种是利用氢电弧等离子体法在自制的设备中以Fe-28Al-5Cr块体材料为原料,利用电弧高温蒸发制备出纳米Fe-Al基金属间化合物,该方法制得的纳米粒子呈球形,平均粒度30 nm,为B2相结构。在600℃真空退火1 h后,纳米粒子发生了B2→DO3相转变;第二种是利用机械合金化方法,将氢电弧等离子体法制备的纳米金属铁、铝单质置于球磨罐中混合湿磨,发现湿磨10 h形成了Fe-Al金属间化合物。     

镁粉含量对Mg-HA牙体充填材料结构与性能的影响

以氢氧化钙和磷酸二氢钙等为原料采用化学沉淀法制备羟基磷灰石粉体,与适当含量的镁粉烧结制备Mg-HA粉体.以聚甲基丙烯酸酯为有机粘结剂控制合适的比例调和制备Mg-HA牙体充填材料,通过扫描电子显微分析（SEM）、X射线衍射分析（XRD）和力学性能测试等方法,研究了镁粉含量对其固化试样结构与抗压强度的影响.结果表明：不同镁含量的试样均可获得较高的抗压强度（大于90MPa）,实验条件下,随镁含量增大,试样的抗压强度有略微上升的趋势;Mg-HA基体与高聚物粘结剂能达到良好的结合,并具备较高的性能.     

利用热实验方法研究纳米金属粒子的储氢性能

利用热实验方法研究纳米金属粒子的储氢性能郝春成，张志琨，崔作林（纳米材料研究所）储氢材料是一种新型多用途功能材料，被广泛用于二次电池、催化剂、储氢储能、热泵空调、氢的纯化等方面。纳米金属粒子是由纳米级小晶粒组成的粉状材料。由于粒子尺寸的减小，尤其是减...     

高能球磨时间对钨铜复合材料性能的影响

将W-15wt%Cu粉在行星式高能球磨机中进行球磨,并将球磨粉末加压烧结成型。研究了不同球磨时间对钨铜复合材料性能的影响。采用XRD、SEM对所制备的球磨粉末及烧结合金分别进行物相分析和组织形貌观察,并测定了烧结合金的相对致密度。结果表明,随着球磨时间的增加,钨铜球磨粉末晶粒尺寸得到细化,且有不饱和固溶体产生;烧结合金晶粒尺寸长大,孔洞减少,相对密度增大接近全致密。