Simultaneously enhanced thermal conductivity and dielectric properties of borosilicate glass-based LTCC with AlN and h-BN additions

Microwave devices with reduced dielectric loss and electronic components with increased integration density necessitate the higher performance of electronic packaging materials. The h-BN/AlN/CaCO₃-MgO-B₂O₃-SiO₂-Li₂CO₃ glass composites were prepared via tape-casting and then sintered by pressureless and hot-pressing, respectively. The thermal conductivity of pressureless sintered composite was increased to 6.55 W/(m·K) by incorporating 3 wt% h-BN, and the thermal expansion of 4.47 ppm/K was achieved along with low dielectric constant of 5.76 and dielectric loss of 7.02 × 10⁻⁴ at 24 GHz. In contrast, the hot-pressing sintered composite containing 4 wt% h-BN exhibited higher thermal conductivity of 10.3 W/(m·K) and lower dielectric loss of 4.77 × 10⁻⁴. The microstructure characterization indicated the construction of heat conduction networks, and XRD analysis illustrated the formation of crystallization in the glass. Such low-temperature co-fired ceramic (LTCC) with high thermal conductivity and low dielectric loss would be a promising candidate for electronic packaging and 5G communication applications.     

Thermal Properties of (Zr,TM)B2 Solid Solutions with TM = Hf,Nb, W,Ti, and Y

The thermal properties were investigated for hot‐pressed zirconium diboride—transition‐metal boride solid solutions. The transition‐metal additives included hafnium, niobium, tungsten, titanium, and yttrium. The nominal additions were equivalent to 3 at.% of each metal with respect to zirconium. Powders were hot‐pressed to nearly full density at 2150°C using 0.5 wt% carbon as a sintering aid. Thermal diffusivity was measured using the laser flash method. Thermal conductivity was calculated from the thermal diffusivity results using temperature‐dependent values for density and heat capacity. At 25°C, the thermal conductivity ranged from 88 to 34 W·(m·K)^?1 for specimens with various additives. Electrical resistivity measurements and the Wiedemann–Franz law were used to calculate the electron contribution of the thermal conductivity and revealed that thermal conductivity was dominated by the electron contribution. The decrease in thermal conductivity correlated with a decrease in unit cell volume, indicating that lattice strain may affect both phonon and electron transport in ZrB₂.     

An Evaluation of the Thermophysical Properties of Stoichiometric CeO2 in Comparison to UO2 and PuO2

The thermal conductivity of stoichiometric CeO₂ was determined through measurement of thermal expansion from 313 to 1723 K, thermal diffusivity from 298 to 1473 K, and specific heat capacity from 313 to 1373 K. The thermal conductivity was then calculated as the product of the density, thermal diffusivity, and specific heat capacity. The thermal conductivity was found to obey an (A + BT)^?1 relationship with A = 6.776×10^?2 m·K·W^?1 and B = 2.793 × 10^?4 m·W^?1. Extrapolations of applied models were made to provide suggested data for the specific heat capacity, thermal diffusivity, and thermal conductivity data up to 1723 K. Results of thermal expansion and heat capacity measurements agreed well with the limited low‐temperature data available in the literature. The thermal conductivity values provided in the current study are significantly higher than the only high‐temperature data located for CeO₂. This is attributed to the tendency of CeO₂ to rapidly reduce at elevated temperatures given the available partial pressure of O₂ in air at ambient pressure. The CeO₂ data are compared to literature values for UO₂ and PuO₂ to evaluate its suitability as a surrogate in nuclear fuel systems where thermal transport is a primary criterion for performance     

Thermal Properties of (Zr,TM)B2 Solid Solutions with TM = Ta,Mo, Re,V, and Cr

The thermal properties were investigated for hot‐pressed zirconium diboride containing solid solution additions of tantalum, molybdenum, rhenium, vanadium, and chromium. The nominal additions were equivalent to 3 at.% of each metal with respect to zirconium. Using 0.5 wt% carbon as a sintering aid, powders were hot‐pressed to near full density at 2150°C. Rietveld refinement of X‐ray diffraction data was used to measure lattice parameters and to ensure that the additives formed solid solutions. Thermal conductivities were calculated from measured thermal diffusivities and temperature‐dependent values for density and heat capacity. Thermal conductivities at 25°C ranged from 88 W·(m·K)^?1 for nominally pure ZrB₂ down to 28 W·(m·K)^?1 for (Zr,Cr)B₂. Electron contributions to thermal conductivity were calculated from electrical resistivity measurements using the Wiedemann–Franz law. Decreases in phonon and electron conduction correlated with the size of the metallic additive, indicating that changes in atom size in the Zr lattice positions reduced thermal transport.     

Accurate Exploration of the Intrinsic Lattice Thermal Conductivity of Si2N2O by Combined Theoretical and Experimental Investigations

Si₂N₂O is a promising ceramic with various structural and functional applications. Precisely exploring its thermal conductivity is crucially important to evaluate its thermal transport reliability as high‐temperature structural component and electronic device. In this paper, temperature‐dependent lattice thermal conductivity of Si₂N₂O is studied based on a method integrating density functional theory calculations and experimental measurements. The relationship between the complex crystal structure (or heterogeneous chemical bonding) and lattice thermal conductivity of Si₂N₂O is studied. We herein show that Si₂N₂O intrinsically has moderately high lattice thermal conductivity [30.9 W·(m·K)^?1 at 373 K], but extrinsic phonon scattering mechanisms, such as phonon scattering by point defects and grain boundaries etc., might significantly degrade the magnitude in experimental measurement [15.0 W·(m·K)^?1 at 373 K]. This work suggests the significance that understanding the intrinsic thermal conductivity, namely the upper limit value, is a precursor to deciphering the more complicated heat transport behavior of Si₂N₂O.     

The dual effect of zirconia fiber on the insulation and mechanical performance of the fumed silica-based thermal insulation material

Inorganic fibers and opacifiers are indispensable for improving the strength and high temperature insulation performance of the fumed silica-based thermal insulation material. However, zirconia fiber enhances the strength of the fumed silica-based thermal insulation material and reduces the radiative heat transfer to replace the opacifier. The sample of fumed SiO₂/Al₂O₃ doped with 7% zirconia fiber (FZ7) has a lower density of 0.70 g/cm³ and a high porosity of 75.0%. In addition, the thermal conductivity of FZ7 at 800 °C is 0.077 W/(m·K), which is lower than the sample of fumed SiO₂/Al₂O₃ doped with 7% glass fiber (FG7) and 0.089 W/(m·K) at 800 °C. The effective extinction coefficient of the thermal insulation material containing zirconia fiber is larger than that of the glass fiber by Fourier transform infrared spectroscopy analysis and calculation, indicating that the zirconia fiber has a distinct absorption and scattering effect on infrared radiation to reduce the radiative heat transfer. Therefore, zirconia fiber enhances the strength and decreases the high temperature thermal conductivity of the composites with the dual effect on the insulation and mechanical performance of the fumed silica-based thermal insulation material.     

Elevated temperature thermal properties of ZrB2-B4C ceramics

The elevated temperature thermal properties of zirconium diboride ceramics containing boron carbide additions of up to 15 vol% were investigated using a combined experimental and modeling approach. The addition of B₄C led to a decrease in the ZrB₂ grain size from 22 µm for nominally pure ZrB₂ to 5.4 µm for ZrB₂ containing 15 vol% B₄C. The measured room temperature thermal conductivity decreased from 93 W/m·K for nominally pure ZrB₂ to 80 W/m·K for ZrB₂ containing 15 vol% B₄C. The thermal conductivity also decreased as temperature increased. For nominally pure ZrB₂, the thermal conductivity was 67 W/m·K at 2000 °C compared to 55 W/m·K for ZrB₂ containing 15 vol% B₄C. A model was developed to describe the effects of grain size and the second phase additions on thermal conductivity from room temperature to 2000 °C. Differences between model predictions and measured values were less than 2 W/m·K at 25 °C for nominally pure ZrB₂ and less than 6 W/m·K when 15 vol% B₄C was added.     

Effect of carbon content on electrical,thermal, and mechanical properties of porous SiC ceramics with B4C and C additives

The electrical, thermal, and mechanical properties of porous SiC ceramics with B₄C-C additives were investigated as functions of C content and sintering temperature. The electrical resistivity of porous SiC ceramics decreased with increases in C content and sintering temperature. A minimal electrical resistivity of 4.6 × 10^?2 Ω·cm was obtained in porous SiC ceramics with 1 wt% B₄C and 10 wt% C. The thermal conductivity and flexural strength increased with increasing sintering temperature and showed maxima at 4 wt% C addition when sintered at 2000 °C and 2100 °C. The thermal conductivity and flexural strength of porous SiC ceramics can be tuned independently from the porosity by controlling C content and sintering temperature. Typical electrical resistivity, thermal conductivity, and flexural strength of porous SiC ceramics with 1 wt% B₄C-4 wt% C sintered at 2100 °C were 1.3 × 10^?1 Ω·cm, 76.0 W/(m·K), and 110.3 MPa, respectively.     

Effect of heat transfer channels on thermal conductivity of silicon carbide composites reinforced with pitch-based carbon fibers

In this study, silicon carbide (SiC) composites reinforced with pitch-based carbon fibers and composed of heat transfer channels were fabricated by combining chemical vapor infiltration and reactive melting infiltration method. It was observed that the internal heat conduction skeleton of pitch-based carbon fibers was sequentially formed. The thermal conductivities from room temperature to 500 °C along through-thickness direction and in-plane direction were investigated. The results showed that C_pf/SiC composites with heat transfer channels possessed excellent thermal conductvity in two directions, and the thermal conductivity increased with increasing volume content of heat transfer channels. The thermal conductivity in through-thickness direction reached 38.89 W/(m·K), and that for in-plane direction reached 112.42 W/(m·K). Theoretical calculations were empolyed to study the temperature dependence of the C_pf/SiC composites. The variations in slope A′ and intercept B′ values of fitted curves were in good agreement with the experimental results. To verify the reliablilty of the theoretical model, the C_pf/SiC composites were heated at 1650 °C for 2 h and the thermal conductivity exhibited further improvement due to the formation of more perfect crystalline structure. Thermal conductivity through thickness direction improved to 43.49 W/(m·K), and that in in-plane direction improved to 142.49 W/(m·K), which could be identified by the theoretical model. Finally, the leading edge model was established by using ABAQUS finite element analysis software to evaluate the potential application of the composites. Owing to the outstanding thermal conductivity, the leading edge obtained by using C_pf/SiC composites in this study exhibited lower temperature gradient and a more uniform temperature distribution. Moreover, less thermal stress and displacement were generated during heating process.     

Electrical and Thermal Properties of SiC Ceramics Sintered with Yttria and Nitrides

The electrical and thermal properties of SiC ceramics containing 1 vol% nitrides (BN, AlN or TiN) were investigated with 2 vol% Y₂O₃ addition as a sintering additive. The AlN‐added SiC specimen exhibited an electrical resistivity (3.8 × 10¹ Ω·cm) that is larger by a factor of ~10² compared to that (1.3 × 10^?1 Ω·cm) of a baseline specimen sintered with Y₂O₃ only. On the other hand, BN‐ or TiN‐added SiC specimens exhibited resistivity that is lower than that of the baseline specimen by a factor of 10^?1. The addition of 1 vol% BN or AlN led to a decrease in the thermal conductivity of SiC from 178 W/m·K (baseline) to 99 W/m·K or 133 W/m·K, respectively. The electrical resistivity and thermal conductivity of the TiN‐added SiC specimen were 1.6 × 10^?2 Ω·cm and 211 W/m·K at room temperature, respectively. The present results suggest that the electrical and thermal properties of SiC ceramics are controllable by adding a small amount of nitrides.     

Thermal Properties of Hf‐Doped ZrB2 Ceramics

The effect of Hf additions on the thermal properties of ZrB₂ ceramics was studied. Reactive hot pressing of ZrH₂, B, and HfB₂ powders was used to synthesize (Zr_1?x,Hf_x)B₂ ceramics with Hf contents ranging from x = 0.0001 (0.01 at.%) to 0.0033 (0.33 at.%). Room‐temperature heat capacity values decreased from 495 J·(kg·K)^?1 for a Hf content of 0.01 at.% to 423 J·(kg·K)^?1 for a Hf content of 0.28 at.%. Thermal conductivity values decreased from 141 to 100 W·(m·K)^?1 as Hf content increased from 0.01 to 0.33 at.%. This study revealed, for the first time, that small Hf contents decreased the thermal conductivity of ZrB₂ ceramics. Furthermore, the results indicated that reported thermal properties of ZrB₂ ceramics are affected by the presence of impurities and do not represent intrinsic behavior.     

Fabrication of lightweight ZrO2 fiberboards using hollow ZrO2 fibers

ZrO₂ fiberboards with ultra-low densities (0.34–0.40 g/cm³) were fabricated using biomorphic ZrO₂ hollow fibers, which have a lower density and better thermal insulation than traditional ZrO₂ solid fibers. The effects of sol binder content, sintering temperature, and proportion of solid fibers on the density, microstructure, compressive strength, linear shrinkage, and thermal conductivity of lightweight ZrO₂ fiberboards were investigated. The results showed that the hollow features of biomorphic ZrO₂ fibers were successfully maintained after they were made into ZrO₂ fiberboards, which made them less dense and thermally conductive. The best conditions were found to be a sol binder content of 30 vol%, sintering temperature of 1400 °C, and 20 wt% sintered solid fibers to balance thermal insulation and compressive strength. The results show that the density and thermal conductivity of lightweight ZrO₂ fiberboard gives it obvious advantages as a heat-insulating ceramic. Specifically, when the sintering temperature was 1400 °C, the sample had an ultra-low density of 0.34–0.40 g/cm³, a thermal conductivity of 0.101–0.116 W/(m·K) (at 500 °C), a compressive strength of 0.05–0.24 MPa, and a linear shrinkage of 9.4–13%.     

Zirconium Diboride with High Thermal Conductivity

Thermal properties were characterized for zirconium diboride produced by reactive hot pressing and compared to ZrB₂ ceramics that were hot pressed from commercial powders. No sintering additives were used in either process. Thermal conductivity was calculated from measured values of heat capacity, thermal diffusivity, and density for temperatures ranging from 298 to 2273 K. ZrB₂ produced by reactive hot pressing achieved near full density, but had a small volume fraction of ZrO₂, whereas hot‐pressed ZrB₂ contained porosity and carbon inclusions. Reactive hot pressing produced a ceramic with higher thermal diffusivity and heat capacity, resulting in thermal conductivities of 127 W·(m·K)^?1 at 298 K and 80 W·(m·K)^?1 at 2273 K, which were up to ~30% higher than typically reported for hot‐pressed ZrB₂.     

Studies on the Al2OC mesophase in synthesized AlN powder and its effects on properties of AlN ceramic substrates

A mesophase of Al₂OC was first determined in AlN powder synthesized in batch quantities via a carbothermal reduction nitridation (CRN) process. The formation and elimination mechanisms of the mesophase were investigated. Effects of the mesophase on properties of the AlN ceramic substrates were evaluated via bending strength and thermal conductivity tests of the substrates fabricated with AlN powder of different O contents. At the conditions of the synthetic furnace, i.e. T = 1700 °C, P_N2 = 10⁻⁵ kPa, and P_CO = 10^−0.008–10^0.973 kPa, the formation of Al₂OC is thermodynamically favorable. By increasing the flow rate of N₂ in the synthetic furnace, the formed Al₂OC was unstable and decomposed into AlN. The properties of the AlN substrates depend on the O content of the AlN powder. The thermal conductivity/bending strength of the AlN substrates increase or decrease, accordingly, based the O content of the reduced AlN powder. AlN substrates made of AlN powder with 0.84 wt% oxygen content show a thermal conductivity and bending strength of 176.3 W/(m·K) and 421.3 MPa, respectively.     

Effects of cerium doping on the microstructure,mechanical properties,thermal conductivity,and dielectric properties of ZrP2O7 ceramics

A two-step method, combined with cold isostatic pressing, was used to prepare CeO₂-doped ZrP₂O₇ ceramics, and their microstructure, mechanical properties, thermal conductivities, and dielectric properties were determined. It was found that CeO₂ doping could increase the Zr–P and P–O bond lengths, which in turn decreased the thermal conductivity of the ZrP₂O₇ matrix. Doping with 12 wt% CeO₂ simultaneously reduced the sintering temperature and improved the mechanical properties of the ZrP₂O₇ ceramics, while retaining its low thermal conductivity and good dielectric properties. The maximum cold modulus of rupture of a sample at 1250 °C was 75.91 MPa, which met most conditions for use at room temperature. A COMSOL model was used to predict the thermal conductivity, based on the microstructure, with a relatively high degree of accuracy. The thermal conductivity of the CeO₂-doped samples was lower than 1.083 W/(m·K). The dielectric constant was in the range of 5.93–6.52 at 20–40 GHz, and the dielectric loss was less than 4 × 10^?3. The ZrP₂O₇-doped ceramics have potential for application in millimetre wave technology, satellite communication, and vehicle radar fields, because they can meet the high thermal insulation requirements for these applications.     

Thermal and mechanical properties of Ta2O5 doped La2Ce2O7 thermal barrier coatings prepared by atmospheric plasma spraying

La₂Ce₂O₇ (LC) is a new promising thermal barrier coating (TBC) material for high-temperature applications. However, the sudden decrease of thermal expansion coefficient (TEC) at ∼623 K limits its application. In this study, the plasma-sprayed La₂Ce_1.7Ta_0.3O_7.15 (LCT) coating was developed by partial substitution of Ce⁴⁺ in LC with Ta⁵⁺. LCT coating shows lower thermal conductivity between 298 K and 1273 K (0.54–0.71 W/(m·K)) than LC coating (0.65–0.85 W/(m·K)) and the traditional yttria partially stabilized zirconia (YSZ) coating (1.53–1.72 W/(m·K)). It also exhibits excellent thermal stability at least up to 1573 K for 1000 h. What is more, the sudden TEC drop is suppressed owing to the reduced oxygen vacancy concentration governed by Ta⁵⁺-substitution content. As a result, LCT TBC shows an improved thermal cycling lifetime in an air furnace as compared to LC TBC.     

Low thermal conductivity in porous SiC–SiO2–Al2O3–TiO2 ceramics induced by multiphase thermal resistance

The introduction of multiple heterogeneous interfaces in a ceramic is an efficient way to increase its thermal resistance. Novel porous SiC–SiO₂–Al₂O₃–TiO₂ (SSAT) ceramics were fabricated to achieve multiple heterogeneous interfaces by sintering equal volumes of SiC, SiO₂, Al₂O₃, and TiO₂ compacted powders with polysiloxane as a bonding phase and carbon as a template at 600 °C in air. The porosity could be controlled between 66% and 74% by adjusting the amounts of polysiloxane and the carbon template. The lowest thermal conductivity (0.059 W/(m·K) at 74% porosity) obtained in this study is an order of magnitude lower than those (0.2–1.3 W/(m·K)) of porous monolithic SiC, SiO₂, Al₂O₃, and TiO₂ ceramics at an equivalent porosity. The typical specific compressive strength value of the porous SSAT ceramics at 74% porosity was 3.2 MPa cm³/g.     

Improvement on thermophysical and mechanincal properties of LaMgAl11O19 magnetoplumbite by Nd2O3 and Sc2O3 co-doping

LaMgAl₁₁O₁₉-type magnetoplumbite holds great promise to be used above 1300 °C as thermal barrier coatings (TBCs), but its practical application has been restricted because of inferior thermophysical properties. Herein, we focus on optimizing the thermophysical properties of LaMgAl₁₁O₁₉ by simultaneously substituting La³⁺ and Al³⁺ ions with Nd³⁺ and Sc³⁺ ions, respectively. Results show that the effects of co-substitution on reducing thermal conductivity are pronounced. The thermal conductivities of La_1-xNd_xMgAl_11-xSc_xO₁₉ (x = 0, 0.1, 0.2, 0.3) ceramics decrease progressively with dopant concentration and a lowest thermal conductivity of 2.04 W/(m·K) is achieved with x = 0.3 at 1000 °C, which is a value superior to pure LMA and even lower than YSZ. The mechanisms behind the lowered thermal conductivity are investigated. Increase of the thermal expansion coefficient is also realized (8.53 × 10⁻⁶ K⁻¹ for pure LMA, 9.07 × 10⁻⁶ K⁻¹ for x = 0.3, 1300 °C). Most importantly, Nd³⁺ and Sc³⁺ combination doping indeed facilitates mechanical properties of La_1-xNd_xMgAl_11-xSc_xO₁₉ solid solutions as well. It should be noted that Sc³⁺ doping at Al³⁺ site plays more effective role in improving thermal properties than Nd³⁺ does at La³⁺ site. This work provides a path to simultaneously integrate low thermal conductivity, good phase stability, moderate thermal expansion behavior and excellent mechanical properties on LMA for the next generation TBCs.     

Rapid preparation of Palygorskite/Al2O3 composite aerogels with superhydrophobicity,high-temperature thermal insulation and improved mechanical properties

Al₂O₃ aerogels are widely employed in heat insulation and flame retardancy because of their unique combination of low thermal conductivity and exceptional high-temperature stability. However, the mechanical properties of Al₂O₃ aerogel are poor, and the preparation time is considerably long. In this study, we present a simple and scalable approach to construct monolithic Pal/Al₂O₃ composite aerogels using solvothermal treatment instead of traditional solvent replacement, which remarkably shortened the preparation time. Subsequently, to obtain stable superhydrophobicity (θ > 152°), the Pal/Al₂O₃ aerogel was modified by gas-phase modification method. The obtained Pal/Al₂O₃ composite aerogels demonstrate the integrated properties of low density (0.078–0.106 g/cm³), low thermal conductivity (1000 °C, 0.143 W/(m·K)), good mechanical properties (Young's modulus, 1.6 MPa), and good heat resistance. The monolithic Pal/Al₂O₃ composite aerogels with improved mechanical performance and improved thermal stability can show great potential in the field of thermal insulation.     

Novel nanometer alumina-silica insulation board with ultra-low thermal conductivity

Advanced nano-porous super thermal insulation materials are widely used in spacecraft, soler-thermal shielding, heat exchangers, photocatalytic carriers due to their low thermal conductivity. In this work, adopting dry preparation technology, nano-Al₂O₃, nano-SiO₂, SiC and glass fibers as raw materials, novel nanometer alumina-silica insulation board (NAIB) were prepared. The preparation process was simple, safe, and reliable. In addition, the NAIB exhibited a high porosity (91.3–92.3%), small pore size (39.83–44.15 nm), low bulk density (0.22–0.26 g/cm³), better volumetric stability, and low thermal conductivity (0.031–0.050 W/(m·K) (200–800 °C)), respectively. The as-prepared NAIB could render them suitable for application as high-temperature thermal insulation materials.