SU—1潜伏性中低温固化环氧结构胶的研究

以环氧树脂6101~#、新型潜伏固化剂、新型固化促进剂及丁腈橡胶等为主要组份的SU—1胶,可在100～110℃固化,是一种粘接性能较好、胶液贮存期长等综合性能优良的潜伏性中低温型固化的环氧结构胶。文中重点介绍了潜伏性固化剂、固化促进剂、固化剂—6101~#体系、潜伏性固化剂—6101~#—固化促进剂体系以及双氰胺—6101~#体系、固化促进剂—双氰胺—6101~#体系的DSC曲线。     

328型环氧树脂潜伏性低中温固化剂及在我厂发电机制造中的应用

本文介绍了328型环氧树脂潜伏性低中温固化剂的技术指标与特点、328型固化剂在环氧树脂中的应用配比、使用工艺与固化物性能指标和用328作固化剂生产的粘合剂、浸渍材料、压敏带以及在发电机制造中的应用。     

潜伏性二酰肼固化剂的研制及应用

通过研制ＮＫ型系列潜伏性二酰肼固化剂和含有该固化剂的环氧粉末涂料，探讨了合成工艺条件和固化工艺条件，并进行了涂层性能测试，取得了满意的效果。     

新型潜伏性环氧树脂固化剂的研制

采用乙二胺与丙烯酸甲酯在乙醇中反应合成了一种具有潜伏性的环氧树脂固化剂。利用红外光谱和元素分析确定产物的化学结构 ,热失重分析结果表明产物基本达到了作为潜伏性固化剂的要求     

环氧复合材料低温固化剂研究进展

低温固化(固化温度低于100℃)可获得高尺寸稳定性、低成本、力学性能优良的环氧复合材料,室温储存期长的低温固化剂体系是低温固化环氧复合材料的关键。重点探讨了微胶囊型、潜伏性以及其它改性环氧低温固化剂,展望了其未来前景及发展方向。     

咪唑类潜伏性固化剂

微电子封装技术是一项重要的技术，这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。要发展高性能、超小型／高密度、低能耗、多功能、高速信号处理和长期可靠性的电子产品，就离不开微电子封装技术。封装材料目前大多使用咪唑类潜伏性固化剂，咪唑类潜伏性固化剂对微电子封装而言非常重要，本文介绍咪唑类潜伏性固化剂的制备方法。以及在电子封装方面的一些应用实例，并对潜伏性固化机理进行扼要的探讨。     

胺基酰亚胺的应用研究进展

综述了近20年来国内外胺基酰亚胺化合物在热潜伏性固化剂、光潜伏性固化剂、药物合成、表面活性剂及金属离子萃取剂等领域的应用研究现状,分析了胺基酰亚胺的热解、光解机理以及取代基团对胺基酰亚胺性质的影响,探讨了国内今后胺基酰亚胺发展的主要方向。     

对甲苯胺改性双氰胺衍生物潜伏性固化剂的合成及性能

合成了一种新型的环氧树脂潜伏性固化剂——对甲苯胺改性的双氰胺衍生物，讨论了反应条件对合成的影响，并通过熔点测定、IR、^1H NMR对其结构进行了表征。初步固化实验结果表明，这种环氧树脂潜伏性固化剂具有较好的固化性能。     

中温潜伏性固化剂在环氧胶黏剂中的研究进展

在环氧胶黏剂体系中,中温潜伏性固化剂以其优异的潜伏性和相对较低的固化温度而成为研究热点,符合当下提倡的绿色、环保、"低碳生活"理念。详细介绍了双氰胺、咪唑、酸酐、有机酰肼、BF3-胺络合物、微胶囊六种中温潜伏性固化剂及其改性方法。它们的改性方法主要是:通过改性活化或者加入活性促进剂降低双氰胺、酸酐、有机酰肼等高温固化剂的固化温度;通过改性钝化咪唑的固化活性,延长室温储存期;将BF3等路易斯酸室温固化的固化剂与胺络合降低其固化活性,提高室温储存期;将活性固化剂用壁材包裹形成微胶囊使其在室温时稳定,较高的温度时壁材破裂释放出活性固化剂,迅速固化。     

新型环氧固化剂问世

上海物竞化工科技有限公司开发出两种创新型环氧树脂固化剂,即端叔胺支化聚酯改性固化剂和QNPI型低温潜伏性环氧树脂固化剂。端叔胺支化聚酯改性环氧固化剂具有黏度低、色泽浅、气味小,用量少、凝胶时间长等特点,同时,流平性好,反应温和,固化时间短,固化物光亮色浅,粘附力强,适用于制备高档环氧胶粘剂和表面涂层。     

单组分环氧树脂用潜伏型固化剂研究进展

对国内外有关单组分环氧树脂用固化剂进行了梳理,介绍了潜伏型单组分环氧树脂用固化剂（热致型、湿致型、光致型以及微胶囊型）,并对其制备合成方法及固化机理进行详细的综述,指出了单组分环氧树脂用固化剂所存在的问题,并明确未来的研究思路。     

Curing characteristics of epoxy resin systems that include a biphenyl moiety

The curing characteristics of epoxy resin systems that include a biphenyl moiety were investigated according to the change of curing agents. Their curing kinetics mainly depend on the type of hardener. An autocatalytic kinetic reaction occurs in epoxy resin systems with phenol novolac hardener, regardless of the kinds of epoxy resin and the epoxy resin systems using Xylok and DCPDP (dicyclopentadiene‐type phenol resin) curing agents following an nth‐order kinetic mechanism. The kinetic parameters of all epoxy resin systems were reported in terms of a generalized kinetic equation that considered the diffusion term. The fastest reaction conversion rate among the epoxy resin systems with a phenol novolac curing agent was obtained in the EOCN‐C epoxy resin system, and for systems with Xylok and DCPDP hardeners, the highest reaction rate values were obtained in NC‐3000P and EOCN‐C epoxy resin systems, respectively. The system constants in DiBenedetto's equation of each epoxy resin system with different curing agents were obtained, and their curing characteristics can be interpreted by the curing model using a curing agent as a spacer. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1942–1952, 2002     

中温热熔预浸料用环氧树脂及其固化体系的研究进展

本文综述了中温热熔预浸料用环氧树脂体系,包括国内外基体树脂及固化体系的发展现状;分析了粘度对基体树脂的影响规律、固化剂和促进剂的匹配、催化剂的选择等;重点介绍了脲类衍生物和咪唑两类固化促进体系的进展;表明环氧树脂热熔预浸料研制的技术关键是选择合理的树脂体系组合,有较长潜伏期的固化剂和促进剂的匹配及合适的催化剂。     

表面组装用贴片胶的研制

为了改善传统贴片胶(SMA)的固化性能,以不同种类的环氧树脂(EP)作为基体树脂、不同潜伏性固化剂复配作为复合固化剂,制备了三种表面组装用SMA。采用差示扫描量热(DSC)法初步确定了固化剂的用量,并对三种SMA的玻璃化转变温度(Tg)和主要性能进行了对比试验。结果表明:以两种EP复配作为基体树脂,其SMA的综合性能优于单一EP基体树脂;当w(固化剂)=35%、w(触变剂)=6%时,该SMA可以在110℃、152 s条件下完全固化,其铺展值≤4.6%、塌落值≤5.4%、拉伸剪切强度为14 MPa且Tg值为89.7℃,说明该SMA既能快速固化,又具有较高的粘接强度和可修复性。     

新型环氧树脂、固化剂、复合材料及纳米技术进展

介绍了新型庶糖环氧树脂、液晶环氧树脂、耐温耐湿环氧树脂及其组成物、改性物 ,新型固化剂如多芳环胺类固化剂、潜伏固化促进剂 ,新型复合材料 ,即碳纤维、玻璃微珠、硅充填、石墨环氧复合材料及纳米复合材料最新进展     

有机酸改性咪唑环氧树脂固化促进剂的研究

二氰二胺作为环氧树脂的潜伏性固化剂,其固化物机械性能和介电性能优异。但由于二氰二胺与环氧树脂相溶性差,得不到均匀的组成物,且环氧树脂/二氰二胺体系的固化过程需在高于160℃的温度中进行。利用不同含量的有机酸与咪唑3位氮原子中和,改性生成的盐作为环氧树脂/二氰二胺体系固化促进剂,对该体系进行了改进,使其能够在中温(90～120℃)条件下固化。利用IR对改性产物进行了表征,并对未加促进剂的环氧树脂/双氰胺体系和以咪唑及有机酸改性咪唑为促进剂三种体系分别进行了差热分析。结果表明,有机酸改性咪唑促进剂可以使环氧树脂/二氰二胺体系的固化温度降低近50℃,并且适用期显著增加,长达141d,耐水性和耐热老化性能增加。     

Preparation and curing behavior of latent 2-PhIm-PS microcapsule curing agent for epoxy resin

A core–shell microcapsule latent epoxy curing agent (2-PhIm-PS) is obtained by solvent evaporation method with 2-phenyl imidazole (2-PhIm) as the core material and polystyrene (PS) as the wall material. The microcapsule parameters, morphology, structure, curing behavior, and the mechanic properties of cured epoxy resin with this microcapsule latent curing agent were characterized through comparing with 2-PhIm. The particle size distribution of the microcapsule is narrow, the average particle size is about 10.56 μm, and the core material content is 23%. The prepared 2-PhIm-PS microcapsule curing agent has excellent latent curing properties. It can completely cure epoxy resin E-51 within 10 min at 130°C, and its latent period can be more than 40 days at room temperature. In addition, the curing kinetics of one-component epoxy resin curing system (E-51/2-PhIm-PS) composed of 2-PhIm-PS microcapsules and epoxy resin E-51 is also studied by using Kissinger equation, Flynn–Wall–Ozawa and Crane formula. The results provide an outline for the evaluation on the applicability of the microcapsule curing agent of 2-PhIm-PS for epoxy resin.     

单组分环氧树脂胶粘剂用潜伏性固化剂

对单组分环氧树脂胶粘剂用潜伏性固化荆的研发进展进行了扼要的综述.     

New type of phenolic resin: Curing reaction of phenol‐novolac based benzoxazine with bisoxazoline or epoxy resin using latent curing agent and the properties of the cured resin

In this study, we aimed to reduce the cure time, and to lower the cure temperature of the benzoxazine compound. Therefore, curing reaction of benzoxazine with bisoxazoline or epoxy resin using the latent curing agent and the properties of the cured resins were investigated. The cure behavior of benzoxazine with bisoxazoline or epoxy resin using the latent curing agent was monitored by differential scanning calorimetry and measurements for storage modulus (G′). The properties of the cured resin were estimated by mechanical properties, electrical insulation, water resistance, heat resistance, and flame resistance. As a result, it was confirmed that by using the latent curing agent, cure time of benzoxazine and bisoxazoline or epoxy resin was reduced, and cure temperature was lowered. And it was found that the curing reaction using phenol‐novolac based benzoxazine (Na) as the benzoxazine compound could proceed more rapidly than that using bisphenol‐A based benzoxazine (Ba) as the benzoxazine compound. However, the cured resins from Ba and bisoxazoline or epoxy resin using the latent curing agent showed good heat resistance, flame resistance, and mechanical properties compared with those from Na and bisoxazoline or epoxy resin using the latent curing agent. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009