Buffer effects on the mosaic structure of the HR-GaN grown on 6H-SiC substrate by MOCVD

High-resistive GaN (>10⁸ Ω cm) layers have been grown with different buffer structures on 6H-SiC substrate using metalorganic chemical vapor deposition reactor. Different combination of the GaN/AlN super lattice, low temperature AlN, high temperature AlN and Al_xGa_1?xN (x ≈ 0.67) layers were used in the buffer structures. The growth parameters of the buffer layers were optimized for obtaining a high-resistive GaN epilayer. The mosaic structure parameters, such as lateral and vertical coherence lengths, tilt and twist angle (and heterogeneous strain), and dislocation densities (edge and screw dislocations) of the high-resistive GaN epilayers have been investigated using x-ray diffraction measurements. In addition, the residual stress behaviors in the high-resistive GaN epilayers were determined using both x-ray diffraction and Raman measurements. It was found that the buffer structures between the HR-GaN and SiC substrate have been found to have significant effect on the surface morphology and the mosaic structures parameters. On the other hand, both XRD and Raman results confirmed that there is low residual stress in the high-resistive GaN epilayers grown on different buffer structures.     

Determination of two-dimensional electron and hole gas carriers in AlGaN/GaN/AlN heterostructures grown by Metal Organic Chemical Vapor Deposition

Resistivity and Hall effect measurements on nominally undoped Al_0.25Ga_0.75N/GaN/AlN heterostructures grown on sapphire substrates prepared by metal organic chemical vapor deposition have been carried out as a function of temperature (20-300 K) and magnetic field (0-1.4 T). Variable magnetic field Hall data have been analyzed using the improved quantitative mobility spectrum analysis technique. The mobility and density of the two-dimensional electron gas at the AlGaN/GaN interface and the two-dimensional hole gas at the GaN/AlN interface are separated by quantitative mobility spectrum analysis. The analysis shows that two-channel conduction is present in nominally undoped Al_0.25Ga_0.75N/GaN/AlN heterostructures grown on sapphire substrate.     

Calculation of residual thermal stress in GaN epitaxial layers grown on technologically important substrates

A detailed investigation of residual thermal stress and misfit strain in GaN epitaxial layers grown on technologically important substrates is performed. The thermal stress is low when GaN is grown on AlN, SiC and Si, and relatively higher when Al₂O₃ substrate is used. The stress is compressive for AlN and Al₂O₃ and tensile for Si and SiC substrates. Residual thermal stress analysis was also performed for three layer heterostructures of GaN/AlN/6H-SiC and GaN/AlN/Al₂O₃. The stress remains the same when a sapphire substrate is used with or without an AlN buffer layer but reduces by an order of magnitude when a 6H-SiC substrate is used with an AlN buffer layer.     

High‐Brightness Blue Light‐Emitting Diodes Enabled by a Directly Grown Graphene Buffer Layer

Single‐crystalline GaN‐based light‐emitting diodes (LEDs) with high efficiency and long lifetime are the most promising solid‐state lighting source compared with conventional incandescent and fluorescent lamps. However, the lattice and thermal mismatch between GaN and sapphire substrate always induces high stress and high density of dislocations and thus degrades the performance of LEDs. Here, the growth of high‐quality GaN with low stress and a low density of dislocations on graphene (Gr) buffered sapphire substrate is reported for high‐brightness blue LEDs. Gr films are directly grown on sapphire substrate to avoid the tedious transfer process and GaN is grown by metal–organic chemical vapor deposition (MOCVD). The introduced Gr buffer layer greatly releases biaxial stress and reduces the density of dislocations in GaN film and In_xGa_1?xN/GaN multiple quantum well structures. The as‐fabricated LED devices therefore deliver much higher light output power compared to that on a bare sapphire substrate, which even outperforms the mature process derived counterpart. The GaN growth on Gr buffered sapphire only requires one‐step growth, which largely shortens the MOCVD growth time. This facile strategy may pave a new way for applications of Gr films and bring several disruptive technologies for epitaxial growth of GaN film and its applications in high‐brightness LEDs.     

AlN钝化层对AlGaN/GaN异质结及其高温特性的影响

主要研究了A1N钝化介质层对AlGaN/GaN异质结势垒层应力的修改以及应力的变化对二维电子气高温输运性质的影响.研究结果表明:AlN介质层会对AlGaN势垒层产生附加的平面压应变;AlN和传统的si3N4钝化介质都能减轻AlGaN势垒层在高温下的应变弛豫,但AlN介质层效果更明显.和传统的Si,N4钝化介质相比较,AlN钝化层不仅会显著增加AlGaN/GaN异质结二维电子气密度度,还会明显提高二维电子气迁移率,同时,AlN钝化后二维电子气密度的温度稳定性也更好.因此,对AlGaN/GaN异质结器件来说,AIN是一种有潜力的钝化介质.     

Influence of double buffer layers on properties of Ga-polarity GaN films grown by rf-plasma assisted molecular-beam epitaxy

Ga-polarity GaN thin films were grown on sapphire (0001) substrates by rf-plasma assisted molecular beam epitaxy (MBE) using a double buffer layer, which consisted of an intermediate-temperature GaN buffer layer (ITBL) grown at 690 °C and a conventional AlN buffer layer deposited at 740 °C. Raman scattering spectra showed that the E₂ (high) mode of GaN film grown on conventional AlN buffer layer is at about 570 cm⁻¹, and shifts to 568 cm⁻¹ when an ITBL was used. This indicates that the ITBL leads to the relaxation of residual strain in GaN film caused by mismatches in the lattice constants and coefficients of thermal expansion between the GaN epilayer and the sapphire substrate. Compared to the GaN film grown on the conventional AlN buffer layer, the GaN film grown on an ITBL shows higher Hall mobility and substantial reduction in the flicker noise levels with a Hooge parameter of 3.87×10⁻⁴, which is believed to be, to date, the lowest reported for GaN material. These results imply that the quality of Ga-polarity GaN films grown by MBE can be significantly improved by using an ITBL in addition to the conventional low-temperature AlN buffer layer.     

Nanoheteroepitaxy of GaN on a nanopore array of Si(111) surface

Nanoheteroepitaxial (NHE) growth of GaN using AlN/AlGaN as a graded buffer layer by metalorganic chemical vapor deposition has been demonstrated on the nanoporous patterned Si(111) substrates. The nanopore array on Si(111) has been fabricated by using anodized aluminum oxide membrane as an induced couple plasma dry etching mask. The reduction of the threading dislocation density and relaxation of the tensile stress in NHE GaN are revealed by transmission electron microscopy (TEM), micro-Raman spectrum and photoluminescence spectrum, respectively. Cross-sectional TEM analysis shows that dislocations nucleated at the interface are forced to bend into (0001) basal plane. Red shift in the E₂ (TO) phonon peak of micro-Raman spectrum indicates the relaxation of tensile stress in the nanoheteroepitaxial lateral overgrowth of GaN. A single step ELO without mask on nanopatterned Si(111) substrates is a simple and promising way for the improvement of the quality of GaN on Si substrates.     

Graphoepitaxy of High‐Quality GaN Layers on Graphene/6H–SiC

The implementation of graphene layers in gallium nitride (GaN) heterostructure growth can solve self‐heating problems in nitride‐based high‐power electronic and light‐emitting optoelectronic devices. In the present study, high‐quality GaN layers are grown on patterned graphene layers and 6H–SiC by metalorganic chemical vapor deposition. A periodic pattern of graphene layers is fabricated on 6H–SiC by using polymethyl methacrylate deposition and electron beam lithography, followed by etching using an Ar/O₂ gas atmosphere. Prior to GaN growth, an AlN buffer layer and an Al_0.2Ga_0.8N transition layer are deposited. The atomic structures of the interfaces between the 6H–SiC and graphene, as well as between the graphene and AlN, are studied using scanning transmission electron microscopy. Phase separation of the Al_0.2Ga_0.8N transition layer into an AlN and GaN superlattice is observed. Above the continuous graphene layers, polycrystalline defective GaN is rapidly overgrown by better quality single‐crystalline GaN from the etched regions. The lateral overgrowth of GaN results in the presence of a low density of dislocations (≈10⁹ cm⁻²) and inversion domains and the formation of a smooth GaN surface.     

Structural properties of GaN and related alloys grown by radio-frequency magnetron sputter epitaxy

Single-crystalline layers of GaN and related alloys such as AlGaN and InGaN were grown on Al₂O₃ (0001) substrates by radio-frequency magnetron sputter epitaxy. The crystalline structures of these layers were studied as functions of substrate temperature, N₂ composition ratio in N₂/Ar mixture source gas and gas pressure during the growth. Surface structure of GaN layer depended on Ga/N ratio in flux density, and nitrogen-rich growth condition resulted in pyramid-type facet structure whereas Ga-rich growth produced flat surface. The crystalline quality of GaN layer improved at relatively low N₂ composition ratios, and the GaN layer grown at 30% N₂ condition was transparent and colorless. Al_xGa_1−xN layers with x = 0.06-0.08 and In_xGa_1−xN layers with x = 0.45-0.5, were obtained at 30-40% and 30-50% N₂ composition ratios, respectively. The AlN and InN molar fractions in these layers were considerably different from Al and In molar fractions in starting metal alloys (x = 0.15 in both Al_xGa_1−x and In_xGa_1−x alloys).     

Effect of high temperature AlGaN buffer thickness on GaN Epilayer grown on Si(111) substrates

Crack-free GaN epitaxial layer was obtained through inserting 80 nm graded AlGaN buffer layer between GaN epilayer and high temperature AlN buffer on 2-in Si(111) substrates by metal organic chemical vapor deposition. This paper investigated the influence of AlGaN buffer thickness on the structural properties of the GaN epilayer. It was confirmed from the optical microscopy and scanning electronic microscopy that the graded AlGaN buffer with optimized thickness had a remarkable effect on introducing relative compressive strain to the top GaN layer and preventing the formation of cracks. X-ray diffraction and atomic force microscopy analysis showed that AlGaN buffer with proper thickness could improve the crystal quality and surface morphology of the GaN film. Transmission electron microscopy analysis revealed that a significant reduction in threading dislocations was achieved in GaN epilayer by the insertion of graded AlGaN buffer.     

Improvements of epitaxial quality and stress state of GaN grown on SiC by in situ SiN<Subscript>x</Subscript> interlayer

In this study, 4.5 μm thick GaN films with graded Al_xGa_1?xN/AlN buffer and SiN_x interlayer were prepared on 6H–SiC substrates by metal–organic chemical vapor deposition. To determine the effects of SiN_x interlayer on epitaxial quality and stress state of GaN films, a series of comparative experiments were carried out by changing the deposition time and the insert location of SiN_x interlayer. By optimizing growth conditions of SiN_x interlayer, the full width at half maximum values of \( (0002) \) and \( (10\bar{1}2) \) rocking curves of GaN films were improved to 142 and 170 arcsec, respectively. A crack-free GaN film with a small root-mean-squared roughness of 0.21 ± 0.02 nm was achieved. Simultaneously, the reduction in threading dislocation density of GaN films was confirmed by using wet etching method. In addition, stress values in GaN films were investigated by Raman and low-temperature photoluminescence spectra, which indicated that the lower tensile stress in GaN film, the higher the film’s crystallinity.     

Evolution of the mosaic structure in InGaN layer grown on a thick GaN template and sapphire substrate

The In_xGa_1?xN epitaxial layers, with indium (x) concentration changes between 0.16 and 1.00 (InN), were grown on GaN template/(0001) Al₂O₃ substrate by metal organic chemical vapour deposition. The indium content (x), lattice parameters and strain values in the InGaN layers were calculated from the reciprocal lattice mapping around symmetric (0002) and asymmetric (10–15) reflection of the GaN and InGaN layers. The characteristics of mosaic structures, such as lateral and vertical coherence lengths, tilt and twist angle and heterogeneous strain and dislocation densities (edge and screw dislocations) of the InGaN epilayers and GaN template layers were investigated by using high-resolution X-ray diffraction (HR-XRD) measurements. With a combination of Williamson–Hall (W-H) measurements and the fitting of twist angles, it was found that the indium content in the InGaN epilayers did not strongly effect the mosaic structures’ parameters, lateral and vertical coherence lengths, tilt and twist angle, or heterogeneous strain of the InGaN epilayers.     

Influence of AlN buffer layer thickness and deposition methods on GaN epitaxial growth

A gallium nitride (GaN) epitaxial layer was grown by metal-organic chemical vapor deposition (MOCVD) on Si (111) substrates with aluminum nitride (AlN) buffer layers at various thicknesses. The AlN buffer layers were deposited by two methods: radio frequency (RF) magnetron sputtering and MOCVD. The effect of the AlN deposition method and layer thickness on the morphological, structural and optical properties of the GaN layers was investigated. Field emission scanning electron microscopy showed that GaN did not coalesce on the sputtered AlN buffer layer. On the other hand, it coalesced with a single domain on the MOCVD-grown AlN buffer layer. Structural and optical analyses indicated that GaN on the MOCVD-grown AlN buffer layer had fewer defects and a better aligned lattice to the a- and c-axes than GaN on the sputtered AlN buffer layer.     

Growth of GaN on SiC/Si substrates using AlN buffer layer by hot-mesh CVD

GaN films were grown on SiC/Si (111) substrates by hot-mesh chemical vapor deposition (CVD) using ammonia (NH₃) and trimetylgallium (TMG) under low V/III source gas ratio (NH₃/TMG = 80). The SiC layer was grown by a carbonization process on the Si substrates using propane (C₃H₈). The AlN layer was deposited as a buffer layer using NH₃ and trimetylaluminum (TMA). GaN films were formed and grown by the reaction between NH_x radicals, generated on a tungsten hot mesh, and the TMG molecules. The GaN films with the AlN buffer layer showed better crystallinity and stronger near-band-edge emission compared to those without the AlN layer.     

Reactive ion etching of GaN and AlGaN/GaN assisted by Cl2/BCl3

This work reports on the latest results of etching of different Al _x Ga_1?x N/GaN heterostructures in relation to percentage composition of aluminum. The etching processes were carried out in a reactive ion etching (RIE) system using the mixture of BCl₃/Cl₂/Ar. The topography of the heterostructures surfaces and the slope were controlled using atomic force microsopy (AFM) technique. The photoluminescence spectra were used to determine the surface damage and to calculate the Al content in AlGaN/GaN heterostructures commonly used for high electron mobility transistors (HEMTs) fabrication.     

Structural and photoluminescence study of thin GaN film grown on silicon substrate by metalorganic chemical vapor deposition

GaN epitaxial layer was grown on Si(111) substrate by metalorganic chemical vapor deposition (MOCVD). The structure consists of 50 nm thick high-temperature grown AlN buffer layer, 150 nm thick AlGaN layer, 30 nm low-temperature grown AlN layer, 300 nm GaN layer, 50 nm AlGaN superlattice layer, followed by 100 nm GaN epitaxial layer. The low-temperature AlN interlayer and AlGaN superlattice layer were inserted as the defect-blocking layers in the MOCVD grown sample to eliminate the dislocations and improve the structural and optical properties of the GaN layer. The dislocation density at the top surface was decreased to ∼ 2.8 × 10⁹/cm². The optical quality was considerably improved. The photoluminescence emission at 3.42-3.45 eV is attributed to the recombination of free hole-to-donor electron. The observed 3.30 eV emission peak is assigned to be donor-acceptor transition with two longitudinal optical phonon side bands. The relationship of the peak energy and the temperature is discussed.     

Effects of interface structures on cracking in AlN(11\overline 2 0)/α-Al2O3 (1\overline 1 02) epitaxial films

The crystal structures and microstructures of AlN $(11\overline 2 0)$ /GaN $(11\overline 2 0)$ epitaxial films on just-cut and ±4° off-cut Al₂O₃ $(1\overline 1 02)$ substrates grown by metal organic chemical vapor deposition (MOCVD) are investigated using high-resolution X-ray diffractometry and transmission electron microscopy, and are compared with those of AlN $(11\overline 2 0)$ film on +4° off-cut Al₂O₃ $(1\overline 1 02)$ substrate. In the AlN/Al₂O₃(+4° off-cut) film and the AlN/GaN/Al₂O₃ (just-cut, ?4° off-cut) films, cracks parallel to the $[1\overline 1 00]$ _AlN direction and perpendicular to the interfaces of the films and the substrates are observed. The AlN/Al₂O₃ and AlN/GaN interfaces exhibit low crystallinity in which moiré fringes are observed. On the other hand, in the AlN/GaN/Al₂O₃(+4° off-cut) film, no cracks form. The GaN layer buffers the lattice mismatch between the AlN film and the Al₂O₃ substrate, and moiré fringes are not observed in the GaN/Al₂O₃ and AlN/GaN interfaces. On the basis of these results, the effects of the interface structures on cracking are discussed.     

The growth of GaN films by alternate source gas supply hot-mesh CVD method

Gallium nitride (GaN) films and Aluminium nitride (AlN) layers were deposited on SiC/Si (111) substrates by an alternating source gas supply or an intermittent supply of a source gas such as ammonia (NH₃), trimethylgallium (TMG) or trimethylaluminum (TMA) in a hot-mesh chemical vapor deposition (CVD) apparatus. The AlN layer was deposited as a buffer layer using NH₃ and TMA on a SiC layer grown by carbonization on Si substrates using propane (C₃H₈). GaN films were grown on an AlN layer by a reaction between NH_x radicals generated on a ruthenium (Ru) coated tungsten (W)-mesh and TMG molecules. An alternating source gas supply or an intermittent supply of one of the source gases during the film growth are expected to be effective for the suppression of gas phase reactions and for the enhancement of precursor migration on the substrate surface. By the intermittent supply of alkylmetal gas only during the growth of the AlN layer, the defect generation in the GaN films was reduced. GaN film growth by intermittent supply on an AlN buffer layer, however, did not lead to the improvement of the film quality.     

Polymerization and structure of poly(sulphur nitride) prepared under high pressure

Poly(sulphur nitride)was prepared by spontaneous solid state polymerization of disulphur dinitride crystals immersed in perfluoro(methyl cyclohexane). The polymerization was carried out at hydrostatic pressures of up to 3.5 kbar in order to eliminate the lattice strain due to the mismatch in the monomer and the polymer lattice in the polymerization direction.It was observed that the pressure had no marked effect on the polymerization rate.The structure of the (SN) _x samples polymerized at high hydrostatic and at atmospheric pressure was examined by electron microscopy and electron diffraction techniques.They were complemented by the measurements of (SN) _x densities and electrical conductivities in the direction along and across the polymer chains. The results show that there is no significant difference in the structure and in the density of the high and the low pressure polymerized (SN) _x . A modest increase in the electrical conductivity parallel to the polymer chains observed in the high pressure polymerized (SN) _x is explained by a pressure induced increase in the average chain length. It is concluded that the long range lattice strain originating from the monomer-polymer lattice mismatch in the polymerization direction is less important for the solid state polymerization of (SN) _x than the nearest-neighbour interactions in the direction across the chain.     

Ion beam studies of multi-quantum wells of III-nitrides

III-Nitrides have attracted much attention due to their versatile and wide range of applications, such as blue/UV light emitting diodes. Strained layer super lattices offer extra degree of freedom to alter the band gap of lattice-mismatched heterostructures. Swift heavy ion irradiation is a post-growth technique to alter the band gap of semiconductors, spatially. In the present study, strained AlGaN/GaN multi-quantum wells (MQWs) were grown on sapphire with insertion of AlN and GaN as buffer layers between substrate and epilayers. Such grown AlGaN/GaN MQWs, AlGaN/GaN heterostructures and GaN layers were irradiated with 200 MeV Au and 150 MeV Ag ions at a fluence of 5 × 10¹¹ ions/cm² and 5 × 10¹² ions/cm² respectively. As-grown and irradiated samples have been characterized by high resolution XRD, photoluminescence and RBS/channelling. Measured strain values show that strain increases upon irradiation and the luminescence properties are enhanced. RBS/channelling confirms the increase in strain values upon irradiation. In this paper we describe the effects of swift heavy ion irradiation on structural and optical properties.