掺杂和未掺杂LEC GaAs中EL2和位错密度分布

测量比较了掺Si和未掺杂LEC GaAs晶锭不同部位EL2浓度和位错密度分布。结果表明,掺Si样品中EL2浓度径向分布和位错密度径向分布分别为M形和W形,而未掺杂样品中两者均为W形。讨论了两者间不同对应关系的机理。     

Inhomogeneity of the deep center el2 in GaAs observed by direct infra-red imaging

The distribution of the dominant deep trap EL2 in 7.5cm diameter crystals of semi-insulating GaAs is studied by whole slice infrared imaging. Very significant fluctuations in the neutral EL2 concentration ([EL2]ℴ) are observed, corresponding at most to variations in [EL2]ℴ of up to 80%. The different sorts of fine structure, namely cell structure and bands of high infrared absorption ("sheets" and “streamers”) lying in (110) planes running down the <001> growth directions, are described.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

退火损伤对Er注入GaAs和Yb注入InP发光的影响

本文报道了CaAs∶Er、InP∶Yb发光样品的二次离子质谱、X-射线双晶衍射测量结果及其与Er离子的表面成份的关系.分析讨论了退火损伤对GaAs∶Er和InP∶Yb发光的影响以及Er~(3+)复合体发光中心模型.     

改进的低压LEC法生长半绝缘GaAs单晶

本文提出了改进的低压LEC/PBN法获得稳定的熔体化学计量比的条件,研究了晶体的电学性质、位错密度、C含量及EL2浓度等特性,并考察了高温热处理对晶体特性的影响.     

Enhanced Third-Order Nonlinearity in Semiconductors Giving Rise to 1 THz Radiation

Third harmonic generation (THG) efficiency is shown to be a greatly enhanced at the onset of inelastic scattering of electrons on optic phonons. Scaling experiments are performed on n-type InP at the pump wave frequency of 9.43 GHz at 80 K. Monte Carlo modeling is employed for scaling the effect to the 3rd harmonic frequency of 1 THz. The THG efficiency in n-type GaAs and InP as well as in the wurtzite phase of n-type InN and GaN compound crystals is compared to that in n-type Si. The efficiency maximum is found to weaken due to the quasi-elastic scattering on acoustic phonons and elastic scattering on ionized impurities. Nevertheless, the THG efficiency at 1 THz in InP crystals cooled down to liquid nitrogen temperatures is predicted to be 2 orders of magnitude higher than the reference value of 0.1% experimentally recorded up to now in n-type Si.     

Bias dependence of GaAs and InP MESFET parameters

A comparative analysis of the bias dependence of critical RF parameters in GaAs and InP metal-semiconductor field-effect transistors (MESFET's) led to the following conclusions. 1) The drain-gate feedback capacitance in GaAs MESFET's is lower than in InP MESFET's, because of a stronger tendency in GaAs to form stationary Gunn domains at the typical drain bias levels employed. 2) The drain-source output resistance in InP MESFET's is lower than in GaAs MESFET's mainly for high drain current units, a fact which is linked to a substrate related softer pinch-off behavior in InP. 3) The current-gain cutoff frequency fT, in the current saturation range of the GaAs MESFET decreases strongly with drain bias as a result of the formation of the stationary Gunn domain. In the InP MESFET, this effect is weaker. At the optimum bias, fT is only 10-20 percent higher in InP MESFET's than in GaAs ones.     

DX centers in II-VI semiconductors and heterojunctions

Measurements of the photoconductivity and Hall effect in Ga-doped ZnSe indicate that Ga donors form DX states in ZnSe. When the photocarriers remain in the ZnSe:Ga layer, the photoconductivity is persistent up to T_a= 100K, due to a barrier to recapture the photocarriers, E_c ≈ 0.3eV. Under certain growth conditions, there is a large conduction band offset at the heterojunction with the GaAs substrate. The photocarriers are trapped at the interface, causing an enhancement of the annealing temperature to T_a≈350K. We discuss the implications of these results to device applications.     

InP光电子集成电路接收机前端的研究进展

由于具有可集成和器件固有速度的内在优势，ＩｎＰ光电子集成（ＯＥＩＣ）接收机在高速（≥１０Ｇｂ／ｓ）光纤通信系统和波分复用网络（ＷＤＭ）方面具有重要的应用，本文介绍了最近的研究进展。     

Concentrations of carbon and oxygen in indium phosphide and gallium arsenide crystals grown by the lec technique

The concentration of carbon and oxygen has been measured in various samples of LEC–grown InP and GaAs crystals using gamma photon activation analysis and mass spectrometry. The concentration of these elements was found to be extremely low (0.1–0.3 ppma) contrary to previouslyreported work.     

GaAs thermal treatment with fullerenes

Fullerenes C₆₀ were introduced into the GaAs crystal through the dislocation network by means of thermal diffusion. Energy level at 0.34–0.42 eV above the valence band was identified, which could be related to C₆₀. Interaction between C₆₀ vibration modes and GaAs Debye phonons was evidenced by the measurements of electric parameters. After the thermal treatment, electron mobility had diminished significantly as compared to pure GaAs crystals. This phenomenon was related to the changes in the EL2 level.     

GaAs/InP的键合界面热应力分析

采用双层条状金属热应力模型,用MATLAB方法对退火过程中GaAs/InP晶片间的应力和双轴弹性形变能进行模拟和分析。结果表明:将InP剪薄至200μm,GaAs剪薄至175μm,剪应力取得了一个相对的小值,而剥离应力更是被完全消除,这时正应力也相对较小。而按照一定的比例适度剪薄两侧晶片的厚度,可以使得两侧的双轴形变能减小到原来的一半以下。通过减薄键合晶片的厚度可以得到较好的键合质量。另外,不管那一种应力都随退火温度的升高而快速增加,所以实验中一定保持低的退火温度,通常小于300°C为宜。     

掺In GaAs晶体中的EL2缺陷及其热处理

比较了掺Ｉｎ和非掺杂ＬＥＣ－ＧａＡｓ晶体中的ＥＬ２缺陷，分析了掺Ｉｎ量的不同与热处理过程的不同对ＬＥＣ－ＧａＡｓ晶体中ＥＬ２缺陷的影响。     

Numerical Comparisons of Terahertz Radiation from GaAs and GaAs: As+ Substrates

In this paper, we have numerically analyzed the ultrafast change of local fields on the surfaces of a large-aperture photoconducting (LA-PC) antenna with GaAs and GaAs: As+ substrates. We find that the ultrafast screening of photogenerated carriers to the externally applied electric field has different effects on the saturation of THz radiation as the function of the laser fluence in the near and far field, respectively. Both screening effect of photocarriers and radiation effect are important in forming the saturation phenomena in the case of near field. But in far field, only the radiation effect is important.     

Growth of low dislocation density InP single crystals by the phosphorus vapor controlled LEC method

Low dislocation density <100> InP single crystals have been grown by a phosphorus vapor controlled LEC method (PC-LEC). 3 inch S-doped and Fe-doped InP and 2 inch Sn-doped InP single crystals have been grown by this method. In S-doped crystals, the dislocation free area could be increased compared with that of conventional LEC crystals. 3 inch Fe-doped InP with the dislocation density lower than 10⁴ cm^?2 could also be grown. The average EPD was lower than 5×10³ cm^?2 in 2 inch Sn-doped InP. The photoluminescence intensity of PC-LEC crystals was much higher than that of conventional LEC crystals in the case of Sn-doped InP.     

Growth mode transition processes in a GaAs/lnP system studied by scanning tunneling microscopy

The growth mode transition processes of GaAs heteroepitaxial growth on an InP substrate were investigated using a scanning tunneling microscopy (STM) multi-chamber system equipped with a molecular beam epitaxy facility. During the initial stage, the growth mode transition from two-dimensional (2D)-to three-dimensional (3D)-island growth occurred with more than 2.0 ML of GaAs deposition onto the InP surface. This 3D-island structure gradually became flat upon increasing the amount of GaAs deposition, and finally recovered to a GaAs 2D structure. Furthermore, an extended dislocation line can be observed in the STM image of the recovered GaAs surface.     

基于异变缓冲层与应变层超晶格的InP/GaAs异质外延

利用低压金属有机化学气相沉积技术, 开展InP/GaAs异质外延实验。由450 ℃生长的低温GaAs层与超薄低温InP层组成双异变缓冲层, 并进一步在正常InP外延层中插入In1-xGaxP/InP(x=7.4%)应变层超晶格。在不同低温GaAs缓冲层厚度、应变层超晶格插入位置及应变层超晶格周期数等条件下, 详细比较了InP外延层(004)晶面的X射线衍射谱, 还尝试插入双应变层超晶格。实验中, 1.2 μm和2.5 μm厚InP外延层的ω扫描曲线半峰全宽仅370 arcsec和219 arcsec; 在2.5 μm厚InP层上生长了10周期In0.53Ga0.47As/InP 多量子阱, 室温PL谱峰值波长位于1625 nm, 半峰全宽为60 meV。实验结果表明, 该异质外延方案有可能成为实现InP-GaAs单片光电子集成的一种有效途径。     

Characterization of ErAs:GaAs and LuAs:GaAs Superlattice Structures for Continuous-Wave Terahertz Wave Generation through Plasmonic Photomixing

We investigate the impact of ErAs:GaAs and LuAs:GaAs superlattice structures with different LuAs/ErAs nanoparticle depositions and superlattice geometries on terahertz radiation properties of plasmonic photomixers operating at a 780-nm optical wavelength. Our analysis indicates the crucial impact of carrier drift velocity and carrier lifetime on the performance of plasmonic photomixers. While higher carrier drift velocities enable higher optical-to-terahertz conversion efficiencies by offering higher quantum efficiencies, shorter carrier lifetimes allow achieving higher optical-to-terahertz conversion efficiencies by mitigating the negative impact of destructive terahertz radiation from slow photocarriers and preventing the carrier screening effect.     

New plasma chemistries for etching III–V compound semiconductors: Bl3 and BBr3

We investigated inductively coupled plasma (ICP) etching of both In-containing (InP, InAs, and InSb) and Ga-containing compound semiconductors (GaAs, GaP, and GaSb) in two new chemistries: BI₃ and BBr₃ with addition of Ar. Etch rates as high as 2 μm·min⁻¹ were obtained for InP in both types of discharge while for GaAs maximum rates were 1 and 2.5 μm·min⁻¹, respectively, in BI₃ and BBr₃. The rates were strongly dependent on plasma composition, ICP source power and radio frquency chuck power. BI₃ etching produced much smoother surfaces on both GaAs and InP, while maintaining the near-surface stoichiometry. Etch selectivities ≥ 10 were obtained for GaAs and InP over SiO₂ and SiN_x masks. The BI₃ chemistry appears attractive as an universal etchant for In-based and Ga-based compound semiconductors.     

用于单片集成光接收机前端的GaAs基InP/InGaAs HBT

实现了一种可用于单片集成光接收机前端的GaAs基InP/InGaAs HBT。借助超薄低温InP缓冲层在GaAs衬底上生长出了高质量的InP外延层。在此基础上,只利用超薄低温InP缓冲层技术就在半绝缘GaAs衬底上成功制备出了InP/InGaAsHBT,器件的电流截止频率达到4.4GHz,开启电压0.4V,反向击穿电压大于4V,直流放大倍数约为20。该HBT器件和GaAs基长波长、可调谐InP光探测器单片集成为实现适用于WDM光纤通信系统的高性能、集成化光接收机前端提供了一种新的解决方法。