退火温度对Si基Bi4Ti3O12铁电薄膜微观结构影响研究

采用Sol-Gel工艺制备了Si基Bi4Ti3O12铁电薄膜。研究了退火温度对Si基Bi4Ti3O12薄膜晶相结构、晶粒尺寸及薄膜表面形貌的影响。研究表明，退火温度低于450℃时Bi4Ti3O12薄膜为非晶状态，退火温度在550-850℃范围内均为多晶薄膜，而且随退火温度升高，Bi4Ti3O12薄膜更趋向于沿c轴取向的生长；而晶粒尺寸及薄膜粗糙度随退火温度升高而增大，但在较高温度下增长速度趋缓。     

Correlation of Microstructure and Magnetotransport Properties of Epitaxially Grown La2/3Ca1/3MnO3 Thin Films

Using the technique of pulsed laser deposition, we have studied the correlation of the film deposition conditions with the microstructure and magnetotransport properties of La_2/3Ca_1/3MnO₃ thin films. Detailed TEM microstructure studies revealed the dependence of the local microstructure with the deposition temperature. The TEM studies reveal a distortion of the La_2/3Ca_1/3MnO₃ lattice leading to a breakdown of the symmetry from orthorhombic to monoclinic. At high deposition temperatures (T<800°C), the substrate/film interface is perfectly coherent, suggesting that the film is strained due to the lattice mismatch. Effects of hydrostatic pressure on the resistivity of the films reveal an increase in temperature of the metal–insulator transition and a colossal change in resistivity qualitatively comparable to the magnetoresistance effect. The data are interpreted in terms of microstructure sensitive changes of the contraction and alignment of the Mn–O–Mn bonds.     

Bi3.45Eu0.55Ti3O12铁电薄膜的光学性能

采用化学溶液沉积法在石英衬底上制备了Bi3.45Eu0.55Ti3O12(BEuT)铁电薄膜,研究了BEuT薄膜的结构和光学性能。XRD测试结果表明,BEuT薄膜皆形成铋层状钙钛矿型结构,其晶粒尺寸随着退火温度的提高而增加。薄膜的光学透过率曲线显示,在大于500nm的波段BEuT的透过率比较高,而其禁带宽度大约为3.61eV。BEuT薄膜的发光强度随着退火温度的提高,先是增强后减弱,在700℃时达到最大。这与薄膜的结晶状况有关。     

Sol-gel法制备LaNiO3/Bi4Ti3O12异质薄膜及性能研究

采用Sol-gel(溶胶-凝胶)法在Si衬底上制备LaNiO3/Bi4Ti3O12(LNO/BTO)叠层薄膜,并研究了不同退火温度下BTO薄膜的生长行为和铁电、介电性能.试验表明,与单晶Si直接作衬底制备的Bi4Ti3O12薄膜相比,引入过渡层LNO降低了Bi4Ti3O12薄膜与衬底的晶格失配度,减少了热应力和外应力,缓解了薄膜龟裂的现象,而且制备出的Ag/BTO/LNO/Si异质薄膜电容具有优良的介电性质.     

快速退火工艺条件下温度对Bi4Ti3O12铁电薄膜微观结构与性能的影响

采用快速退火工艺在Pt/Ti/SiO2/p-Si衬底上制备了Bi4Ti3O12铁电薄膜.研究了退火温度对薄膜微观结构、铁电特性及介电性能的影响.研究表明:退火温度对Si基Bi4Ti3O12铁电薄膜晶相结构的影响显著,对晶粒尺寸和表面形貌的影响较小,但退火温度超过800℃后会出现焦绿石等杂相;低于750℃时,薄膜的剩余极化随退火温度升高而增大,高于750℃时却有所减小,但矫顽电场随退火温度升高而逐渐降低;退火温度对薄膜的漏电流密度有一定的影响,薄膜的漏电流密度在200kV/cm极化电场作用下低于3×10-9A/cm2,750℃时的剩余极化和矫顽电场分别为11μC/cm2和77kV/cm,具有较好的铁电和介电性能.     

硅基LiNbO3薄膜的微结构研究

利用透射电子显微镜及X射线衍射，研究脉冲激光沉积技术(PLD)在Si(001)衬底上生长LiNbO3薄膜的微结构．结果表明，在600℃的衬底温度、30Pa的氧分压条件下，在硅片表面5nm厚的非晶氧化层上生长的薄膜，为c轴择优取向的单相LiNbO3晶体，本文还讨论了获得c轴择优取向LiNbO3薄膜的生长机理．     

Bi4Ti3O12铁电薄膜的MOCVD制备及其物理性质研究

采用常压ＭＯＣＶＤ技术在（１００）硅衬底上生长了具有（１００）及（００１）取各的钛酸铋（Ｂｉ４Ｔｉ３Ｏ１２）薄膜。在适当的生长条件下可获得（１００）取向膜，在７５０－８００℃下退火可获得（００１）择优取向膜。通过观察Ｐ－Ｅ电滞回线可确认膜的铁电性质，测得（１００）取向膜的剩余极化强度为３８μｃ／ｃｍ＾２，矫顽场为４５ＫＶ／ｃｍ。同时测量了钛酸铋薄膜的介电常数及损耗角正切。     

三元陶瓷Pb(In1/2Nb1/2)O3-Pb(Ni1/3Nb2/3)O3-PbTiO3准同型相界附近组分的介电、铁电和压电性能

铅基复合钙钛矿铁电材料广泛应用于机电传感器、致动器和换能器。二元铁电固溶体Pb(Ni_1/3Nb_2/3)O₃- PbTiO₃(PNN-PT)由于其在准同型相界(MPB)区域具有优异的压电、介电性能而备受关注。然而较大的介电损耗和较低的居里温度限制了其在高温高功率器件方面的应用。本研究通过引入Pb(In_1/2Nb_1/2)O₃ (PIN)作为第三组元改善PNN-PT的电学性能, 提高其居里温度; 通过两步法合成了MPB区域的三元铁电陶瓷Pb(In_1/2Nb_1/2)O₃- Pb(Ni_1/3Nb_2/3)O₃-PbTiO₃ (PIN-PNN-PT), 研究了其结构、介电、铁电和压电性能。制备的所有组分陶瓷具有纯的钙钛矿结构。随着PT含量的增加, 陶瓷结构从三方相转变为四方相。通过XRD分析得到了室温下PIN-PNN-PT体系的MPB相图。体系的居里温度由于PIN的加入得到了很大的提高, 更重要的是PIN的引入降低了PNN-PT体系的介电损耗和电导。MPB处的组分展现出了优异的电学性能, 室温下, 性能最优组分为0.30PIN-0.33PNN-0.37PT: d₃₃=417 pC/N, T_C=200 ℃, ε′= 3206, tanδ=0.033, P_r=33.5 μC/cm², E_C=14.1 kV/cm。引入PNN-PT的PIN第三组元使得体系的居里温度和压电性得到提高的同时降低了的介电损耗和电导率, 因此, PIN-PNN-PT三元铁电陶瓷在高温高功率换能器等方面具备一定的应用潜力。     

Sol-gel法制备Pb(Zr0.53Ti0.47)O3铁电薄膜

利用Sol-gel工艺在Pt/Ti/SiO2/Si衬底上制备了Pb(Zr0.53Ti0.47)O3(PZT)薄膜,研究了退火温度、保温时间和薄膜厚度对其晶相、微观结构和铁电性能的影响.在500℃退火处理的PZT薄膜开始形成钙钛矿相;在550℃退火处理的PZT薄膜基本形成钙钛矿相结构;升高退火温度(500～850℃)、延长保温时间(30～150min)、增加薄膜厚度(120～630nm)都有利于PZT晶粒的长大.在650～750℃退火的PZT薄膜具有较好的铁电性能,保温时间对PZT薄膜的铁电性能影响不大,PZT薄膜的厚度为200～300nm时可以得到比较好的铁电性能.在退火温度750℃、保温时间30min条件下退火处理厚310nm的PZT薄膜,其剩余极化值(2Pr)和矫顽电场(2Ec)分别是72μC/cm2、158kV/cm.     

Ferroelectricity and Antiferroelectricity of Doped Thin HfO2‐Based Films

The recent progress in ferroelectricity and antiferroelectricity in HfO₂‐based thin films is reported. Most ferroelectric thin film research focuses on perovskite structure materials, such as Pb(Zr,Ti)O₃, BaTiO₃, and SrBi₂Ta₂O₉, which are considered to be feasible candidate materials for non‐volatile semiconductor memory devices. However, these conventional ferroelectrics suffer from various problems including poor Si‐compatibility, environmental issues related to Pb, large physical thickness, low resistance to hydrogen, and small bandgap. In 2011, ferroelectricity in Si‐doped HfO₂ thin films was first reported. Various dopants, such as Si, Zr, Al, Y, Gd, Sr, and La can induce ferro­electricity or antiferroelectricity in thin HfO₂ films. They have large remanent polarization of up to 45 μC cm^?2, and their coercive field (≈1–2 MV cm^?1) is larger than conventional ferroelectric films by approximately one order of magnitude. Furthermore, they can be extremely thin (<10 nm) and have a large bandgap (>5 eV). These differences are believed to overcome the barriers of conventional ferroelectrics in memory applications, including ferroelectric field‐effect‐transistors and three‐dimensional capacitors. Moreover, the coupling of electric and thermal properties of the antiferroelectric thin films is expected to be useful for various applications, including energy harvesting/storage, solid‐state‐cooling, and infrared sensors.     

Interfacial Electronic Structure of Thin Cu Films Grown on Ar^＋—ion Sputter—cleaned α—Al2O3 Substrates

The bonding and electronic structure of Cu/(0001)Al2O3 and Cu/(1120)Al2O3 interfaces has been studied experimentally using spatially-resolved transmission electron energy loss spectroscopy.The specimen were prepared by depositing Cu on single-crystal α-Al2O3 substrates,which have been Ar^ -ion sputter-cleaned prior to the growth of Cu.For both orientations of theα-Al2O3 substrate,atomically abrupt interfaces formed as determined by high-resolution transmission electron microscopy.The investigations of the interfacial Cu-L2,3,Al-L2,3 and O-K energy loss near-edge structures,which are proportional to the site-and angular-momentum-projected unoccupied density of states above the Fermi level,indicate the existence of metallic Cu-Al bonds at the Cu/Al2O3 interface independent of the substrate orientation.     

SrTiO3斜切基片上外延生长YBa2Cu3O7-δ薄膜的扫描探针显微镜研究

采用激光脉冲沉积法在钛酸锶SrTiO3 (0 0 1)斜切基片上外延生长YBa2 Cu3 O7 δ薄膜 ,在大气环境下采用扫描探针显微镜对YBa2 Cu3 O7 δ薄膜的表面纳米形貌进行直接观察。发现YBa2 Cu3 O7 δ薄膜具有相对光滑的表面形貌 ,薄膜表面由沿SrTiO3台阶趋向外延生长的纳米台阶组成 ,薄膜生长模式主要以台阶媒体生长为主。     

Er2O3掺杂Gd2(Zr0.8Ti0.2)2O7陶瓷的物理性能

用固相反应法制备(Gd_1-xEr_x)₂(Zr_0.8Ti_0.2)₂O₇(摩尔分数x=0,0.2,0.4)陶瓷并测试其晶体结构、显微形貌和物理性能,研究了Er₂O₃掺杂的影响。结果表明,(Gd_1-xEr_x)₂(Zr_0.8Ti_0.2)₂O₇陶瓷具有立方烧绿石结构,显微结构致密,在室温至1200℃高温相的稳定性良好;Er³⁺掺杂降低了陶瓷材料的热导率和平均热膨胀系数,当x=0.2时,其1000℃的热导率最低(为1.26 W·m^-1·k^-1)。同时,Er³⁺掺杂还提高了这种材料的硬度和断裂韧性。     

a轴取向YBa2Cu3O7-x薄膜的制备及其Raman光谱研究

采用直流磁控溅射法在SrTiO3(100)衬底上制备a轴取向的YBa2Cu3O7-x薄膜,用四引线法测量R-T曲线Tc0=86K.对于YBa2Cu3O7-x薄膜进行喇曼光谱测量,发现0(4)振动的声子峰(～500cm-1)强度远远大于0(2)-0(3)反相振动的声子峰(～340cm-1)强度,应用群论分析证明薄膜主要是沿a轴生长的.在较低的衬底温度下(<780℃),YBa2Cu3O7-x薄膜沿a轴生长,随着衬底温度的升高,薄膜中沿c轴生长的组分逐渐增加.     

Magnetic and Transport Properties of Mn()l)8Cr()()2Te Epitaxial Films Grown on A1,0、Substrates

The epitaxial Mno0.98Cr0.02Te films on single crystal Al2O3 （0001） substrates were prepared by pulsed laser deposition. The X-ray diffraction and scanning electron microscopy results showed that the good continuous epitaxial film was obtained with substrate temperature of 500 ℃. When the substrate temperature reached 700 ℃, the film was island growth and the manganese oxides phase appeared. The temperature dependence of both the magnetization and electrical resistance showed a sharp rise at around 60 K due to the magnetoelastic coupling. The temperature dependence of the electrical resistance of Mno0.98Cr0.02Te provided evidence for a transition from the metallic to semiconducting state at 305 K due to the spin disorder scattering with a large contribution from the influence of magnon drag.     

磁控溅射制备(Pb1-xSrx)TiO3系铁电薄膜的实验研究

钛酸锶铅((Pb1-xSrx)TiO3,PST)固溶体材料是一种性能优良的钙钛矿型铁电材料,其形成铁电相的温度较低,且易于和半导体工艺结合,应用潜力较大.本文采用磁控溅射法制备了PST薄膜,并初步研究了其介电和铁电特性.结果表明,磁控溅射得到的PST薄膜必须进行一定的热处理,才能使之转变为具有铁电性的钙钛矿结构的铁电薄膜.其介电特性与测试频率有关,试样的饱和极化强度可达19μC/cm2,剩余极化强度可达6.6μC/cm2,矫顽场强达16kV/cm,热释电系数达10-4C/m2*K量级,表明所制备的PST薄膜具有良好的铁电性.