新型可焊性锡铈铋镀层电镀工艺

介绍了新型可焊性锡铈铋镀层电镀工艺的镀液配方和电镀操作条件;测试了镀液的分散能力、阴极电流效率和沉积速率.用铜丝或铜片作镀件,在小槽内电镀,获得的镀层,外观致密均匀,似镜面光亮,结合力强.     

氨基磺酸盐镀铁工艺的研究

本文就氨基磺酸盐镀铁工艺、镀层的机械性能及微观组织形貌进行了研究探讨。结果表明:氨基磺酸盐镀铁层为柱状结晶组织,与氧化物低温镀铁层相比。镀层硬度较低,一般只有 HV140～180,无微观裂纹,内应力小,具有较好的塑性和结合强度。其允许使用的阴极电流密度上限可超过60A/dm~2。最后,文中还给出了氨基磺酸盐的镀铁工艺。     

光亮碱性Zn-Al合金电镀工艺研究

在碱性锌酸盐镀锌液中加入铝盐，研究成功了一种光亮碱性锌铝合金电镀工艺。采用霍尔槽试验探讨了镀液成分和工艺条件对镀层质量的影响，检测了镀液和镀层性能。研究结果表明：镀液阴极电流效率达到80%以上，镀液分散能力和复盖能力好，镀层中铝含量为1．5％左右，所形成的Zn-Al合金镀层结晶细致、光亮度好、结合力好、耐蚀性优良，适用于作高耐蚀性镀层。     

可焊性光亮锡铋合金电镀工艺研究

研究一种可焊性光亮锡铋合金电镀工艺的镀液配方和电镀操作条件;测试了镀液的分散能力、深镀能力、阴极电流效率和沉积速度;经小槽电镀,获得外观致密均匀、似镜面光亮、结合力强、具有优良的可焊性镀层。     

甲基磺酸盐电镀锡的镀层性能

在电镀锡镀种中存在许多缺点,如:氟硼酸盐系列对环境污染严重;硫酸盐电镀液不稳定,镀液容易变浑浊,工作温度范围小。本工作对目前最流行的硫酸盐电镀锡产品和甲基磺酸盐电镀锡产品进行镀层性能测试,比较它们的抗氧化能力、结合力、可焊性和耐腐蚀性等。结果表明甲基磺酸盐电镀锡镀层质量优于硫酸盐电镀锡工艺。甲基磺酸盐电镀锡镀液比较稳定,对环境污染小,成分简单,适合未来电镀锡工业发展方向。     

氨基磺酸盐低应力镀镍工艺

通过对氨基磺酸盐镀镍工艺获得的低应力镀镍层进行结合力、氢脆、耐蚀性等测定,确定了低应力氨基磺酸盐镀镍的预处理工艺、镀镍配方及电镀工艺参数,同时研究了低应力镀镍液成分及工艺参数对镀层应力的影响。试验结果表明,这种低应力镀镍工艺获得的镀层具有应力低、结合力好和低氢脆性等性能。     

可焊性光亮锡锑合金电镀工艺研究

研究了一种新型可焊性光亮锡锑合金电镀工艺的镀液配方和电镀操作条件；测试了镀液的分散能力、深镀能力、阴极电流交流效率和沉积速度；经小槽电镀，获得了外观臻密均匀，似镜面光亮，结合力强，具有优良的可焊性镀层。     

超声电镀锡铋合金研究

研究了超声波对锡铋合金电镀的影响.通过赫尔槽试验优选出最佳镀液配方和工艺条件,用SEM法观测了镀层形貌,并测试了镀层和镀液性能.结果表明:超声波的作用扩大了电流密度范围和温度范围;所得镀层表面光亮、结晶更细致、均匀,镀层结合力、抗氧化性和可焊性改善明显,耐蚀性增强;镀液性能稳定,阴极电流效率和沉积速度得到提高.因此,超声波对电镀工艺条件、镀层质量和镀液性能都有明显的改善作用.     

甲基磺酸盐镀液体系可焊性合金镀层的工艺

研究了一种新型可焊性镀层-含银量3%的锡银合金的电镀工艺,选择甲基磺酸亚锡和甲基磺酸银为主盐,柠檬酸钠、碘化钾和三乙醇胺为络合剂,研制了镀覆含银量为3%的最佳镀液配方和施镀工艺条件.通过对镀层可焊性、抗高温氧化性能和表面接触电阻等性能的考察发现,低含银量的锡银合金镀层性能优于锡铅合金镀层,且镀液成分简单、性能稳定、无毒无害,具有广泛的应用前景.     

新型柠檬酸盐镀铜工艺

为了淘汰剧毒性的氰化镀铜工艺，华中科技大学化学系开发出一种以柠檬酸盐为主络合剂的镀铜工艺．分析了各种工艺条件和参数的影响，并对镀液性能和镀层质量进行了检验。该工艺解决了无氰镀铜工艺中镀层与基体结合力不良的难题，所得镀层细致、均匀、韧性好，有望取代氰化镀铜。这种新型的柠檬酸盐镀铜工艺解决了其他非氰镀铜工艺在锌合金压铸件上镀层结合力不良的难题，     

Corrosion Resistance of Copper Deposits Produced from Different Electrolytes

Plating of steel components with copper prior to nickel and chromium plating is of commercial importance. Copper is used as a pre-plate for improved adhesion of the subsequent deposit. It is also employed to prevent case hardening on selected areas of ferrous metal surfaces. Attempts have been made to carry out copper deposition from a sulphamate electrolyte using an optimised bath composition and operating conditions. Alkaline EDTA, conventional cyanide and acid-sulphate baths have also been used for comparative studies. In the present work the corrosion resistance of copper deposits from these electrolytes has been studied using potentiostatic polarisation techniques, A.C. Impedance spectroscopy and weight loss measurements. Although the deposits from different baths indicate good corrosion resistance, the sulphamate bath gives the most highly corrosion resistant and low porosity deposit.     

The Effect of Brush Plating on the Structure and Wear Properties of Electrodeposits

In this work, the structure and wear properties of brush plated electrodeposits were investigated. An additive free sulphamate solution was used for plating with different methods of solution supply as well as conventional bath plating, and the structures were investigated by TEM and X-ray diffraction.

The structure of the nickel sulphamate deposit obtained by brush plating with pumped solution supply was found to resemble that of bath plated deposits. When solution supply was realised by dipping of the anode, the coatings had a more fine grained structure and higher hardness.

Ball-on-ring tests were carried out on samples brush plated with different nickel and cobalt alloy coatings. A comparison was made with specimens bath plated with hard chromium. The cobalt and chromium deposits gave similar results, while nickel coatings were found to be less wear resistant.     

中温酸性化学镀镍磷合金组织和性能研究

化学镀成本高是影响其应用的原因之一.降低化学镀工艺温度及其镀液配制成本是降低化学镀成本的有效途径.对自来水配制的中温酸性化学镀镀液进行了周期试验,并对镀层表面成分、组织、性能进行了研究.结果表明:研制的配方及工艺具有镀速稳定、允许负载大(≤2.2dm2/L)和寿命长(≥8个周期)等特点.镀层表面含磷量与化学镀时间有关.镀层具有较高的硬度、良好的耐蚀性,且与基体结合力良好.因此,研制的镀液有望获得应用.     

Mechanism of crack decoration of oxides by electrodeposition

The cathodic behaviour of a duplex oxide on 9%Cr steel has been potentiostatically investigated in acidic plating baths based on copper sulphate or nickel sulphamate. Metallography and electron probe microanalysis of decorated specimens has shown that decoration from the copper plating bath involves cathodic dissolution of the outer layer oxide (magnetite). Thus the more stable inner layer of oxide is exposed at cracks and provides an effective site for copper deposition. It is proposed that decoration by nickel occurs by a similar mechanism, but is less readily achieved because magnetite is less readily dissolved in the sulphamate bath.     

Twenty-First Anniversary of the Electrodepositors’ Technical Society

This paper presents a review of early work with sulphamate electrolytes and reports certain new developments on nickel plating from sulphamate solutions.

Experimental work is described which deals with the nickel suiphamate bath with and without addition agents. Particular emphasis is given to the physical properties of the deposits and the effect of bath composition and operating variables on stress, hardness, tensile strength, elongation and ductility. Photomicrographs showing the structure of the deposits and data on certain electrical properties are presented.

The results of these studies indicate that the nickel deposits produced from the sulphamate bath are particularly applicable to engineering and functional uses. Several such applications are described.     

Effect of the plating parameters on the electrodeposition of Ni matrix coatings containing Ti nanoparticles

This work focuses on the production of electrodeposited nickel matrix composite coatings containing Ti nanoparticles and on the modification of the process parameters in order to maximise the codeposited particles content as well as obtaining a uniform distribution along the coating thickness. The deposition was carried out using a Ni sulphamate plating bath with different amounts of Ti nanoparticles. The plating parameters such as current density, current type (direct, DC, or pulsed, PC) and the use of ultrasound during the deposition have been modified. The specimens produced have had their microstructure, chemical composition and microhardness analysed. It was found that the increase of the particle concentration in the plating bath up to 40?g?L^?1 leads to an increase of the amount of codeposited particles. The use of ultrasound prevents agglomeration of the particles, leads to a more uniform distribution and increases the Ti content. However, it induces microstructural defects in the matrix. These defects can be limited by increasing the current density or by using pulsed current.     

Electrodeposition of zinc–nickel alloy by pulse plating using non-cyanide bath

Abstract

In this study, zinc–nickel electrodeposition was carried out in a sulphamate bath at pH 3–4 by pulse plating and the deposits obtained were characterised by measuring microhardness, surface roughness and by employing SEM, XRD, AFM techniques. The corrosion behaviour of the deposits was evaluated by potentiodynamic polarisation. The deposits obtained by pulse plating have an increased Ni content, thought to be responsible for an improved corrosion resistance.     

全光亮碱性锌酸盐镀锌工艺研究

在碱性锌酸盐镀锌基础液中加入自制光亮剂XY-03A,研究成功了一种全光亮碱性锌酸盐镀锌工艺,确定了电镀工艺规范,采用霍尔槽试验探讨了主要成分对镀层质量的影响,检测了镀液和镀层性能,结果表明：所形成的锌镀层光亮度高,镀层结晶细致,与基体结合力好;镀液的分散能力、复盖能力、电流效率和镀层耐蚀性优于DE型镀锌工艺,具有较高的应用价值.     

电沉积Fe-Cr合金研究

三价铬盐的二甲基酰胺（ＤＭＦ）水溶液体系电沉积Ｆe-Cr合金,可获得含Ｃr12%-65%(质量分数）的光亮合金镀层,研究了阴极电流密度,镀液pH值,三价铬盐浓度对镀层分的影响及合金层耐腐蚀性能。