一种新型小电容ESD箝位电路北大核心

为了解决RC触发机制在小电容条件下开启时间不足的问题，设计了一种新型ESD箝位电路。电路采用反馈和分流机制与电容组合的方法，将小电容与一个受反馈nMOS控制的分流nMOS并联。分流nMOS分流了电容的充电电流，从而延长了电路的开启时间。仿真结果显示，新提出的电路开启时间足够长且能够快速响应ESD事件，能够实现ESD保护。此外，该电路引入可调节的最小开启电压，能够有效避免快速上电条件下的误触发现象。     

On-Chip Transient Detection Circuit for System-Level ESD Protection in CMOS Integrated Circuits to Meet Electromagnetic Compatibility Regulation

A new on-chip transient detection circuit for system-level electrostatic discharge (ESD) protection is proposed. The circuit performance to detect different positive and negative fast electrical transients has been investigated by the HSPICE simulator and verified in a silicon chip. The experimental results in a 0.13-m CMOS integrated circuit (IC) have confirmed that the proposed on-chip transient detection circuit can be used to detect fast electrical transients during the system-level ESD events. The proposed transient detection circuit can be further combined with the power-on reset circuit to improve the immunity of the CMOS IC products against system-level ESD stress.     

CMOS射频集成电路ESD保护的挑战

随着集成电路(IC)T艺进入深亚微米水平,以及射频(Radi0.Frequency,RF)IC工作频率向数千兆赫兹频段迈进,片上防静电泄放(ESD)保护设计越来越成为RF IC设计的挑战.产生这一挑战的关键原因在于ESD保护电路和被保护的RF IC核电路之间存在着不可避免的复杂交互影响效应.本文讨论了RF ESD保护的研究和设计领域的最新动态,总结了所出现的新挑战、新的设计方法和最新的RF ESD保护解决方案.     

CMOS射频集成电路ESD保护的挑战

随着集成电路(IC)T艺进入深亚微米水平,以及射频(Radi0.Frequency,RF)IC工作频率向数千兆赫兹频段迈进,片上防静电泄放(ESD)保护设计越来越成为RF IC设计的挑战.产生这一挑战的关键原因在于ESD保护电路和被保护的RF IC核电路之间存在着不可避免的复杂交互影响效应.本文讨论了RF ESD保护的研究和设计领域的最新动态,总结了所出现的新挑战、新的设计方法和最新的RF ESD保护解决方案.     

ESD Protection Design With On-Chip ESD Bus and High-Voltage-Tolerant ESD Clamp Circuit for Mixed-Voltage I/O Buffers

Considering gate-oxide reliability, a new electrostatic discharge (ESD) protection scheme with an on-chip ESD bus (ESD_BUS) and a high-voltage-tolerant ESD clamp circuit for 1.2/2.5 V mixed-voltage I/O interfaces is proposed. The devices used in the high-voltage-tolerant ESD clamp circuit are all 1.2 V low-voltage N- and P-type MOS devices that can be safely operated under the 2.5-V bias conditions without suffering from the gate-oxide reliability issue. The four-mode (positive-to-V_SS, negative-to-V_SS, positive-to-V_DD, and negative-to-V_DD) ESD stresses on the mixed-voltage I/O pad and pin-to-pin ESD stresses can be effectively discharged by the proposed ESD protection scheme. The experimental results verified in a 0.13-mum CMOS process have confirmed that the proposed new ESD protection scheme has high human-body model (HBM) and machine-model (MM) ESD robustness with a fast turn-on speed. The proposed new ESD protection scheme, which is designed with only low- voltage devices, is an excellent and cost-efficient solution to protect mixed-voltage I/O interfaces.     

混合信号IC的ESD保护电路设计

从电路设计的角度,介绍了混合信号IC的输入、输出、电源箝位ESD保护电路.在此基础上,构建了一种混合信号IC全芯片ESD保护电路结构.该结构采用二极管正偏放电模式,以实现在较小的寄生电容情况下达到足够的ESD强度;另外,该结构在任意两个pad间均能形成ESD放电通路,同时将不同的电源域进行了隔离.     

Design and Analysis of On-Chip ESD Protection Circuit with Very Low Input Capacitance for High-Precision Analog Applications

An ESD protection design is proposed to solve the ESD protection challenge to the analog pins for high-frequency or current-mode applications. By including an efficient power-rails clamp circuit into the analog I/O pin, the device dimension (W/L) of ESD clamp device connected to the I/O pad in the analog ESD protection circuit can be reduced to only 50/0.5 (m/m) in a 0.35-m silicided CMOS process, but it can sustain the human-body-model (machine-model) ESD level of up to 6 kV (400 V). With such a smaller device dimension, the input capacitance of this analog ESD protection circuit can be significantly reduced to only 1.0 pF (including the bond pad capacitance) for high-frequency applications. A design model to find the optimized layout dimensions and spacings on the input ESD clamp devices has been also developed to keep the total input capacitance almost constant (within 1% variation), even if the analog input signal has a dynamic range of 1 V.     

一种改进的片内ESD保护电路仿真设计方法

对现有的片内ESD保护电路仿真设计方法进行了改进,使之适用于深亚微米工艺.文中设计了新的激励电路以简化仿真电路模型;增加了栅氧化层击穿这一失效判据;使用能量平衡方程描述深亚微米MOSFET的非本地输运,并对碰撞离化模型进行了修正;使用蒙特卡罗仿真得到新的电子能量驰豫时间随电子能量变化的经验模型.最后使用文中改进的仿真设计方法对一个ESD保护电路进行了设计和验证,测试结果符合设计要求.     

CMOS VLSI ESD保护电路设计技术

本文对CMOSVLSI芯片ESD失效现象及其ESD事件发生机理进行了分析,介绍了CMOSVLSIESD保护电路设计技术。使用具有大电流放电性能的MOS器件构成的ESD电路,以及采用周密的版图布局布线技术,可实现良好的ESD保护性能。     

一种新型互补电容耦合ESD保护电路

提出了一种改进型的基于亚微米工艺中ESD保护电路,它由互补式电容实现,结构与工艺简单。电路采用0.6μm1P2MCMOS工艺进行了验证,结果表明,ESD失效电压特性有较明显改善,可达3000V以上。     

一种CMOS IC片上电源ESD保护电路

随着集成电路工艺的高速发展,特征尺寸越来越小,静电放电对CMOS器件可靠性的危害也日益增大,ESD保护电路设计已经成为IC设计中的一个重要部分.讨论了两种常见的CMOS集成电路电源系统ESD保护电路,分析了它们的电路结构、工作原理和存在的问题,进而提出了一种改进的电源动态侦测ESD保护电路.使用HSPICE仿真验证了该电路工作的正确性,并且在一款自主芯片中使用,ESD测试通过士3000 V.     

CMOS集成电路中ESD保护技术研究

分析ESD失效的原因和失效模式,针对亚微米CMOS工艺对器件ESD保护能力的降低,从工艺、器件、电路三个层次对提高ESD保护能力的设计思路进行论述。工艺层次上通过增加ESD注入层和硅化物阻挡层实现ESD能力的提高;器件方面可针对电路的特点,选择合适的器件(如MOS,SCR,二极管及电阻)达到电路需要的ESD保护能力;电路方面采用栅耦和实现功能较强的ESD保护。     

ESD protection strategies in advanced CMOS SOI ICs

This paper represents a part of the ESREF 2007 tutorial on the design of IC protection circuits built with advanced deep sub-micron CMOS silicon-on-insulator (SOI) technologies. The tutorial covers fundamental aspects of active rail clamp Electrostatic Discharge (ESD) protection approach to meet the human body model (HBM), machine model (MM), and charged device model (CDM) requirements in SOI ICs. The paper focuses on 65 nm SOI ESD protection network and design methodology including both device and circuit level characterization data. It compares pulsed measurement results of SOI MOSFETs and diodes to bulk devices. It also introduces a response surface method (RSM) to optimize device sizes in the ESD networks.     

Built-in ESD Protection for RFID Tag ICs

The built-in Electro-Static discharge (ESD) protection circuits for Radio frequency identification (RFID) tag ICs are proposed.The ESD protection function is built into the rectifier and amplitude limiter.The rectifier and limiter are connected directly to the RF interface,and some transistors can discharge the larger current.These transistors can be used to build ESD protection circuits,through the redesign and optimization.The built-in ESD protection circuits can improve the ESD protection level and reduce the layout area.The circuits have been fabricated in 0.18μm CMOS process.The test results show that the built-in ESD protection circuits work well under 4kV ESD pressure and save as much as 72％ of the layout area compare with foundry standard ESD protection cells.     

Ladder-shaped network for ESD protection of millimetre-wave CMOS ICs

A compact ladder-shaped electrostatic discharge (ESD) protection circuit is presented for millimetre-wave integrated circuits (ICs) in CMOS technology. Multiple shorted shunt stubs form a ladder network together with series stubs as ESD protection that discharges current/voltage pulses caused by an ESD event, while at the same time the network is embedded as part of the matching circuit for a normal operation. A 60 GHz low-noise amplifier using a 90 nm CMOS process is demonstrated with the proposed ESD protection methodology that introduces less than 1 dB insertion loss. Owing to the ESD current distribution through multiple shorted stubs, the proposed methodology is useful to millimetre-wave ICs with advanced CMOS technology that suffers from higher sheet resistance of the metal layers.     

深亚微米CMOS IC抗噪声ESD保护电路的设计

CMOS工艺技术缩小到深亚微米阶段，电路的静电(ESD)保护能力受到了更大的限制。因此，需要采取更加有效并且可靠的静电放电保护设计。文章提出了一种新型的ESD保护电路，以LVTSCR结构为基础，结合栅耦合技术以及抗噪声干扰技术。这种新型电路即使被意外触发也不会引起闩锁效应，提高了ESD保护电路的可靠性，实现了全芯片保护。     

一种用于片上静电防护的新型闩锁免疫可控硅

可控硅(SCR)被广泛应用于片上静电放电(ESD)防护。由于SCR的低维持电压特性,闩锁问题一直是其应用于高压工艺ESD防护的主要问题。改进设计了一种新型SCR器件,即MOS High-holding Voltage SCR (MHVSCR)。通过对SCR寄生三极管正反馈进行抑制,并提高维持电压,实现了闩锁免疫。详细分析了MHVSCR提高SCR维持电压的可行性、工作原理以及实现步骤。基于Sentaurus TCAD的仿真结果表明:设计的器件将传统器件的SCR维持电压从2.8 V提高至15.88 V,有效实现了SCR在12 V工艺下的闩锁免疫能力。     

由版图引起的CMOS ESD保护电路失效的分析

ESD保护电路已经成为CMOS集成电路不可或缺的组成部分,在当前CMOS IC特征尺寸进入深亚微米时代后,如何避免由ESD应力导致的保护电路的击穿已经成为CMOS IC设计过程中一个棘手的问题.光发射显微镜利用了IC芯片失效点所产生的显微红外发光现象可以对失效部位进行定位,结合版图分析以及微分析技术,如扫描电子显微镜SEM、聚焦离子束FIB等的应用可以揭示ESD保护电路的失效原因及其机理.通过对两个击穿失效的CMOS功率ICESD保护电路实际案例的分析和研究,提出了改进ESD保护电路版图设计的途径.     

A thyristor-only input ESD protection scheme for CMOS RF ICs

We propose an input protection scheme composed of thyristor devices only avoiding usage of a clamp NMOS device to minimize the area consumed by an input pad structure in CMOS RF ICs. For this purpose, we suggest low-voltage triggering thyristor protection device structures assuming usage of standard CMOS processes, and attempt an in-depth comparison study with a conventional thyristor protection scheme incorporating a clamp NMOS device in the input pad. The comparison study mainly focuses on robustness against the human body model electrostatic discharge (HBM ESD) in terms of peak voltages applied to gate oxides in an input buffer and lattice heating inside protection devices based on DC and mixed-mode transient analyses utilizing a 2-dimensional device simulator. We constructed an equivalent circuit for the input HBM test environment of the CMOS chip equipped with the input ESD protection devices, and by executing mixed-mode simulations including up to four protection devices and analyzing the results for five different test modes, we attempt a detailed analysis on the problems which can occur in real HBM tests. We figure out strength of the proposed thyristor-only protection scheme, and suggest guidelines relating the design of the protection devices and circuits.     

一种基于CMOS工艺的新型结构ESD保护电路

根据伞芯片静电放电(ESD)损伤防护理论,设计了一种新犁结构保护电路,采用0.6μm标准CMOS p阱工艺进行了新型保护电路的多项目晶圆(MPW)投片验证.通过对同一MPW中的新型结构ESD保护电路和具有同样宽长比的传统栅极接地MOS(GG-nMOS)保护电路的传输线脉冲测试,结果表明在不增加额外工艺步骤的前提下,本文设计的新型结构ESD保护电路芯片面积减少了约22%,静态电流更低,而抗ESD电压提高了近32%.该保护电路通过了5kV的人体模型测试.