共查询到20条相似文献,搜索用时 109 毫秒
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基于热电分离式设计理念,将AlN陶瓷片金属化后作为微散热器嵌入FR4材料内形成了复合散热基板.采用电镜扫描、光学显微,通过冷热循环冲击试验对FR4与AlN两相界面处在高低温突变情况下的界面形貌进行了分析.利用ANSYS软件对基板进行了仿真热模拟,研究了AlN嵌入后FR4导热性能的变化规律.利用结温测试仪、功率计和半导体制冷温控台等仪器设备,通过结温测试对比研究了该复合散热结构与金属芯印刷电路板(MCPCB)对大功率LED封装散热效果的影响.结果表明,该复合散热基板在经低温-55℃,高温125℃,1 000个冷热循环后,FR4和AlN界面无剥离现象发生,在环境温度急剧变化的条件下结合力良好.同时,FR4在嵌入AlN之后,导热性能得到了明显改善,且与MCPCB相比,能更有效降低LED芯片结温. 相似文献
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基于热电分离式设计理念,开发出FR4/Cu与FR4/AlN两种高导热散热基板,并利用SMT工艺将13W的Osram S2W型LED灯珠分别与上述两种散热基板焊接后组装成LED模组,利用半导体制冷温控台恒定散热基板底部温度后,使用结温测试仪对LED的结温进行了测试,同时借助直流电源和积分球分别对LED的总功率和光功率进行了测量后得到了模组的热功率值。最后根据LED结温测试结果与热功率值计算得出了模组的热阻值,并在此基础上对两种基板的散热性能进行了对比研究。结果表明,FR4/AlN基板的散热性能较之FR4/Cu基板稍逊,当使用FR4/Cu基板散热时,LED的结温和热阻分别是49.72 ℃ 、2.21℃ /W,当使用FR4/AlN基板散热时LED的结温和热阻分别是51.32 ℃、2.32℃/W。 相似文献
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基于有限元分析的LED肋片散热器非等距排列研究 总被引:2,自引:0,他引:2
为了降低LED芯片的结温,国内外的专家和学者主要从改进LED的封装结构,选取合适的LED封装材料等方面来研究。通过对比分析各种散热方法,本论文指出散热器对降低LED芯片的结温有很大的作用,并且散热器的散热面积越大越好,选择合适的散热片来增加散热面积将是一个重点[3]。本文通过有限元软件对模型进行仿真分析。通过改变散热器的肋片的形状,排列方式以及制作材料来比较在不同状况下的温度场分布,对比分析出这些参数对LED芯片结温的影响。 相似文献
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改善大功率LED散热的关键问题 总被引:6,自引:0,他引:6
考虑热导率与散热方式的影响,使用大型有限元软件ANSYS10.0模拟并分析了大功率LED热分布.通过分析不同封装、热沉材料及散热方式对LED热分布与最大散热能力的影响,指出解决LED散热问题的关键不是寻找高热导率的材料,而是改变LED的散热结构或者散热方式. 相似文献
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高功率LED热管理方法研究最新进展 总被引:2,自引:1,他引:1
LED芯片结温的高低直接影响其出光效率、工作寿命和可靠性。在分析系统各个环节热阻的基础上,详细评述了高功率LED产品从芯片到系统级的热管理研究新动向,包括:自然对流冷却,采用压电风扇、电离方法所进行的强迫空气对流冷却,采用水、液态金属作为冷却工质的液冷方法,采用热管实现的相变冷却,采用热电片进行的固态冷却方案以及利用热电片对余热进行回收利用的热管热回收方案和液体金属冷却方法。并在上述基础上提出了发展更高功率密度LED热管理方法的关键科学问题。 相似文献
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考虑热导率与散热方式的影响,使用大型有限元软件ANSYS10.0模拟并分析了大功率LED热分布。通过分析不同封装、热沉材料及散热方式对LED热分布与最大散热能力的影响,指出解决LED散热问题的关键不是寻找高热导率的材料,而是改变LED的散热结构或者散热方式。 相似文献
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The goal of this study is to improve the thermal characteristics of high power LED (light-emitting diode) package using a flat heat pipe (FHP). The heat-release characteristics of high power LED package are analyzed and a novel flat heat pipe (FHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of high power LED package with flat heat pipe heat sink have been investigated experimentally. The obtained results indicate that the junction temperature of LED is about 52 °C for the input power of 3 W, and correspondingly the total thermal resistance of LED system is 8.8 K/W. The impact of the different filling rates and inclination angles of the heat pipe to the heat transfer performance of the heat pipe should be evaluated before such a structure of heat pipe cooling system is used to cool high power LED system. 相似文献
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A new cooling method of ethanol direct-contact phase-change immersion cooling was proposed in the thermal management of high power light emitting diodes (LED) and the feasibility of this cooling method was investigated. The heat generated by LED was measured firstly using two types of power systems: DC power and LED driver. Then the heat dissipation performance was evaluated under different experimental conditions. The results indicate that startup process of the cooling system is quick and only 450 s is needed to reach steady-state under heat load of 42.78 W. The minimum thermal resistance of 1.233 °C/W is obtained when liquid filling ratio is 33.14%. The junction temperature of LED under different absolute pressures is much lower than the limited value of 120 °C. Baffle with total height of 140 mm, bottom space height of 20 mm and distance away from substrate surface of LED of 8 mm improves heat transfer performance best due to ethanol self-circulating in the cooling receiver. Overall, the ethanol phase-change immersion cooling is an effective way to make sure high power LED work reliably and high efficiently. 相似文献
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We present the results of an experimental study of a cooling system based on a novel thermoelectric module specifically designed for thermal management of high-power light-emitting diodes (LEDs). The Seoul Semiconductor LED W724C0 device was chosen for experimental validation of the efficiency of the proposed cooling unit. Two cooling systems with identical heat sinks were tested for comparison: a state-of-the-art one based on an insulated metal substrate-printed circuit board (IMS-PCB), and a system with thermoelectric cooling. The obtained results show that use of thermoelectrics results in a considerable reduction of the LED operating temperature, providing increased light output and greatly increased LED lifetime. 相似文献
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LED光源在矿井工作面照明灯中的应用 总被引:2,自引:0,他引:2
对目前我国煤矿用灯作了简单的介绍,指出了煤矿用灯的发展方向应为节能、本质安全型;阐述了采煤工作面本质安全型LED照明灯应该具备的条件,分析了LED的发光机理.通过光谱分析,得出了LED在实际照明应用中散热的重要性;介绍了LED灯的一次散热方法及二次散热方法;对LED灯隔爆兼本安驱动电路作了设计并对小功率LED灯进行了合理的排列,结果表明隔爆兼本质安全型LED照明灯在采煤工作面是完全可以应用并具备广泛发展前景的. 相似文献
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《Microelectronics Journal》2014,45(2):249-255
With an urgent need for energy conservation and pollution reduction, the trend of replacing traditional incandescent or fluorescent lamps with high-power LEDs is growing more and more popular. In this research, high power white LED chips are used in automotive headlamp low beam system design. Several different cooling devices are designed for headlamp cooling, the heat dissipation performances are simulated and analysed both by the finite volume method (FVM) in FloEFD and experimental measurements. The simulation and experimental results show that nature convection cooling is not an effective method for LED headlamp cooling. Heat sink combined with heat pipes technology can greatly improve the heat dissipation performance. When the liquid filled ratio is 10%, heat pipes with evaporator length 30 mm, adiabatic section length 40 mm and condenser length 50 mm have the best cooling performance. Cooling device with heat pipes placed dispersedly makes the junction temperature lower than cooling device with heat pipes isometric placed in the same plane. The liquid filled ratio of heat pipes can influence the equivalent heat transfer coefficient significantly, and the optimal filling rate is 30% in our study. 相似文献
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基于LED照明灯具的散热片设计与分析 总被引:3,自引:1,他引:2
新一代大功率白光LED光源具有很多优点,如节能、环保、寿命长等,但大功率LED的散热也是一个至关重要的问题。如果LED散热问题解决不好,LED灯具工作一段时间后就会输出光功率减小,芯片加速老化,工作寿命缩短。文章从LED散热问题着手,详细介绍了目前广泛商用的大功率LED器件结构及导热途径、所用散热基片的特点,以及LED所用的散热片设计和计算方法。另外介绍了一种大功率LED在散热片上不同位置温度变化的测试结果,并推导出用于计算LED器件散热的有效公式。 相似文献