静电纺丝法制备碳纳米纤维及其应用

碳纳米纤维由于因其比表面积大、导电和导热性好,被广泛用于催化剂载体、吸附和储能材料。静电纺丝是制备一维纳米纤维直接、有效的方法,在介绍静电纺丝的基本原理和工艺影响因素的基础上,综述了电纺碳纳米纤维的特性及其应用。     

静电纺纳米纤维的应用

综述了静电纺纳米纤维在保护性服用材料、传感器、过滤防护材料、高分子纳米模板、纳米复合改性材料、航空航天等方面的应用;详述了在生物医用材料方面的应用;展望了静电纺丝纳米纤维的发展前景;指出应继续研发具有特殊性能的静电纺纳米纤维新产品,扩大其应用领域,最终实现成果产业化。     

静电纺丝制备纳米级纤维的研究

介绍了静电纺丝制备纳米纤维的原理及其影响因素,归纳、总结了当前国内外静电纺丝制备纳米纤维的研究内容,并对今后的研究提出了建议.     

静电纺纳米纤维的研究及应用进展

简述了静电纺丝基本原理及纺丝过程中射流存在的几种不稳定性形式;探讨了静电纺丝制备纳米纤维的主要影响因素。回顾了静电纺丝的发展历程,介绍了纳米纤维在电子器件、生物医学领域、滤材、防护服用材料纤维增强复合材料及传感器感知膜等方面的应用。指出静电纺纳米纤维性能优异、应用广泛,应用于生物医学领域是研发热点,必将进一步产业化。     

静电纺聚乳酸纳米纤维的制备及其孔结构调控

为了调控聚乳酸(PLA)纳米纤维的孔结构,采用静电纺丝技术,以PLA母粒为原料,三氯甲烷(CF)和N,N-二甲基甲酰胺(DMF)按一定比例混合的溶液为溶剂,制备了平均直径在1.37μm的PLA纳米纤维,并对其结构进行表征。结果表明,PLA纳米纤维的平均直径随着纺丝液中CF含量、聚合物浓度、环境湿度的增加而增大;随纺丝电压和灌注速度的增大而呈减小的趋势。同时,环境湿度对纤维表面孔结构有显著影响。随着湿度的增加,纤维表面孔的分布密度增加,且形状由圆形转变为椭圆形。此外,与表面光滑的PLA纳米纤维(2.4 m²/g)相比,所制备的PLA多孔纤维的比表面积提升了10倍(24.0 m²/g)。     

静电纺无机纳米纤维的研究进展

综述了静电纺丝制备无机纳米纤维的最新研究进展,主要介绍了电纺氧化物纳米纤维和多组分纳米纤维的研究进展,说明了各种无机纳米纤维的特性、应用前景,并且指出其不足以及今后研究的主要方向.     

静电纺丝制备纳米纤维束及其应用

纳米纤维束独特的微纳结构赋予其较大的比表面积、粗糙度和孔隙率等特性,在生物医学、催化、传感、过滤和吸附等领域具有广泛的应用前景。然而,常规制备纳米纤维的方法如自组装法、模板法和熔喷法等,很难制备出纤维束;传统的静电纺丝法所制备的纤维束的"束"尺寸基本在微米级以上,如何制备较小"束"尺寸的纳米纤维束是提高材料性能及应用开发的关键。文章首先介绍了近年来通过改进静电纺丝工艺和设备制备纳米纤维束的各种方法,进而总结了纳米纤维束的特点和应用,最后提出了纳米纤维束研究亟待解决的问题。     

静电纺纳米纤维市场前景看好

20世纪90年代后期，科学家们对于纳米纤维制备及应用的研究达到高潮，开发了一系列制备聚合物纳米纤维的方法，如纺丝、模板合成法、相分离法、自组装法以及静电纺丝法等。与上述方法相比，静电纺制备聚合物纳米纤维具有设备简单、操作容易以及高效等特点，是制备聚合物连续纳米纤维最有效的方法。静电纺纳米纤维性能优异、应用广泛，在电子器件、生物医学领域、滤材、防护服用材料纤维增强复合材料及传感器感知膜的应用前景十分看好，产业化市场发展前景广阔。     

高压静电纺丝法制备聚酰亚胺超细纤维无纺布膜

采用制备聚合物纳米纤维的一种简易的重要基本方法,即静电纺丝技术,以实验室合成的聚酰胺酸（PAA）溶液为纺丝溶液,采用自制静电纺丝机进行电纺得到PAA纤维无纺布膜。采用傅立叶变换红外光谱分析技术对无纺布膜的化学结构进行了表征分析;由PAA及聚酰亚胺（PI）无纺布膜的谱图吸收峰对比分析得知,纤维热酰亚胺化的程度是比较完全的;但由相应吸收峰对比分析得知,热酰亚胺化的程度并没有达到100％。     

静电纺丝制备纳米级纤维的研究

首先介绍了静电纺丝制备纳米纤维的原理及其影响因素,然后归纳、总结了当前国内外静电纺丝制备纳米纤维的研究内容,并对今后的研究提出了建设.     

聚酰亚胺气凝胶制备、性能及应用进展

聚酰亚胺气凝胶具有高比表面积、低密度、低热导率等优点,但是存在易吸湿、收缩率大且在制备过程中大量使用有机溶剂以及使用价格昂贵的化学交联剂等问题。本文主要介绍了目前聚酰亚胺气凝胶的制备方法、性能及其应用,重点综述了二酐与二胺缩合反应法、异氰酸酯法、开环易位聚合法。简述了几种方法的制备原理,同时也总结了聚酰亚胺气凝胶在隔热、抗辐射、油水分离、过滤等领域应用的研究进展。最后,对聚酰亚胺气凝胶的制备方法及实际应用进行了总结与评价,提出在今后的研究工作中要以解决易吸湿、收缩率大、探索其他类型交联剂作为重点。并且,立足于目前聚酰亚胺气凝胶及其复合材料的发展趋势,对今后聚酰亚胺气凝胶新的存在形态、新的应用领域进行了展望。     

共聚聚酰亚胺纤维的制备及其性能研究

采用4,4’-二氨基二苯醚和1,6-己二胺(HDA)为二胺单体,与均苯四甲酸酐(PMDA)在二甲基乙酰胺(DMAc)中共聚得到聚酰胺酸(PAA)纺丝原液,通过干法纺丝工艺路线纺制PAA初生纤维,利用热酰亚胺化制备了共聚型聚酰亚胺(PI)纤维;通过红外光谱分析、动态力学分析、热重分析、X射线衍射等手段分析了PI纤维的力学性能及热性能。结果表明:红外光谱分析发现HDA的长亚甲基链引入到PI的链中;当HDA质量分数为20%时,PI纤维的断裂强度和模量分别为5.1 cN/dtex和76 cN/dtex;动态力学和热重分析发现,纤维的玻璃化转变温度为315～380℃,热稳定性在400℃以上;纤维经热处理后聚集态结构存在一定的有序性。     

Preparation and properties of rigid polyimide foams derived from dianhydride and isocyanate

A series of rigid polyimide (PI) foams were synthesized via the reaction of a first solution with a second solution. The first solution was isocyanate‐terminated polyimide prepolymers; the second solution contained deionized water and surfactant. The effect of different water contents and isocyanate index on the structures and properties of rigid PI foams were investigated. The apparent density, hardness, compressive strength, and the 5% weight loss temperatures (T_5%) decreased with the increase of water content. With the increase of isocyanate index, the apparent density and the T_5% values decreased, whereas the glass transition temperatures (T_g) increased and the hardness, compressive strength first increased and then decreased. The rigid PI foams composed of closed‐cells were confirmed by scanning electron microscopy. The maximum compressive strength of rigid PI foams prepared was up to 1.31 MPa. Moreover, excellent thermal stability was presented with the T_5% values were all above 360°C and the residual weights of the foams (R_w) were more than 50% at 800°C. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Low dielectric constant polyimide mixtures fabricated by polyimide matrix and polyimide microsphere fillers

Polyimide microspheres were prepared via non‐aqueous emulsion polymerization by using pyromellitic dianhydride (PMDA) as anhydride monomer and 2,2‐bis(4‐(4‐aminophenoxy)phenyl)propane as amine monomer. The polyimide microspheres were well characterized by Fourier transform infrared spectroscopy, SEM and laser particle size analyzer. They were spherical in shape and monodisperse and their size was 31–33 μm. Polyimide mixtures formed by polyimide microspheres as fillers and polyimide composed of pyromellitic and dianhydride 4,4′‐oxydianiline (ODA) as matrix were investigated with regard to thermal properties, dielectric properties and mechanical properties. With 10%–50% polyimide microspheres in the polyimide mixtures, the dielectric constants were 2.26–2.48 (1 MHz) and the loss tangents were 0.00663–0.00857 (1 MHz), which were both significantly lower than the values for ODA‐PMDA polyimide. The decomposition temperature and glass transition temperature were above 440 and 290 °C. The polyimide mixtures possessed excellent thermal resistance. When the percentage of polyimide microsphere addition was 30%, the polyimide mixtures had the largest tensile strength (128.50 MPa) and elongation at break (9.01%). These results indicate that the polyimide microspheres were used as both low dielectric fillers and reinforcing fillers. © 2020 Society of Chemical Industry     

聚酰亚胺纤维的制备及其结构研究

将均苯四甲酸二酐(PMDA)和4,4’-二氨基二苯醚(ODA)在N-甲基吡咯烷酮(NMP)中进行溶液聚合得到聚酰胺酸(PAA)溶液,并用该溶液进行干湿法纺丝得到PAA纤维,分别用化学酰亚胺化法和热酰亚胺化法得到聚酰亚胺(PI)纤维。研究了凝固浴组成和工艺条件对PAA形态结构和纤维性能的影响,以及不同酰亚胺化方法对PI纤维形态结构和性能的影响。结果表明:以甲醇为凝固浴制备的PAA初生纤维,无孔致密,最高拉伸强度和初始模量分别为2．21 cN/dtex和40．73 cN/dtex;采用化学酰亚胺化法制得的PI纤维中存在少许孔洞缺陷,其强度较低,热酰亚胺化法制得的PI纤维无孔致密,其强度和模量分别达到2．83 cN/ dtex和43．4 cN/dtex。     

Preparation and characteristics of composite films with functionalized graphene/polyimide

Polyimide (PI) has the inherent defect of poor intrinsic thermal conductivity and cannot meet the increasing demand for rapid heat dissipation in the thermal management introduction. To improve the thermal conductivity of PI, in this study, thick sheet graphene-ionic liquid (TSG-IL) functionalized graphene has been prepared by a one-step ultrasonic-chemical method. Under the action of mechanical force, IL is successfully modified on the surface of TSG, and TSG is peeled to some extent. TSG-IL/PI has been prepared the typical method of solution casting followed by thermal imidization. The structure, morphology, thermal conductivity, and mechanical properties of the composites are evaluated by Fourier-transform infrared spectroscopy, x-ray diffraction analysis, scanning electron microscopy, transmission electron microscopy, and Hot Disk thermal conductivity tests. When the amount of TSG-IL is 0.3 wt%, the thermal conductivity of TSG-IL/PI (0.18 W·m⁻¹·k⁻¹) than pure PI and TSG (ultrasonication)/PI increased by 50.0% and 28.6%, respectively. Moreover, it can maintain good mechanical properties, and its tensile strength (121.5 MPa) is 6.5% and 3.5% higher than that of pure PI and TSG (ultrasonication)/PI, respectively. The potential for application in the preparation of composites with high-thermal conductivity is promising.     

含羟基聚酰亚胺改性环氧胶的制备及性能研究

将3,3'-二氨基-4,4'-二羟基联苯(DADHBP)、2,2-双(3-氨基-4-羟基苯基)六氟丙烷(BAH-PFP)和3,3',4,4'-四羧酸二苯醚二酐(ODPA)、3,3',4,4'-四羧酸二苯甲酮二酐(BTDA)单体聚合,再经亚胺化得到含羟基聚酰亚胺(HPI)粉末,采用傅里叶红外光谱对其进行了表征。由HPI、烯丙基双酚A、双马来酰亚胺、2-乙基-4-甲基咪唑与N,N,N',N'-四缩水甘油基-4,4'-二氨基二苯甲烷(TGDDM)共聚反应制得胶粘剂,并对胶粘剂的热性能、力学性能及吸水性进行了研究,结果表明:该胶拉伸剪切强度为21.1 MPa,固化后吸水率为0.49%。通过凝胶化时间法计算胶粘剂的表观活化能为64.5 kJ/mol。     

Preparation of a polyimide composite filled with corundum as a kind of precision grinding slice

By using a two‐step synthetic method, a novel grinding material, SiC and polyimide grinding slice, is prepared. This grinding slice can be used for mechanical planarization of hard and brittle materials, such as silicon, optical glass, advanced ceramics, specials metal, jewelry, disks etc. For observing the physical and chemical properties of the slice, scanning electron microscopy, FTIR spectroscopy, thermal gravimetric analysis, tensile strength, and elongation at break are used. All the experimental data indicate that the SiC/PI slice will be a very useful grinding material for obtaining a precision surface. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

聚酰亚胺基气凝胶材料的制备与应用

气凝胶是一类以空气为分散介质的干态凝胶材料,具有由纳米粒子随机聚集并相互连接而成的复杂三维网络结构,也因此集低密度、高比表面积、高孔隙率、低热导率等优异性能于一身,在众多尖端及民生领域显示出巨大的应用潜力。作为一种高性能材料,聚酰亚胺(polyimide, PI)已被广泛用于航空航天、防火织物等诸多领域,由其制成的PI气凝胶具有较高的机械强度,对传统脆弱易碎的无机气凝胶显示出明显的替代趋势,也因此得到了研究人员的广泛关注。本文主要介绍了PI基气凝胶材料的研究进展,从PI气凝胶的制备方法、改性方法及应用等角度进行综述,并对其未来的发展进行展望,以期为后续研究提供借鉴与参考。     

聚酰亚胺基气凝胶材料的制备与应用

气凝胶是一类以空气为分散介质的干态凝胶材料,具有由纳米粒子随机聚集并相互连接而成的复杂三维网络结构,也因此集低密度、高比表面积、高孔隙率、低热导率等优异性能于一身,在众多尖端及民生领域显示出巨大的应用潜力。作为一种高性能材料,聚酰亚胺(polyimide, PI)已被广泛用于航空航天、防火织物等诸多领域,由其制成的PI气凝胶具有较高的机械强度,对传统脆弱易碎的无机气凝胶显示出明显的替代趋势,也因此得到了研究人员的广泛关注。本文主要介绍了PI基气凝胶材料的研究进展,从PI气凝胶的制备方法、改性方法及应用等角度进行综述,并对其未来的发展进行展望,以期为后续研究提供借鉴与参考。