Heat flow resistance measurements of silicon p+-v-n+ diodes under forward and reverse biased conditions

A detailed study of the heat flow resistance measurements in a p⁺-v-n⁺ diode is studied in both forward and reverse biased conditions. Measurements are made by continuously switching the diode from the power dissipation state into the temperature measuring state. Safe operating power limits are identified for the diodes depending upon their mode of operation either as a microwave switch or as an IMPATT oscillator.     

Post-breakdown bulk oscillations in gold-doped silicon p+−i−n+ double-injection diodes

Experimental work on post-breakdown bulk oscillations in n-type gold-doped phosphorus-compensated p⁺?i?n⁺ double-injection diodes is presented. An empirical relationship for the frequency of oscillation in this region is derived for the first time and discussed.     

Junction potentials of strongly illuminated n+ - p - p+ solar cells

The low-junction (LHJ) model is applied to an n⁺ - p - p⁺ solar cell having finite dimensions, in order to investigate its performance under intense illumination. Ambipolar transport equations are solved in the three sections of the cell using appropriate boundary conditions. Expressions for junction currents are derived, and the junction potentials under open-circuit conditions are computed by the Newton-Raphson method.The theory presented here includes the effects of high level injection. The generalized current density equations which are derived here for an n⁺ - p - p⁺ device are shown to reduce to the ideal Shockley diode equation with appropriate modifications. The effects of p - p⁺ low-high junction on the open-circuit voltage of the cell are explained. The theoretical results of this paper are consistent with the experimental results of others.     

Noise in near-ballistic n+nn+ and n+pn+ gallium arsenide submicron diodes

Direct-current (d.c.) characteristics and noise measurements in the range 1 Hz-25 kHz are reported for n⁺nn⁺ and n⁺pn⁺ near-ballistic devices, with n regions (p regions) of 0.4 μm (0.45 μm), fabricated by molecular beam epitaxy at Cornell. The n⁺nn⁺ mesa structures show very low 1/? noise. indicating a Hooge parameter α_H = 6.0 × 10^?. This very low noise is attributed to the near absence of phonon collisions. The thermal (? like) noise above 1 kHz is equal to Nyquist noise at the lowest currents, rising to slightly above Nyquist noise for high currents, indicating the presence of carrier drag effects. The n⁺pn⁺ noise, on the contrary, is quite high. It seems to be associated with the ambipolar effects occurring for low injection of electrons in the p region. The importance of noise measurements for confirming ballistic or near-ballistic behavior is discussed.     

High injection phenomena in p+in+ silicon solar cells

A very simple analytic analysis of p⁺in⁺ solar cell structures is undertaken based in the quasi-neutrality condition (n = p), which validity is verified. The only differential equation to be solved in the model is the classical continuity one. Non linearities, appea ronly in the boundary conditions. This model can be applied to p⁺nn⁺ or n⁺pp⁺ cells under very high injection conditions. High carrier concentrations are required to support the current flow even in short-circuit conditions, so enhancing the recombination which, on the other hand, is reduced by high injection lifetime increase. Under-linearity between the short-circuit current and the photon flux is also deduced at very high irradiance. The short-circuit current under bifacial illumination is higher than the sum of those currents under front and back illumination alternatively, so leading to inherently better bifacial cells. In the V_oc vs J_sc curve values of m in the logarithmic slope mkT/q range from values slightly below one to two. The value m = 1 is not to be expected even if the base recombination is negligible due to Dember potential effects.     

Low field study of P+NN+ or P+PN+ structures in the forward direction

It is shown, on the basis of P⁺NN⁺ and P⁺PN⁺ models, how injection processes modify the field distribution in two-electrode systems, and thereby the effective resistivity.     

A discrete element small-signal equivalent circuit for forward-biased p+n diodes containing deep levels

A discrete element small-signal equivalent circuit model for p-n diodes containing deep defect levels is developed, by extending an existing model for undamaged devices. With the aid of a simple analytical expression which accurately describes the forward bias d.c. current, the enhanced small-signal conductance due to carrier recombination in the depletion region is included in the model. The influence of trapped charge on the space charge capacitance is incorporated using a simplified version of the analysis of Beguwala and Crowell. The predictions of the model are verified by experimental data from silicon p⁺n diodes, in which deep levels have been induced by electron irradiation. It is shown that the deep level activation energies may be estimated from the forward bias capacitance-voltage characteristics, yielding values which agree well with those obtained by established techniques.     

Characteristics of three-terminal metal-tunnel if oxide-n/p+ devices

The device described here comprises a p⁺ substrate containing an epitaxial n-layer, on the surface of which is grown a thin (～50 Å) tunnel oxide. A metal cathode is deposited on the oxide surface, and a metal anode on the back side of the p⁺ substrate. A third terminal, the gate electrode, is connected to the n epilayer to provide for biasing the n-p⁺ junction.The I-V characteristic exhibit two stable states: a high-impedance state and a low-impedance state which are separated by a negative-resistance region. The high-impedance state is stable for applied voltages up to the intrinsic threshold voltage, V_s. When the switching voltage is exceeded, the device switches rapidly to the low-impendance state, which is characterized by a current that increases with little increase in the voltage across the device.The switching voltage may be reduced below V_s by current or voltage biasing of the n-p⁺ junction by means of the gate electrode. Gate efficiencies, the ratio of the change in switching voltage with d.c. gate voltage or current, of 10 V/V and 1.0 V/μA have been observed. Pulsed gate measurements are also presented, and it found that for pulse widths down to 0.1 μs the gate switching characteristics follow the d.c. characteristics. For pulse widths less than 0.1 μs the gate efficiencies are degraded. Suggestions for improving the device characteristics and the turn-on and turn-off time of the device and device reliability are discussed.     

Analysis of harmonic generator circuits for step recovery diodes

This paper gives formulas for the transients in a simple lossless harmonic generator circuit consisting of a step recovery diode, two inductors, and two capacitors. By means of graphic plots of the instantaneous values of currents and voltages, it is concluded that high efficiency requires approximately equal values of the two inductors.     

Temperature rise in microwave p-i-n diodes: A computer aided analysis

Results of a computer aided thermal analysis of microwave p-i-n diodes are presented in this paper. The nonlinear heat flow equations in one dimension are solved using the central finite difference method of Leibman's formulation taking into account the temperature dependence of thermal conductivity and specific heat. Results are presented showing the temperature profile inside the device as a function of microwave pulsewidth and power dissipation. The effect of a heat sink on the temperature rise is also shown. The main conclusion arrived at is that the nonlinear thermal properties lead to higher temperature rise in the device and larger thermal time constants than could be expected otherwise. The method used for calculation is applicable for other solid state devices like the TRAPATT, the fast recovery thyristor, and power transistors where similar orders of power levels are involved.     

Electron bombardment effect on the reverse I–V characteristics and tensosensibility of p+-nGaAs diodes

The effect of ≈2 MeV electron bombardment on the reverse characteristics and tensoelectric properties in p⁺-nGaAs diodes is investigated. The reverse breakdown voltage showed a weak increase due to irradiation and an anomalous temperature dependence in the range 77–300 K. The I–V characteristics in electron-irradiated diodes revealed a high pressure sensitivity (tensosensibility) to the external hydrostatic pressure (up to 6 · 10⁸ Pa). The peculiarities in the reverse I–V characteristics of diodes investigated point to the presence of a radiation-induced deep trap (acceptor-type level at about E₀ ? 0.3 + 0.4 eV), which is attached to the Γ₁₅^V-maximum of the valence band.     

Design considerations of step recovery diodes with the aid of numerical large-signal analysis

Switching behavior of the step recovery diode (SRD) is studied through exact large-signal analysis. Two numerical methods are presented. One is suitable for steady-state and slow-transient calculations, while the other is based on a principle given by Scharfetter and Gummel, being appropriate for fast-transient calculation. Criteria for each method are described in terms of space and time intervals. A variety of doping profiles is generated by seven parameters, to determine the influence of each parameter on switching response. The normally defined transition time for current falloff from 90 to 10 percent consists of a physical transition phase and the phase of the CR time constant, which is defined as the product of junction capacitance and series resistance. The former is minimized by a narrow region of light doping, or by an abrupt profile, whereas the latter is minimized by a wide region of light doping, thus making a compromise necessary. Under the assumption of improved device fabrication technology, operation with low external impedance will allow total transition time to decrease to about one-half or one-third of today's standard sample. As was pointed out by Moll et al., a small amount of series inductance is desirable for fast transition.     

A difficulty in the theory of p+-n junction diode noise

It is shown that the usual theory of p⁺-n junction diode noise leads to the following difficulty. The spectrum of the open-circuit noise voltage of the diode does not go to zero fast enough at sufficiently high frequencies, so that the spectrum cannot be integrated from 0 to ∞. The difficulty is removed when the effect of the capacitance C_j of the junction space charge region is taken into account. This is a particular example of a more general result.     

Base current and dominant time constant of an n+n−pn+ transistor operating in the upward mode

An attempt will be made to put together all information on I²L base current available from literature. The aim is to get explicit relations for all base current components at low, medium and high injection. This requires knowledge of excess concentration patterns and stored excess charge as well as of the associated time constants. As a final result the upward current amplification β_u and the upward time constant τ_u are obtained. In the latter no depletion charges have been taken along and a quasi-static condition is assumed. Lateral base current effects have not been taken into account.     

Effective recombination velocity at the NN+ interface

The effective recombination velocity S_nn⁺ at the nn⁺ interface in buried layer (nn⁺p) and n epi-n⁺ substrate structures has been studied using a model which takes into account the retarding outdiffusion region, recombination and bandgap narrowing. The variation of S_nn⁺ with diffusion length and bandgap narrowing has been estimated taking into consideration their doping-dependence. An attempt has been made to explain the wide range in the reported values for S_nn⁺ using the results of this study.Results indicate clearly the difference between the S_nn⁺ of the two structures. This difference arises from the collection by the p-substrate which accounts for a significant part of the S_nn⁺ of the buried layer structure over a wide range of values of diffusion length. This collection component of S_nn⁺ is sensitive to bandgap narrowing.On the other hand, the S_nn⁺ of the nn⁺ structure is largely determined by the recombination in the outdiffusion region which is sensitive mainly to the value of diffusion length in that region. The component of S_nn⁺ representing recombination in the n⁺ substrate is sensitive to bandgap narrowing. The present study indicates the dependence of S_nn⁺ on the structure and processing of the devices in which the nn⁺ interface occurs.     

Degradation mechanism for silicon p+-n junctions under forward bias

Leakage current degradation has been observed during forward bias stressing of silicon integrated p⁺-n junctions. Detailed characterization results of the anomalous leakage behavior are discussed in this paper. From these results an electric field-enhanced impurity diffusion mechanism has been proposed to explain both the strong temperature and forward bias dependencies on leakage current time-to-saturation. An activation energy has been determined for this mechanism (0.48±0.04 eV) and is in good agreement with that previously determined for diffusion of interstitial copper in p-type silicon. Subsequent Secondary Ion Mass Spectrometer elemental analysis has confirmed the presence of copper near the surface of the epitaxial layer containing the p⁺-n device.     

Physical modeling of the step recovery diode for pulse and harmonic generation circuits

A simple charge-controlled switching model describes most fundamental aspects of the step recovery diode. However, it is shown that switching speed and the associated loss are related to the width of the i layer and to the doping level. A switching model appropriate for general computer use is given, and examples of its application are shown in pulse and harmonic generator circuits.     

Theoretical model for calculation of breakdown voltage of implanted p-n junctions

Avalanche breakdown voltage (ABV) of an implanted planar p-n junction was calculated taking the junction curvature into consideration. Curvature was determined from the two-dimensional form of LSS-profiles incorporating lateral spread of implanted ions. Supposing a one-sided abrupt junction, theoretical ABVs are compared with experimental values. The junctions were produced by 20–80 keV boron implantation into 〈111〉 oriented, 1·5 ohmcm silicon. The structure was gate-controlled to set the surface into flat-band condition. The model satisfactorily describes the ABVs of fully annealed implanted planar junctions. For partially annealed diodes, the increase in ABV was attributed to effective curvature due to the depth-dependence of the electrically active portion.     

A simplified theory of the p-i-n diode

A simplified theory of the p-i-n diode is developed for the case of heavy injection in the base, and light injection in the end regions. The current I is taken as the fundamental parameter. The carrier densities n₁ and n₂ at the base boundaries are given directly as functions of the current I by means of simple approximate expressions. The approximation improves with increasing base width and increasing current. It is always within 15% of the correct value for base widths of about 2 diffusion lengths or higher. The accuracy is much better still on the voltage drop across the device, as calculated from the approximate equations for the carrier densities within the base.     

The effect of current suppression in the pn−n+ diode of integrated injection logic

The j-V characteristics of the pn^?n⁺ diode are derived by combining the different current components in the n^? region of the diode for various bias voltages. For infinitly fast recombination, the expression for the current density as a function of bias reduces to that of a conventional one-dimensional theory. For finite recombination, however, the expression deviates significantly from the usual expression. In fact, contrary to what would be expected from the conventional theory, the current increases as the width of the neutral n^? region increases for a constant bias. Finally the results of the analysis of the pn^?n + diode are applied to an analysis of the current gain in the integrated injection logic (I²L) device. A qualitative discussion of the current gain for the lateral pnp transistor and for that of the vertical npn transistor is given.