Influence of Ti film thickness and oxidation temperature on TiO2 thin film formation via thermal oxidation of sputtered Ti film

Single-phase rutile TiO₂ films with good crystallinity were obtained by thermal oxidation of sputtered Ti films on Si and quartz substrates. The influence of the Ti film thickness on oxidation was systematically investigated. A temperature of 823 K was sufficient to fully oxidize Ti films of <0.2 μm in thickness, but 923 K was required for complete oxidation of thicker films. The crystal structure, phase, composition, and optical properties of the TiO₂ films were investigated using X-ray diffraction (XRD), Raman spectroscopy, energy-dispersive X-ray analysis (EDAX), and UV-vis-NIR spectroscopy. XRD and Raman analyses showed that the TiO₂ films are rutile phase. The bandgap of the TiO₂ films decreased with increasing thickness. A growth mechanism for TiO₂ thin films due to thermal oxidation of sputtered Ti films is proposed. Oxidation commences from the surface and proceeds inside the bulk and Ti→TiO₂ phase transformation occurs via different intermediate phases. We found that the oxidation temperature rather than the duration is the dominant factor in the growth of TiO₂ thin films.     

Composition,structure and electrical properties of DC reactive magnetron sputtered Al2O3 thin films

Thin films of alumina (Al₂O₃) were deposited over Si 〈1 0 0〉 substrates at room temperature at an oxygen gas pressure of 0.03 Pa and sputtering power of 60 W using DC reactive magnetron sputtering. The composition of the as-deposited film was analyzed by X-ray photoelectron spectroscopy and the O/Al atomic ratio was found to be 1.72. The films were then annealed in vacuum to 350, 550 and 750 °C and X-ray diffraction results revealed that both as-deposited and post deposition annealed films were amorphous. The surface morphology and topography of the films was studied using scanning electron microscopy and atomic force microscopy, respectively. A progressive decrease in the root mean square (RMS) roughness of the films from 1.53 nm to 0.7 nm was observed with increase in the annealing temperature. Al–Al₂O₃–Al thin film capacitors were then fabricated on p-type Si 〈1 0 0〉 substrate to study the effect of temperature and frequency on the dielectric property of the films and the results are discussed.     

Enhancement in electrical performance of indium gallium zinc oxide-based thin film transistors by low temperature thermal annealing

We have studied the characteristics of transparent bottom-gate thin film transistors (TFTs) using In–Ga–Zn–O (IGZO) as an active channel material. IGZO films were deposited on SiO₂/Si substrates by DC sputtering techniques. Thereafter, the bottom-gate TFT devices were fabricated by depositing Ti/Au metal pads on IGZO films, where the channel length and width were defined to be 200 and 1000 μm, respectively. Post-metallization thermal annealing of the devices was carried out at 260, 280 and 300 °C in nitrogen ambient for 1 h. The devices annealed at 280 °C have shown better characteristics with enhanced field-effect mobility and high on–off current ratio. The compositional variation of IGZO films was also observed with different annealing temperatures.     

Control of the Ti diffusion in Pt/Ti bottom electrodes for the fabrication of PZT thin film transducers

For the achievement of microactuators based on piezoelectric thin films, a Pt/Ti/Si bottom electrode is widely used. This study presents the experimental results for Ti out-diffusion in Pt and Si for both sputtered Pt/Ti and Pt/TiO_x electrodes. These results have been compared before and after a rapid thermal annealing (RTA). The diffusion has been characterized by secondary ion mass spectroscopy (SIMS) analysis using Cs⁺ as a primary ion source. The Pt orientation has been observed by XRD measurements. Ti thin films (20 nm) have been sputtered in pure Ar whereas TiO_x films have been obtained by reactive sputtering in a mixture of Ar/O₂ (90/10). Finally, the Pt (100 nm) has been sputtered without vacuum breaking. After RTA (400°C, 30 s, in N₂), the Pt film exhibited a (1 1 1) orientation for both Ti and TiO_x adhesion films. The roughness of the Pt film measured by AFM with TiO_x underlayer was 80% less than that of the Pt/Ti bi-layer. The TiO_x film, as shown by SIMS analysis, has drastically reduced the diffusion of Ti in both Pt and Si. This phenomenon is accompanied by a very low Pt roughness. These results are analyzed in terms of diffusion and regrowth mechanisms inside the Pt film.     

Charge-trapping characteristics of BaTiO3 with and without nitridation for nonvolatile memory applications

The charge-trapping characteristics of BaTiO₃ with and without nitrogen incorporation were investigated based on Al/Al₂O₃/BaTiO₃/SiO₂/Si (MONOS) capacitors. The physical properties of the high-k films were analyzed by transmission electron microscopy and X-ray photoelectron spectroscopy. Compared with the MONOS capacitor with BaTiO₃ as charge-trapping layer, the one with nitrided BaTiO₃ showed higher program speed even at lower operating voltage (4.3 V at +8 V for 100 μs), better endurance property and smaller charge loss (charge loss of 10.6% after 10⁴ s at 85 °C), due to the nitrided BaTiO₃ film exhibiting higher charge-trapping efficiency caused by nitrogen incorporation and suppressed leakage induced by nitrogen passivation.     

Al-doped ZnO and N-doped CuxO thermoelectric thin films for self-powering integrated devices

With the use of a thermoelectric material, terrestrial heat can be harvested then converted to electrical power. The advent of these devices has led to the idea of self-powering wherein devices are driven by heat from their working environment. The focus of this study is to fabricate low cost thermoelectric materials, such as aluminum-doped ZnO (ZnO:Al) and nitrogen-doped Cu_xO (Cu_xO:N) that can effectively harvest heat for power generation.ZnO:Al (n-type) and Cu_xO:N (p-type) thin films with nanocrystallites were deposited in (1.27×0.64) cm² glass substrates via spray pyrolysis technique. These materials exhibit significantly high thermoelectric properties, which is comparable to previous works on thermoelectric materials. ZnO:Al showed to have a maximum Seebeck coefficient (S) of 448 μV/K ranging from 300 to 330 K. Cu_xO:N exhibited a significantly much larger |S| of 1002 μV/K at the same temperature range. A prototype of a thermoelectric device was constructed based from these grown thin films and showed to generate a maximum of 32.8 mV at 28 K temperature difference.     

The significant effect of film thickness on the properties of chalcopyrite thin absorbing films deposited by RF magnetron sputtering

In this paper, thickness dependent structural, surface morphological, optical and electrical properties of RF magnetron sputtered CuIn_0.8Ga_0.2Se₂ (CIGS) thin films were studied using X-ray diffraction (XRD), Transmission electron microscopy (TEM), Field emission scanning electron microscopy (FE-SEM), Atomic force microscopy (AFM), UV–vis–NIR spectrophotometer and Keithley electrical measurement unit. The peak intensity along (112) plane as well as crystallite size was found to increase with thickness. However, for higher film thickness >1.16 μm, crystallinity reduced due to higher % of Cu content. TEM analysis confirmed pollycrysallinity as well as chalcopyrite phase of deposited films. The band gap was found to decrease with increase in thickness yielding a minimum value of 1.12 eV for film thickness 1.70 μm. The I–V characteristics showed the ohmic behavior of metal semiconductor contact with higher conductivity for film thickness 1.16 μm.     

Aluminum titanium oxide alloys: Deposition of amorphous,transparent, corrosion-resistant films by pulsed DC reactive magnetron sputtering with RF substrate bias

Optically transparent and mechanically flexible encapsulation films are desirable for advanced optoelectronic devices. Among many variations of encapsulation, ternary metal oxide films present good optical and mechanical properties. In this study, aluminum titanium oxide (Al_1−xTi_xO_y) films were deposited with a range of Ti/(Ti+Al) molar fractions (x) using pulsed DC magnetron sputtering with RF substrate bias. Subsequently, the films were subjected to an Accelerated Weathering Environment (AWE) test at 220 °C, 1.6 atm and ~100% RH for 3 h. Optical, chemical, and morphological analyses revealed that there exists a range of Ti/(Ti+Al) molar fraction (x=0.4–0.7) where films withstood the test, maintaining their optical, chemical, and morphological integrities. The study suggests that encapsulation films with continuously and spatially varying refractive index can be available by varying x within this range, forming encapsulation with broadband, wide angle antireflective coatings.     

Effects of oxygen concentration on the properties of Al-doped ZnO transparent conductive films deposited by pulsed DC magnetron sputtering

The effect of oxygen concentration on the properties of Al-doped ZnO (AZO) transparent conductive films has been investigated on the films deposited by pulsed DC magnetron sputtering using a cylindrical ZnO target containing 2 wt% Al. AZO films were deposited at 230 °C to the thickness of about 1000 nm and the oxygen concentration was controlled by varying the O₂/Ar supply ratio from 0 to 0.167. With the increasing O₂/Ar ratio, crystallinity of the AZO films deteriorated while the film surface became smooth. Accompanying this, electrical properties also deteriorated significantly. When the O₂/Ar ratios were 0 and 0.033, the AZO films showed metallic conduction behavior with the electrical resistivity in the mid 10^?4 Ω cm range. However, when the ratios were 0.100 and 0.167, the films showed poor electrical conduction behavior similar to semiconductors as deduced from the transmittance behavior. Spectroscopic analysis showed that such deteriorating properties are due to the formation of condensed oxide group through the reaction between excess oxygen and dopant aluminum.     

Development of highly conducting n-type micro-crystalline silicon oxide thin film and its application in high efficiency amorphous silicon solar cell

Wide band gap and highly conducting n-type nano-crystalline silicon film can have multiple roles in thin film solar cell. We prepared phosphorus doped micro-crystalline silicon oxide films (n-μc-SiO:H) of varying crystalline volume fraction (X_c) and applied some of the selected films in device fabrication, so that it plays the roles of n-layer and back reflector in p-i-n type solar cells. It is generally understood that a higher hydrogen dilution is needed to prepare micro-crystalline silicon, but in case of the n-μc-SiO:H an optimized hydrogen dilution was found suitable for higher X_c. Observed X_c of these films mostly decreased with increased plasma power (for pressure<2.0 Torr), increased gas pressure, flow rate of oxygen source gas and flow rates of PH₃>0.08 sccm. In order to determine deposition conditions for optimized opto-electronic and structural characteristics of the n-μc-SiO:H film, the gas flow rates, plasma power, deposition pressure and substrate temperature were varied. In these films, the X_c, dark conductivity (σ_d) and activation energy (E_a) remained within the range of 0–50%, 3.5×10⁻¹⁰ S/cm to 9.1 S/cm and 0.71 eV to 0.02 eV, respectively. Low power (30 W) and optimized flow rates of H₂ (500 sccm), CO₂ (5 sccm), PH₃ (0.08 sccm) showed the best properties of the n-μc-SiO:H layers and an improved performance of a solar cell. The photovoltaic parameters of one of the cells were as follows, open circuit voltage (V_oc), short circuit current density (J_sc), fill-factor (FF), and photovoltaic conversion efficiency (η) were 950 mV, 15 mA/cm², 64.5% and 9.2% respectively.     

Low temperature TiO2 rutile phase thin film synthesis by chemical spray pyrolysis (CSP) of titanyl acetylacetonate

Rutile phase TiO₂ thin films have been synthesized using chemical spray pyrolysis of titanyl acetylacetonate TiAcAc in ethanol at 500 °C. The first part of the paper focuses on the thermal decomposition behavior of the precursor by simultaneous thermogravimetry and differential thermal analysis (TG/DTA) coupled with differential scanning calorimetry (DSC). The second part of the paper focuses on the evolution of TiO₂ thin films and their structural transformation with substrate temperature. XRD revealed amorphous TiO₂ thin film at low substrate temperatures (<350 °C) and on high substrate temperatures anatase (3.84 g/cm³) or rutile (4.25 g/cm³) crystalline structure was obtained. The lattice constant, grain size, microstrain and the dislocation density of the film were obtained from the peak width. FTIR spectra of both anatase and rutile TiO₂ revealed stretching vibration of the Ti–O bond for tetrahedral and octahedral surroundings of the titanium atom. Scanning electron micrograph showed the compactness of the rutile film.     

Charge transport mechanism of Al/Bi2Te3/Al thin film devices

Results of dielectric and conduction properties of vacuum evaporated Bi₂Te₃ thin film capacitors (Al/Bi₂Te₃/Al) have been reported in the frequency range 12 Hz to 100 kHz at various temperatures (303–423 K). The variation of capacitance and dielectric constant was found to be temperature and frequency dependent. The capacitance of the film decrease with increasing temperature which may be due to the expansion of the lattice and also due to the excitation of charge carriers at the sites of imperfection. The dielectric constant decreases with frequency at all temperature. This can be attributed to an interfacial polarization caused by space charge. The prevailing ac conduction mechanism in these films is hopping type. The activation energies were evaluated for various thicknesses and it is found to be 0.016 and 0.014 eV for the frequencies 200 Hz and 1 kHz, respectively.     

Enhanced organic ferroelectric field effect transistor characteristics with strained poly(vinylidene fluoride-trifluoroethylene) dielectric

Poly(vinylidene fluoride-trifluoroethylene) (70–30 mol%) was used as the functional dielectric layer in organic ferroelectric field effect transistors (FeFET) for non-volatile memory applications. Thin P(VDF-TrFE) film samples spin-coated on metallized plastic substrates were stretch-annealed to attain a topographically flat-grain structure and greatly reduce the surface roughness and current leakage of semi-crystalline copolymer film, while enhancing the preferred β-phase of the ferroelectric films. Resultant ferroelectric properties (P_R = |10| μC/cm², E_C = |50| MV/m) for samples simultaneously stretched (50–70% strain) and heated below the Curie transition (70 ^oC) were comparable to those resulting from high temperature annealing (>140 ^oC). The observed enhancements by heating and stretching were studied by vibration spectroscopy and showed mutual complementary effects of both processes. Organic FeFET fabricated by thermal evaporating pentacene on the smooth P(VDF-TrFE) films showed substantial improvement of semiconductor grain growth and enhanced electrical characteristics with promising non-volatile memory functionality.     

A facile chemical reduction approach for effectively tuning thermoelectric properties of PEDOT films

Poly(3,4-ethylenedioxythiophene)–tosylate–polyethylene glycol–polypropylene glycol–polyethylene glycol (PEDOT–Tos–PPP) films were prepared via a vapor phase polymerization (VPP) method. The films possess good electrical conductivity (1550 S cm⁻¹), low Seebeck coefficient (14.9 μV K⁻¹) and thermal conductivity (0.501 W m⁻¹ K⁻¹), and ZT ∼ 0.02 at room temperature (RT, 295 K). Then, the films were treated with NaBH₄/DMSO solutions of different NaBH₄ concentrations to adjust the redox level. After the NaBH₄/DMSO treatment (dedoping), the electrical conductivity of the films continuously decreased from 1550 to 5.7 S cm⁻¹, whereas the Seebeck coefficient steeply increased from 14.9 to 143.5 μV K⁻¹. A maximum power factor of 98.1 μW m⁻¹ K⁻² has been achieved at an optimum redox level. In addition, the thermal conductivity of the PEDOT–Tos–PPP films decrease from 0.501 to 0.451 W m⁻¹ K⁻¹ after treated with 0.04% NaBH₄/DMSO solution. A maximum ZT value of 0.064 has been achieved at RT. The electrical conductivity and thermal conductivity (Seebeck coefficient) of the untreated and 0.04% NaBH₄/DMSO treated PEDOT–Tos–PPP films decrease (increases) with increasing temperature from 295 to 385 K. And the power factor of the films monotonically increases with temperature. The ZT at 385 K of the 0.04% NaBH₄/DMSO treated film is 0.155.     

Thermal conductivity of AlN thin films deposited by RF magnetron sputtering

Aluminum nitride (AlN) film, which is being investigated as a possible passivation layer in inkjet printheads, was deposited on a Si (1 0 0) substrate at 400 °C by radio frequency (RF) magnetron sputtering using an AlN ceramic target. Dependence on various reactive gas compositions (Ar, Ar:H₂, Ar:N₂) during sputtering was investigated to determine thermal conductivity. The crystallinity, grain size, and Al–N bonding changes by the gas compositions were examined and are discussed in relation to thermal conductivity. Using an Ar and 4% H₂, the deposited AlN films were crystalline with larger grains. Using a higher nitrogen concentration of 10%, a near amorphous phase, finer morphology, and an enhanced Al–N bonding ratio were achieved. A high thermal conductivity of 134 W/mk, which is nine times higher than that of the conventional Si₃N₄ passivation film, was obtained with a 10% N₂ reactive gas mixture. A high Al–N bonding ratio in AlN film is considered the most important factor for higher thermal conductivity.     

Effect of seed layers (Al,Ti) on optical and morphology of Fe-doped ZnO thin film nanowires grown on Si substrate via electron beam evaporation

The effects of Al and Ti seed layers were studied for undoped and Fe-doped ZnO thin films deposited on n-type Si substrates by electron beam (e-beam) evaporation. The films were characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM) and transmission electron microscopy (TEM). The films grown on seed layers showed wurtzite hexagonal crystal nanorod and nanowire structures. A higher angle phase shift was observed in the doped thin films compared to the pristine ZnO films. Microstructural studies confirmed the growth of nanorods and nanowires with average widths of ~32 nm and ~8–29 nm, respectively. The nanostructures were denser and more crystalline on the Al seed layer than on the Ti seed layer for the doped thin films. However, in the undoped thin films, a more crystalline nature was observed on the Ti seeded layer than the Al seeded layer.     

Biaxially aligned YBCO film tapes fabricated by all pulsed laser deposition

Biaxially aligned yttria-stabilized zirconia (YSZ) films on Ni-based alloy substrates were realized with high deposition rate of 0.5 μm min⁻¹ by the inclined substrate deposition (ISD) technique without ion beam assistance. The microstructure of YSZ was examined to study the growth mechanism of biaxial alignment by ISD. Columnar structures toward the plasma plume suggested a self-shadowing effect in the ISD process. To raise I_c values, YBCO thickness was increased up to 5 μm. Thick YBCO films with high J_c values were realized on the ISD-grown YSZ. Long YBCO tapes with biaxial alignment were successfully fabricated using continuous pulsed laser deposition and a high I_c value of 37.0 A (77.3 K, 0 T) at a 75 cm voltage tap spacing was achieved.     

Effect of Al dopant concentration on structural,optical and photoconducting properties in nanostructured zinc oxide thin films

Thin films of undoped and doped ZnO, with different Al concentrations (1–5 wt%) were deposited onto glass substrates, by the sol–gel spin coating method. Grazing incidence X-ray diffraction (GIXRD) studies confirmed the nature of films as poly-crystalline, with typical hexagonal wurtzite structure. The films showed variation in crystallite size and change in relative intensities, upon different Al doping concentrations. The surface morphology of the films examined using FE-SEM, showed the grain size becoming smaller upon Al doping. The influence of Al with different concentrations, onto ZnO on the optical absorption and transmittance was studied using UV–Vis–NIR spectrophotometer in the wavelength range 300–2500 nm. The UV absorption shifted towards shorter wavelength upon Al doping. The average transmittance in the visible region increased for Al doped films up to 1–2 wt% and decreased for other concentration. The dark and photo conductivity measurements of the films indicated increase in the current values upon doping up to 1–2 wt% of Al and decreased for further concentrations. The rise and decay time measured from the photoresponse study, indicate larger values of rise time for the doped films compared to undoped ZnO. However, the film with 1–2 wt% doping of Al showed better response within the doping concentration. The thermal activation energy obtained from temperature-dependant conductivity showed decrease in the value upon Al doping up to 2 wt% and increased beyond this concentration in the temperature range 300–400 K.     

High-performance C60 and picene thin film field-effect transistors with conducting polymer electrodes in bottom contact structure

C₆₀ and picene thin film field-effect transistors (FETs) in bottom contact structure have been fabricated with poly(3,4-ethylenedioxythiophene): poly(styrenesulfonate) (PEDOT:PSS) electrodes for a realization of mechanical flexible organic FETs. The C₆₀ thin film FETs showed n-channel enhancement-type characteristics with the field-effect mobility μ value of 0.41 cm² V^?1 s^?1, while the picene thin film FET showed p-channel enhancement-type characteristics with the μ of 0.61 cm² V^?1 s^?1. The μ values recorded for C₆₀ and picene thin film FETs are comparable to those for C₆₀ and picene thin film FETs with Au electrodes.     

Effect of high-temperature annealing on lanthanum aluminate thin films grown by ALD on Si(1 0 0)

Amorphous lanthanum aluminate thin films were deposited by atomic layer deposition on Si(1 0 0) using La(ⁱPrCp)₃, Al(CH₃)₃ and O₃ species. The effects of post-deposition rapid thermal annealing on the physical and electrical properties of the films were investigated. High-temperature annealing at 900 °C in N₂ atmosphere leads to the formation of amorphous La-aluminosilicate due to Si diffusion from the substrate. The annealed oxide exhibits a uniform composition through the film thickness, a large band gap of 7.0 ± 0.1 eV, and relatively high dielectric constant (κ) of 18 ± 1.