A novel fiber-reinforced polyethylene composite with added silicon nitride particles for enhanced thermal conductivity

A novel thermally conductive plastic composite was prepared from a mixture of silicon nitride (Si₃N₄) filler particles and an ultrahigh molecular weight polyethylene–linear low density polyethylene blend. The effects of Si₃N₄ particle sizes, concentration, and dispersion on the thermal conductivity and relevant dielectric properties were investigated. With proper fabrication the Si₃N₄ particles could form a continuously connected dispersion that acted as the dominant thermally conductive pathway through the plastic matrix. By adding 0–20% Si₃N₄ filler particles, the composite thermal conductivity was increased from 0.2 to ～1.0 W m^?1 K^?1. Also, the composite thermal conductivity was further enhanced to 1.8 W m^?1 K^?1 by decreasing the Si₃N₄ particle sizes from 35, 3 and 0.2 μm, and using coupling agent, for the composites with higher filler content. Alumina short fibers were then added to improve the overall composite toughness and strength. Optimum thermal, dielectric and mechanical properties were obtained for a fiber-reinforced polyethylene composite with 20% total alumina–Si₃N₄ (0.2 μm size) filler particles.     

Preparation and properties of Si3N4/PS composites used for electronic packaging

A kind of polymer composite was fabricated using polystyrene as the matrix and Si₃N₄ powder as filler employing the method of heat press molding. Microstructure, thermal conductivity and dielectric constant of the Si₃N₄ filled composite were evaluated. The effect of the volume fraction of Si₃N₄, the particle size of the polystyrene matrix and the silane treatment of Si₃N₄ filler on the thermal conductivity of the composite was investigated; dielectric constant of the composite was evaluated. The main factors that affect the thermal conductivity of the composite were confirmed through theoretical analyzing of the experimental data and the thermal conductivity model. Experimental results show that with the filler content increasing, a thermally conductive network is formed in the composites, thus the thermal conductivity of the composite increases rapidly. The composites experience a highest thermal conductivity of 3.0 W/m K when the volume fraction of the filler reaches 40%. The increasing of thermal conductivity is dominated by the ease of forming a thermal conductive network. A larger polystyrene particle size, a higher Si₃N₄ filler content and the silane treatment of the filler have a beneficial effect on improving the thermal conductivity. The dielectric constant increases with the content of Si₃N₄ filler, however, it remains at a relatively low lever (<4, at 1 MHz).     

Enhanced thermal conductivity and dielectric properties of Al/β-SiCw/PVDF composites

Polymeric composites with high thermal conductivity, high dielectric permittivity but low dissipation factor have wide important applications in electronic and electrical industry. In this study, three phases composites consisting of poly(vinylidene fluoride) (PVDF), Al nanoparticles and β-silicon carbide whiskers (β-SiC_w) were prepared. The thermal conductivity, morphological and dielectric properties of the composites were investigated. The results indicate that the addition of 12 vol% β-SiC_w not only improves the thermal conductivity of Al/PVDF from 1.57 to 2.1 W/m K, but also remarkably increases the dielectric constant from 46 to 330 at 100 Hz, whereas the dielectric loss of the composites still remain at relatively low levels similar to that of Al/PVDF at a wider frequency range from 10⁻¹ Hz to 10⁷ Hz. With further increasing the β-SiC_w loading to 20 vol%, the thermal conductivity and dielectric constant of the composites continue to increase, whereas both the dielectric loss and conductivity also rise rapidly.     

Investigation of thermal conductivity and dielectric properties of LDPE-matrix composites filled with hybrid filler of hollow glass microspheres and nitride particles

The hybrid filler of hollow glass microspheres (HGM) and nitride particles was filled into low-density polyethylene (LDPE) matrix via powder mixing and then hot pressing technology to obtain the composites with higher thermal conductivity as well as lower dielectric constant (D_k) and loss (D_f). The effects of surface modification of nitride particles and HGMs as well as volume ratio between them on the thermal conductivity and dielectric properties at 1 MHz of the composites were first investigated. The results indicate that the surface modification of the filler has a beneficial effect on thermal conductivity and dielectric properties of the composites due to the good interfacial adhesion between the filler and matrix. An optimal volume ratio of nitride particles to HGMs of 1:1 is determined on the basis of overall performance of the composites. The thermal conductivity as well as dielectric properties at 1 MHz and microwave frequency of the composites made from surface-modified fillers with the optimal nitride to HGM volume ratio were investigated as a function of the total volume fraction of hybrid filler. It is found that the thermal conductivity increases with filler volume fraction, and it is mainly related to the type of nitride particle other than HGM. The D_k values at 1 MHz and microwave frequency show an increasing trend with filler volume fraction and depend largely on the types of both nitride particles and HGMs. The D_f values at 1 MHz or quality factor (Q × f) at microwave frequency show an increasing or decreasing trend with filler volume fraction and also depend on the types of both nitride particle and HGM. Finally, optimal type of HGM and nitride particles as well as corresponding thermal conductivity and dielectric properties is obtained. SEM observations show that the hybrid filler particles are agglomerated around the LDPE matrix particles, and within the agglomerates the smaller-sized nitride particles in the hybrid filler can easily form thermally conductive networks to make the composites with high thermal conductivity. At the same time, the increase of the value D_k of the composites is restricted due to the presence of HGMs.     

Thermal conductivity of polystyrene–aluminum nitride composite

The thermal conductivity of polymer composites having a matrix of polystyrene (PS) containing aluminum nitride (AlN) reinforcement has been investigated under a special dispersion state of filler in the composites: aluminum nitride filler particles surrounding polystyrene matrix particles. Data for the thermal conductivity of the composites are discussed as a function of composition parameters (aluminum nitride concentration, polystyrene particle size) and temperature. It is found that the thermal conductivity of composites is higher for a polystyrene particle size of 2 mm than that for a particle size of 0.15 mm. The thermal conductivity of the composite is five times that of pure polystyrene at about 20% volume fraction of AlN for the composite containing 2 mm polystyrene particle size. The relationship between thermal conductivity of composites and AlN filler concentrations has been compared with the predictions of two theoretical models from the literature.     

Synthesis and characterization of magnetite nanoparticles via the chemical co-precipitation method

Magnetite nanoparticles were synthesized via the chemical co-precipitation method using ammonium hydroxide as the precipitating agent. The size of the magnetite nanoparticles was carefully controlled by varying the reaction temperature and through the surface modification. Herein, the hexanoic acid and oleic acid were introduced as the coating agents during the initial crystallization phase of the magnetite. Their structure and morphology were characterized by the Fourier transform infrared spectroscopy (FTIR), the X-ray diffraction (XRD) and the field-emission scanning electron microscopy (FE-SEM). Moreover, the electrical and magnetic properties were studied by using a conductivity meter and a vibrating sample magnetometer (VSM), respectively. Both of the bare magnetite and the coated magnetite were of the cubic spinel structure and the spherical-shaped morphology. The reaction temperature and the surface modification critically affected the particle size, the electrical conductivity, and the magnetic properties of these particles. The particle size of the magnetite was increased through the surface modification and reaction temperature. In this study, the particle size of the magnetite nanoparticles was successfully controlled to be in the range of 10–40 nm, suitable for various biomedical applications. The electrical conductivity of the smallest particle size was 1.3 × 10^?3 S/cm, within the semi-conductive materials range, which was higher than that of the largest particle by about 5 times. All of the magnetite nanoparticles showed the superparamagnetic behavior with high saturation magnetization. Furthermore, the highest magnetization was 58.72 emu/g obtained from the hexanoic acid coated magnetite nanoparticles.     

Morphology and thermal conductivity of polyacrylate composites containing aluminum/multi-walled carbon nanotubes

Polyacrylate composites with various fillers such as multi-walled carbon nanotube (CNT), aluminum flake (Al-flake), aluminum powders and Al–CNT were prepared by a ball milling. The thermal decomposition temperature increased by as much as 64 °C for polyacrylate/Al-flake 70 wt% composite compared to polyacrylate. The thermal conductivity of polyacrylate/Al–CNT composites increased from 0.50 to 1.67 W/m K as the Al–CNT content increases from 50 to 80 wt%. The thermal conductivity of the composite sheet increases with the sheet thickness. At the given filler concentration (90 wt%), the composite filled with aluminum powder of 13 μm has a higher thermal conductivity than the one filled 3 μm powder, and the composite filled with mixture of two powders showed a synergistic effect on the thermal conductivity. The morphology indicates that the dispersion of CNT in the polyacrylate/Al-flake + CNT composite is not perfect, and agglomeration of CNTs was observed.     

Effect of mechanical milling on thermoelectric properties of half-Heusler ZrNiSn0.98Sb0.02 intermetallic compound

Thermoelectric properties of half-Heusler ZrNiSn intermetallic compound were investigated. The partial substitution for Sn site in ZrNiSn by Sb is effective for the reduction of the electrical resistivity, which leads to increase the power factor of the compound. The thermal conductivity for ZrNiSn_0.98Sb_0.02 can be reduced by the mechanical milling process maintaining the moderate Seebeck coefficient and electrical resistivity. The reduction of the thermal conductivity is ascribed to the enhancement of the phonon scattering accompanied with the minute crystal grains in the milled compounds. As a result, ZrNiSn_0.98Sb_0.02 with a milling time of 3 h shows a maximum ZT of 0.67 at 573 K.     

Synthesis of Dy doped Yb0.1Ca0.9MnO3 ceramics with a high relative density and their thermoelectric properties

Perovskite-type Yb_0.1Ca_0.9?xDy_xMnO₃ ceramics were synthesized by solid state reaction. Their microstructures were characterized and the thermoelectric properties were evaluated between 300 K and 1100 K. Each of sample exhibits single phase with orthorhombic structure. All samples have high relative densities, and their values are between 95% and 97%, which is consistent with the SEM image. The electrical resistivity shows a typical metallic conductivity behavior. Lowest electrical resistivity 2.36 mΩ cm is achieved at room temperature, and the variation of electrical resistivity is not evident in whole measured temperature range. The Seebeck coefficients are negative, indicating an n-type conduction. The highest power factor 310 μW/(K² m) is obtained for the sample with x = 0.02. The thermal conductivity is decreased by the difference in the mass between the Ca²⁺ and Dy³⁺ ions, especially in the heavy doped samples. The highest figure of merit is 0.11 at 1069 K for the sample with x = 0.02.     

Carbon fiber polymer–matrix structural composites exhibiting greatly enhanced through-thickness thermoelectric figure of merit

The through-thickness thermoelectric behavior of continuous carbon fiber epoxy-matrix composites is greatly improved by adding tellurium particles (13 vol.%), bismuth telluride particles (2 vol.%) and carbon black (2 vol.%). The thermoelectric power is increased from 8 to 163 μV/K, the electrical resistivity is decreased from 0.17 to 0.02.Ω.cm, the thermal conductivity is decreased from 1.31 to 0.51 W/m.K, and the dimensionless thermoelectric figure of merit ZT at 70 °C is increased from 9 × 10⁻⁶ to 9 × 10⁻². Tellurium increases the thermoelectric power greatly. Bismuth telluride decreases the electrical resistivity and thermal conductivity. Carbon black decreases the electrical resistivity.     

Effect of silica coating thickness on the thermal conductivity of polyurethane/SiO2 coated multiwalled carbon nanotube composites

Silica coated multiwalled carbon nanotubes (SiO₂@MWCNTs) with different coating thicknesses of ∼4 nm, 30–50 nm, and 70–90 nm were synthesized by a sol–gel method and compounded with polyurethane (PU). The effects of SiO₂@MWCNTs on the electrical properties and thermal conductivity of the resulting PU/SiO₂@MWCNT composites were investigated. The SiO₂ coating maintained the high electrical resistivity of pure PU. Meanwhile, incorporating 0.5, 0.75 and 1.0 wt% SiO₂@MWCNT (70–90 nm) into PU, produced thermal conductivity values of 0.287, 0.289 and 0.310 W/mK, respectively, representing increases of 62.1%, 63.3% and 75.1%. The thermal conductivity of PU/SiO₂@MWCNT composites was also increased by increasing the thickness of the SiO₂ coating.     

Enhanced conductivity behavior of polydimethylsiloxane (PDMS) hybrid composites containing exfoliated graphite nanoplatelets and carbon nanotubes

Polydimethylsiloxane (PDMS) hybrid composites consisting of exfoliated graphite nanoplatelets (xGnPs) and multiwalled carbon nanotubes functionalized with hydroxyl groups (MWCNTs-OH) were fabricated, and the effects of the xGnP/MWCNT-OH ratio on the thermal, electrical, and mechanical properties of polydimethylsiloxane (PDMS) hybrid composites were investigated. With the total filler content fixed at 4 wt%, a hybrid composite consisting of 75% × GnP/25% MWCNT-OH showed the highest thermal conductivity (0.392 W/m K) and electrical conductivity (1.24 × 10⁻³ S/m), which significantly exceeded the values shown by either of the respective single filler composites. The increased thermal and electrical conductivity found when both fillers are used in combination is attributed to the synergistic effect between the fillers that forms an interconnected hybrid network. In contrast, the various different combinations of the fillers only showed a modest effect on the mechanical behavior, thermal stability, and thermal expansion of the PDMS composite.     

Estimation of thermal conductivity for polypropylene/hollow glass bead composites

The thermal conductivity of hollow glass bead (HGB)-filled polypropylene (PP) composites was estimated using the thermal conductivity equation of inorganic hollow microsphere-filled polymer composites published in the previous paper. The estimations were compared with the measured data of the PP composites filled with two kinds of HGB with different size (the mean diameter was respectively 35 μm and 70 μm). The results showed that the predictions of the thermal conductivity were in good agreement with the measured data except to individual data points. Furthermore, both the estimated and measured thermal conductivity decreased roughly linearly with increasing the HGB volume fraction when the HGB volume fraction was less than 20%; the influence of the particle diameter on the thermal conductivity was insignificant.     

Thermal conductivity of a CuCrZr alloy from 5 K to room temperatures

Thermal conductivity of a CuCrZr alloy containing of 0.71% of Cr and 0.23% of Zr was measured in the temperature interval from 5 K to 300 K. A method utilizing the measurement of thermal conductivity integral of a sample was verified and applied. Measurements of thermal conductivity, electrical resistivity at 4.2 K and 295 K and of Brinell hardness were performed on solution annealed, precipitation hardened and “as received” materials. The CuCrZr alloy was found to be applicable where high mechanical properties together with high and stable thermal conductivity are required. The possibility to predict the thermal conductivity of precipitation hardened copper alloys from the electrical properties even if the RRR values are lower than 10 was verified at RRR = 5.     

Rheological and mechanical properties of carbon nanotube/Graphite/SS316L/polypropylene nanocomposite for a conductive polymer composite

Highly filled conductive fillers (>60 vol%) for conductive polymer composites (CPCs) cause the degradation of rheological and mechanical properties. This study investigated the rheological properties of highly filled metal powder (SS316L) in a polymer matrix composite combined with carbon nanotubes (CNTs) and Graphite (G). The effects of filler concentrations and chemical functionalization on the mechanical and electrical properties of the resulting CPC were determined. Feedstocks with different concentrations were injection molded, and the molded specimens were subjected to tests of tensile strength, three-point bending, hardness, and three-point probe electrical conductivity. The feedstock of CNTs/G/SS316L can be injection molded from 28 vol% polypropylene (PP). The functionalized CPC shows higher strength and elongation than as-produced CPC based on the tensile and flexural tests. The highest flexural and tensile strengths are 80 and 35 MPa, respectively. The functionalized CPC also exhibits higher hardness and better electrical properties than as-produced CPC. Thus, functionalization with CNTs and Graphite enable the reinforcement and formation electrical conducting networks between metal- and carbon-based fillers within a polymer matrix.     

A review of the fabrication and properties of vapor-grown carbon nanofiber/polymer composites

Several varieties of vapor-grown carbon nanofiber with diameters under 200 nm and conically shaped graphene planes canted with respect to the longitudinal fiber axis are available. Because of the strong inter-fiber bonding, compounding these fibers with polymeric resins demands some care. Therefore, fabrication of nanofiber composites has led to variable and occasionally disappointing electrical conductivity and tensile strength. In the following paper we review the published data for vapor-grown carbon nanofiber (VGCNF) composites and show that the best results, achieved with satisfactory dispersion, are consistent with each other and with calculation. With careful preparation techniques, composite tensile strength and modulus of more than triple that of the neat resin can be achieved with 15 vol% fibers. Electrical conductivity can be achieved with less than 1/2 vol% fiber loading, while above 15 vol% loading resistivities near 0.1 Ω cm are possible. Excellent compressive strength and thermal conductivity can also be achieved.     

Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers

Aluminum oxide and aluminum nitride with different sizes were used alone or in combination to prepare thermally conductive polymer composites. The composites were categorized into two systems, one including composites filled with large-sized aluminum nitride and small-sized aluminum oxide particles, and the other including composites filled with large-sized aluminum oxide and small-sized aluminum nitride. The use of these hybrid fillers was found to be effective for increasing the thermal conductivity of the composite, which was probably due to the enhanced connectivity offered by the structuring filler. At a total filler content of 58.4 vol.%, the maximum values of both thermal conductivities in the two systems were 3.402 W/mK and 2.842 W/mK, respectively, when the volume ratio of large particles to small particles was 7:3. This result was represented when the composite was filled with the maximum packing density and the minimum surface area at the same volume content. As such, the proposed thermal model predicted thermal conductivity in good agreement with experimental values.     

Hybrids of silver nanowires and silica nanoparticles as morphology controlled conductive filler applied in flexible conductive nanocomposites

Flexible conductive polymer nanocomposites based on silver nanowires (AgNWs) have been widely studied to develop the next generation of flexible electronics. However, AgNWs tend to aggregate in polymer matrix that usually results in high percolation threshold. In this study, nonconductive silica nanoparticles (nano-SiO₂) were successfully co-assembled on AgNWs to form AgNWs/nano-SiO₂ hybrids and waterborne polyurethane (WPU) conductive nanocomposites filled with the hybrids were prepared. The results show that the resistivity of WPU nanocomposites filled with AgNWs/nano-SiO₂ hybrids decreased about 5000 times and the percolation threshold decreased from 10.6 vol% to 3.6 vol% due to AgNWs distribute more uniformly in WPU with the help of nano-SiO₂. The further study to mechanism of interactions between AgNWs and nano-SiO₂ suggest that the promotion of dispersion is attributed to hydrogen bonding and van der Waals force. The WPU nanocomposites embedded with AgNWs/nano-SiO₂ hybrids present excellent mechanical adhesiveness, flexibility and thermal stability.     

The effect of interfacial state on the thermal conductivity of functionalized Al2O3 filled glass fibers reinforced polymer composites

Rapidly increasing packaging density of electronic devices puts forward higher requirements for thermal conductivity of glass fibers reinforced polymer (GFRP) composites, which are commonly used as substrates in printed circuit board. Interface between fillers and polymer matrix has long been playing an important role in affecting thermal conductivity. In this paper, the effect of interfacial state on the thermal conductivity of functionalized Al₂O₃ filled GFRP composites was evaluated. The results indicated that amino groups-Al₂O₃ was demonstrated to be effective filler to fabricate thermally conductive GFPR composite (1.07 W/m K), compared with epoxy group and graphene oxide functionalized Al₂O₃. It was determined that the strong adhesion at the interface and homogeneous dispersion of filler particles were the key factors. Moreover, the effect of interfacial state on dielectric and thermomechanical properties of GFRP composites was also discussed. This research provides an efficient way to develop high-performance GFRP composites with high thermal conductivity for integrated circuit packaging applications.     

Thermal conductivity of graphene nanoplatelets filled composites fabricated by solvent-free processing for the excellent filler dispersion and a theoretical approach for the composites containing the geometrized fillers

The thermal conductivity of polymer composites containing nanofillers such as GNP (graphene nanoplatelet) and carbon black (CB) was investigated using experimental and theoretical approaches. We developed a fabrication method that allows different shapes and sizes of nanofillers to be highly dispersed in polymer resin. When the bulk and in-plane thermal conductivities of the fabricated composites were measured, they were found to increase rapidly as the GNP filler content increased. The in-plane thermal conductivity of composites with 20 wt.% GNP filler was found to reach a maximum value of 1.98 W/m K. The measured thermal conductivities were compared with the calculated values based on a micromechanics model where the waviness of nanofillers could be taken into account. The waviness of the incorporated GNP filler is an important physical factor that determines the thermal conductivity of composites and must be taken into consideration in theoretical calculations.