On misorientation distribution evolution during anisotropic grain growth

In order to study the development of texture and boundary character during annealing, three-dimensional grain crystallography and crystallographically mediated grain boundary properties were incoporated into a finite temperature Monte Carlo model for grain growth. Randomly textured microstructures evolve normally, with growth exponent n=0.96. While texture remains random, the steady-state boundary misorientation distribution favors low-angle boundaries. To first order, low-angle boundaries increase by lengthening, not by proliferating. In contrast, microstructures with a strong single-component texture develop four-grain junctions and highly curved grain boundaries, which alter evolution. The boundary misorientation distribution narrows and shifts to low angles, and no steady state is observed. The accompanying decrease in mean boundary mobility causes growth to slow, resulting in a growth exponent n=0.62. The dependence of the growth exponent on average boundary mobility may explain experimental observations of exponents less than unity.     

Grain growth in anisotropic systems: comparison of effects of energy and mobility

Grain growth in systems of anisotropic grain boundary energy and mobility is investigated by computer simulations in a two-dimensional textured polycrystalline system. The energy and mobility are allowed to depend on both grain boundary inclination and misorientation. Mobility anisotropy alone does not significantly change the growth kinetics or statistical distributions of misorientation, grain size and number of grain edges, even though grain shapes evolve in a self-dissimilar fashion where the aspect ratio of grains and inclination distribution of grain boundaries are time dependent. Energy anisotropy, however, causes significant deviation of grain growth kinetics, misorientation and edge-distributions from the ones observed in isotropic systems. Moreover, misorientation distribution is skewed towards low energy (special) boundaries. Size distributions are similar in all cases. Mobility anisotropy influences grain growth kinetics only when energy is also anisotropic. Variation of misorientation distribution with time plays the key role in determining the grain growth behavior.     

Analysis of the growth of individual grains during recrystallization in pure nickel

The growth of individual grains during recrystallization in 96% cold-rolled pure nickel has been followed using electron backscatter pattern maps of the same surface area taken after each of several annealing steps. It was found that the growth is quite complex, with boundaries moving, stopping and moving again. The growth kinetics differ from grain to grain and, on average, cube-oriented grains grow the fastest. The growth of the grains has also been analyzed as a function of boundary misorientation. This analysis shows that there is no significant difference in misorientation distribution between boundaries that move and those that do not. This is contrary to the usual assumption that the boundary mobility and the migration rate depend on the misorientation across a boundary. This observation and the reasons for the faster growth of cube-oriented grains are discussed.     

退火温度对新型锆合金薄板带材析出相和织构的影响

采用扫描电镜和超高分辨透射电镜,对具有良好冲制性能的新型锆合金薄板成品带材进行含晶粒、第二相粒子等在内的显微组织研究,并探索真空退火处理条件下温度对带材显微组织的影响。结果显示:新型锆合金薄板成品带材晶粒平均尺寸2.17 μm,存在{0001}<1010>和{0001}<1120>两种织构,大部分晶粒<1120>平行带材RD方向,较少晶粒<1010>平行带材RD方向;第二相粒子分布在晶粒内部及晶界,平均尺寸114 nm,尺寸较大的为不规则椭圆形的Zr-Nb-Fe相,尺寸较小的为圆形的β-Nb相;热处理退火温度降低,带材晶粒尺寸减小,第二相粒子细小弥散分布;新型锆合金薄板成品带材良好冲制性能主要源于轧制积累应变诱发再结晶过程进行充分,导致晶粒细小及孪晶发生破碎;相对轧制变形,退火对带材冲制性能影响不显著。     

Recrystallized microstructural evolution of UFG copper prepared by asymmetrical accumulative rolling-bonding process

Copper sheet with grain size of 30-60μm was processed by plastic deformation of asymmetrical accumulative rolling-bonding(AARB)with the strain of 3.2.The effects of annealing temperature and time on microstructural evolution were studied by means of electron backscattered diffraction(EBSD).EBSD grain mapping,recrystallization pole figure and grain boundary misorientation angle distribution graph were constructed,and the characteristics were assessed by microstructure,grain size,grain boundary misorientation and texture.The results show that ultra fine grains(UFG)are obtained after annealing at 250℃ for 30?40 min.When the annealing is controlled at 250℃for 40 min,the recrystallization is finished,a large number of small grains appear and most grain boundaries consist of low-angle boundaries.The character of texture is rolling texture after the recrystallization treatment,but the strength of the texture is faint.While second recrystallization happens,{110}1ī2+{112}11ī texture component disappears and turns into{122}212cube twin texture component.     

A comparison of grain boundary evolution during grain growth in fcc metals

Grain growth of Cu and Ni thin films, subjected to in situ annealing within a transmission electron microscope, has been quantified using a precession-enhanced electron diffraction technique. The orientation of each grain and its misorientation with respect to its neighboring grains were calculated. The Cu underwent grain growth that maintained a monomodal grain size distribution, with its low-angle grain boundaries being consumed, and the Ni exhibited grain size distributions in stages, from monomodal to bimodal to monomodal. The onset of Ni’s abnormal grain growth was accompanied by a sharp increase in the Σ3 and Σ9 boundary fractions, which is attributed to simulation predictions of their increased mobility. These Σ3 and Σ9 fractions then dropped to their room temperature values during the third stage of grain growth. In addition to the Σ3 and Σ9 boundaries, the Σ5 and Σ7 boundaries also underwent an increase in total boundary fraction with increasing temperature in both metals.     

Effect of grain size on strain-induced martensitic transformation start temperature in an ultrafine grained metastable austenitic steel

Tensile tests were used to investigate the effect of grain size on the strain-induced martensitic transformation start temperature in metastable austenitic steel with special attention to ultrafine grain size. The austenite grains were refined to submicron size by the strain-induced martensite and its reverse transformations (SIMRT), which occurred during a conventional cold rolling and annealing process. The start temperature of the straininduced martensitic transformation was linearly lowered with a decrease in austenite grain size, even down to submicron grain sizes. This result is due to the decrease in grain size causing an increase in the temperature dependency of the strain-induced martensitic transformation and higher austenite stability brought about by grain refinement.     

Mechanism of dynamic continuous recrystallization during superplastic deformation in a microduplex stainless steel

Microstructural evolution during the cyclic cold-rolling and annealing process in an (α + γ) microduplex stainless steel, which consists of α subgrains and fine γ particles, has been studied in detail with the aim of clarifying the mechanism of dynamic continuous recrystallization. A continuous increase in α subgrain boundary misorientation is obtained by the present processing where grain boundary sliding does not occur and the effect of increasing boundary misorientation with cumulative strain is comparable to those observed in dynamic continuous recrystallization of superplastic aluminium alloys. The increase in boundary misorientation is accounted for by the absorption of dislocations into subgrain boundaries during annealing, dislocations which had operated to accommodate the plastic strain incompatibility of the neighboring phases undergoing slip deformation. The present results show that grain boundary sliding is not indispensable but the difference in accommodation deformation between adjacent subgrains is of great importance for the dynamic continuous recrystallization during superplastic deformation.     

Simulation of microstructural evolution during directional annealing with variable boundary energy and mobility

Microstructural evolution during directional annealing has been investigated with variable grain boundary energy and mobility. The boundary energy and mobility were expressed as a function of misorientation between grains and incorporated into a front-tracking grain-growth simulation model. Development of columnar grain structure becomes more difficult with anisotropic boundary properties with the proportion of low angle boundaries increasing with increasing hot zone width. The critical hot zone velocity for the propagation of a columnar grain structure in an anisotropic system is expressed as a function of the boundary misorientation angle. The grain aspect ratio is shown to increase and the texture becomes more pronounced with decreasing hot zone velocity.     

Evolution of misorientation spectrum of grain boundaries of submicrocrystalline molybdenum upon deformation under conditions of grain-boundary diffusion of nickel

Comparative investigations of the concurrent evolution of the structure and the misorientation spectrum of grain boundaries of submicrocrystalline molybdenum have been performed upon free annealing and under the creep conditions at a temperature of 1023 K. It has been established that changes in the misorientation spectrum of grain boundaries of submicrocrystalline molybdenum upon annealing and creep are observed concurrently with boundary migration. The grain-boundary diffusion of nickel upon annealing leads to an increase in the fraction of grain boundaries of the special type with Σ17a in the grain-boundary ensemble of submicrocrystalline molybdenum. Under the creep conditions grain-boundary diffusion fluxes of nickel atoms favor transformation of low-angle boundaries into high-angle boundaries and growth in the angle of misorientation of the high-angle boundaries of submicrocrystalline molybdenum to 45°–60°.     

Grain refinement and boundary misorientation transition by annealing in the laser rapid solidified 6FeNiCoCrAlTiSi multicomponent ferrous alloy coating

A 6FeNiCoCrAlTiSi multicomponent ferrous alloy coating with simple BCC solid solution phase has been prepared by laser cladding on a low carbon steel substrate. Grain boundary misorientation transition and abnormal microstructure refinement in the coating after annealing at 500 °C have been studied by electron backscatter diffraction (EBSD) observation. Before annealing, the microstructure of the coating is mainly composed of directionally solidified columnar grains with low angle grain boundaries distributed as networks. After annealing, the main phase and microhardness of the coating almost remain unchanged. However, the columnar grains transform to equiaxed refined grains with the grain boundary misorientation transition from low to high angles. This result supports such an argument that the reheating process in post-stage of solidification plays a key role on the grain refinement during rapid solidification process.     

Evolution of microstructure and twin density during thermomechanical processing in a γ-γ’ nickel-based superalloy

Microstructure evolution has been studied in the nickel-based superalloy PER®72 subjected to hot torsion, to annealing below the primary γ’ solvus temperature and to annealing at a supersolvus temperature, with a special emphasis on grain size and twin content. Dynamic abnormal grain growth occurs before the onset of dynamic recrystallization. The resulting bimodal grain size distribution affects the grain-coarsening kinetics at the supersolvus temperature, so that the final microstructures depend on the former straining stages. As a consequence, the twin content does not follow a univocal relationship with the average grain size. The grain boundary velocity history before reaching the final grain size is a contributing factor, and this is notably related to the initial grain size distribution width. Dynamically recrystallized microstructures are by nature more homogeneous and thus give rise to lower rates in supersolvus grain coarsening, and accordingly lead to relatively lower twin densities.     

多向锻造和单向轧制304不锈钢高温退火后的晶界面分布

固溶处理后的2组304不锈钢样品分别经应变量ε=2的多向锻造(MF)和单向轧制(DR)后,再经900℃高温退火2—120min.采用电子背散射衍射(EBSD)技术和五参数晶界面分析方法(FPA),研究了样品的晶界特征分布(GBCD)和晶界面分布(GBPD).结果表明,2组样品中∑3~n(n=1,2,3)特殊晶界的比例均不超过45%,并且在退火过程中,非共格∑3晶界逐渐共格化,∑9和∑27晶界比例也随之下降.分别经MF和DR处理后再经120 min退火的样品中,一般大角度晶界(过滤掉Σ3n)一般均以(111)扭转晶界和〈110〉倾侧晶界为主,表明样品中均存在明显的晶界织构(GBT);在某些特定取向差条件下,一般大角度晶界的GBPD在样品中存在显著差异,表明退火之前的加工过程对304不锈钢的GBPD有显著影响.     

Large strain deformation of Ni3Al+B: Part II. Microstructure and texture evolution during recrystallization

The microstructure evolution and texture development of the intermetallic compound Ni₇₆Al₂₄, doped with minor additions of boron, was investigated during annealing subsequent to cold-rolling. Upon annealing of cold-rolled specimens, a hardness increase prior to recrystallization was observed. This is attributed to a relaxation process of the dislocation cores during annealing. Recrystallization proceeded with very different kinetics locally and a very small recrystallized grain size was obtained. From grain growth kinetics, the activation energy for grain boundary motion was found to be close to the activation energy for self-diffusion of Ni in Ni₃Al. The recrystallization texture was almost random. However, three texture components could be invariably recognized ({013}100, {012}021 and {112}294). They are related by special orientation relationships to the brass rolling orientation. A high frequency of annealing twins occurred in the recrystallized microstructure. The misorientation distribution function (MODF) shows a preference of certain low Σ boundaries, namely small-angle boundaries (Σ1) and twins (Σ3).     

喷丸强化对H13钢表面完整性的影响

为研究不同强度喷丸对H13钢表面完整性的影响,采用白光干涉仪、显微硬度计、XRD、SEM和EBSD等对喷丸前后H13钢试样的表面粗糙度、硬度、残余应力和表层微观组织等表面完整性进行了表征,并定量分析了未喷丸和经0.33A喷丸的试样表层组织的晶粒尺寸、晶界取向差及织构等的变化规律。结果表明,不同强度喷丸均改变了H13钢的表面完整性。喷丸在提高表面粗糙度和塑性硬化程度的同时引入了具有一定深度的残余压应力层。与未喷丸试样相比,经0.23 A喷丸后H13钢表面粗糙度提高了约152%。随着喷丸强度从0.23 A增大到0.33 A,硬化层深度由100μm增至160μm,残余压应力层深度由200μm增至300μm。H13钢的未喷丸组织的平均晶粒尺寸为950 nm,晶界平均取向差为33.5858°,主要存在强度较弱的{001}100和{110}111型混合织构;经0.33 A喷丸后距表面10μm处的平均晶粒细化至470 nm,晶界平均取向差增至39.0228°,组织中出现了两类{111}uvw和{hkl}110型板织构,且表层晶粒细化层深度达30μm以上。     

Relative grain boundary area and energy distributions in nickel

The three-dimensional interfacial network of grain boundaries in polycrystalline nickel has been characterized using a combination of electron backscatter diffraction mapping and focused ion beam serial sectioning. These data have been used to determine the relative areas of different grain boundary types, categorized on the basis of lattice misorientation and grain boundary plane orientation. Using the geometries of the interfaces at triple lines, relative grain boundary energies have also been determined as a function of lattice misorientation and grain boundary plane orientation. Grain boundaries comprising (1 1 1) planes have, on average, lower energies than other boundaries. Asymmetric tilt grain boundaries with the Σ9 misorientation also have relatively low energies. The grain boundary energies and areas are inversely correlated.     

激光电弧热源复合模式对301L不锈钢焊接接头性能的弱化机制

激光电弧复合焊在传统的激光填丝焊基础上加入了电弧形成复合热源,导致电弧区产生热量积累,造成焊缝晶粒粗大,并弱化了焊接接头的强度和断后伸长率,促使焊接结构的服役安全性能大幅降低. 通过建立三维熔池温度模型及力学性能分析阐明了激光与电弧协同热作用对焊接接头强度和断后伸长率的影响规律. 结合焊缝的晶粒尺寸、晶界取向差分布、织构强度从微观晶体学角度揭示了焊接接头强度和断后伸长率的弱化机制. 结果表明,电弧介入促使复合热源产生热积累,降低熔池温度梯度,强化了晶粒的择优取向生长及织构强度,导致接头各向异性,从而使焊接接头的断后伸长率降低2%. 较低的温度梯度会延长熔池冷却时间,促使晶粒长大和大角度晶界减少,不利于阻碍位错滑移,导致焊接接头平均屈服强度降低35 MPa,极限抗拉强度降低66 MPa. 并且随着焊接电流的升高,熔池高温停留时间延长,接头晶粒及织构强度增大,接头强度和断后伸长率继续降低.     

EBSD研究高纯金溅射靶材的微观组织与织构

溅射靶材的微观组织均匀性、晶粒尺寸大小及晶粒取向分布对溅射性能有着直接的影响。采用电子背散射衍射(EBSD)技术对制备的高纯Au溅射靶材不同区域的微观组织、织构组分和晶界取向差进行了研究。结果表明,高纯金靶材整体晶粒尺寸分布均匀,平均尺寸192.5 nm,边沿及中心晶界取向差分布比较相似,组织均匀性良好,对溅射高质量薄膜十分有利。     

冷轧变形量和退火制度对超快速加热下5083铝合金晶粒尺寸的影响

利用Gleeble-3500 热模拟系统和电子背散射衍射(EBSD)技术对5083 铝合金的超快速退火组织演变规律进行研究,探讨了快速加热速度、退火温度及冷轧变形量对5083 铝合金晶粒尺寸的影响.结果表明,5083 铝合金经80％的冷轧变形后分别以25、250、500℃/s 的加热速度升温至450℃保温3s 后以40...     

Simulation of the influence of particles on grain structure evolution in two-dimensional systems and thin films

A two-dimensional front-tracking simulation of grain growth has been extended to treat the effects of particles on the evolution of grain structures during annealing. When grain boundaries come into contact with particles, boundary motion is assumed to be pinned. It is found that even a small volume fraction of particles retards grain growth, lowers the ultimate average grain size, and leads to significant changes in the grain-size and number-of-sides distributions. These changes differ in detail from the changes in the grain-size distribution predicted using the Potts model. The changes in the nature of the grain-size distribution are explained by considering the topology of the evolving and of the stagnant grain structures. The average grain size in the stagnant structure scales with the number of particles in a way consistent with a scaling with area fraction of the particles to the power 0.46, in near agreement with the expected dependence from a Zener-pinning analysis in two dimensions. Particle pinning is also simulated in conjunction with the effects of other mechanisms impeding grain growth such as solute drag or grain boundary grooving. In this case it is found that the stagnant grain-size distribution is determined by the competing stagnation forces, and that the Zener-pinning analysis is not obeyed and must be modified.