Temperature dependence of the growth of gallium oxide on CoGa(100)

The oxidation of a CoGa(100) surface at high temperatures has been studied by scanning tunnelling microscopy (STM) and auger electron spectroscopy (AES). When CoGa(100) is oxidised at a sufficiently high temperature (>600 K), an ordered Ga₂O₃ film is formed. The stability of the film depends on the sample temperature and partial oxygen pressure of the ambient gas. At negligible oxygen pressure (<10⁻¹¹ mbar) the oxide is stable up to 850 K. At an oxygen pressure of 10⁻⁶ mbar the oxide is stable up to 930 K and some of the oxide remains present up to 970 K. The oxide film is found to be very uniform. The thickness of the film is constant and independent of the oxidation temperature (600 K<T<930 K), oxygen pressure (<10⁻⁶ mbar), and exposure (10⁻⁴–10⁻² mbar.s≈10²–10⁴ L). We find a clear improvement of the order of the oxide film surface with increasing oxidation temperature. In STM images, a domain structure of the oxide film is observed. The size of the domains increases by a factor of 5–10 when the oxidation temperature is increased from 700 to 900 K.     

Characterization of phosphorus oxinitride (PON) gate insulators for InP metal-insulator-semiconductor devices

A new gate-insulating film consisting of phosphorus oxinitride (PON) was formed on an (n)InP surface by vapour transport technique. The substrate temperature was in the range of 280–350°C. The deposited films were characterized by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectroscopy (SIMS). The interfacial properties of phosphorus oxinitride/(n)InP metal-insulator-semiconductor were investigated. The minimum value of the interface states density distribution (D_it), evaluated from high-frequency capacitance-voltage (C-V) measurement was 1.2 × 10¹¹ eV⁻¹ cm⁻² at about 0.48 eV below the conduction band edge of Inp.     

Structural, electrical, and optical studies on rapid thermally processed ferroelectric BaTiO3 thin films prepared by metallo-organic solution deposition technique

Polycrystalline BaTiO₃ thin films having the perovskite structure were successfully produced on platinum coated silicon, bare silicon, and fused quartz substrate by the combination of the metallo-organic solution deposition technique and post-deposition rapid thermal annealing treatment. The films exhibited good structural, electrical, and optical properties. The electrical measurements were conducted on metal-ferroelectric-metal (MFM) and metal-ferroelectric-semiconductor (MFS) capacitors. The typical measured small signal dielectric constant and dissipation factor at a frequency of 100 kHz were 255 and 0.025, respectively, and the remanent polarization and coercive field were 2.2 μC cm⁻² and 25 kV cm⁻¹, respectively. The resistivity was found to be in the range 10¹⁰–10¹² Ω·cm, up to an applied electric field of 100 kV cm⁻¹, for films annealed in the temperature range 550–700 °C. The films deposited on bare silicon substrates exhibited good film/substrate interface characteristics. The films deposited on fused quartz were highly transparent. An optical band gap of 3.5 eV and a refractive index of 2.05 (measured at 550 nm) was obtained for polycrystalline BaTiO₃ thin film on fused quartz substrate. The optical dispersion behavior of BaTiO₃ thin films was found to fit the Sellmeir dispersion formula well.     

A novel technique for fabrication of metallic structures on polyimide by selective electroless copper plating using ion implantation

The successful use of palladium ion implantation into polyimide to seed an electroless plated film of copper on the polyimide surface is reported. Polyimide (Hitachi PIX 3400) was implanted with palladium ions to doses of 1.5 × 10¹⁵ − 1.2 × 10¹⁷ ions cm⁻² using a MEVVA ion implanter. The implanted ions acted as sites for nucleation of copper film. A copper film was then deposited on implanted polyimide using a commercial electroless plating solution. The ion energy was kept low enough to facilitate a low critical ‘seed’ threshold dose that was measured to be 3.6× 10¹⁶ Pd ions cm⁻². Test patterns were made using polyimide to study the adaptability of this technique to form thick structures. Plated films were studied with optical microscopy, Rutherford Backscattering Spectrometry (RBS) and Profilometry. The adhesion of films was qualitatively assessed by a ‘scotch tape test’. The film growth (thickness) was observed to be linear with plating time. A higher implantation dose led to greater plating rates. The adhesion was found to improve with increasing dose.     

Dielectric properties of AlN films prepared by laser-induced chemical vapour deposition

The dielectric properties and electrical conductivity of AlN films deposited by laser-induced chemical vapour deposition (LCVD) are studied for a range of growth conditions. The static dielectric constant is 8.0 ± 0.2 over the frequency range 10²−10⁷ Hz and breakdown electric fields better than 10⁶ V cm⁻¹ are found for all films grown at temperatures above 130°C. The resistivity of the films grown under optimum conditions (substrate temperature above 170°C, NH₃/TMA flow rate ratio greater than 300 and a deposition pressure of 1–2 Torr) is about 10¹⁴ Ω cm and two conduction mechanisms can be identified. At low fields, F < 5 × 10⁵ V cm⁻¹ and conductivity is ohmic with a temperature dependence showing a thermal activation energy of 50–100 meV, compatible with the presumed shallow donor-like states. At high fields, F > 1 × 10⁶ V cm⁻¹, a Poole-Frenkel (field-induced emission) process dominates, with electrons activated from traps at about 0.7–1.2 eV below the conduction band edge. A trap in this depth region is well-known in AlN. At fields between 4 and 7 × 10⁵ V cm⁻¹ both conduction paths contribute significantly. The degradation of properties under non-ideal growth conditions of low temperature or low precursor V/III ratio is described.     

高分辨X射线衍射表征氮化镓外延层缺陷密度

利用高分辨X射线衍射方法, 分析了在4H-SiC(0001)面上采用金属有机物化学气相沉积(MOCVD)生长的GaN薄膜的位错。采用对称面衍射和斜对称面衍射等方法研究了晶面倾转角、面内扭转角、晶粒尺寸和晶面弯曲半径等参数, 通过排除仪器、晶粒尺寸及晶面弯曲对摇摆曲线半高宽的影响, 从而获得GaN薄膜的螺位错密度和刃位错密度分别为4.62×10⁷ cm^-2和5.20×10⁹ cm^-2, 总位错密度为5.25×10⁹ cm^-2。     

Electrical characterization of CVD diamond thin films grown on silicon substrates

Diamond thin films grown on high resistivity, 100 oriented silicon substrates by the hot filament chemical vapor deposition (HFCVD) method have been characterized by four-point probe and current-voltage (through film) techniques. The resistivities of the as-grown, chemically etched and annealed samples lie in the range of 10² Ω cm to 10⁸ Ω cm. The Raman measurements on these samples indicate sp³ bonding with a sharp peak at 1332 cm⁻¹. The surface morphology as determined by scanning electron microscope shows polycrystalline films with (100) or (111) faceted structures with average grain size of ≈2.5 μm. The through film current-voltage characteristics obtained via indium contacts on these diamond films showed either rectifying or ohmic behavior. The difference in Schottky and ohmic behavior is explained on the basis of the high or low sheet resistivities measured by four-point probe technique. 5% methane to hydrogen concentration during film growth resulted in poor surface morphology, absence of sp³ bonds, and low resistivity.     

Elastic stiffness and thermal expansion coefficients of various refractory silicides and silicon nitride films

The elestic stiffness parameter E_f/(1−ν_f) and the thermal expansion coefficient _f were obtained for four different silicides (TiSi₂, TaSi₂, MoSi₂ and WSi₂) and for two different nitrides (chemically vapor-deposited Nitrox Si₃N₄ and r.f. plasma SiN) from stress-temperature measurements on identical films deposited on two different substrate materials. The values determined for _f and E_f/(1−ν_f) were quite similar for all silicides and averaged 15 ppm °C⁻¹ and 1.1 × 10¹² dyncm⁻² respectively. The thermal mismatch of these silicides is such that, once safely formed, the silicide film should be able to withstand high temperature processing steps without cracking. For the nitrides the values were essentially the same (approximately 1.5 ppm°C^-1), although the larger value of E_f/(1−ν_f) chemically vapor-deposited Si₃N₄ film (3.7 × 10¹² as opposed to 1.1 × 10¹² dyn cm^-2) indicates that it is somewhat stiffer than the SiN film.     

Field-lowering carrier excitation in cadmium arsenide thin films

Cadmium arsenide is a II–V semiconductor which exhibits n-type intrinsic conductivity with high mobility up to μ_n=1.0–1.5 m²/V s. Potential applications include magnetoresistors and both thermal and photodetectors, which require electrical characterization over a wide range of deposition and measurement conditions. The films were prepared by vacuum evaporation with deposition rates in the range 0.5–6.0 nm/s and substrate temperatures maintained at constant values of 20–120°C. Sandwich-type samples were deposited with film thicknesses of 0.1–1.1 μm using evaporated electrodes of Ag and occasionally Au or Al. Above a typical electric field F_b of up to 5×10⁷ V/m all samples showed instabilities characteristic of dielectric breakdown or electroforming. Below this field they showed a high-field conduction process with logJ∝V^1/2, where J is the current density and V the applied voltage. This type of dependence is indicative of carrier excitation over a potential barrier whose effective barrier height has been lowered by the high electric field. The field-lowering coefficient β had a value of (1.2–5.3)×10⁻⁵ eV m^1/2/V^1/2 which is reasonably consistent with the theoretical value of β_PF=2.19×10⁻⁵ eV m^1/2/V^1/2 expected when the field-lowering occurs at donor-like centres in the semiconductor (Poole–Frenkel effect). For thinner films Schottky emission was more probable. The effects of the film thickness, electrode materials, deposition rate, and substrate temperature on the conductivity behaviour are discussed.     

Photoelectron spectroscopy of ion-irradiated B-doped CVD diamond surfaces

Chemical vapour deposition (CVD) diamond films were irradiated by 1 keV argon ions at room temperature with doses ranging from 3.6 × 10¹² to 1.1 × 10¹⁶ Ar⁺ cm². The influence of sputtering on the valence band density of states of a boron-doped CVD diamond film was investigated by ultraviolet photoelectron spectroscopy and the changes in the plasmon features were observed by X-ray photoelectron spectroscopy of the carbon Is core level and its loss region. A gradual change from typical diamond features to amorphous carbon was observed after prolonged bombardment times. Above a critical dose D_crit of 5.8 × 10¹⁴ Ar⁺ cm² the damaged surface layer is characterized by a splitting of the C Is bulk peak into two components: a bulk-like diamond peak at 285.3 eV binding energy and a defect peak with 1 eV lower binding energy, which is attributed to the production of an amorphous sp²-rich carbon matrix. Moreover additional occupied states in the range of 0–4 eV binding energy, completely different to those observed on reconstructed diamond surfaces, were observed in the valence band spectra of the ion-irradiated diamond surface. These filled states can also be attributed to the amorphous carbon matrix which is formed at high doses. At very low doses (< 3 × 10¹⁴ ions cm²) only a band bending of the C Is diamond core level peak, along with the formation of some occupied states in the band structure at around 3.8 eV binding energy was observed. A comparison with annealed hydrogen-free CVD diamond surfaces shows some similarities concerning these filled states. The obtained spectra are compared with other crystalline and amorphous forms of carbon and the results are discussed in terms of an irradiation-induced change in the atomic structure of the surface. A comparison of ion bombarded and annealed diamond samples clearly shows that no graphitization takes place in the latter case.     

衬底温度对碲化镉薄膜性质及太阳电池性能的影响

蒸汽输运法是制备高质量且大面积均匀的CdTe薄膜的一种优良的方法。采用自主研发的一套蒸汽输运沉积系统制备了CdTe多晶薄膜, 并研究了衬底温度对CdTe薄膜性质及太阳电池性能的影响。利用XRD、SEM、UV-Vis和Hall等测试手段研究了衬底温度对薄膜的结构、光学性质和电学性质的影响。结果表明, 蒸汽输运法制备的CdTe薄膜具有立方相结构, 且沿(111)方向高度择优。随着衬底温度的升高(520℃~640℃), CdTe薄膜的平均晶粒尺寸从2 μm增大到约6 μm, CdTe薄膜的载流子浓度也从1.93×10¹⁰ cm^-3提高到2.36×10¹³ cm^-3, 说明提高衬底温度能够降低CdTe薄膜的缺陷复合, 使薄膜的p型更强。实验进一步研究了衬底温度对CdTe薄膜太阳电池性能的影响, 结果表明适当提高衬底温度, 能够大幅度提高电池的效率、开路电压和填充因子, 但是过高的衬底温度又会降低电池的长波光谱响应, 导致电池转换效率的下降。经过参数优化, 在衬底温度为610℃、无背接触层小面积CdTe薄膜太阳电池的转换效率达到11.2%。     

Influence of Si doping level on the Raman and IR reflectivity spectra and optical absorption spectrum of GaN

The optical absorption (hν) and Raman and Infra Red (IR) spectra of Si doped GaN layers deposited on sapphire through buffer layers have been recorded for electron concentrations from 5×10¹⁷ to 5×10¹⁹ cm⁻³. The (hν) values deduced from photothermal deflection spectroscopy (0.5–3.5 eV) and IR absorption (0.15–0.5 eV) vary between 50 and 10⁴ cm⁻¹ showing doping dependant free electron absorption at low energy, doping independant band gap at high energy, and slowly doping dependant defect absorption in the medium energy range. In our micro Raman geometry, maxima appear or can be deduced near the frequency expected for either the A₁(LO⁻) or the A₁(LO⁺) modes split from the A₁(LO) mode by plasmon phonon interaction. There is a large systematic evolution in the expected way for the IR reflectivity.     

A study on the formation and characteristics of the Si---O---C---H composite thin films with low dielectric constant for advanced semiconductor devices

The Si---O---C---H composite thin films were deposited on a p-type Si(100) substrate using bis-trimethylsilane (BTMSM) and O₂ mixture gases by an inductively coupled plasma chemical vapor deposition (ICPCVD). High density plasma of approximately 10¹² cm⁻³ is obtained at low pressure (<320 mtorr) with an RF power of approximately 300 W in the inductively coupled plasma source where the BTMSM and oxygen gases are greatly dissociated. Fourier transform infrared (FTIR) and X-ray photoelectron spectroscopy (XPS) spectra show that the film has Si---CH₃ and O---H related bonds. The CH₃ groups formed the void in the film and the Si atoms in the annealed sample have different chemical states from those in the deposited sample. It means that the void is formed due to the removing of O---H related bonds during the annealing process. The relative dielectric constant of the annealed sample with the flow rate ratio O₂/BTMSM as 0.3 at 500°C for 30 min is approximately 2.5.     

Fabrication and characterization of (1−x)SrBi2Ta2O9–xBi3TaTiO9 layered structure solid solution thin films for ferroelectric random access memory (FRAM) applications

We report on the properties of (1−x)SrBi₂Ta₂O₉–xBi₃TaTiO₉ solid solution thin films for ferroelectric non-volatile memory applications. The solid solution thin films fabricated by modified metalorganic solution deposition technique showed much improved properties compared to SrBi₂Ta₂O₉. A pyrochlore free crystalline phase was obtained at a low annealing temperature of 600°C and grain size was found to be considerably increased for the solid solution compositions. The film properties were found to be strongly dependent on the composition and annealing temperatures. The measured dielectric constant of the solid solution thin films was in the range 180–225 for films with 10–50% of Bi₃TaTiO₉ content in the solid solution. Ferroelectric properties of (1−x)SrBi₂Ta₂O₉–xBi₃TaTiO₉ thin films were significantly improved compared to SrBi₂Ta₂O₉. For example, the observed remanent polarization (2P_r) and coercive field (E_c) values for films with 0.7SrBi₂Ta₂O₉–0.3Bi₃TaTiO₉ composition, annealed at 650°C, were 12.4 μC/cm² and 80 kV/cm, respectively. The solid solution thin films showed less than 5% decay of the polarization charge after 10¹⁰ switching cycles and good memory retention characteristics after about 10⁶ s of memory retention. The improved microstructural and ferroelectric properties of (1−x)SrBi₂Ta₂O₉–xBi₃TaTiO₉ thin films compared to SrBi₂Ta₂O₉, especially at lower annealing temperatures, suggest their suitability for high density FRAM applications.     

The effect of rapid thermal annealing on structural and electrical properties of TiB2 thin films

This work reports on the effect of post-deposition rapid thermal annealing on the structural and electrical properties of deposited TiB₂ thin films. The TiB₂ thin films, thicknesses from 9 to 450 nm, were deposited by e-beam evaporation on high resistivity and thermally oxidized silicon wafers. The resistivity of as-deposited films varied from 1820 μΩ cm for the thinnest film to 267 μΩ cm for thicknesses greater than 100 nm. In the thickness range from 100 to 450 nm, the resistivity of TiB₂ films has a constant value of 267 μΩ cm.

A rapid thermal annealing (RTA) technique has been used to reduce the resistivity of deposited films. During vacuum annealing at 7 × 10⁻³ Pa, the film resistivity decreases from 267 μΩ cm at 200 °C to 16 μΩ cm at 1200 °C. Heating cycles during RTA were a sequence of 10 s. According to scanning tunneling microscopy analysis, the decrease in resistivity may be attributed to a grain growth through polycrystalline recrystallization, as well as to an increase in film density.

The grain size and mean surface roughness of annealed films increase with annealing temperature. At the same time, the conductivity of the annealed samples increases linearly with grain size. The obtained results show that RTA technique has a great potential for low resistivity TiB₂ formation.     

Highly homogeneous silica coatings for optical and protective applications deposited by PECVD at room temperature in a planar uniform distributed electron cyclotron resonance plasma reactor.

Thin near-stoichiometric silica films were deposited by plasma-enhanced chemical vapour deposition (PECVD) using pure SiH₄ and O₂ in a planar plasma reactor based on the proprietary uniform distributed electron cyclotron resonance (UDECR) technology. Samples were kept approximately at room temperature during the process. In the pressure range 0.1–0.4 Pa, dense ( > 5 × 10¹⁰ cm⁻³) diffusion plasmas could be sustained very homogeneously over areas larger than 200 mm× 200 mm. In conjunction with appropriate distributed gas injection set-up, extremely good layer uniformities were obtained, with no visible irisations for thicknesses of 0.1–6 μm. The reactor concept intrinsically lends itself to process scale-up which is even trivial along one dimension. The effects of gas flow rates and substrate r.f. bias were investigated, mainly by Fourier transform infrared absorption spectroscopy and spectroscopic ellipsometry (1.4–5.0 eV). The Si-H and O-H bond contents were found to be very low for all samples. For films deposited under sufficient ion bombardment energy, typical values for the refractive index at 2.0 eV (1.458) and the Si-O-Si stretching frequency (1075 cm⁻¹) were very close to those obtained in the case of thermally grown silica, indicating an unusually dense microstructure for the as-deposited PECVD films grown at quasi-ambient temperature.

Transparent protective coatings 3–5 μm thick showing excellent abrasion resistance and weatherability could thus be deposited on metals and optical polymers.     

Fabrication and characterization of three-dimensional cellular-matrix composites reinforced with woven carbon fabric

A low-density three-dimensional cellular-matrix composite reinforced with woven carbon fabric (3DCMC), was fabricated by means of a pressure-quenching molding technique with nitrogen gas as the blowing agent. Epoxy resins in the interstices of yarns in the 3DCMC samples were vacated during the foaming process and needle shaped voids were also generated between fibers in yarns. The average density of the 3DCMC samples was about 10³ kg/m³, and their density reduction was 28–37% compared with a regular matrix composite with the same preform. The 3DCMC has 32–42% higher specific tensile strength, 14–37% greater specific tensile modulus, a lower specific flexure strength but 35% higher specific tangent modulus in 3-point bending, a 30–40% higher specific impact energy absorption at an impact velocity around 120 m/s and a similar specific energy absorption at about 220 m/s. Meanwhile, the 3-point bending and impact test results of 3DCMC showed that they have different fracture mechanisms from that of 3DRMC.     

Optical constants of polycrystalline CuGaTe2 films

Thin films of CuGaTe₂ with thicknesses in the range, 0.1–1.0 μm were deposited on Corning 7059 glass substrates by flash evaporation. The substrate temperatures, T_s, were maintained in the range 373–623 K. The transmittance of the films was recorded in the wavelength range 900–2500 nm. The dependence of the optical band gap, E_g, on substrate temperature showed that the value of E_g varied from 1.21 eV to 1.24 eV. The variation of refractive index and extinction coefficient with photon energy was studied from which the material properties such as the limiting value of dielectric constant, ε_∞, plasma frequency, ω_p, and hole effective mass, m_h^*, were evaluated as ε_∞ = 7.59, ω_p = 1.47 × 10¹⁴ and m_h^* = 1.25 m₀.     

Deposition and modification of titanium dioxide thin films by filtered arc deposition

Thin films of titanium dioxide have been deposited on glass substrates and conducting (100) silicon wafers by filtered arc deposition (FAD). The influence of the depositing Ti⁻ energy, substrate types and substrate temperature on the structure, density, mechanical and optical properties have been investigated. The results of X-ray diffraction (XRD) showed that with increasing substrate bias, the film structure on silicon substrates changes from anatase to amorphous and then to rutile phase without auxiliary heating, the transition to rutile occurring at a depositing particle energy of about 100 eV. However, in the case of the glass substrate, no changes in the structure and optical properties were observed with increasing substrate bias. The optical properties over the range of 300–800 nm were measured using spectroscopic elliosometery, and found to be strongly dependent on the substrate bias, film density and substrate type. The refractive index values of the amorphous, anatase and rutile films on Si were found to be 2.56, 2.62 and 2.72 at a wavelength of 550 nm, respectively. The hardness and elastic modulus of the films were found to be strongly dependent on the film density. Measurements of the mechanical properties and stress also confirmed the structural transitions. The hardness and elastic modulus range of TiO₂ films were found to be between 10–18 and 140–225 GPa, respectively. The compressive stress was found to vary from 0.7 to 2.6 GPa over the substrate bias range studied. The composition of the film was measured to be stoichiometric and no change was observed with increasing substrate bias. The density of the film varied with change in the substrate bias, and the density ranged between 3.62 and 4.09 g/cm³.     

Enhanced ferroelectric properties of multilayer SrBi2Ta2O9/SrBi2Nb2O9 thin films for NVRAM applications

Ferroelectric SrBi₂Ta₂O₉/SrBi₂Nb₂O₉ (SBT/SBN) multilayer thin films with various stacking periodicity were deposited on Pt/TiO₂/SiO₂/Si substrate by pulsed laser deposition technique. The X-ray diffraction patterns indicated that the perovskite phase was fully formed with polycrystalline structure in all the films. The Raman spectra showed the frequency of the O–Ta–O stretching mode for multilayer and single layer SrBi₂(Ta_0.5Nb_0.5)₂O₉ (SBNT) samples was 827–829 cm⁻¹, which was in between the stretching mode frequency in SBT (813 cm⁻¹) and SBN (834 cm⁻¹) thin films. The dielectric constant was increased from 300 (SBT) to 373 at 100 kHz in the double layer SBT/SBN sample with thickness of each layer being 200 nm. The remanent polarization (2P_r) for this film was obtained 41.7 μC/cm², which is much higher, compared to pure SBT film (19.2 μC/cm²). The coercive field of this double layer film (67 kV/cm) was found to be lower than SBN film (98 kV/cm).