Curing behavior and thermal property of epoxy resin with boron‐containing phenol‐formaldehyde resin

The curing reaction of bisphenol‐A epoxy resin (BPAER) with boron‐containing phenol–formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER‐BPFR was shown to follow autocatalytic kinetics. The activation energy in the dynamic cure reaction was derived. The influence of the composition of BPAER and BPFR on the reaction was evaluated. In addition, the glass transition temperatures (T_gs) were measured for the BPAER‐BPFR samples cured partially at isothermal temperatures. With the curing conditions varying, different glass transition behaviors were observed. By monitoring the variation in these T_gs, the curing process and the thermal property of BPAER–BPFR are clearly illustrated. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1054–1061, 2000     

Curing of epoxy resin using imide‐amines

The curing behavior of diglycidyl ether of bisphenol‐A (DGEBA) was investigated by differential scanning calorimetry, using varying molar ratios of imide‐amines and 4,4′‐diaminodiphenyl sulfone (DDS). The imide‐amines were prepared by reacting 1 mol of pyromellitic dianhydride (P) with excess (2.5 mol) of 4,4′‐diaminodiphenyl ether (E), 4,4′‐diaminodiphenyl methane (M), or 4,4′‐diaminodiphenyl sulfone (S) and designated as PE, PM, PS. Structural characterization was done using FTIR, ¹H NMR, ¹³C NMR spectroscopic techniques and elemental analysis. The mixture of imide‐amines and DDS at ratio of 0 : 1, 0.25 : 0.75, 0.5 : 0.5, 0.75 : 0.25, and 1 : 0 were used to investigate the curing behavior of DGEBA. The multiple heating rate method (5, 10, 15, and 20°C/min) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide‐amine, and also on the ratio of imide‐amine : DDS used. Activation energy was highest in case of epoxy cured using a mixture of DDS : imide‐amine of a ratio of 0.75 : 0.25. Thermal stability of the isothermally cured resins was also evaluated in a nitrogen atmosphere using dynamic thermogravimetry. The char yield was highest in case of resins cured using mixture of DDS : PS (0.25 : 0.75; EPS‐3), DDS : PM (0.25 : 0.75; EPM‐3), and DDS : PE (0.75 : 0.25; EPE‐1). © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3502–3510, 2006     

Studies on curing kinetics and thermal behavior of phosphorylated epoxy resin in the presence of aromatic amide‐amines

This article describes the synthesis of some novel aromatic amide‐amine curing agents by reacting 1 mole of p‐amino benzoic acid with 1 mole of each of 1,4‐phenylene diamine (P), 1,5‐diamino naphthalene (N), 4,4′‐(9‐fluorenyllidene)‐dianiline (F), 3,4′‐oxydianiline (O), and 4,4′‐diaminodiphenyl sulphide (DS) and were designated as PA, NA, FA, OA, and SA, respectively. The aromatic amide‐amines so synthesized were characterized with the help of spectroscopic techniques, viz., Fourier Transform Infrared, proton nuclear magnetic resonance, and carbon nuclear magnetic resonance. The curing kinetics of the epoxy resins obtained by reacting amines with diglycidyl ether of bisphenol‐A blended with tris(glycidyloxy)phosphine oxide in a ratio of 3 : 2, respectively, were investigated by DSC technique using multiple heating rate method (5, 10, 15, 20°C/min). Activation energies were determined by fitting the experimental data into Kissinger and Flynn‐Wall‐Ozawa Kinetic models. The activation energies obtained through Flynn‐Wall‐Ozawa method were slightly higher than Kissinger method but were comparable. However, both the energies were found to be dependent on the structure of amines. The thermal stability and weight loss behavior of isothermally cured thermosets were also investigated using thermogravimetric analysis in nitrogen atmosphere. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Curing and thermal behaviour of epoxy resin in the presence of pyromellitic dianhydride and imidazole

The curing behaviour of DGEBA was investigated by differential scanning calorimetry in the presence of varying amounts of PMDA. The molar ratio of DGEBA : PMDA was varied as 1 : 0.8, 1 : 1, 1 : 1.5, 1 : 2.0, and 1 : 2.5. The heat of polymerization (ΔH) was found to be maximum at a molar ratio of 1 : 0.8 (DGEBA : PMDA). To study the effect of imidazole content on the curing behaviour, varying amounts of imidazole, i.e., 0.1, 0.15, 0.2, and 0.3% (w/w) were used keeping the ratio of DGEBA : PMDA (1 : 0.8) constant. A broad exotherm was observed in all the samples. A significant decrease in the peak exotherm was observed when 0.1% imidazole was used. Further increase in the imidazole concentration up to 0.2% resulted in a marginal decrease in the peak exotherm temperature. Thermal stability of epoxy resin, cured isothermally, was evaluated by recording thermogravimetric traces in nitrogen atmosphere. The percent char yield was highest in case of resin sample, IP1‐30 (i.e., DGEBA (1 mole) cured using 0.8 mole of PMDA in the presence of 0.3 (w/w) of imidazole). © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Curing behavior and thermal properties of multifunctional epoxy resin with methylhexahydrophthalic anhydride

The curing behavior and thermal properties of bisphenol A type novolac epoxy resin (bisANER) with methylhexahydrophthalic anhydride (MHHPA) at an anhydride/epoxy group ratio of 0.85 was studied with Fourier‐transform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC), and thermogravimetry. The results showed that the FTIR absorption intensity of anhydride and epoxide decreased during the curing reaction, and the absorption peak of ester appeared. The dynamic curing energies were determined as 48.5 and 54.1 kJ/mol with Kissinger and Flynn–Wall–Ozawa methods, respectively. DSC measurements showed that as higher is the curing temperature, higher is the glass transition. The thermal degradation of the cured bisANER/MHHPA network was identified as two steps: the breaking or detaching of ? OH, ? CH₂? , ? CH₃, OC? O and C? O? C, etc., taking place between 300 and 450°C; and the carbonizing or oxidating of aromatic rings occurring above 450°C. The kinetics of the degradation reaction was studied with Coats–Redfern method showing a first‐order process. In addition, vinyl cyclohexene dioxide (VCD) was employed as a reactive diluent for bisANER (VCD/bisANER = 1 : 2 w/w) and cured with MHHPA, and the obtained network had a higher T_g and a slight lower degradation temperature than the undiluted system. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 2041–2048, 2007     

Synthesis and characterization of a novel silicon‐containing polytriazole resin

4,4′‐Diazidomethylbiphenyl (DAMBP) and poly(dimethylsilylene‐ethynylenephenyleneethynylene) (PDMSEPE) were thermally polymerized to form a novel silicon‐containing polytriazole resin (PDMSEPE‐DAMBP) by 1,3‐dipolar cycloaddition. Differential scanning calorimetry, FTIR, and ¹³C‐NMR were used to characterize the curing behaviors of PDMSEPE‐DAMBP resins. The results indicated that the resins could cure at temperatures as low as 80°C. Dynamic mechanical analysis showed that there was a glass transition at 302°C for the cured PDMSEPE‐DAMBP resin. The carbon fiber (T700) reinforced PDMSEPE‐DAMBP composites exhibited excellent mechanical properties at room temperature and high property retention at 250°C. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Synthesis and characterization of silicon‐containing poly(amide‐amide)s

A modified new aromatic diacid, bis[(4‐carboxyphenyl) 4‐benzamide] dimethylsilane (IV) with preformed amide linkages and a silicon moiety was synthesized and characterized by IR, NMR, mass spectroscopy, and a physical constant. Novel poly(amide‐amide)s were synthesized from IV and aromatic diamines by Yamazaki's direct polyamidation method in N‐methyl pyrrolidinone. The polymers were obtained in excellent yields and showed reduced viscosities in the range of 0.42–6.15 dL/g. They were readily soluble in aprotic polar solvents. These poly(amide‐amide)s showed glass‐transition temperatures of 303–378°C as measured by DSC and showed no weight loss below 377°C in a nitrogen atmosphere. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 1610–1617, 2001     

Novel adamantane‐containing epoxy resin

A novel adamantane‐containing epoxy resin diglycidyl ether of bisphenol‐adamantane (DGEBAda) was successfully synthesized from 1,3‐bis(4‐hydroxyphenyl)adamantane by a one‐step method. The proposed structure of the epoxy resin was confirmed with Fourier transform infrared, ¹H‐NMR, gel permeation chromatography, and epoxy equivalent weight titration. The synthesized adamantane‐containing epoxy resin was cured with 4,4′‐diaminodiphenyl sulfone (DDS) and dicyandiamide (DICY). The thermal properties of the DDS‐cured epoxy were investigated with differential scanning calorimetry and thermogravimetric analysis (TGA). The dielectric properties of the DICY‐cured epoxy were determined from its dielectric spectrum. The obtained results were compared with those of commercially available diglycidyl ether of bisphenol A (DGEBA), a tetramethyl biphenol (TMBP)/epoxy system, and some other associated epoxy resins. According to the measured values, the glass‐transition temperature of the DGEBAda/DDS system (223°C) was higher than that of the DGEBA/DDS system and close to that of the TMBP/DDS system. TGA results showed that the DGEBAda/DDS system had a higher char yield (25.02%) and integral procedure decomposition temperature (850.7°C); however, the 5 wt % degradation temperature was lower than that of DDS‐cured DGEBA and TMBP. Moreover, DGEBAda/DDS had reduced moisture absorption and lower dielectric properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Curing behavior of epoxy resin having hydroxymethyl group

A new type of epoxy resin having hydroxymethyl group was synthesized. This epoxy resin was mixed with commercial epoxy resin in various ratios. The mixed epoxy resins were cured with a mixture of 4,4′-diaminodiphenylmethane and m-phenylenediamine (molar ratio, 6 : 4) as a hardener. Curing behavior of the epoxy resin systems with the hardener was examined by DSC and TG-DSC, and parameters of cure reaction were obtained. Viscoelastic properties of cured resin were studied by dynamic mechanical analyzer. It was found that the higher the amount of epoxy resin having hydroxymethyl group, the lower the activation energy (Ea) and the higher the rate constant (k) were. It was also found that the higher the amount of the epoxy resin having hydroxymethyl group, the better heat resistance the fully-cured resin had. These results were explained as follows: Hydroxymethyl group accelerated an epoxideamine reaction. The crosslinking density of the cured resin was increased because in the hydroxymethyl group occurred a condensation reaction above 200°C.     

Curing and post‐curing luminescence in an epoxy resin

A spontaneous luminescence is reported when epoxy resin samples are heated in air. This phenomenon is very sensitive to the nature of the atmosphere. The same treatment in nitrogen leads to an extinction of the luminescence. The emission process is restored when samples are kept for a sufficient time in air. To better understand this phenomenon, we have investigated the luminescence of the elementary constituents of the epoxy (resin and hardener), when heated in air and nitrogen, as well as during resin‐curing in the same atmospheres. It appears that the emission process is linked with the presence of oxygen. Although the kinetics of the luminescence can differ, depending on the nature of the sample (cured resin, resin during curing, liquid components), the emission spectra are the same during resin‐curing and upon heating of the cured resin and hardener. The emission spectrum of the base resin is different. It is concluded that the light results from a chemiluminescence process during oxidation. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 1899–1904, 2006     

Halogen‐free flame retardant epoxy resins from hybrids of phosphorus‐ or silicon‐containing epoxies with an amine resin

Epoxy–melamine hybrid resins were obtained from in situ polymerization of siliconized (SE500) and phosphorylated (PE690) epoxy resins with hexakis(methoxymethyl)melamine (HMMM). The hybrid resins having HMMM contents less than 15 wt % exhibited high transparency and homogeneity. The compatibilities between SE500 and melamine as well as that between PE690 and melamine were poor than the compatibility between general bisphenol‐A epoxy and melamine. Incorporation of HMMM altered the degradation mechanisms and enhanced the thermal stability of the epoxy resins, especially for PE690 based resins. Excellent flame retardant property was observed with the hybrid resins because of the Si? N and P? N synergisms of flame retardation. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1071–1077, 2006     

Curing behavior of Azo‐containing twin liquid crystalline epoxy resins with anhydride

A series of novel azo‐containing twin liquid crystalline (LC) epoxy monomers were cured with anhydrides without extra catalyst, and the curing kinetics was investigated by non‐isothermal differential scanning calorimetry (DSC) technique. The results showed that the effect of phase behavior on activation energy (E_a) was enormous, which increased first and then decreased quickly with the curing reaction processing. The chemical kinetic control and diffusion‐control mechanisms dominate the curing together, which gives large values of E_a. Azo group also served as a catalyst to accelerate the curing reaction. The curing mechanism was confirmed by the UV–Vis spectra of azo‐doped curing system in which the absorbance values at 366 nm and 475 nm changed with the curing reaction processing. POLYM. ENG. SCI., 2012. © 2012 Society of Plastics Engineers     

Curing and toughening of a styrene‐modified epoxy resin

A commercially available epoxy resin (E907) formulated with a viscosity‐reducing styrene monomer and several additives was subjected to thermal cure studies and mechanical property measurements. Thermoplastic poly(arylene ether sulfone) (PES) and poly(arylene ether phosphine oxide) (PEPO) with reactive amine or hydroxyl end groups were utilized to toughen and co‐cure with the system. The cure cycle was optimized and the networks were analyzed via differential scanning calorimetry, thermogravimetric analysis, dynamic mechanical analyzer, scanning electron microscopy, sol–gel extractions, and fracture toughness. A model epoxy resin was prepared from a tetrafunctional epoxy, e.g., MY722, difunctional EPON828, styrene monomer, and benzoyl peroxide initiator (BPO), and was evaluated as a control to assess the possible role of the styrene monomer. The optimized cure cycle for E907 was 6 h at 93°C, followed by a postcure of 2 h at 204°C. The fracture toughness of E907 was increased only marginally with PES and PEPO. In contrast, the model epoxy resin demonstrated a positive effect due to the styrene monomer and BPO and exhibited significantly increased fracture toughness with PES modification. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 1504–1513, 2001     

Curing kinetics and thermal property characterization of the bisphenol‐F epoxy resin and phthalic anhydride system

The curing kinetics of bisphenol‐F epoxy resin (BPFER) and curing agent phthalic anhydride, with N,N‐dimethylbenzylamine as an accelerator, were studied by differential scanning calorimetry (DSC). Analysis of DSC data indicated autocatalytic behaviour in the first stages of the cure for the system, and that this, could be well described by the model proposed by Kamal, which includes two rate constants, k₁ and k₂, and two reaction orders, m and n. The curing reaction in the later stages was practically diffusion‐controlled. To consider the diffusion effect more precisely, a diffusion factor, ??(α), was introduced into Kamal's equation. The glass transition temperatures (T_gs) of the BPFER/phthalic anhydride samples were determined by means of torsional braid analysis. The thermal degradation kinetics of cured BPFER were investigated by thermogravimetric analysis. © 2002 Society of Chemical Industry     

Curing kinetics and thermal property characterization of a bisphenol‐F epoxy resin and DDO system

The curing kinetics of a bisphenol‐F epoxy resin (BPFER)/4,4′‐diaminodiphenyl oxide (DDO) system were studied with isothermal experiments via differential scanning calorimetry. Autocatalytic behavior was shown in the first stages of the cure for the system, which was well described by the model proposed by Kamal that includes two rate constants, k₁ and k₂, and two reaction orders, m and n. The curing reaction at the later stages was practically diffusion‐controlled because of the onset of gelation and vitrification. For a more precise consideration of the diffusion effect, a diffusion factor, f(α), was introduced into Kamal's equation. In this way, the curing kinetics were predicted well over the entire range of conversion, covering both previtrification and postvitrification stages. The glass‐transition temperatures (T_g's) of the BPFER/DDO system partially isothermally cured were determined by means of torsional braid analysis, and the results showed that T_g's increased with conversion up to a constant value. The highest T_g was 376.3 K. The thermal degradation kinetics of cured BPFER were investigated with thermogravimetric analysis, which revealed two decomposition steps. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1586–1595, 2002     

Curing kinetics and thermal property characterization of a bisphenol‐S epoxy resin and DDS system

The kinetics of the cure reaction for a system of bisphenol‐S epoxy resin (BPSER), with 4,4′‐diaminodiphenyl sulfone (DDS) as a curing agent was investigated with a differential scanning calorimeter (DSC). Autocatalytic behaviour was observed in the first stages of the cure which can well be described by the model proposed by Kamal, using two rate constants, k₁ and k₂, and two reaction orders, m and n. The overall reaction order, m + n, is in the range 2∼2.5, and the activation energy for k₁ and k₂ was 86.26 and 65.13 kJ mol⁻¹, respectively. In the later stages, a crosslinked network was formed and diffusion control was incorporated to describe the cure. The glass transition temperature (T_g) of the BPSER/DDS samples partially cured isothermally was determined by means of torsional braid analysis (TBA) and the results showed that the reaction rate increased with increasing T_g, in terms of rate constant, but decreased with increasing conversion. It was also found that the  SO₂ group both in the epoxy resin and in the hardener increases the T_g values of the cured materials compared with that of BPAER. The thermal degradation kinetics of this system was investigated by thermogravimetric analysis (TGA). It illustrated that the thermal degradation of BPSER/DDS has nth order reaction kinetics. © 2000 Society of Chemical Industry     

Curing and thermal behavior of diglycidyl ether of bisphenol A in the presence of a mixture of amines

The curing behavior of diglycidyl ether of bisphenol A (DGEBA) was investigated by differential scanning calorimetry with mixtures of silicon‐containing amide–amines and diaminodiphenyl sulfone (DDS). Silicon‐containing amide–amines were prepared by the reaction of 2.5 mol of 4,4′‐diaminodiphenyl ether (E), 4,4′‐diaminodiphenyl methane (M), 3,3′‐diaminodiphenyl sulfone (mS), 4,4′‐diaminodiphenyl sulfone (pS), bis(3‐aminophenyl) methyl phosphine oxide (B), or tris(3‐aminophenyl) phosphine oxide (T) with 1 mol of bis(4‐chlorobenzoyl) dimethyl silane. Mixtures of the amide–amines and DDS at ratios of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25, and 1:0 were used to investigate the curing behavior of DGEBA. A single exotherm was observed on curing with a mixture of amide–amine and DDS. This clearly shows that the mixture participated in the cocuring reaction. The peak exotherm temperature depended on the structure and the molar ratio of amide–amines. With all of the amide–amines and DDS, a significant decrease in the kick‐off temperature of the curing exotherm was observed on the incorporation of a 0.25 molar fraction of amide–amines. Thus, with the mixture, the curing temperatures were reduced and were lowest for ether‐containing amide‐amines and highest for methylene‐containing amide–amines. The char yield was almost similar in the samples cured with amide–amines (E, pS, or mS) or DDS. The char yield was higher than for either of the constituents when a mixture was used. A synergistic behavior was observed when a mixture of E, M, mS, or pS and DDS was used, whereas mixture of B or T and DDS showed antigonism in the char yield. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 1739–1747, 2003     

Synthesis,thermal and mechanical behavior of a silicon/phosphorus containing epoxy resin

A liquid silicon/phosphorus containing flame retardant (DOPO–TVS) was synthesized with 9,10‐dihydro‐9‐oxa‐10‐phosphapheanthrene‐10‐oxid (DOPO) and triethoxyvinylsilane (TVS). Meanwhile, a modified epoxy resin (IPTS–EP) was prepared by grafting isocyanate propyl triethoxysilane (IPTS) to the side chain of bisphenol A epoxy resin (EP) through radical polymerization. Finally, the flame retardant (DOPO–TVS) was incorporated into the modified epoxy resin (IPTS–EP) through sol–gel reaction between the ethyoxyl of the two intermediates to obtain the silicon/phosphorus containing epoxy resin. The molecular structures of DOPO–TVS, IPTS–EP and the final modified epoxy resin were confirmed by FTIR spectra and ¹H‐NMR, ³¹P‐NMR. Thermogravimetric analysis (TGA), differential scanning calorimetry, and limiting oxygen index were conducted to explore the thermal properties and flame retardancy of the synthesized epoxy resin. The thermal behavior and flame retardancy were improved. After heating to 600°C in a tube furnace, the char residue of the modified resin containing 10 wt % DOPO–TVS displayed more stable feature compared to that of pure EP, which was observed both by visual inspection and scanning electron microscope (SEM). Moreover, the mechanical performance testing results exhibited the modified epoxy resins possessed elevated tensile properties and fracture toughness which is supported by SEM observation of the tensile fracture section. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42788.     

Curing and mechanical characterization of a soy‐based epoxy resin system

A potentially inexpensive alternative epoxy resin system based on soybean oil has been developed for polymer composite applications. Epoxidized methyl soyate (EMS) and epoxidized allyl soyate (EAS) have been synthesized at the University of Missouri–Rolla. These materials consist of mixtures of epoxidized fatty acid esters. The epoxidized soy‐based resins provide better intermolecular crosslinking and yield materials that are stronger than materials obtained with commercially available epoxidized soybean oil (ESO). The curing behavior and glass transition have been monitored with differential scanning calorimetry. Neat resin test samples have been fabricated from resin systems containing various amounts of EMS, EAS, and ESO. Standardized tests have shown that the addition of EAS enhances the tensile and flexural properties of the base epoxy resin system. Therefore, epoxidized soy ester additives hold great potential for environmentally friendly and lower cost raw materials for the fabrication of epoxy composites for structural applications. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91: 3513–3518, 2004     

Curing of epoxy resins with amines

Summary Using determination of the critical molar ratio of functional groups necessary for gel formation with amino groups in excess, network formation was investigated in the reaction of diglycidyl ether of Bisphenol A (DGEBA) and nitrogen-containing epoxy resins — diglycidylaniline and N,N,N,N-tetraglycidyl-4,4-diaminodiphenylmethane with aromatic or aliphatic amines. It was found that in the case of nitrogen-containing epoxides the crosslinking is accompanied by pronounced cyclization, unlike in systems with DGEBA. Gelation depends on the relative reactivity of the primary and secondary hydrogen atom of the amino group. In the case of nitrogen-containing polyepoxides, the dependence of reactivities of adjacent glycidyl groups is also operative.