Phosphorous‐containing epoxy resins from a novel synthesis route

The ? P(O)‐H in 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) was used as an active group to react with the carbonyl group in 4,4′‐dihydroxybenzophenone (DHBP) to result a novel phosphorous‐containing biphenol compound (DOPO‐2OH). Phosphorous‐containing epoxy resins were therefore obtained from reacting DOPO‐2OH with epichlorohydrin or with diglycidylether bisphenol A. The synthesized compounds were characterized with FTIR, ¹H and ³¹P NMR, elemental analysis, and epoxide equivalent weight titration to demonstrate the their chemical structures. Cured epoxy resins were prepared via thermal curing the epoxy resins with various curing agents. Thermal analysis results (differential scanning calorimetry and thermogravimetric analysis) revealed that these cured epoxy resins exhibited high glass transition temperatures and high thermal stability. High char yields at 700°C and high LOI (limited oxygen index) values were also found for the cured epoxy resins to imply that the resins were possessing high flame retardancy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1697–1701, 2002     

Polyamide‐enhanced flame retardancy of ammonium polyphosphate on epoxy resin

An attractive intumescent flame retardant epoxy system was prepared from epoxy resin (diglycidyl ether of bisphenol A), low molecular weight polyamide (cure agent, LWPA), and ammonium polyphosphate (APP). The cured epoxy resin was served as carbonization agent as well as blowing agent itself in the intumescent flame retardant formulation. Flammability and thermal stability of the cured epoxy resins with different contents of APP and LWPA were investigated by limited oxygen index (LOI), UL‐94 test, and thermogravimetric analysis (TGA). The results of LOI and UL‐94 indicate that APP can improve the flame retardancy of LWPA‐cured epoxy resins. Only 5 wt % of APP can increase the LOI value of epoxy resins from 19.6 to 27.1, and improve the UL‐94 ratings, reaching V‐0 rating from no rating when the mass ratio of epoxy resin to LWPA is 100/40. It is much interesting that LOI values of flame retardant cured epoxy resins (FR‐CEP) increase with decreasing LWPA. The results of TGA, FTIR, and X‐ray photoelectron spectroscopy (XPS) indicate that the process of thermal degradation of FR‐CEP consists of two main stages: the first stage is that a phosphorus rich char is formed on the surface of the material under 500°C, and then a compact char yields over 500°C; the second stage is that the char residue layer can give more effective protection for the materials than the char formed at the first stage do. The flame retardant mechanism also has been discussed according to the results of TGA, FTIR, and XPS for FR‐CEP. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Synthesis and characterization of epoxy film cured with phosphorous‐containing phenolic resin

Through the electrophilic addition reaction of ? P(O)? H and C?C, a series of novel phosphorus‐containing phenolic resins bearing maleimide (P‐PMFs) were synthesized and used as curing agent for preparing high performance and flame retardancy epoxy resins. The structure of the resin was confirmed with FTIR and elemental analysis. Thermal properties and thermal degradation behaviors of the thermosetted resin was investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The epoxy resins exhibited high glass transition temperature (143–156°C), goof thermal stability (>330°C) and retardation on thermal degradation rates. High char yields (700°C, 52.9%) and high limited oxygen indices (30.6–34.8) were observed, indicating the resins' good flame retardance for the P‐PMFs/CNE cured resins. The developed resin may be used potentially as environmentally preferable products in electronic fields. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 3813–3817, 2007     

Preparation of phosphorous‐containing poly(epichlorohydrin) and polyurethane from a novel synthesis route

Phosphorylation of poly(epichlorohydrin) (PECH) was successfully performed via reacting the P? H bond of 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) with the pendent chloromethyl groups of PECH. From this reaction, phosphorus‐containing PECH with hydroxyl terminal groups was obtained. This compound was further reacted with toluene‐2,4‐diisocyanate to form a phosphorous‐containing polyurethane. The performance of the phosphorylation reaction and the structure of the resulting polymers were characterized by Fourier transform infrared spectroscopy, phosphorous‐31 nuclear magnetic resonance (³¹P NMR) spectroscopy, and elemental analysis. The phosphorylated PECH and polyurethane were characterized by thermogravimetric analysis (TGA), which showed weight loss retardation behavior under air at high temperature at >500 °C and high char yield at 700 °C. Both of the synthesized polymers are potentially useful as multifunctional modifiers for epoxy resins and for improving the toughness and flame retardancy of the resins. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 2254–2259, 2002     

Flame retardant epoxy resins based on diglycidyl ether of isobutyl bis(hydroxypropyl)phosphine oxide

Phosphorous‐containing epoxy resins were prepared from diglycidyl ether of isobutyl bis(hydroxypropyl)phosphine oxide (IHPOGly) and diglycidyl ether of bisphenol A (DGEBA) by crosslinking with 2,4‐diaminotoluene. Several IHPOGly/DGEBA molar ratios were used to obtain materials with different phosphorous content. Thermal, dynamomechanical, and flame retardant properties were evaluated and related with the phosphorous content. The weight loss rate of phosphorous‐containing resins is lower than that of the phosphorous‐free resin for the thermoxidative degradation. Char yields under nitrogen do not show significant differences among the phosphorous‐containing resins and the phosphorous‐free resin, while under air char yields increase with the phosphorous content. The presence of phosphorous increases the limiting oxygen index (LOI) values even when the phosphorous content is low, and no significant differences with the phosphorous content are observed. V‐0 materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 1367–1373, 2006     

Improving thermal and flame‐retardant properties of epoxy resins by a novel reactive phosphorous‐containing curing agent

In an attempt to improve thermal and flame‐retardant properties of epoxy resins efficiently, a new reactive phosphorus‐containing curing agent called 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐(phenylimino)‐(4‐hydroxyphenyl)me‐thane (DOPO‐PHM) was synthesized and was combined with 4,4′‐diaminodiphenyl methane (DDM) to co‐cure epoxy resins (E51), which covalently incorporated halogen‐free DOPO organ groups into the epoxy networks. The chemical structure of this curing agent was confirmed by FTIR, 1D, and 2D NMR spectra. A reaction mechanism during the preparation was proposed, and the electron effect on the stabilization of the carbocation was discussed. Various DDM/DOPO‐PHM molar ratios were used to get the materials with different phosphorus contents. Their dynamic mechanical, thermal, and flame‐retardant properties were evaluated by dynamic mechanical thermal analysis, thermogravimetric analysis, and limiting oxygen index (LOI) respectively. All samples had a single T_g, showing that these epoxy resins were homogeneous phase for long‐term use in spite of adding DOPO‐PHM. Both char yields (under nitrogen and air atmospheres) increased with the increasing of phosphorus content and the LOI values increased from 24.5 for standard resin to 33.5 for phosphorus‐containing resins, indicating the significant enhancement of thermal stability and flame retardancy. POLYM. ENG. SCI., 54:1192–1200, 2014. © 2013 Society of Plastics Engineers     

New epoxy resins. II. The preparation,characterization, and curing of epoxy resins and their copolymers

A polymer having high aromaticity and/or cyclic ring structures in the chain backbone usually gives high heat resistance and flame resistance. Five glycidyl ether-type epoxy resins are prepared from bisphenol A (DGEBA), 9,9-bis(4-hydroxyphenyl)fluorene (DGEBF), 3,6-dihydroxyspiro-[fluorene-9,9′-xanthane] (DGEFX), 10,10-bis(4-hydroxyphenyl) anthrone (DGEA), and 9,9,10,10-tetrakis(4-hydroxyphenyl)anthracene (TGETA) in order to study structure–thermal stability–flame resistance property relationships. In this study, trimethoxyboroxine (TMB) and diaminodiphenylsulfone (DDS) are employed as the curing agents. The char yield at 700°C under a nitrogen atmosphere and the glass transition temperature (T_g) for the uncured resins decrease according to the sequence TGETA > DGEFX > DGEA > DGEBF > DGEBA. The Tg values for these cured epoxy resins are DGEBA < DGEBF < DGEFX < DGEA. A T_g for the TGETA is not obtainable but would be expected to be the highest. The char yields at 700°C of these cured epoxy resins have the same trend as the uncured resins. DGEBF, DGEFX, DGEA, and TGETA added to the DGEBA system show increases in the char yield, T_g, and oxygen index with increasing concentration of these novel epoxy resins.     

Improving thermal and flame‐retardant properties of epoxy resins by a new imine linkage phosphorous‐containing curing agent

A new reactive phosphorus‐containing curing agent with imine linkage called 4, 4′‐[1, 3‐phenyl‐bis(9, 10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl)dimethyneimino)]diphenol (2) was synthesized both via two‐pot and one‐pot procedure. The chemical structure of this curing agent was confirmed by FTIR, ¹H, ¹³C, and ³¹P NMR spectra. A series of thermosetting systems were prepared by using conventional epoxy resins (E51), 4, 4′‐diaminodiphenyl methane (DDM) and (2). Resins with different phosphorus contents were obtained by changing the DDM/(2) molar ratios. Their dynamic mechanical thermal, thermal and flame‐retardant properties were evaluated by dynamic mechanical thermal analysis (DMTA), thermogravimetric analysis (TGA), and limiting oxygen index (LOI), respectively. All samples had a single T_g, which showed that these epoxy resins were homogeneous phase. Both the two char yields under nitrogen and air atmospheres increased with increasing content of (2) and the LOI values increased from 24.5 for standard resin to 37.5 for phosphorus‐containing resin, which indicated that incorporation of (2) could impart good thermal stability and excellent flame retardancy to the conventional epoxy thermosets. POLYM. ENG. SCI., 56:441–447, 2016. © 2016 Society of Plastics Engineers     

Simultaneously Improving the Thermal,Flame‐Retardant and Mechanical Properties of Epoxy Resins Modified by a Novel Multi‐Element Synergistic Flame Retardant

To obtain epoxy resins with satisfactory thermal, flame retardant, and mechanical properties, a novel multi‐element synergistic flame retardant (PPVSZ) is synthesized through the reaction between P? H of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) and C?C of polysilazane (PVSZ) and utilized as a multi‐element synergistic flame retardant for epoxy resins. The flame retardant mechanism is explored by XPS and SEM, confirming that the excellent flame‐retardance efficiency owes itself to an optimal flame retardant way which jointly exerts the flame‐retardant effects in the gaseous and condensed phase. The thermal properties deduced from DSC, TGA, and DMA, indicate the glass transition temperature, maximum weight loss rate, and char yields at 700 °C for EP‐2 increase by about 5.0 °C, 8.4 °C and 8.8%, respectively. Furthermore, mechanical properties such as impact strength, tensile strength, and flexural strength are also increased by 45.38%, 14.16%, and 17.43%, respectively, which show that the incorporation of PPVSZ does not deteriorate the mechanical properties of modified resin. All the results demonstrate that epoxy resins modified by PPVSZ not only have good effect on the flame retardance, but also have good improvement on thermal and mechanical properties, indicating the potential for applications in many fields requiring fire safety.     

Synthesis of a novel cross‐linked organophosphorus‐nitrogen containing polymer and its application in flame retardant epoxy resins

A novel cross‐linked organophosphorus–nitrogen polymetric flame retardant additive poly(urea tetramethylene phosphonium sulfate) defined as PUTMPS was synthesized by the condensation polymerization between urea and tetrahydroxymethyl phosphonium sulfate. Its chemical structure was well characterized by Fourier transform infrared (FTIR) spectroscopy, ¹³C and ³¹P solid‐state nuclear magnetic resonance. The synthesized PUTMPS and curing agent m‐phenylenediamine were blended into epoxy resins to prepare flame retardant epoxy resin thermosets. The effects of PUTMPS on fire retardancy and thermal degradation behavior of EP/PUTMPS thermosets were investigated by limiting oxygen index (LOI), vertical burning test (UL‐94), cone calorimeter measurement, and thermalgravimetric analysis (TGA) tests. The surface morphologies and chemical compositions of char residues for cured epoxy resins were investigated by scanning electron microscopy and X‐ray photoelectron spectroscopy (XPS), respectively. Water resistant properties of epoxy resin thermosets were evaluated by putting the samples into distilled water at 70°C for 168 h. The results demonstrated that the EP/12 wt% PUTMPS thermosets successfully passed UL‐94 V‐0 flammability rating and the LOI value reached 31.3%. The TGA results indicated that the incorporation of PUTMPS promoted epoxy resin matrix decomposed and char forming ahead of time, which led to a higher char yield and thermal stability for epoxy resin thermosets at high temperature. The morphological structures and analysis of XPS for the char residues of the epoxy resin thermosets shown that PUTMPS benefited to the formation of a sufficient, more compact, and homogeneous char layer with rich flame retardant elements on the materials surface during burning, which prevented the heat transmission and diffusion, limited the production of combustible gases, inhibited the emission of smoke, and then led to the reduction of the heat release rate and smoke produce rate. After water resistance tests, EP/12 wt% PUTMPS thermosets still remained excellent flame retardancy. Copyright © 2015 John Wiley & Sons, Ltd.     

Novel flame retardant thermosets from nitrogen‐containing and phosphorus‐containing epoxy resins cured with dicyandiamide

A novel phosphorus‐containing epoxy resin (EPN‐D) was prepared by addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) and epoxy phenol‐ formaldehyde novolac resin (EPN). The reaction was monitored by epoxide equivalent weight (EEW) titration, and its structure was confirmed by FTIR and NMR spectra. Halogen‐free epoxy resins containing EPN‐D resin and a nitrogen‐containing epoxy resin (XT resin) were cured with dicyandiamide (DICY) to give new halogen‐free epoxy thermosets. Thermal properties of these thermosets were studied by differential scanning calorimeter (DSC), dynamic mechanical analysis (DMA), thermal mechanical analyzer (TMA) and thermal‐gravimetric analysis (TGA). They exhibited very high glass transition temperatures (T_gs, 139–175°C from DSC, 138–155°C from TMA and 159–193°C from DMA), high thermal stability with T_{d,5 wt %} over 300°C when the weight ratio of XT/EPN‐D is ≥1. The flame‐retardancy of these thermosets was evaluated by limiting oxygen index (LOI) and UL‐94 vertical test. The thermosets containing isocyanurate and DOPO moieties showed high LOI (32.7–43.7) and could achieve UL‐94 V‐0/V‐1 grade. Isocyanurate and DOPO moieties had an obvious synergistic effect on the improvement of the flame retardancy. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Self‐catalyzed silicon‐containing phthalonitrile resins with low melting point,excellent solubility and thermal stability

A series of silicon‐containing self‐catalyzed phthalonitrile derivatives (SiPNs) have been successfully synthesized from reaction of 4‐(4‐aminophenoxy)phthalonitrile (APN) with corresponding chlorosilanes. The chemical structures of the SiPNs were confirmed by spectroscopic techniques. The introduction of silicon‐containing unit into the phthalonitrile structure has dramatically decreased the melting point from 143°C for APN to 40–60°C for the new SiPNs, which also exhibit improved solubility and are soluble in many common solvents. Differential scanning calorimetry analysis showed that they possess the self‐catalyzed behavior with the temperature of exothermic peak due to the self‐catalyzed reaction between 255 and 281°C. The cured SiPNs exhibit excellent thermal stability with glass transition temperature above 450°C, the temperature of 5% weight loss in range of 535–570°C under nitrogen, and 543–562°C under air. Their char yields at 1000°C are in the range of 80.2–82.6% in nitrogen, and 10.1–12.5% in air, respectively. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40919.     

Synthesis,characterization, and thermal properties of tris (3‐aminophenyl) phosphine oxide‐based nadimide resins

This article describes the synthesis, characterization, and thermal properties of nadimides obtained by reacting endo‐5‐norbornene‐2,3‐dicarboxylic acid anhydride (nadic anhydride) (NA), 4,4′‐oxodiphthalic anhydride (ODA), 1,4,5,8‐naphthalene tetra carboxylic dianhydride (NTDA) in glacial acetic acid/DMF. Structural characterization of the resins was done by elemental analysis, IR, ¹H‐NMR, and ¹³C‐NMR. The DSC scan showed the endothermic transition in the temperature range of 120–270°C. Multistep decomposition was observed in the TG scan of uncured resins in nitrogen atmosphere. Isothermal curing of the resins was done at 250 and 300°C for 1 h in an air atmosphere. These cured resins were stable to (350 ± 30)°C and decomposed in a single step above this temperature. This may be due to the retro Diels Alder (RDA) reaction. The char yield of the resins increased significantly on curing. The char yield was highest for P‐2N resin and this could be due to the presence of rigid skeleton i.e. naphthalene. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Flame retardant epoxy polymers using phosphorus‐containing polyalkylene amines as curing agents

Two series of novel phosphorus‐containing poly(alkylene) amines with or without aromatic groups were synthesized via reacting phosphoryl chloride derivatives with commercially available polyetheramines, ethylenediamine and N‐phenyl‐1,4‐phenylenediamine, respectively. Chemical structures of the amines were characterized with FTIR, NMR, P (phosphorus) content measurement, and amine content titration. These amines were then utilized as curing agents to react with diglycidyl ether of bisphenol A for preparing phosphorus containing epoxy polymers. The introduction of soft ? P? O? linkage, polyalkyene, and hard aromatic group into the backbones of the synthesized phosphorus‐containing amine (PCA) provides epoxy resins with tunable flexibility. Thermal analysis of differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) reveals that these resulted epoxy resins possess moderate T_g's and thermal stability. Furthermore, high char yields in TGA and high limited oxygen index (LOI) values indicate that these phosphorus‐containing epoxy (PCE) resins are capable of exhibiting excellent flame retardant properties. These polymers can be potentially utilized in flame retardant epoxy coatings and other applications. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 3526–3538, 2001     

Phosphorus‐containing epoxy resin for an electronic application

A phosphorus‐containing epoxy resin, 6‐H‐dibenz[c,e][1,2] oxaphosphorin‐6‐[2,5‐bis(oxiranylmethoxy)phenyl]‐6‐oxide (DOPO epoxy resin), was synthesized and cured with phenolic novolac (Ph Nov), 4,4′‐diaminodiphenylsulfone (DDS), or dicyandiamide (DICY). The reactivity of these three curing agents toward DOPO epoxy resin was found in the order of DICY > DDS > Ph Nov. Thermal stability and the weight loss behavior of the cured polymers were studied by TGA. The phosphorus‐containing epoxy resin showed lower weight loss temperature and higher char yield than that of bisphenol‐A based epoxy resin. The high char yields and limiting oxygen index (LOI) values as well as excellent UL‐94 vertical burn test results of DOPO epoxy resin indicated the flame‐retardant effectiveness of phosphorus‐containing epoxy resins. The DOPO epoxy resin was investigated as a reactive flame‐retardant additive in an electronic encapsulation application. Owing to the rigid structure of DOPO and the pendant P group, the resulting phosphorus‐containing encapsulant exhibited better flame retardancy, higher glass transition temperature, and thermal stability than the regular encapsulant containing a brominated epoxy resin. High LOI value and UL‐94 V‐0 rating could be achieved with a phosphorus content of as low as 1.03% (comparable to bromine content of 7.24%) in the cured epoxy, and no fume and toxic gas emission were observed. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 353–361, 1999     

Novel phosphorus‐based flame retardants containing 4‐tert‐butylcalix[4]arene: Preparation and application for the fire safety of epoxy resins

A novel flame retardant (FR) containing phosphorus and 4‐tert‐butylcalix[4]arene was synthesized and characterized. The FR combined with ammonium polyphosphate (APP) was then incorporated into epoxy resins (EPs) at different ratios. The flame retardancy, thermal stability, and smoke‐releasing properties were investigated. The limiting oxygen index was as high as 30.8% when the mass fraction ratio of the FR to APP was 1:2. The improved FR effect have been due to the combined FR effects between the FR and APP. The char residue content at 800 °C under a nitrogen atmosphere increased notably from 8.22% to 17.6% when the FR APP was incorporated into EP; this indicated an improvement in the thermooxidation resistance. From the cone test, we found that both the total heat‐release and peak heat‐release rate of the FR resins were reduced. Compared to the resins containing no FRs, the smoke‐production rate and total smoke‐production results indicate that the FR resins also exhibited good smoke‐suppression properties. Generally, the stable char layer of the FR APP–EP not only effectively prevented the release of combustion gases but also hindered the propagation of oxygen and heat into the interior substrate. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 45105.     

Curing behavior,thermal, and mechanical properties of epoxy resins cured with a novel liquid crystalline dicarboxylic acid curing agent

A novel di‐carboxylic acid curing agent (DACA) was successfully synthesized and cured with three different epoxy resins: glycidyl end‐capped poly(bisphenol‐A‐co‐epichlorohydrin) (pDGEBA, M_n = 377), N,N‐diglycidyl‐4‐glycidyloxyaniline (TGAP), and 4,4′‐methylenebis(N,N‐diglycidylaniline) (TGDDM). The cured epoxy exhibited excellent thermal stability, which was indicated by high initial degradation temperature (T_id) and char yield. The T_id values of cured epoxy were in the range of 327–338°C, and the char yields increased with increasing epoxy functionality. The char yields of cured DACA/pDGEPA, DACA/TGAP, and DACA/TGDDM samples were 21.1, 60.4, and 66.9%, respectively. In addition, the cured epoxy samples also showed low coefficients of thermal expansion and high storage moduli (E′), which were around 60 ppm/°C and 2800 MPa, respectively. The failure surfaces were ductile and rough, so the cured epoxy samples are expected to have high fracture toughness and impact strength. POLYM. ENG. SCI., 54:695–703, 2014. © 2013 Society of Plastics Engineers     

Synthesis,characteristic, and application of new flame retardant containing phosphorus,nitrogen, and silicon

In this study, the novel halogen‐free flame retardants (PSiN, A and B), which contain phosphorus, nitrogen, and silicon, have been synthesized. The structure of PSiN‐A is characterized by fourier transform infrared spectroscopy and proton nuclear magnetic resonance, and its thermal property is studied through thermo gravimetric analysis (TGA). PSiN‐A and B were blended with polypropylene(PP) to obtain PP/PSiN composites. The flame‐retardant properties of PP/PSiN composites are estimated by Limiting Oxygen Index (LOI) values, and their degradation behaviors are investigated through TGA, under nitrogen from room temperature to 800°C. The fire performance of PP is improved by PSiN(A or B): the LOI value of PP/PSiN‐A reach 26.0 vol% and the char yield is at 27 wt% at 800°C. The phosphorus in PSiN provides possibility for the PP blends to form char, and the silicon improves the thermal stability of char. The active energies of PSiN and PP are calculated through the method of Horowitz–Metzger. POLYM. ENG. SCI. 46:344–350, 2006. © 2006 Society of Plastics Engineers     

Photopolymerization and thermal behavior of phosphate diacrylate and triacrylate used as reactive‐type flame‐retardant monomers in ultraviolet‐curable resins

Tri(acryloyloxyethyl)phosphate (TAEP) and di(acryloyloxyethyl)ethyl phosphate (DAEEP) were used as reactive‐type flame‐retardant monomers along with commercial epoxy acrylate and polyurethane acrylate oligomers in ultraviolet (UV)‐curable resins. The concentrations of the monomers were varied from 17 to 50 wt %. The addition of the monomers greatly reduced the viscosity of the oligomers and increased the photopolymerization rates of the resins. The flame retardancy and thermal degradation behavior of the UV‐cured films were investigated with the limiting oxygen index (LOI) and thermogravimetric analysis. The results showed that the thermal stability at high temperatures greater than 400°C and the LOI values of the UV‐cured resins, especially those containing epoxy acrylate, were largely improved by the addition of the monomers. The dynamic mechanical thermal properties of the UV‐cured films were also measured. The results showed that the crosslink density increased along with the concentrations of the monomers. However, the glass‐transition temperature decreased with an increasing concentration of DAEEP because of the reduction in the rigidity of the cured films, whereas the glass‐transition temperature increased with the concentration of TAEP because of the higher crosslink density of the cured films. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 185–194, 2005     

Structure and high‐resolution thermogravimetry of liquid‐crystalline copoly(p‐oxybenzoate‐ethylene terephthalate‐p‐benzamide)

Thermotropic liquid‐crystalline copoly(ester‐amide)s consisting of three units of p‐oxybenzoate (B), ethylene terephthalate (E) and p‐benzamide (A) were studied by proton nuclear magnetic resonance at 200 and 400 MHz, wide‐angle X‐ray diffraction, and high‐resolution thermogravimetry to ascertain their molecular and supermolecular structures, thermostability and kinetics parameters of thermal decomposition in both nitrogen and air. The assignments of all resonance peaks of [¹H]NMR spectra for the copoly(ester‐amide)s are given and the characteristics of X‐ray equatorial and meridional scans are discussed. Overall activation energy data of the first major decomposition have been evaluated through three calculating techniques. The thermal degradation occurs in three steps in nitrogen and air. The degradation temperatures are higher than 447 °C in nitrogen and 440 °C in air and increase with increasing B‐unit content at a fixed A‐unit content of 5 mol%. The temperatures at the first maximum weight‐loss rate are higher than 455 °C in nitrogen and 445 °C in air and also increase with an increase in B‐unit content. The first maximum weight‐loss rates range between 11.1 and 14.5%min⁻¹ in nitrogen and between 11.9 and 13.5%min⁻¹ in air. The char yields at 500 °C in both nitrogen and air range from 45.8 to 54.3 wt% and increase with increasing B‐unit content. But the char yields at 800 °C in nitrogen and air are quite irregular with the variation of copolymer composition and testing atmosphere. The activation energy and Ln (pre‐exponential factor) for the first major decomposition are usually higher in nitrogen than in air and increase slightly with an increase in B‐unit content at a given A‐unit content of 5 mol%. The activation energy, decomposition order, and Ln (pre‐exponential factor) of the thermal degradation for the copoly(ester‐amide)s in two testing atmospheres, are situated in the ranges of 210–292 kJmol⁻¹, 2.0–2.8, 33–46 min⁻¹, respectively. The three kinetic parameters of the thermal degradation for the aromatic copoly(ester‐amide)s obtained by high‐resolution thermogravimetry at a variable heating rate are almost the same as those by traditional thermogravimetry at constant heating rate, suggesting good applicability of kinetic methods developed for constant heating rate to the variable heating‐rate method. These results indicate that the copoly(ester‐amide)s exhibit high thermostability. The isothermal decomposition kinetics of the copoly(ester‐amide)s at 450 and 420 °C are also discussed and compared with the results obtained based on non‐isothermal high‐resolution thermogravimetry. © 1999 Society of Chemical Industry