天然金刚石刀具的研磨及其刃口半径检测技术

指出了天然金刚石刀具的刃口锋利度对现代超精密切削加工的重要影响,介绍了国内外天然金刚石刀具研磨技术的发展现状,以及我国金刚石刀具刃磨技术中普遍存在的问题。详细叙述了对刃磨后刀具刃口半径检测的几种可行方法,展望了刃口半径检测技术的前景。     

金刚石刀具研磨设备及研磨技术的研究

分析了超精密金刚石刀具的研磨要求，研究了金刚石刀具研磨设备与技术。试验表明，用该套技术研制的刀具， 直，光滑，无缺陷，能满足超精密切削的要求。     

单晶金刚石刀具的研磨工艺

介绍了单晶金刚石刀具的研磨方法,重点分析了影响研磨质量的各种因素,并提出了相应的工艺措施。     

金刚石刀具研磨质量的影响因素

金刚石刀具研磨非常困难,影响研磨质量的因素较多。     

金刚石刀具研磨设备与研磨技术的研究

分析了超精密金刚石刀具的研磨要求，研究了金刚石刀具研磨设备与技术。试验表明，用该套技术研制的刀具，刃口平直、光滑、无缺陷，能满足超精密切削的要求。     

金刚石刀具研磨压力自适应控制初探

在对金刚石刀具研磨过程中容易造成研磨压力波动的主要因素分析的基础上,就金刚石刀具研磨压力的自适应控制做了详细的研究,以期为今后金刚石刀具研磨相关工艺技术的研究奠定一定基础。     

圆弧刃金刚石刀具刃磨中的关键技术

天然圆弧刃金刚石刀具是加工球曲面、非球曲面零件的重要工具 ,由于金刚石各向异性 ,使圆弧刃刃磨技术成为金刚石刀具制造中的难点和关键。本文针对圆弧金刚石刀具刃磨机理 ,设计了相应的刃磨机 ,并对刃磨结果进行了检测 ,表明这种刃磨机完全可以满足超精密球面和非球面曲面零件的加工要求     

利用散射光测量有椭圆形刃口的金刚石刀具锋利度的原理

本文提出了利用光学原理测量具有椭圆形刃口的金刚石刀具锋利度的方法，即通过测量刀刃表面的散射光的强度分布，从而获得刀刃几何形状的信息。文中首次提出了刀刃轮廊的椭圆模型，从理论上推导出了椭圆刀刃轮廊散射光的强度分布。     

金刚石刀具的研磨与切削实验

对四种不同材料的金刚石晶体 (天然单晶、MONODITE、CVD、PCD)进行了研磨和切削实验 ,获得了一些基础数据 ,并对实验结果分析。在研磨实验中对研磨方法、研磨效率及研磨的刀具刃口质量进行了比较 ,同时对这四种刀具进行切削实验———对有色金属进行精密加工     

一种基于AFM的金刚石刀具刃口锋利度的检测方法

金刚石刀具刃口纳米级别的锋利度是影响超精密加工表面质量特别是表面微观几何形貌的重要因素.针对目前测量中存在的问题,介绍了一种新的使用原子力显微镜(Atomic Force Microscope,AFM)进行金刚石刀具刃口锋利度检测的方法,该方法首先利用仿射变换进行截面数据提取,然后利用一种基于曲率的算法求出圆弧拟合点,...     

陶瓷球轴承球体的高精密研磨方式

论述氮化硅陶瓷的性能和应用及球体圆度误差趋小化研磨机理 ,比较各种研磨方式的原理、精度、效率 ,提出今后的研究方向。     

计算机视觉二维刀具预调仪的研究

研究了计算机视觉二维刀形检测系统。由面阵CCD摄像机摄取刀形图像,通过硬件解调电路提取刀形轮廓数据并送入计算机。数据处理程序给出刀形曲线的参数值,并存入数据库及绘制出刀形曲线。根据系统的特性给出了定标方法。由于测试结果是以参数值的形式给出,便于程控加工时调用。系统具有高精度、高速度、自动化测试的特点,测量精度优于3μm。     

Studies on high-efficiency and high-precision orthogonal turn-milling-The effects of relative cutting speed and tool axis offset on tool flank temperature

The cutting-edge temperature on the flank face in dry turn-milling of medium carbon steel (ISO C45) is measured using a two-color pyrometer with an optical fiber. In turn-milling, undeformed chip geometry is complex due to its dependence on several factors including diameter of the cutting tool, number of tooth, diameter of the workpiece, tool-work revolution speed ratio, depth of cut, feed per tooth, tool axis offset, and the cutting distance. In this study, the undeformed chip is analyzed and visualized by the 3D-CAD system, and the effects of the cutting parameters in turn-milling, especially relative cutting speed and tool axis offset on tool flank temperature, are investigated. It is interesting that the relative cutting speed does not significantly affect the tool flank temperature, where it increases by approximately 20 °C at most when relative cutting speed increases from 124 m/min to 217 m/min. In addition, tool flank temperature varies by approximately 40 °C when the tool axis offset is changed from 0 mm to 9.2 mm due to the change in the undeformed chip geometry.     

A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers

Ductile mode cutting of silicon wafers can be achieved under certain cutting conditions and tool geometry. An experimental investigation of the critical undeformed chip thickness in relation to the tool cutting edge radius for the brittle-ductile transition of chip formation in cutting of silicon wafers is presented in this paper. Experimental tests for cutting of silicon wafers using diamond tools of different cutting edge radii for a range of undeformed chip thickness are conducted on an ultra-precision lathe. Both ductile and brittle mode of chip formation processes are observed in the cutting tests. The results indicate that ductile cutting of silicon can be achieved at certain values of the undeformed chip thickness, which depends on the tool cutting edge radius. It is found that in cutting of silicon wafers with a certain tool cutting edge radius there is a critical value of undeformed chip thickness beyond which the chip formation changes from ductile mode to brittle mode. The ductile-brittle transition of chip formation varies with the tool cutting edge radius. Within the range of cutting conditions in the present study, it has also been found that the larger the cutting edge radius, the larger the critical undeformed chip thickness for the ductile-brittle transition in the chip formation.     

Investigation of diamond cutting tool lapping system based on on-machine image measurement

The profile tolerance of diamond cutting tool??s edge is one of the key factors in affecting machining accuracy. With the development of ultra-precision machining technology for optical free-form surfaces and optical microstructures, the demand for high-precision round nose diamond cutting tools is increasing. In this study, an on-machine image processing approach is applied to cutting edge geometry truing process, and profile data of cutting edge in sub-pixel precision is acquired using a series of image processing methods. According to the profile captured, the deviation from an ideal cutting edge is calculated and feedbacked to the controller. The lapping system is employed to lap the cutting edge pertinently using the deviation and the corresponding position captured, and the round edge of high accuracy is obtained efficiently. This method can avoid the error caused by the process of refixturing for offline measurement in the traditional lapping method of diamond cutting tool and reduce the influence of human factors. A truing experiment for cutting edge of the monocrystal diamond cutting tool is carried out at the developed lapping system based on on-machine image measurement, and round cutting edge of profile tolerance less than or equal to ±0.5???m is achieved.     

Microscopic topographical analysis of tool vibration effects on diamond turned optical surfaces

In diamond turning for the manufacture of optical surfaces, a certain degree of relative vibration is inevitably encountered between the tool and work, deteriorating the surface quality. In this paper we first describe how the tool vibration affects the surface profiles in microscopic level, and then propose a metrological scheme to identify any existence of tool vibration with a minimum effort of surface measurement and analysis.     

干式切削刀具技术

干式切削技术作为一种绿色制造工艺,又是一项庞大的系统工程,需要从刀具技术、机床结构和工艺过程等各方面采取一系列的措施,而首当其冲的是切削刀具技术,设计干式切削刀具时,不仅要选择适用的刀具材料和采用的涂层,而且应当综合考虑刀具材料、刀具涂层和刀具几何形状之间的相互兼顾和优化.     

环形电镀金刚石线锯锯切工艺参数的正交试验研究

这里对环形电镀金刚石线锯锯切工艺参数进行了正交试验研究。分析了金刚石粒度、进给压力和锯丝速度对锯切过程的影响。获得了基于提高锯切效率和锯丝寿命,降低锯切力的最佳锯切工艺参数。锯切花岗岩时,要保证较高的锯切效率和锯切比,在本试验范围内,最佳工艺参数为:采用金刚石粒度为200～230#的锯丝,进给压力为9N,锯丝速度为20m/s。