超薄预浸料对碳纤维/环氧树脂复合材料导电性能的影响

为了协同提高碳纤维/环氧树脂（CF/EP）复合材料的电性能和力学性能,采用碳纤维丝束展宽、浸润一体化的工艺方法,将12K CF展宽预浸制备成厚度分别为0.02 mm、0.03 mm、0.08 mm、0.10 mm的CF/EP预浸料及其单向层合板,分析测试了微观结构尺度对CF/EP复合材料层合板电阻率、电阻率随温度及在拉伸载荷作用下响应的影响机制。结果表明,随着CF/EP预浸料厚度从0.10 mm减小到0.02 mm,CF/EP复合材料单向层合板中大尺度树脂富集区所占比例明显减小,厚度方向的电阻率从151.3 Ω·cm减小到32.1 Ω·cm,导电性能提高了约5倍;随着温度升高,CF/EP复合材料层合板电阻率逐步下降,厚预浸料层合板沿厚度方向电阻率的下降速率高于薄预浸料层合板;在载荷作用下由CF/EP薄预浸料制成的CF/EP复合材料层合板的电阻率具有较高的稳定性,表明预浸料薄层化有助于提高CF/EP复合材料抵抗载荷作用的能力,从而获得较高的力学性能和电性能。实验结果为CF/EP复合材料结构-功能一体化设计提供了基础。      

碳纤维/聚醚醚酮单向带各向异性导电行为的尺度效应

具有导电各向异性的高分子复合材料(ACPCs)在场发射装置及传感器设计领域具有重要应用。常规的ACPCs很难获得超大导电各向异性系数,且力学性能有限。本文采用碳纤维(CF)宽展、表面浸润与树脂复合一体化超薄热塑性单向带制备方法,制备厚度为0.04 mm和0.1 mm的CF增强聚醚醚酮(CF/PEEK)复合材料单向带,以PEEK纤维为纬线制备CF/PEEK复合材料单向编织布,采用热成型工艺制备CF/PEEK复合材料单向层合板。利用数字万用表和霍尔效应系统测试层合板面内及厚度方向的电阻率和面内的电子迁移率;采用超景深显微镜观察CF/PEEK复合材料单向层合板面内和厚度方向的纤维排列形貌。结果表明,超薄CF/PEEK复合材料单向层合板面内(纤维方向与横向)导电率之比高达377,而面内横向和厚度方向的导电率之比接近1,表明CF/PEEK复合材料获得了良好的横观各向同性;超薄化CF/PEEK复合材料的面内电子迁移行为同样具有巨大的各向异性,这一结果为CF/PEEK复合材料在场发射器件、传感器设计及其灵敏度调控方面提供了实验基础。      

水环境对热塑性复合材料层合板分层疲劳裂纹扩展的影响

本文研究了水环境对ICIAPC-2热塑性预浸料(AS4/PEEK)制成的单向复合材料层合板分层疲劳裂纹扩展的影响.用双悬臂梁试件进行了I型张开位移加载试验.试验环境为23℃水中和50℃水中.水环境未引起很大的不利影响.用电子显微镜和机理分析讨论了水环境对CF/PEEK和CF/环氧两种层合板的差异.     

水环境对热塑性复合材料层合板分层疲劳裂纹扩展的影响

本文研究了水环境对ICIAPC-2热塑性预浸料(AS4/PEEK)制成的单向复合材料层合板分层疲劳裂纹扩展的影响.用双悬臂梁试件进行了I型张开位移加载试验.试验环境为23℃水中和50℃水中.水环境未引起很大的不利影响.用电子显微镜和机理分析讨论了水环境对CF/PEEK和CF/环氧两种层合板的差异.      

预浸料的超薄化对碳纤维/环氧树脂复合材料拉伸破坏行为的影响

采用自主研发的碳纤维（CF）宽展设备,将12K CF宽展预浸制备成0.02 mm和0.10 mm厚的CF/环氧树脂（EP）预浸料,利用模压工艺制成1 mm厚的单向层合板。利用万能试验机、声发射装置和高速照相机组成的集成系统测试其抗拉强度、加载过程中试样内部的损伤情况及断裂破坏时样品宏观形貌的变化。用SEM观测其拉伸断口形貌。分别用超景深显微镜、金相显微镜观测记录CF/EP复合材料预浸料和单向层合板中CF的排布状态以表征薄层化过程中CF和EP的分布状态对CF/EP复合材料拉伸性能的影响。结果表明:薄CF/EP复合材料预浸料中CF的排布更加均匀,制成的CF/EP复合材料单向层合板试样中层间树脂富集区的尺度明显小于厚CF/EP复合材料预浸料制成的试样,试样的抗拉强度提高了15%;薄CF/EP复合材料预浸料制成层合板试样的拉伸宏观断口形貌中分层劈裂现象减少,集束性增强,微观断口形貌中未发现横贯横截面的穿透裂纹。      

玻璃纤维-碳纤维混杂增强PCBT复合材料层合板的制备及低速冲击性能

采用环状对苯二甲酸丁二醇酯(CBT)预浸料,利用真空袋辅助热压工艺制备了玻璃纤维机织布-碳纤维机织布/聚环状对苯二甲酸丁二醇酯(GF-CF/PCBT)混杂复合材料层合板。利用双悬臂梁(DCB)和三点端部开口弯曲(3ENF)试验对连续纤维增强PCBT复合材料层合板的层间强度做出评估。同时,利用低速冲击试验结合Abaqus/Explicit有限元仿真重点考察了混杂纤维增强PCBT复合材料层合板的低速冲击性能。试验结果表明:尽管CF/PCBT复合材料层合板具有优异的层间性能,当冲击能量为114.3J时,由于CF自身的脆性,CF/PCBT复合材料层合板被完全穿透,而GF-CF/PCBT混杂复合材料层合板只在表面形成凹痕。与纯CF增强PCBT复合材料层合板相比,铺层形式为[CF/GF/CF]25的GF-CF/PCBT混杂复合材料层合板的抗冲击损伤能力提高2倍。仿真得到的云图显示,冲击引起的应力在CF中的分布区域要明显大于在GF中的分布区域。     

铺层角度对碳纤维/形状记忆环氧树脂层合板形状回复性能的影响

对不同铺层角度的碳纤维/环氧树脂形状记忆复合材料(SMC)层合板的弯曲回复性能进行了研究。结果表明,[±θ]_s铺层方式的SMC层合板的形状回复率、回复力均随着铺层角度增大而减小,回复时间随着铺层角度增大而增大,其中铺层角度增大至45°后,回复时间开始出现大幅的增加,铺层角度增大至60°后,回复率开始出现大幅的降低。对SMC层合板进行了15次的赋形-回复循环过程,发现不同铺层角度SMC层合板均能保持较稳定的形状记忆回复率和回复时间。但在铺层角度0~30°的范围内,层合板的形状回复力随着铺层角度增大而减小。最后分析了不同铺层角度SMC层合板的局部损伤,结果表明,[0]_4和[±15]_s铺层方式的SMC层合板基体已达到了其极限剪切应变,基体发生严重破坏,并且会随着赋形次数的增加而加剧。     

复合材料头盔壳体用超薄层合板冲击后的压缩性能

使用[0°/0°/0°]T、[45°/0°/45°]T两种铺层角度将碳纤维经面缎纹织物、碳纤维平纹织物预浸料、不同面密度芳纶纬编双轴向织物(MBWK)三种增强材料混杂铺层,制备出厚度为1.30 mm的复合材料头盔壳体用超薄层合板。测试分析了层板冲击后的压缩性能,用C扫描超声波检测仪测试了层合板冲击损伤图像,使用Image Pro Plus图像分析软件计算出不同冲击条件下的超薄层合板冲击损伤面积,研究了增强体结构类型、铺层角度对超薄复合材料层合板冲击后压缩性能的影响。结果表明,使用铺层角度为[45°/0°/45°]T的增强体结构可抑制层板沿纤维方向的冲击损伤裂纹的扩展,但是冲击点损伤破坏严重;纬编双轴向织物的面密度越大,则层板冲击后的凹坑深度越小。与其他铺层结构相比,当铺层角度为[0°/0°/0°]T时底层为碳纤维预浸料、中间层纬编双轴向织物面密度为630 g/m2、面层为碳纤维经面缎纹织物的复合材料超薄层板的冲击损伤面积与凹坑深度均最小,分别为225.28 mm2、0.16 mm,其剩余冲击后压缩强度达到最大值97.43 MPa,压缩强度保持率75.72%。这种结构,具有优异的冲击后压缩性能。     

纤维复合材料层合板内埋光纤光栅传感器的保护技术

内埋的光纤Bragg光栅（FBG）传感器的存活率及测试精度是其在线监测纤维增强树脂基复合材料制备和服役状态的重要前提。采用[90₁₁/0₁₁]的碳纤维预浸料铺层方式,在层合板0°和45°方向的典型位置埋入FBG温度和应变传感器,采用模压成型工艺制备复合材料层合板。在异向铺排（光纤光栅方向与碳纤维方向不同）的45°方向光纤光栅传感器内埋于碳纤维预浸料层间的过程中,对其采用4种不同的保护方式。通过对比实验结果发现:当对异向铺排的FBG传感器不采取保护措施时,在加热加压复合材料时光纤光栅容易失活;整层铺设同向预浸料以保护异向铺排的FBG传感器的方式改变了具有特定铺层参数复合材料的力学性能;采用窄长条同向预浸料上下包埋保护FBG传感器的方式增大了应变光栅测量结果的系统误差;采用窄长条同向预浸料上下包埋并在邻近铺层开凹槽的保护方式能明显提高内埋光纤光栅的存活率及测试精度。      

卫星贮箱安装板复合材料蒙皮热应力工艺设计优化

基于有限元分析方法,对热压罐成型卫星贮箱安装板复合材料蒙皮热应力工艺设计方案进行仿真分析,研究了预浸料铺层区域、均压板结构、固化温度等工艺参数对蒙皮热应力的影响。结果表明,在均压板开孔结构不变,当预浸料铺层方法从整体铺层转变为开孔铺层,最大压缩热应力为-393.7MPa,增加了3.8%;最大拉伸热应力为87.9MPa,降低了62.9%。保持均压板开孔结构-预浸料开孔铺层不变,当固化最高温度从180℃降低到120℃,最大压缩热应力为-250.5MPa,最大拉伸热应力为55.9MPa,最大压缩应力和拉伸应力均降低了36.3%。降低固化温度显著降低热应力,并通过实验验证了分析结果。     

PEEK modified PLA shape memory blends: towards enhanced mechanical and deformation properties

Polylactic acid (PLA) is one of the most promising shape memory polymers with outstanding biocompatibility, while poly(ether ether ketone) (PEEK) is a special engineering plastic with excellent mechanical performance. In this work, PEEK was selected to modify PLA, and a series of PLA blended with different PEEK contents (PLA/PEEK blends) were obtained. The effects of PEEK on thermodynamic, mechanical and shape memory properties of PLA/PEEK blends were investigated. The results showed that the thermal stability of the PLA/PEEK blend was improved with the PEEK content increase. The tensile strength reached the highest value of 20.6 MPa when the PEEK content was 10%. While the best shape memory performance occurred with the PEEK content of 15%, the shape recovery time was less than 2 s, and the shape fixation/recovery ratio was more than 99%. Furthermore, the programmable mimetic flower opening process was achieved by using PLA/PEEK blends with different PEEK content ratios. The above results indicated that the blend of an appropriate proportion of PEEK had positive effects on mechanical and deformation performances of PLA.     

碳纤维增强形状记忆聚合物复合材料的热-力学行为建模与影响因素碳纤维增强形状记忆聚合物复合材料的热-力学行为建模与影响因素

采用变形梯度分解的方法,基于热力学内变量理论,构建了适用于描述碳纤维增强形状记忆聚合物（CF/SMP）复合材料热-力学行为的热黏弹性本构模型。模型中考虑了材料的结构松弛效应和应力松弛效应,且适用于有限变形条件。依据该模型研究了一种CF/SMP薄板在受到单向均布载荷作用且处于平面应力状态时的碳纤维有效应变影响因素。理论上证实了虽然碳纤维的容许应变很小,但合理取向的纤维分布形式能使其应用于有限变形条件下而不被破坏。此外,分析了该CF/SMP形状记忆热-力学循环过程中形状记忆效应（SME）的影响因素。结果表明,碳纤维含量的增大和纤维倾斜角的减小会导致CF/SMP刚度增大,从而降低其形状固定率。此外,碳纤维体积含量和温度变化率对升温回复阶段也存在一定影响。上述研究方法和结果能对单向连续CF/SMP的设计与应用提供一定理论指导。      

碳纤维-AlN/聚醚醚酮复合材料的制备与性能

以聚醚醚酮(PEEK)为基体树脂、碳纤维(CF)和氮化铝(AlN)为填料,通过模压成型的方法制备了抗静电耐热型CF-AlN/PEEK复合材料。采用高阻计、导热系数测定仪、热失重、差示扫描量热仪和SEM研究了CF-AlN/PEEK复合材料的抗静电性能、热性能、力学性能以及降温速率对复合材料性能的影响,并探讨了后期热处理对力学性能的影响。结果表明:当CF和AlN的质量分数均为10%时,CF-AlN/PEEK复合材料的性能较优,其表面电阻率达到108 Ω,比PEEK的表面电阻率提高了6个数量级;导热系数为0.418 W·(m·K)-1,初始分解温度高达573℃;拉伸强度提高了40.4%;降温速率越低,复合材料的熔点越高;后期热处理会影响CF-AlN/PEEK复合材料的力学性能,在270℃下热处理2 h,其拉伸强度可达146 MPa,表明在生产过程中,加工温度是影响复合材料性能的因素之一。      

Physical cutting model of Polyetheretherketone composites

This paper presents a study on the experimental physical model of the orthogonal cutting on the composite polyetheretherketone (PEEK) and PEEK CF30 (reinforced with 30% of carbon fiber). The objective of this study is evaluating the influence of the reinforcement on the chip thickness ratio (R), chip deformation (ε), friction angle (ρ), shear angle (), normal stress (σ) and shear stress (τ) under prefixed cutting parameters (cutting velocity and feed rate). The experimental physical model was compared with the Merchant equation.     

剪切载荷下温度和应变率对碳纤维增强聚醚醚酮复合材料强化行为的影响

碳纤维增强聚醚醚酮(CF/PEEK)是一种高性能热塑性复合材料,在航空航天领域有着广阔的应用前景。由于PEEK具有温度和应变率相关的非线性行为,导致CF/PEEK复合材料在基体主导的面内剪切方向也有类似的力学行为。本文在不同的温度和应变率下对CF/PEEK复合材料试件进行了剪切实验,将应力-应变曲线分为线性与非线性部分,发现温度和应变率对CF/PEEK复合材料的屈服应力有着较大的影响。随着温度从20℃升高到130℃屈服应力下降了66%左右,下降速度先快后慢,随着应变率从10?5 s?1提高到0.1 s?1屈服应力均匀增大了35%左右。将所得规律拟合背应力经验公式,修改了经典的热塑性复合材料本构模型的屈服函数。并编写VUMAT用户子程序对CF/PEEK复合材料剪切实验进行数值分析,与实验结果对比发现非线性阶段的剪切应力-应变关系及屈服点的剪切应力吻合良好,但是由于纤维和PEEK基体的浸润性较差,导致CF/PEEK复合材料内部存在孔隙缺陷,影响了CF/PEEK复合材料的初始剪切弹性行为,导致加载初始阶段存在偏差。      

基于导热板的碳纤维增强聚醚醚酮复合材料感应焊接温度调控

研究了碳纤维增强聚醚醚酮(CF/PEEK)复合材料感应焊接中厚度方向及焊接面内的温度分布及调控。基于对温度分布结果的分析,使用导热板结合真空袋压的方式对CF/PEEK进行感应焊接,结合使用合适的功率及加热时间,测试了焊接件的单搭接强度,观测分析了焊接件的断裂形貌。结果表明,导热板对层合板表层和边缘均有良好的散热效果;焊接功率越低,焊接面的加热均匀性增加,但是会延长加热时间。在真空袋中对层合板上表面和两侧添加导热板,在输出功率示数为600时感应焊接300 s,焊接件的单搭接剪切强度达到41.57 MPa。      

Electrophoretic deposition of polyetheretherketone (PEEK) and PEEK/Bioglass® coatings on NiTi shape memory alloy wires

Polyetheretherketone (PEEK) and PEEK/Bioglass® coatings were produced on shape memory alloy (NiTi, Nitinol®) wires using electrophoretic deposition (EPD). Best results were achieved with suspensions of PEEK powders in ethanol in the range (1–6 wt%), using a deposition time of 5 minutes and applied voltage of 20 Volts. EPD using these parameters led to high quality PEEK coatings with a homogeneous microstructure along the wire length and a uniform thickness of up to 15 μm without development of cracks or the presence of large voids. Suspensions of PEEK powders in ethanol with addition of Bioglass® particles (0.5–2 wt%) (size < 5 μm) were used to produce PEEK/Bioglass® coatings. Sintering was carried out as a post EPD process in order to densify the coatings and to improve the adhesion of the coatings to the substrate. The sintering temperature was 340 °C, sintering time 20 min and heating rate 300 °C/h. Sintering led to uniform and dense PEEK and PEEK/Bioglass® coatings without any cracks. The bioactive behaviour of PEEK/Bioglass® composite coatings was investigated by immersion in acellular simulated body fluid (SBF) for up to two weeks. As expected, hydroxyapatite crystals formed on the surface of the coated wires after 1 week in SBF, confirming the bioactive character of the coatings. The results have demonstrated for the first time that EPD is a very convenient method to obtain homogeneous and uniform bioactive PEEK and PEEK/Bioglass® coatings on Nitinol® wires for biomedical applications.     

纤维素/琼脂糖复合膜的制备、表征及其形状记忆性能研究

近年来,形状记忆材料因其刺激响应性在纺织、航空航天、生物医疗等领域备受关注。在此,采用碱/尿素水溶液作为共溶剂,环氧氯丙烷作为交联剂,制备出具有水、热刺激形状记忆性能的纤维素/琼脂糖复合膜。该膜显示出良好的透明度和力学性能,透光率超过90%,干强和湿强可达132和5.4 MPa。同时,该膜在水刺激下的固定率(R_f)和回复率(R_r)分别达95%和84%以上,热刺激下的R_f和R_r分别达58%和85%以上,表现出较好的形状记忆效果。机理分析表明:氢键的断裂和形成导致复合膜具有水刺激形状记忆行为,琼脂糖结晶的破坏与形成是复合膜具有热刺激形状记忆行为的关键。     

Topographical characterization and microstructural interface analysis of vacuum-plasma-sprayed titanium and hydroxyapatite coatings on carbon fibre-reinforced poly(etheretherketone)

In the present study, topographical characterization and microstructural interface analysis of vacuum-plasma-sprayed titanium and hydroxyapatite (HA) coatings on carbon fibre-reinforced polyetheretherketone (CF/PEEK) was performed. VPS-Ti coatings with high roughness values (Ra=28.29±3.07 m, Rz=145.35±9.88 m) were obtained. On this titanium, intermediate layer HA coatings of various thicknesses were produced. With increasing coating thickness, roughness values of the HA coatings decreased. A high increase of profile length ratio, Lr, of the VPS-Ti coatings (Lr=1.45) compared to the grit-blasted CF/PEEK substrate (Lr=1.08) was observed. Increasing the HA coating thickness resulted in a reduction of the Lr values similar to the roughness values. Fractal analysis of the obtained roughness profiles revealed that the VPS-Ti coatings showed the highest fractal dimension of D=1.34±0.02. Fractal dimension dropped to a value of 1.23–1.25 for all HA coatings. No physical deterioration of the CF/PEEK substrate was observed, indicating that substrate drying and the used VPS process parameter led to the desired coatings on the composite material. Cross-section analysis revealed a good interlocking between the titanium intermediate layer and the PEEK substrate. It is therefore assumed that this interlocking results in suitable mechanical adhesive strength. From the results obtained in this study it is concluded that VPS is a suitable method for manufacturing HA coatings on carbon fibre-reinforced PEEK implant materials.