共查询到19条相似文献,搜索用时 203 毫秒
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对带微通道的铝基板上封装的不同功率LED,用Comsol Multiphysics软件对其温度场进行了有限元模拟,重点研究了微通道的孔大小、孔间距、绝缘层的厚度和热导率对基板散热性能的影响,结果表明:铝基板厚度为1.5mm左右,微通道方形孔,孔长0.8mm,孔间距0.8mm,绝缘层厚度50μm,热导率1.5 W/(m·K),为最佳散热性能铝基板.微通道铝基板封装3W灯珠与普通铝基板和氮化铝基板相比,热阻分别下降了5.44和3.21℃/W,表明微通道铝基板能更好地满足大功率LED散热的需求. 相似文献
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基于微通道散热的大功率LED阵列的热阻研究 总被引:2,自引:1,他引:1
采用微通道致冷技术,设计了大功率LED阵列的外部热沉.针对直鳍片微通道结构的散热器,理论分析了影响其热阻的因素,推导了热阻表达式,并对微通道散热器的结构参数进行了优化,指出当通道宽度取某一数值时,散热器的热阻可达到最小.利用MATLAB软件,对LED的热阻与微通道散热器的结构参数和冷却液的压力关系进行了仿真,给出了直观的关系曲线. 相似文献
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激光器工作时由于存在各种非辐射复合损耗和自由载流子吸收等损耗机制,使注入到器件中的部分电功率转换成热耗散在激光器内,直接影响激光器的效率和寿命,因此散热处理一直是一个引人注意的焦点。采用微通道载体解决大功率半导体激光器阵列连续工作时散热问题,通过ANSYS软件模拟优化结构参数,实验测得了大功率半导体激光器阵列热阻。 相似文献
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LED封装中的散热研究 总被引:4,自引:1,他引:3
文章论述了大功率LED封装中的散热问题,说明它对器件的输出功率和寿命有很大的影响,分析了小功率、大功率LED模块的封装中的散热对光效和寿命的影响。对封装及应用而言,增强它的散热能力是关键技术,指出对大功率LED和LED模块散热设计很重要,因为大功率白光LED的光效和寿命取决于其散热。目前大功率LED的重点是提高散热能力,说明封装结构和封装材料在提高大功率LED散热中的影响,LED模块的散热是未来的重点。通过选用高热导率材料可以使温度得到显著控制,重点论述了封装的关键技术,最后指出了未来LED封装技术的发展趋势。 相似文献
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为了更好地解决大功率三维系统封装(3D-SIP)芯片散热的问题,将分形理论和翅片型微通道相结合,应用于微米级的微通道布局中,形成新型的平行翅片型微通道、交错翅片型微通道、树状翅片型微通道3种布局.在ANSYS的FLOTRAN中建立了相应模型,得到了大功率芯片结温、芯片温差和3D-SIP的热阻,比较了3种微通道布局对大功率3D-SIP散热特性的影响.研究结果表明,相比其他两种微通道布局,树状翅片型微通道布局使3D-SIP的大功率芯片散热效果最好,为大功率3D-SIP的散热设计提供了很好的参考依据. 相似文献
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基于热电制冷的大功率LED散热性能分析 总被引:5,自引:0,他引:5
提出了一种新型的基于热电制冷的大功率LED热管理方法。这种大功率LED阵列模块采用板上封装技术制造。为了解决散热问题,采用了热电制冷器将LED芯片产生的热量转移到周围的环境中。利用热电偶测量了大功率LED阵列模块在不同工作条件下的温度分布,LED的光学性能则通过光强分布测试仪来测试。结果表明,这种采用热电制冷的大功率LED阵列封装模块能够显著降低器件的工作温度,与不采用热电制冷器相比,基板温度能够降低36%以上,光学性能测量表明LED阵列模块的发光效率达到30.18lm/W。 相似文献
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薄片激光器的导热距离短,能显著降低热透镜效应,已经成为高功率固体激光研究的热点。然而,随着泵浦口径和泵浦功率的不断增大,热效应愈发严重,其造成的热致畸变成为限制激光器出光功率和光束质量的主要因素之一。针对大尺寸薄片激光器工作时热致畸变过大的情况,提出了基于非均匀冷却的微通道复合射流冲击的流道设计思路。基于该思路完成了中心辐射结构冷却器的设计,并借助流-固-热耦合仿真,研究了不同冷却器的流道结构参数对增益介质热致畸变的影响。实验结果表明,采用中心辐射结构的冷却器能将相同条件下的增益介质的光学畸变缩小50%。 相似文献
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The goal of this study is to improve the thermal characteristics of high power LED (light-emitting diode) package using a flat heat pipe (FHP). The heat-release characteristics of high power LED package are analyzed and a novel flat heat pipe (FHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of high power LED package with flat heat pipe heat sink have been investigated experimentally. The obtained results indicate that the junction temperature of LED is about 52 °C for the input power of 3 W, and correspondingly the total thermal resistance of LED system is 8.8 K/W. The impact of the different filling rates and inclination angles of the heat pipe to the heat transfer performance of the heat pipe should be evaluated before such a structure of heat pipe cooling system is used to cool high power LED system. 相似文献
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A new thermosyphon cooling module (TSCM) has been designed, fabricated and tested to cool the multi-chip module plugged into a planar packaging system. The cooling module consists of a cold plate and an integrated condenser. With an allowable temperature rise of 56°C on the surface of the heater, the cooling module TSCM can handle a heat flux of about 2.7 W/cm2 using R11 as working fluid. The transient characteristics of the cooling module have been proved to be excellent: that is, when a heat load is applied inside of the system, steady state can be achieved within 10 to 15 minutes. It has been found that the length of the vapor channel between the cold plate and the condenser in addition to the ambient and the condenser temperatures affect the system performance. 相似文献
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Colgan E.G. Furman B. Gaynes M. Graham W.S. LaBianca N.C. Magerlein J.H. Polastre R.J. Rothwell M.B. Bezama R.J. Choudhary R. Marston K.C. Toy H. Wakil J. Zitz J.A. Schmidt R.R. 《Components and Packaging Technologies, IEEE Transactions on》2007,30(2):218-225
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2 or more 相似文献
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低温应用的大功率器件需要设计高冷却效率的液冷室结构。采用计算流体动力学(CFD)方法模拟了以液氮-氮气两相流为制冷剂的空腔结构、微通道结构和扰流柱结构的流动与传热过程。结果表明,相比于空腔结构和微槽道结构,扰流柱结构具有较好的换热能力。圆形扰流柱易发展45°方向支流,而方形扰流柱结构有利于垂直方向流速均匀化。相较于平行排布,扰流柱交错排列时圆形和方形扰流柱结构中流速分布更为均匀。对比对流换热系数发现,交错排布优于平行排布,方形扰流柱优于圆形扰流柱。换热效果最好的结构为交错排布的2 mm方形扰流柱,对流换热系数为4223 W/(m2·K),较空腔结构提高125.83%。采用上述结构进行测试验证,在107.6 W加热功率工况下冷头测温点温度与相同功率下仿真结果有较好的对应性。 相似文献
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Octavio A. Leon Gilbert De Mey Erik Dick Jan Vierendeels 《Microelectronics Reliability》2004,44(7):1482-1187
The effect of aerodynamic shaping of the cooling fins in staggered heat sinks is numerically studied. It is shown that by rounding the cooling fins, the aerodynamic efficiency is increased without affecting the thermal efficiency. Three different geometries (in-line rectangular, staggered rectangular and rounded staggered shape) have been compared. These three different layouts were studied to obtain the best ratio between the removed heat and the energy spent to drive the coolant flow through the cooling fins. The main purpose of the paper is to determine the influence of the rounded shape on the average performance. As an example, it was found that a rounded staggered fin layout removes the same heat for an incident air velocity of 4 m/s as a classical in-line fin layout with a higher air speed of 6 m/s, with a reduction of fan power consumption by more than 60%. 相似文献