Reaction kinetics modeling and thermal properties of epoxy–amines as measured by modulated‐temperature DSC. II. Network‐forming DGEBA + MDA

Reaction‐induced vitrification takes place in the network‐forming epoxy–amine system diglycidyl ether of bisphenol A (DGEBA) + methylenedianiline (MDA) when the glass‐transition temperature (T_g) rises above the cure temperature (T_cure). This chemorheological transition results in diffusion‐controlled reaction and can be followed simultaneously with the reaction rate in modulated‐temperature DSC (MTDSC). To predict the effect of T_cure and the NH/epoxy molar mixing ratio (r) on the reaction rate in chemically controlled conditions, a mechanistic approach was used based on the nonreversing heat flow and heat capacity MTDSC signals, in which the reaction steps of primary (E_1OH = 44 kJ mol^?1) and secondary amine (E_2OH = 48 kJ mol^?1) with the epoxy–hydroxyl complex predominating. The diffusion factor DF as defined by the Rabinowitch approach expresses whether the chemical reaction rate or the diffusion rate determines the overall reaction rate. A model based on the free volume theory together with an Arrhenius temperature dependency was used to calculate the diffusion rate constant in DF as a function of conversion (x) and T_cure. The relation between x, r, and T_g, needed in this model, can be predicted with the Couchman equation. An experimental approximation for DF is the mobility factor DF* obtained from the heat capacity signal at a modulation frequency of 1/60 Hz, normalized for the effect of the reaction heat capacity in the liquid state and the change in C_p in the glassy region with x and T_cure. In this way, an optimized set of diffusion parameters was obtained that, together with the optimized kinetic parameters set, can predict the reaction rate for different cure schedules and for stoichiometric and off‐stoichiometric mixtures. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91: 2814–2833, 2004     

Isothermal Cure of an Epoxy System Containing Tetraglycidyl-4,4′-diaminodiphenylmethane (TGDDM), a Multifunctional Novolac Glycidyl Ether and 4,4′-Diaminodiphenylsulphone (DDS): Vitrification and Gelation

Times to gelation and vitrification have been determined at different isothermal curing temperatures between 200 and 240°C for an epoxy/amine system containing both tetraglycidyl-4,4′-diaminodiphenylmethane (TGDDM) and a multifunctional Novolac glycidyl ether with 4,4′-diaminodiphenylsulphone (DDS). The mixture was rich in epoxy, with an amine/epoxide ratio of 0·64. Gelation occurred around 44% conversion. Vitrification was determined from data curves of glass transition temperature, T_g, versus curing time obtained from differential scanning calorimetry experiments. The minimum and maximum values T_g determined for this epoxy system were T_g0=12°C and T_gmax=242°C. Values of activation energy for the cure reaction were obtained from T_g versus time shift factors, a_T, and gel time measurements. These values were, respectively, 76·2kJmol^-1 and 61·0kJmol^-1. The isothermal time–temperature–transformation (TTT) diagram for this system has been established. Vitrification and gelation curves cross at a cure temperature of 102°C, which corresponds to glass transition temperature of the gel. © of SCI.     

Glass‐transition temperature–conversion relationship for an epoxy–hexahydro‐4‐methylphthalic anhydride system

The DGEBA–MHHPA epoxy system has found increasing applications in microelectronics packaging, making crucial the ability to understand and model the cure kinetics mechanism accurately. The present article reports on work done to elucidate an appropriate model, modified from the empirical DiBenedetto's equation, to relate the glass‐transition temperature (T_g) to the degree of conversion for a DGEBA–MHHPA epoxy system. This model employs the ratio of segmental mobility for crosslinked and uncrosslinked polymers, λ, to fit the model curve to the data obtained. A higher ratio value was shown to indicate a more consistent rate of increase of T_g in relation to the degree of conversion, while a lower value indicated that the rate of T_g increase was disproportionately higher at higher degrees of conversion. The best fit value of λ determined by regression analysis for the DGEBA–MHHPA epoxy system was 0.64, which appeared to be higher than for those previously obtained for other epoxy systems, which ranged from 0.43–0.58. The highest T_g value obtained experimentally, T_{g max}, was 146°C, which is significantly below the derived theoretical maximum T_g∞ value of 170. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 511–516, 2000     

Reaction kinetics modeling and thermal properties of epoxy–amines as measured by modulated‐temperature DSC. I. Linear step‐growth polymerization of DGEBA + aniline

A mechanistic approach including both reactive and nonreactive complexes can successfully simulate both nonreversing (NR) heat flow and heat capacity (C_p) signals from modulated‐temperature DSC in isothermal and nonisothermal reaction conditions for different mixtures of diglycidyl ether of bisphenol A + aniline. The reaction of the primary amine with an epoxy–amine complex initiates cure (E_1A1 = 80 kJ mol^?1), whereas the reactions of the primary amine (E_1OH = 48 kJ mol^?1) and secondary amine (E_2OH = 48 kJ mol^?1) with an epoxy–hydroxyl complex are rate determining from about 2% epoxy conversion on. The reliability of the proposed mechanistic model was verified by experimental concentration profiles from Raman spectroscopy. When cure temperatures are chosen inside or below the full cure glass‐transition region, vitrification takes place partially or completely, respectively, as can be concluded from the magnitude of the stepwise decrease in C_p. The effect of the epoxy conversion (x) and mixture composition on thermal properties such as the glass‐transition temperature (T_g), the change in heat capacity at T_g [ΔC_p(T_g)], and the width of the glass transition region (ΔT_g) are considered. The Couchman relationship, in which only T_g and ΔC_p(T_g) of both the unreacted and the fully reacted systems are needed, was evaluated to predict the T_g– x relation by using simulated concentration profiles. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91:2798–2813, 2004     

New thermosets obtained by cationic copolymerization of DGEBA with γ‐caprolactone with improvement in the shrinkage. II. Time–temperature–transformation (TTT) cure diagram

Mixtures of diglycidylether of bisphenol A (DGEBA) with different proportions of γ‐caprolactone (γ‐CL) were cured with ytterbium triflate as initiator. The curing was studied with differential scanning calorimetry (DSC) and thermo mechanical analysis (TMA). The results are presented in the form of a time–temperature–transformation diagram. The kinetic analysis was performed by means of the isoconversional integral procedure and the kinetic model was also determined using the Coats–Redfern method. Gelation was determined by means of combined experiences of DSC and TMA. The relationship between the glass transition temperature (T_g) and the degree of conversion α was determined by DSC. Using the isoconversional lines and the T_g‐α relationship, the vitrificacion curve was obtained. The methodology developed makes it possible to obtain the TTT diagram using only no‐isothermal experiments with equivalent results to those using classical isothermal procedures. The addition of γ‐CL accelerates the curing and reduces the shrinkage after gelation and consequently the internal stresses in the material. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Master curve and time–temperature–transformation cure diagram of a polyfunctional epoxy acrylic resin

The curing reaction of a well‐defined glycidyl methacrylate‐co‐butyl acrylate statistical copolymer, prepared by atom transfer radical polymerization, and a commercial linear diamine (Jeffamine D‐230) was studied with the objectives of constructing and discussing a time–temperature–transformation isothermal curing for this system. Thermal and rheological analyses were used to obtain the gelation and vitrification times. Differential scanning calorimetry data showed a one‐to‐one relationship between the glass‐transition temperature (T_g) and fractional conversion independent of the cure temperature. As a result, T_g was used as a measurement of conversion. We obtained a kinetically controlled master curve for isothermal curing temperatures from 50 to 100°C by shifting T_g versus the natural logarithm time data to a reference temperature of 80°C. We calculated the apparent activation energy by applying two different methods, gel time measurements versus shift factors, suggesting a good agreement between them. Isoconversion contours were calculated by the numerical integration of the kinetic model. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Time–temperature–transformation cure diagrams of phenol–formaldehyde and lignin–phenol–formaldehyde novolac resins

In this study, the time–temperature– transformation (TTT) cure diagrams of the curing processes of several novolac resins were determined. Each diagram corresponded to a mixture of commercial phenol–formaldehyde novolac, lignin–phenol–formaldehyde novolac, and methylolated lignin–phenol–formaldehyde novolac resins with hexamethylenetetramine as a curing agent. Thermomechanical analysis and differential scanning calorimetry techniques were applied to study the resin gelation and the kinetics of the curing process to obtain the isoconversional curves. The temperature at which the material gelled and vitrified [the glass‐transition temperature at the gel point (_gelT_g)], the glass‐transition temperature of the uncured material (without crosslinking; T_g0), and the glass‐transition temperature with full crosslinking were also obtained. On the basis of the measured of conversion degree at gelation, the approximate glass‐transition temperature/conversion relationship, and the thermokinetic results of the curing process of the resins, TTT cure diagrams of the novolac samples were constructed. The TTT diagrams showed that the lignin–novolac and methylolated lignin–novolac resins presented lower T_g0 and _gelT_g values than the commercial resin. The TTT diagram is a suitable tool for understanding novolac resin behavior during the isothermal curing process. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Cure behavior of an epoxy–novolac molding compound

The isothermal cure of an epoxy–novolac molding compound was studied by means of differential scanning calorimetry (DSC). The glass transition temperature (T_g) of the molding compound increased in an approximately linear manner with conversion (α) during the major part of the cure process. Predictions of an empirical kinetic scheme (established earlier from dynamic DSC results) compared favorably with the present isothermal results in the absence of vitrification. In combination with the gel point conversion (α_gel) determined via dynamic rheological analysis and gravimetric measurements, our DSC results indicated that gelation bears no apparent effect on the rate of cure whereas vitrification retards the cure reaction. Based on the measured α_gel, the approximate T_g?α relationship, and the thermokinetic results, the time–temperature–transformation diagram of this molding compound was constructed and discussed.     

Observations of physical aging in a polycarbonate and acrylonitrile–butadiene–styrene blend

The effects of physical aging of a 75 : 25 PC/ABS blend have been studied using differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy (FTIR). From DSC, two distinct peak endotherms at about 90°C and 110°C, which are associated with the glass transition of ABS (T_g,ABS) and PC (T_g,PC) components, respectively, were observed. When progressive aging was monitored at 80°C for over 1000 h, the changes in enthalpic relaxation, glass and fictive temperatures for the blend followed similar trends to those already seen in the literature for PC aged between 125 and 130°C. The rate of enthalpy relaxation was also comparable. The plot of peak endotherm against logarithmic aging time for the PC blend constituent, however, behaved quite differently from the linear relationship known for highly aged PC. The ABS peak component also appeared to be insensitive to aging. Both observations were confirmed to be statistically significant using analysis of variance methods. Using temperature modulated‐DSC, there is evidence that aging increases the blend miscibility as the T_g,PC shifts toward the stationary T_g,ABS during aging. Parallel FTIR investigations found oxidation of butadiene during aging to be even at this relatively low temperature, forming hydroxyl and carbonyl degradation products. The presence of ABS in the blend also appeared to have prevented the shifting from the trans‐cis to trans‐trans arrangement of the carbonate linkage, which is a well‐known phenomenon during elevated temperature aging of PC alone. Moreover, the carbonate linkage appears to have been at the lower energy, trans‐trans, arrangement prior to the aging process. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Curing of epoxy systems at sub‐glass transition temperature

Three epoxy‐amine thermoset systems were cured at a low ambient temperature. Evolution of the reaction kinetics and molecular structure during cure at the sub‐glass transition temperature was followed by DSC and chemorheology experiments. The effect of vitrification and the reaction exotherm on curing and final mechanical properties of the epoxy thermosets was determined. Thermomechanical properties of the low‐temperature cured systems depend on the reaction kinetics and volume of the reaction mixture. Curing of the fast‐reacting system in a large volume (12‐mm thick layer) resulted in the material with T_g exceeding the cure temperature by 70–80°C because of an exothermal temperature rise. However, the reaction in a too large volume (50‐mm layer) led to thermal degradation of the network. In contrast, thin layers (1.5 mm) were severely undercured. Well‐cured epoxy thermosets could be prepared at sub‐T_g temperatures by optimizing reaction conditions. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3669–3676, 2006     

Curing of epoxy–urethane copolymers in a heated mold: Effect of the curing conditions on the phase‐separation process

The curing process of an epoxy–urethane copolymer in a heated mold was studied. The epoxy resin (DGEBA, Araldyt GY9527; Ciba Geigy), was coreacted with a urethane prepolymer (PU, Desmocap 12; Bayer) through an amine that acted as crosslinking agent (mixture of cycloaliphatic amines; Distraltec). The study focused on the effect of the curing condition and PU concentration on time–temperature profiles measured in the mold and the consequent final morphologies obtained. As the PU concentration increases, the maximum temperature reached in the mold decreases as a result of the dilution effect of the elastomer on reaction heat, whereas the T_g of the piece also decreases. Phase separation is a function of conversion and temperature reached in the curing part and was analyzed using experimental data and a mathematical model that predicts temperature and conversion throughout the thickness of the mold. Scanning electron microscopy and atomic force microscopy were used to determine the characteristics of the dispersed phase for the different formulations and conditions of curing. It was shown that the size of the dispersed phase increased with the initial PU concentration, whereas there were practically no differences in the separated phase as a function of position or temperature of curing (in the range of 70 to 100°C studied). The superposition of the phase diagrams with the conversion–temperature trajectories during cure provided an explanation of the morphologies generated. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 889–900, 2001     

High‐Tg,heat resistant epoxy–silica hybrids with a low content of silica generated by nonaqueous sol–gel process

The epoxy‐silica hybrids showing high T_g and thermal stability are prepared by the non‐aqueous sol–gel process initiated with borontriflouride monoethylamine. Tetramethoxysilane (TMOS) is used as a precursor of silica and 3‐glycidyloxypropyl trimethoxysilane as a coupling agent to strengthen the interphase interaction with an epoxy matrix. The basic factors governing the nonaqueous sol–gel process are studied in order to reveal the formation–structure–properties relationships and to optimize the hybrid composition as well as conditions of the nonaqueous synthesis. The formation of the hybrid, its structure, thermomechanical properties and thermal stability are followed by chemorheology experiments, NMR, DMA and TGA. The most efficient reinforcement of the epoxy network is achieved by the combination of both alkoxysilanes, showing synergy effects. The hybrids with a low content (～10 wt %) of the in situ generated silica exhibit dramatic increase in T_g and the high modulus, 335 MPa, up to the temperature 300°C. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40899.     

Curing kinetics and reaction‐induced homogeneity in networks of poly(4‐vinyl phenol) and diglycidylether epoxide cured with amine

Mixtures of diglycidyl ether of bisphenol‐A (DGEBA) epoxy resin with poly(4‐vinyl phenol) (PVPh) of various compositions were examined with a differential scanning calorimeter (DSC), using the curing agent 4,4′‐diaminodiphenylsulfone (DDS). The phase morphology of the cured epoxy blends and their curing mechanisms depended on the reactive additive, PVPh. Cured epoxy/PVPh blends exhibited network homogeneity based on a single glass transition temperature (T_g) over the whole composition range. Additionally, the morphology of these cured PVPh/epoxy blends exhibited a homogeneous network when observed by optical microscopy. Furthermore, the DDS‐cure of the epoxy blends with PVPh exhibited an autocatalytic mechanism. This was similar to the neat epoxy system, but the reaction rate of the epoxy/polymer blends exceeded that of neat epoxy. These results are mainly attributable to the chemical reactions between the epoxy and PVPh, and the regular reactions between DDS and epoxy. Polym. Eng. Sci. 45:1–10, 2005. © 2004 Society of Plastics Engineers.     

Effects of amino‐functionalized carbon nanotubes on the properties of amine‐terminated butadiene–acrylonitrile rubber‐toughened epoxy resins

Amino‐functionalized multiwalled carbon nanotubes (MWCNT‐NH₂s) as nanofillers were incorporated into diglycidyl ether of bisphenol A (DGEBA) toughened with amine‐terminated butadiene–acrylonitrile (ATBN). The curing kinetics, glass‐transition temperature (T_g), thermal stability, mechanical properties, and morphology of DGEBA/ATBN/MWCNT‐NH₂ nanocomposites were investigated by differential scanning calorimetry (DSC), thermogravimetric analysis, a universal test machine, and scanning electron microscopy. DSC dynamic kinetic studies showed that the addition of MWCNT‐NH₂s accelerated the curing reaction of the ATBN‐toughened epoxy resin. DSC results revealed that the T_g of the rubber‐toughened epoxy nanocomposites decreased nearly 10°C with 2 wt % MWCNT‐NH₂s. The thermogravimetric results show that the addition of MWCNT‐NH₂s enhanced the thermal stability of the ATBN‐toughened epoxy resin. The tensile strength, flexural strength, and flexural modulus of the DGEBA/ATBN/MWCNT‐NH₂ nanocomposites increased increasing MWCNT‐NH₂ contents, whereas the addition of the MWCNT‐NH₂s slightly decreased the elongation at break of the rubber‐toughened epoxy. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40472.     

Grafting of maleic anhydride onto styrene–butadiene–styrene triblock copolymer using supercritical CO2 as a swelling agent

Grafting of maleic anhydride (MA) onto styrene–butadiene–styrene triblock copolymer (SBS) was carried out by free radical polymerization using supercritical carbon dioxide (SC CO₂) as a solvent of MA and swelling agent of SBS. The effect of various factors such as monomer concentration, initiator concentration, SC CO₂ pressure, and reaction time on grafting ratio was studied. SBS and the product (SBS‐g‐MA) were characterized by Fourier transform infrared spectroscopy (FTIR), gel permeation chromatography (GPC), differential scanning calorimetry (DSC), and scanning electron microscopy (SEM). GPC data showed that the molecular weight of SBS‐g‐MA is bigger than that of SBS. DSC testing indicated that the glass transition temperature (T_g) of SBS‐g‐MA is higher than that of SBS. By SEM photo, we can observe that some particles which contain more oxygen atom grew out from the surface of SBS‐g‐MA when grafting ratio reached at 5.6%, and the amount and diameter of particles increased with increasing of grafting ratio. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 4425–4429, 2006     

Investigation of the reaction mechanism of different epoxy resins using a phosphorus‐based hardener

In this work, the fundamental kinetic and structure/property information for a novel phosphorus‐based hardener, bis(4‐aminophenoxy) phosphonate is cured with a range of common epoxy resins such as diglycidyl ether of bisphenol A, tri glycidyl p‐amino phenol and tetra glycidyl diamino diphenyl methane (TGDDM) at various cure temperatures. The rate coefficients k₁ and k₂ for the primary and secondary amine epoxide addition reactions, respectively, were determined and were found to exhibit a positive substitution effect for the TGAP and TGDDM epoxy resins. Etherification or internal cyclization were shown to be important at higher levels of cure conversion, with these reactions being more significant for the TGAP/BAPP system. Some basic structure/property relationships were established between the glass transition temperature (T_g) and epoxide conversion. The master curve obtained for the superimposition of the various cure temperatures for each epoxy demonstrated the independence of the cure mechanism with temperature. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99:3288–3299, 2006     

Epoxy–imide resins from N‐(4‐ and 3‐carboxyphenyl)trimellitimides. I. Adhesive and thermal properties

Epoxy–imide resins were obtained by curing Araldite GY 250 (diglycidyl ether of bisphenol‐A and epichlorohydrin; difunctional) and Araldite EPN 1138 (Novolac–epoxy resin; polyfunctional) with N‐(4‐ and 3‐carboxyphenyl)trimellitimides derived from 4‐ and 3‐aminobenzoic acids and trimellitic anhydride. The adhesive lap shear strength of epoxy–imide systems at room temperature and at 100, 125, and 150°C was determined on stainless‐steel substrates. Araldite GY 250‐based systems give a room‐temperature adhesive lap shear strength of about 23 MPa and 49–56% of the room‐temperature adhesive strength is retained at 150°C. Araldite EPN 1138‐based systems give a room‐temperature adhesive lap shear strength of 16–19 MPa and 100% retention of room‐temperature adhesive strength is observed at 150°C. Glass transition temperatures of the Araldite GY 250‐based systems are in the range of 132–139°C and those of the Araldite EPN 1138‐based systems are in the range of 158–170°C. All these systems are thermally stable up to 360°C. The char residues of Araldite GY 250‐ and Araldite EPN 1138‐based systems are in the range of 22–26% and 41–42% at 900°C, respectively. Araldite EPN 1138‐based systems show a higher retention of adhesive strength at 150°C and have higher thermal stability and T_g when compared to Araldite GY 250‐based systems. This has been attributed to the high crosslinking possible with Araldite EPN 1138‐based systems arising due to the polyfunctional nature of Araldite EPN 1138. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 1729–1736, 2000     

Time–temperature–transformation (TTT) cure diagram: Modeling the cure behavior of thermosets

The times to gelation and to vitrification for the isothermal cure of an amine-cured epoxy (Epon 828/PACM-20) have been measured on macroscopic and molecular levels by dynamic mechanical spectrometry (torsional braid analysis and Rheometrics dynamic spectrometer), infrared spectroscopy, and gel fraction experiments. The relationships between the extents of conversion at gelation and at vitrification and the isothermal cure temperature form the basis of a theoretical model of the time–temperature–transformation (TTT) cure diagram, in which the times to gelation and to vitrification during isothermal cure versus temperature are predicted. The model demonstrates that the “S” shape of the vitrification curve depends on the reaction kinetics, as well as on the physical parameters of the system, i.e., the glass transition temperatures of the uncured resin (T_g0), the fully cured resin (T_g∞), and the gel (_gelT_g). The bulk viscosity of a reactive system prior to gelation and/or vitrification is also described.     

Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging

For electrical interconnections in semiconductor packaging, epoxy‐based pastes have recently attracted considerable interest due to their excellent adhesion to various substrates and their reasonable electrical and mechanical properties, especially when combined with deoxidizing agents (to remove metallic oxides). Here, epoxy–diacid‐based hybrid pastes were examined to achieve a deoxidizing capability for eliminating Sn‐based solder oxides and adhesion between microchip and substrate as a one‐step process. Onset, exothermic peak and end temperatures of the reaction between epoxy and diacids were systematically probed using DSC, rheometry and Fourier transform infrared (FTIR) spectroscopy. The last moment of the adhesive reaction during heating substantially enhanced the thermal and mechanical properties of the epoxy–diacid adhesive despite the absence of exothermic enthalpy detected by DSC. The glass transition temperature (T_g) and Young's modulus gradually decreased as a function of aliphatic chain length of diacids except when the length was extremely short and voids were produced. Soldering (wetting) and deoxidizing capabilities of the hybrid adhesive were observed via optical microscopy and FTIR. The correlation between the reaction, T_g, conversion and viscosity was also investigated. Lastly, complete wetting and electrical interconnection with good mechanical robustness were achieved for a commercial chip/substrate set by flip‐chip bonding. © 2018 Society of Chemical Industry