Thermogravimetric study of degradation process of diglycidyl ether of bisphenol A–1,2‐diaminocyclohexane/calcium carbonate system

The thermal degradation of the epoxy system consisting of diglycidyl ether of bisphenol A (BADGE, n = 0)–1,2‐diaminocyclohexane (DCH) containing calcium carbonate filler is studied by thermogravimetric analysis to determine the reaction mechanism of the degradation process. The value of the activation energy, which is necessary for this study, is calculated using various integral and differential methods. The values obtained using the different methods are compared to the value obtained by Kissinger's method (234.84 ± 15.12 kJ/mol), which does not require knowledge of the n‐order value of the reaction mechanism. All the experimental results are compared to master curves in the range of Doyle's approximation (5–35% of conversion). The analysis of the results suggests that the reaction mechanism is a sigmoidal A₂ type. The thermodegradation mechanism is similar to that found for the same epoxy system without additives. However, for this last system the sigmoidal mechanism is an A₄ type. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1528–1535, 2002     

Lifetime prediction of the epoxy system DGEBA (n = 0)/1,2‐DCH modified with an epoxy reactive diluent by thermogravimetric analysis

Thermogravimetric analysis was used to predict the lifetime of two three‐component systems of diglycidyl ether of bisphenol A (n = 0)/1,2‐diamine cyclohexane [DGEBA (n = 0)/1,2‐DCH] modified with different concentrations of an epoxy reactive diluent, vinylcyclohexene dioxide (VCHD). Experimental results were treated using two methods. The first method was independent of the degradation mechanism, and the second was based on the thermodegradation kinetic mechanism. The activation energies of the reaction were determined using the Flynn–Wall–Ozawa method. These values were compared with those obtained using Kissinger's method. From experimental results it was found that the optimum temperature of service for these materials were different, so one or the other must be selected, depending on the application temperature considered. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 3835–3839, 2003     

Activation energies for the epoxy system BADGE n = 0/m‐XDA obtained using data from thermogravimetric analysis

In this article we study the kinetics of thermal degradation of the epoxy system BADGE n = 0/m‐XDA using different kinetic methods with data from thermogravimetric analysis (TGA) in dynamic conditions. Activation energies obtained using different integral methods (Flynn‐Wall‐Ozawa and Coats‐Redfern Methods) are in good agreement with the value obtained using the Kissinger method (204.44 kJ/mol). The solid‐state decomposition mechanism followed by this epoxy system is a decelerated R_n type (phase boundary controlled reaction). We have also calculated activation energies using the Van Krevelen and the Horowitz‐Metzger methods. These last methods corroborate the decelerated behavior. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 776–782, 2001     

Toughening of epoxy resins with aromatic polyesters

Polyesters, prepared by direct polycondensation from bisphenol A and aliphatic dicarboxylic acids [adipic acid (AD), suberic acid, sebacic acid (SE), and dodecanedioic acid], were used to improve the toughness of the diglycidyl ether of the bisphenol A/diaminodiphenyl methane epoxy system. Polyesters had the number average molecular weight (M_n) ranging from 4300 to 19,200 g/mole. The epoxy systems modified with the AD system (M_n = 6400 g/mole) and the SE system (M_n = 10,200 g/mole) showed phase separated structures with discrete domains of 0.2 μm, but other systems showed smooth fracture surfaces when observed by scanning electron microscopy. The modified epoxy systems except for the AD system and SE system showed two tan δ peaks corresponding to the α and β transitions of the epoxy resin. The modified epoxy systems showed maximum values of K_1c at around 10 wt % of polyester and maximum flexural properties at 5 wt % of polyester. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 2464–2473, 2000     

Kinetics of aryl phosphinate anhydride curing of epoxy resins using differential scanning calorimetry

The curing reaction of two kinds of epoxy resins, (bisphenol A epoxy DER331, and novolac epoxy DEN438) with aryl phosphinate anhydride (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide)-methyl succinic anhydride (DMSA), and benzyldimethylamine (BDMA) as the catalyst, was investigated by differential scanning calorimetry (DSC) using an isothermal approach over the temperature range 130–160°C. The experimental results showing autocatalytic behaviour were compared with the model proposed by Kamal, including two rate constants (k₁ and k₂) and two reaction orders (m and n). The model predictions are in good agreement with the experimental data and demonstrate that the autocatalytic model is capable of predicting the curing kinetics of both systems without any additional assumptions. The activation energies for the rate constants of DER331/DMSA and DEN438/DMSA are 77–92 kJmol^-1 and 83–146 kJmol^-1, respectively. The obtained overall reaction order of 2 is in agreement with the reaction mechanism reported by several workers. © 1998 SCI.     

Curing characteristics of epoxy resin systems that include a biphenyl moiety

The curing characteristics of epoxy resin systems that include a biphenyl moiety were investigated according to the change of curing agents. Their curing kinetics mainly depend on the type of hardener. An autocatalytic kinetic reaction occurs in epoxy resin systems with phenol novolac hardener, regardless of the kinds of epoxy resin and the epoxy resin systems using Xylok and DCPDP (dicyclopentadiene‐type phenol resin) curing agents following an nth‐order kinetic mechanism. The kinetic parameters of all epoxy resin systems were reported in terms of a generalized kinetic equation that considered the diffusion term. The fastest reaction conversion rate among the epoxy resin systems with a phenol novolac curing agent was obtained in the EOCN‐C epoxy resin system, and for systems with Xylok and DCPDP hardeners, the highest reaction rate values were obtained in NC‐3000P and EOCN‐C epoxy resin systems, respectively. The system constants in DiBenedetto's equation of each epoxy resin system with different curing agents were obtained, and their curing characteristics can be interpreted by the curing model using a curing agent as a spacer. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1942–1952, 2002     

Thermal decomposition kinetics of poly(nButMA‐b‐St) diblock copolymer synthesized by ATRP

The reaction mechanism of decomposition process and the kinetic parameters of the poly(n‐butyl methacrylate‐b‐styrene), poly(nButMA‐b‐St), diblock copolymer synthesized by atom transfer radical polymerization (ATRP) were investigated by thermogravimetric analysis (TGA) at different heating rates. TGA curves showed that the thermal decomposition occurred in one stage. The apparent activation energies of thermal decomposition for copolymer, as determined by the Kissinger's, Flynn–Wall–Ozawa and Tang methods, which does not require knowledge of the reaction mechanism (RM), were 112.52, 116.54, and 113.41 kJ/mol, respectively. The experimental results were compared with master plots, in the range of the Doyle approximation. Analysis of experimental results suggests that in the conversion range studied, 3–18%, the actual RM is an A₂ sigmoidal type. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Curing of epoxy systems at sub‐glass transition temperature

Three epoxy‐amine thermoset systems were cured at a low ambient temperature. Evolution of the reaction kinetics and molecular structure during cure at the sub‐glass transition temperature was followed by DSC and chemorheology experiments. The effect of vitrification and the reaction exotherm on curing and final mechanical properties of the epoxy thermosets was determined. Thermomechanical properties of the low‐temperature cured systems depend on the reaction kinetics and volume of the reaction mixture. Curing of the fast‐reacting system in a large volume (12‐mm thick layer) resulted in the material with T_g exceeding the cure temperature by 70–80°C because of an exothermal temperature rise. However, the reaction in a too large volume (50‐mm layer) led to thermal degradation of the network. In contrast, thin layers (1.5 mm) were severely undercured. Well‐cured epoxy thermosets could be prepared at sub‐T_g temperatures by optimizing reaction conditions. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3669–3676, 2006     

Thermal degradation of the epoxy system BADGE n = 0/1,2‐DCH immersed in hydrochloric acid

The thermal degradation of an epoxy system consisting of diglycidyl ether of bisphenol‐A and 1,2‐diamine cyclohexane (BADGE n = 0/1,2‐DCH), immersed in hydrochloric acid for 30 days, was studied by thermogravimetric analysis, to determine the reaction mechanism of the degradation process. The results were compared with experimental data corresponding to the same epoxy system without exposure to the acid. It was found that the kinetic reaction mechanism changed with the immersion in HCl. The average activation energy of the solid‐state process was determined by using the Flynn‐Wall‐Ozawa method, resulting in 81 ± 2 kJ/mol. Different integral and differential methods and different reaction mechanisms reported in the literature were used and compared to this value. Analysis of experimental results suggests that in the conversion range studied, 5–20%, the reaction mechanism is somewhere between the different types of phase boundary controlled reaction and random nucleation with one nucleus on the individual particle. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 371–375, 2002     

Crown ethers as new curing agents for epoxy resins

Different crown ethers (4‐aminobenzo‐15‐crown‐5 (4‐aminobenzo‐15‐C5), 1,4,10,13‐tetraoxa‐7,16‐diazacyclooctadecane (diaza‐18‐crown‐6), tetraazacyclododecane‐1,4,7,10‐tetraacetic acid (H₄DOTA) and tetraazacyclododecane‐1,4,7,10‐tetraacetamide (H₂ODDA)) were used as curing agent for bisphenol A diglycidyl ether (BADGE, n = 0). The maximum enthalpy change for all systems except that formed by the epoxy resin with H₄DOTA corresponds to a stoichiometric ratio, since from this value the reaction enthalpies decrease when the proportion of epoxy increases. Heteropolymerization reaction occurs in all the crown ethers. Etherification reactions occur at temperatures much lower (30 °C less) than for the porphyrin systems studied in which a second signal appears at 300 °C. The etherification is evidenced by a slight shoulder in the thermograms for H₄DOTA and H₂ODDA. The systems BADGE (n = 0)/4‐aminobenzo‐15‐C5 and BADGE (n = 0)/diaza‐18‐crown‐6 improve the thermal stability of the epoxy resin by 30 °C approximately while the improvement for BADGE (n = 0)/H₄DOTA and BADGE (n = 0)/H₂ODDA is about 60 °C. © 2017 Society of Chemical Industry     

Curing kinetics and thermal property characterization of the bisphenol‐F epoxy resin and phthalic anhydride system

The curing kinetics of bisphenol‐F epoxy resin (BPFER) and curing agent phthalic anhydride, with N,N‐dimethylbenzylamine as an accelerator, were studied by differential scanning calorimetry (DSC). Analysis of DSC data indicated autocatalytic behaviour in the first stages of the cure for the system, and that this, could be well described by the model proposed by Kamal, which includes two rate constants, k₁ and k₂, and two reaction orders, m and n. The curing reaction in the later stages was practically diffusion‐controlled. To consider the diffusion effect more precisely, a diffusion factor, ??(α), was introduced into Kamal's equation. The glass transition temperatures (T_gs) of the BPFER/phthalic anhydride samples were determined by means of torsional braid analysis. The thermal degradation kinetics of cured BPFER were investigated by thermogravimetric analysis. © 2002 Society of Chemical Industry     

Synthesis and properties of urethane elastomer-modified epoxy resin having hydroxymethyl group

Synthesis and properties of urethane elastomer-modified epoxy resins were studied. The urethane elastomer-modified epoxy resins were synthesized by the reaction of a 4-cresol type epoxy compound having hydroxymethyl groups (EPCDA) with isocyanate prepolymer. The structure was identified by IR, ¹H NMR and GPC. These epoxy resins (EPCDATDI) were mixed with a commercial epoxy resin (DGEBA) in various ratios. The mixed epoxy resins were cured with a mixture of 4,4′-diaminodiphenylmethane and 3-phenylenediamine (molar ratio 6:4) as a hardener. The curing behaviour of these epoxy resins was studied by DSC. The higher the concentration of EPCDATDI, the higher the onset temperature and the smaller the rate constant (k) of the exothermic cure reaction were. It was considered that the ratio of hydroxymethyl group to epoxide group was very small and the molecular weight of EPCDATDI was large. Therefore, the accelerating effect of the hydroxymethyl group on the epoxide–amine reaction was cancelled by the retardant effect of increased molecular weight and viscosity, and decreased molecular motion. Toughness was estimated by Izod impact strength and fracture toughness (K_1C). On addition of 10 wt% EPCDATDI with low molecular weight (M?_n 6710, estimated by GPC using polystyrene standard samples), Izod impact strength and K_1C increased by 70% and 60%, respectively, compared with unmodified epoxy resin. Glass transition temperatures (T_g) for the cured epoxy resins mixed with EPCDATDI measured by dynamic mechanical spectrometry were the same as those of unmodified epoxy resin. The storage modulus (E′) at room temperature decreased with increasing concentration of EPCDATDI. Toughness and dynamic mechnical behaviour of cured epoxy resin systems were studied based on the morphology.     

Studies on thermal and morphological behavior of siliconized epoxy bismaleimide matrices

Novel bismaleimide‐modified siliconized epoxy intercrosslinked network systems were developed. Siliconized epoxy systems containing 5, 10, and 15% siloxane units were prepared using epoxy resin and hydroxyl‐terminated polydimethylsiloxane (HTPDMS) with γ‐aminopropyltriethoxysilane (γ‐APS) as a compatibilizer and dibutyltindilaurate as a catalyst. The siliconized epoxy systems were further modified with 5, 10, and 15% (wt %) of bismaleimide [(N,N′‐bismaleimido‐4,4′‐diphenylmethane) (BMI)] and cured by diaminodiphenylmethane (DDM). Differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and heat‐distortion temperature measurement of the matrix samples were carried out to assess their thermal behavior. DSC thermograms of the BMI‐modified epoxy systems show unimodel reaction exotherms. The glass transition temperature (T_g) of the cured BMI‐modified epoxy and siliconized epoxy systems increases with increasing BMI content. Thermogravimetric analysis and heat‐distortion temperature measurements indicate that the thermal degradation temperature and heat‐distortion temperature of the BMI‐modified epoxy and siliconized epoxy systems increase with increasing BMI content. The morphology of the BMI‐modified siliconized epoxy systems was also studied by scanning electron microscopy (SEM). © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2330–2346, 2001     

Cure and glass transition temperature of the bisphenol S epoxy resin with 4,4′‐diaminodiphenylmethane

The curing reaction of bisphenol S epoxy resin (BPSER) with 4,4′‐diaminodiphenylmethane (DDM) was studied by means of torsional braid analysis (TBA) in the temperature range of 393–433 K. The glass transition temperature (T_g) of the BPSER/DDM system is determined, and the results show that the reaction rate increases with increasing the T_g in terms of the rate constant, but decreases with increasing conversion. 1 The T_g of BPSER/DDM is about 40 K higher than BPAER/DDM. The gelation and vitrification time were assigned by the isothermal TBA under 373 K; in addition, an FTIR spectrum was carried out to describe the change of the molecular structure. The thermal degradation kinetics of this system was investigated by thermogravimetric analysis (TGA). It illustrated that the thermal degradation of the BPSER/DDM has n‐order reaction kinetics. 2 © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 794–799, 2000     

Kinetic study of the effect of catalysts on the curing of biphenyl epoxy resin

The investigation of cure kinetics of biphenyl epoxy (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl)dicyclopentadiene type phenolic resin system with different kinds of catalysts was performed by a differential scanning calorimeter using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of the formulations using triphenylphosphine (TPP), 1-benzyl-2-methylimidazole (1B2MI), and tris(4-methoxyphenyl)phosphine (TPAP) as a catalyst proceeds through an nth-order kinetic mechanism, whereas thatof the formulations using diazabicycloundecene (DBU) and tetraphenyl phosphonium tetraphenyl borate (TPP–TPB) proceeds by an autocatalytic kinetic mechanism. To describe the cure reaction in the latter stage, we have used semiempirical relationship proposed by Chern and Poehlein. By combining an nth-order kinetic model or an auto-catalytic model with a diffusion factor, it is possible to predict the cure kinetics of each catalytic system over the whole range of conversion. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 68: 1125–1137, 1998     

Effect of amino-polycarbonate on the curing kinetics and morphology of epoxy resin

The curing kinetics and the glass transition behavior of amino-polycarbonate with diglycidyl ether of bisphenol-A epoxy resin systems were studied by differential scanning calorimetry (DSC). The ASTM E-698 method was chosen to determine the kinetics parameters of the curing reaction, including the activation energy, preexponential factor, rate constant, and 60-min half-life temperature. The amino-polycarbonate was able to accelerate the curing reaction, reduce the apparent active energy, and decrease T_g of the systems. A homogeneous amino-polycarbonate/epoxy resin network was observed in scanning electron microscopy (SEM) pictures. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 833–838, 2001     

Curing kinetics and thermal property characterization of a bisphenol‐F epoxy resin and DDO system

The curing kinetics of a bisphenol‐F epoxy resin (BPFER)/4,4′‐diaminodiphenyl oxide (DDO) system were studied with isothermal experiments via differential scanning calorimetry. Autocatalytic behavior was shown in the first stages of the cure for the system, which was well described by the model proposed by Kamal that includes two rate constants, k₁ and k₂, and two reaction orders, m and n. The curing reaction at the later stages was practically diffusion‐controlled because of the onset of gelation and vitrification. For a more precise consideration of the diffusion effect, a diffusion factor, f(α), was introduced into Kamal's equation. In this way, the curing kinetics were predicted well over the entire range of conversion, covering both previtrification and postvitrification stages. The glass‐transition temperatures (T_g's) of the BPFER/DDO system partially isothermally cured were determined by means of torsional braid analysis, and the results showed that T_g's increased with conversion up to a constant value. The highest T_g was 376.3 K. The thermal degradation kinetics of cured BPFER were investigated with thermogravimetric analysis, which revealed two decomposition steps. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1586–1595, 2002     

Curing kinetics and thermal property characterization of a bisphenol‐S epoxy resin and DDS system

The kinetics of the cure reaction for a system of bisphenol‐S epoxy resin (BPSER), with 4,4′‐diaminodiphenyl sulfone (DDS) as a curing agent was investigated with a differential scanning calorimeter (DSC). Autocatalytic behaviour was observed in the first stages of the cure which can well be described by the model proposed by Kamal, using two rate constants, k₁ and k₂, and two reaction orders, m and n. The overall reaction order, m + n, is in the range 2∼2.5, and the activation energy for k₁ and k₂ was 86.26 and 65.13 kJ mol⁻¹, respectively. In the later stages, a crosslinked network was formed and diffusion control was incorporated to describe the cure. The glass transition temperature (T_g) of the BPSER/DDS samples partially cured isothermally was determined by means of torsional braid analysis (TBA) and the results showed that the reaction rate increased with increasing T_g, in terms of rate constant, but decreased with increasing conversion. It was also found that the  SO₂ group both in the epoxy resin and in the hardener increases the T_g values of the cured materials compared with that of BPAER. The thermal degradation kinetics of this system was investigated by thermogravimetric analysis (TGA). It illustrated that the thermal degradation of BPSER/DDS has nth order reaction kinetics. © 2000 Society of Chemical Industry     

Effects of epoxy content on dynamic mechanical behaviour of PEI‐toughened dicyanate–novolac epoxy blends

By varying the cyanate/epoxy ratio, three polyetherimide(PEI)‐modified bisphenol A dicyanate–novolac epoxy resin blends with different epoxy contents were prepared. The effects of epoxy content on the dynamic mechanical behaviour of those blends were investigated by dynamic mechanical thermal analysis. The results showed that the glass transition temperature of the cyanate–epoxy network (T_g1) in the modified blend decreases with epoxy content. When the epoxy content increases, both the width of the glass transition of the cyanate–epoxy network and its peak density are depressed substantially. Although the tangent delta peak value of PEI is basically independent of epoxy content, the T_g of PEI (T_g2) decreases with epoxy content. T_g1 is independent of the PEI loading. When T_g1 is lower than T_g2, however, the T_g1 in the blend with revised phase structure is substantially lower than other blends. Copyright © 2004 Society of Chemical Industry     

Synthesis,cationic polymerization and curing reaction with epoxy resin of 3,9‐di(p‐methoxybenzyl)‐1,5,7,11‐tetra‐oxaspiro(5,5)undecane

A new spiro ortho carbonate, 3,9‐di(p‐methoxybenzyl)‐1,5,7,11‐tetra‐oxaspiro(5,5)undecane was prepared by the reaction of 2‐methoxybenzyl‐1,3‐propanediol with di(n‐butyl)tin oxide, following with carbon disulfide. Its cationic polymerization was carried out in dichloromethane using BF₃‐OEt₂ as catalyst. The [¹H], [¹³C]NMR and IR data as well as elementary analysis of the polymers obtained indicated that it underwent double ring‐opening polymerization. The polymerization mechanism is discussed. The curing reaction of bisphenol A type epoxy resin in the presence of the monomer and a curing agent was investigated. DSC measurements were used to follow the curing process. In the case of boron trifluoride‐o‐phenylenediamine (BF₃‐OPDA) as curing agent, two peaks were found on the DSC curves, one of which was attributed to the polymerization of the epoxy group, and the other to the copolymerization of the monomer with the isolated epoxy groups or homopolymerization. However, when BF₃‐H₂NEt was used as curing agent, only one peak was present. IR measurement of the modified epoxy resin with various weight ratios of epoxy resin/monomer was performed in the presence of BF₃‐H₂NEt as curing agent. The results demonstrate that the conversion of epoxy group increases as the content of monomer increases. The curing process and the structure of the epoxy resin network are discussed. © 2000 Society of Chemical Industry