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1.
3,3′‐Dinitrobenzidine was first reacted with excess m‐chlorophenyl acid to form a monomer with dicarboxylic acid end groups. Two types of aromatic dianhydrides (Pyromellitic diconhydride (PMDA) and 3,3′,4,4′‐sulfonyl diphthalic anhydride) were also reacted with excess 4,4′‐diphenylmethane diisocyanate to form polyimide prepolymers terminated with isocyanate groups. The prepolymers were further extended with the diacid monomer to form nitro groups containing aromatic poly(imide amide). The nitro groups in these copolymers were hydrogenated to form amine groups and then were cyclized at 180°C to form poly(imide amide benzimidazole) in poly(phosphoric acid), which acted as a cyclization agent. The resultant copolymers were soluble in sulfuric acid and poly(phosphoric acid), in sulfolane under heating to 100°C, and in the polar solvent N‐methyl‐2‐pyrrolidone under heating to 100°C with 5% lithium chloride. According to wide‐angle X‐ray diffraction, all the copolymers were amorphous. According to thermal analysis, the glass‐transition temperatures of the copolymers were 270–322°C. The 10% weight‐loss temperatures were 460–541°C in nitrogen and 441–529°C in air. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 1435–1444, 2003  相似文献   

2.
Poly(amide imide) copolymers were synthesized with different molar ratios of 4,4‐diphenylmethane diisocyanate, two types of aromatic dianhydrides (pyromellitic dianhydride (PMDA) and 3,3′,4,4′‐sulfonyl diphthalic anhydride (DSDA)), and a diacid, which was derived from 3,3′‐dinitrobenzidine and isophthaloyl chloride in a previous work. In this study, the copolymers were further reacted with a reducing agent, and the nitro groups in the copolymers were hydrogenated into amine groups. Then, the amine‐group‐containing poly(amide imide) copolymers were cyclized at 180°C to form the poly(benzimidazole imide amide) copolymers in poly(phosphoric acid), which acted as a cyclizing agent. The resultant copolymers were soluble in sulfuric acid and poly(phosphoric acid) at room temperature and in sulfolane or N‐methyl‐2‐pyrrolidone under heating to 100°C with 5% lithium chloride. According to wide‐angle X‐ray diffraction, all the copolymers were amorphous. According to thermal analysis, the glass‐transition temperature ranged from 270 to 322°C, and the 10% weight‐loss temperature ranged from 460 to 541°C in nitrogen and from 441 to 529°C in air. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 91: 378–386, 2004  相似文献   

3.
In this study, the 3′-dinitrobenzidine was first reacted with excess isophthaloyl chloride form a monomer with dicarboxylic acid end group. Two types of aromatic dianhydride (viz. pyromellitic dianhydride (PMDA) and 3,3′,4,4′-sulfonyldiphthalic anhydride (DSDA)), were also reacted with excess 4,4′-diphenyl-methane diisocyanate to form polyimide prepolymers terminated with an isocyanate group. The prepolymers was further extended with the diacid monomer to form a nitro group containing aromatic poly(amide-imide) copolymers. The nitro groups in these copolymers were hydrogenated to form amine groups and cyclized at 180 C, to form the poly(benzimidazole amide imide) copolymers in polyphosphoric acid which acted as a cyclization agent. The resulting copolymers can be soluble in sulfuric acid and polyphosphoric acid, in sulfolane under heating to 100 C, and in polar solvent N-methyl-2-pyrrolidone under heating to 100 C with 5% lithium chloride. From the DSC and TGA measurements, it demonstrated that the glass transition temperature of copolymers exhibits a range of 270∼322 C. The 10% weight loss temperatures exhibits a range of 460∼541 C in nitrogen, and 441∼529 C in air, respectively. The activation energy and the integration parameter of degradation temperature of the copolymers were evaluated by the Doyle–Ozawa method. It indicated that these copolymers exhibited good thermal and thermo-oxidative stability with the increase of imide content.  相似文献   

4.
The poly(urea‐imide) copolymers with inherent viscosity of 0.81–1.08 dL/g were synthesized by reacting aryl ether diamine or its polyurea prepolymer with various diisocyanate‐terminated polyimide prepolymers. The aryl ether diamine was obtained by first nucleophilic substitution of phenolphthalein with p‐chloronitrobenzene in the presence of anhydrous potassium carbonate to form a dinitro aryl ether, and then further hydrogenated to diamine. The polyimide prepolymers were prepared by using 4,4′‐diphenylmethane diisocyanate to react with pyromellitic dianhydride, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride, or 3,3′,4,4′‐sulfonyldiphthalic anhydride by using the direct one‐pot method to improve their solubility, but without sacrificing thermal property. These copolymers are amorphous and readily soluble in a wide range of organic solvents such as N‐methyl‐2‐pyrrolidone, dimethylimidazole, N,N‐dimethylacetamide, dimethyl sulfoxide, N,N‐dimethylformamide, m‐cresol, and sulfolane. All the poly(urea‐imides) have glass transition temperatures in the range of 205–240°C and show a 10 wt % loss at 326–352°C in nitrogen and 324–350°C in air. The tensile strength, elongation at break, and initial modulus of these copolymer films range from 42 to 79 MPa, 5 to 16%, and 1.23 to 2.02 GPa, respectively. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 1719–1730, 1999  相似文献   

5.
Thermostable Nomex copoly(amide–imide)s with inherent viscosity of 0.72–1.31 dL/g were synthesized by reacting diacid-terminated Nomex prepolymer with various diisocyanate-terminated polyimide prepolymers. The polyimide prepolymer was prepared by using 4,4′-diphenylmethane diisocyanate to react with 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, or 3,3′,4,4′-sulfonyl diphthalic anhydride using a direct one pot method in order to improve their solubility. The copolymers, except B-1, P-1, P-2, D-1, and D-2, could be dissolved in N, N-dimethylacetamide +5% lithium chloride at room temperature or dimethyl sulfoxide at high temperature but were not soluble in N,N-dimethylformamide or pyridine. The solubility is considered to be related to their crystallinity. Those copolymers with crystalline structure displayed poor solubility. All the Nomex copoly(amide–imide)s had glass transition temperatures in the range of 223–352°C and showed a 10% weight loss temperature of 438–574°C in air and 441–585°C in nitrogen atmosphere. The tensile strength, elongation at break, and initial modulus of polymer films ranged 63–118 MPa, 4–9% and 1.67–2.53 GPa, respectively. From the X-ray diffraction studies, copolymers of B-1, P-1, P-2, D-1, and D-2 with high content of PmIA showed a crystalline structure, but the others only displayed an amorphous morphology. © 1996 John Wiley amp; Sons, Inc.  相似文献   

6.
Thermostable polyamideimides with inherent viscosity of 1.02–1.50 dL/g were synthesized from reacting of diamine-terminated aromatic amide prepolymer with various diisocyanate terminated imide prepolymers. The imide prepolymer was prepared by using 4,4′-diphen-ylmethane diisocyanate to react with 3,3′,4,4′ benzophenonetetracarboxylic dianhydride, 3,3′,4,4′ sulfonyl diphthalic anhydride, or 4,4′-oxydiphthalic anhydride using the direct one-pot method to improve their solubility. Almost all of the polyamideimides were generally soluble in a wide range of organic solvents such as N,N-dimethylformamide, N,N-dimeth-ylacetamide, N-methyl-2-pyrrolidone, dimethyl sulfoxide, and pyridine at room temperature. Polymers with high imide content required high temperatures to dissolve. All polyamide-imides had a glass transition temperature of 223–352°C and showed a 10% weight loss temperature of 415–575°C in air and 424–583°C in nitrogen atmosphere. The tensile strength, elongation at break, and initial modulus of polymer films ranged from 61 to 108 MPa, 5 to 10% and 1.54 to 2.50 GPa, respectively. These copolymers were partly crystalline in structure as shown by X-ray pattern. © 1996 John Wiley & Sons, Inc.  相似文献   

7.
Soluble poly(amide imide) derivatives were prepared through the direct polycondensation of 1,2,4‐benzenetricarboxylic acid and three diamines—bis[4‐(3‐aminophenoxy)phenyl]sulfone, bis(4‐aminophenyl)‐1,4‐diisopropylbenzene, and 4,4′‐oxydianilne—in the presence of metal salts and phosphorous compounds. Phosphonium salt, which was used as the initiating species and was prepared by the reaction of the metal salts and phosphorous compounds, reacted with 1,2,4‐benzenetricarboxylic acid to form acyloxy phosphonium salt, and then the salt was reacted with a diamine for the preparation of the prepolymers. The prepolymers were converted into the corresponding poly(amide imide)s in a homogeneous solution state at 180°C. The poly(amide imide)s showed good thermal and mechanical properties. Glass‐transition temperatures were observed from 240 to 270°C in differential scanning calorimetry traces. A melting endotherm was not observed for the polymers with differential scanning calorimetry. The initial decomposition occurred around 400°C according to thermogravimetric analysis, and major weight loss was observed from 610 to 680°C. The poly(amide imide)s had comparatively good solubility in aprotic polar solvents at concentrations high enough (~30%) for the fabrication of various forms. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 1399–1407, 2002  相似文献   

8.
Thermostable naphthalate-containing copoly(amide-imide)s with inherent viscosity of 0.53–0.96 dL/g were synthesized by reacting diacid-terminated naphthalate monomers with various diisocyanate-terminated polyimide prepolymers. The poly-imide prepolymers were prepared by using 4,4′-diphenylmethane diisocyanate to react with 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, or 3,3′,4,4′-sulfonyl diphthalic anhydride using a direct one-pot method to improve their solubility without sacrificing their thermal properties. The copolymers, except the B-2 and P-2 series, can be dissolved in N,N-dimethylacetamide and 5% lithium chloride or dimethyl sulfoxide at high temperature but are not soluble in pyridine. The solubility of the copolymers is related to their chemical and crystalline structures. Those copolymers with sulfonyl or amorphous structures display good solubility. All the naphthalate-containing copoly(amide-imide)s have glass transition temperatures and melting points in the range of 223–312°C and 348–366°C, respectively, and show a 10% weight-loss temperature of 485–549°C in air and 465–564°C in a nitrogen atmosphere. The tensile strength, elongation at break, and initial modulus of polymer films range from 25–74 MPa, 4–9%, and 0.74–1.60 GPa, respectively. From the X-ray diffraction studies, copolymers of B-2, P-2, and D-2 with symmetrical 2,6-naphthalate amide structure are crystalline, but the others are amorphous. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 65:1581–1593, 1997  相似文献   

9.
Our interest in the fabrication of high‐performance polyimides has led to thiourea‐substituted poly(thiourea‐ether‐imide)s (PTEIs) with good retention of thermal properties along with flame retardancy. A new aromatic monomer, 4,4′‐oxydiphenyl‐bis(thiourea) (ODPBT), was efficiently synthesized and polymerized with various dianhydrides (pyromellitic dianhydride, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride and 4,4′‐(hexafluoroisopropylidene)diphthalic dianhydride) via two‐stage chemical imidization to fabricate a series of PTEIs. The structural characterization of ODPBT and the polymers was carried out using Fourier transform infrared, 1H NMR and 13C NMR spectral techniques along with crystallinity, organosolubility, inherent viscosity and gel permeation chromatographic measurements. PTEIs bearing C?S and ? O? moieties in the backbone demonstrated an amorphous nature and were readily soluble in various amide solvents. The novel polymers had inherent viscosities of 1.16–1.23 dL g?1 and molecular weights of ca 90 783–96 927 g mol?1. Their thermal stability was substantiated via 10% weight loss in the temperature range 516–530 °C under inert atmosphere. The polyimides had glass transition temperatures of 260–265 °C. Incorporation of thiourea functionalities into polymer backbones is demonstrated to be an effective way to enhance their thermal properties and flame retardancy. Thus, ODPBT can be considered as an excellent candidate for use in the synthesis of high‐performance polymeric materials. Copyright © 2010 Society of Chemical Industry  相似文献   

10.
Thermostable poly(amide-imide)s containing parameta benzoic structure were synthesized by reacting a parameta benzoic polyamide prepolymer with various diisocyanate-terminated polyimide prepolymers. The polyamide prepolymers were prepared by first reacting m-phenylene diamine and isophthaloyl dichloride to form a poly(m-phenylphthalamide) prepolymer, then the terephthaloyl dichloride was subsequently added to form a parameta benzoic polyamide prepolymer. The polyimide prepolymers were also prepared by using 4,4′-diphenylmethane disocyanate to react with pyromellitic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, or 3,3′,4,4′-sulfonyldiphthalic anhydride using the direct one-pot method to improve their solubility, but without sacrificing thermal and physical properties. From the experimental results, the inherent viscosity of the copolymers was 0.72–1.15 dL/g and they were readily soluble in a wide range of organic hot solvents such as N-methyl-2-pyrrolidone, dimethylimidazole, N,N-dimethylacetamide, dimethyl sulfoxide, and N,N-dimethylformamide; however, some of the copolymers were not soluble in pyridine. The solubility was related to their chemical structure. Those copolymers with sulfonyl and high amide content displayed good solubility. All the poly(amide-imide)s had a glass transition temperature of 260–324°C, but the melting point did not vary much. The 10% weight loss temperatures were in a range of 463–580°C in nitrogen and 450–555°C in an air atmosphere. The tensile strength, elongation at break, and initial modulus of the copolymer films ranged from 59 to 102 MPa, 3.1 to 5.1%, and 1.52 to 3.59 GPa, respectively. These copolymers, except those of high imide content (e.g., P-6, B-4, B-6 and D-6), which showed an amorphous structure, mostly display a crystalline morphology. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 2671–2679, 1999  相似文献   

11.
Addition polyimide oligomers have been synthesized from 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride and 3,3′-methylenedianiline using a variety of latent crosslinking groups as end-caps. The nominal 1300 molecular weight imide prepolymers were isolated and characterized for solubility in amide, chlorinated and ether solvents, melt-flow and cure properties, glass transition temperature, and thermal stability on heating in an air atmosphere. Adhesive strengths of the polyimides were obtained both at ambient and elevated temperatures before and after aging at 232°C. Properties of the novel addition polyimides were compared to a known nadic end-capped adhesive, LARC-13.  相似文献   

12.
Two series of aromatic polyimides containing various linkage groups based on 2,7‐bis(4‐aminophenoxy)naphthalene or 3,3′‐dimethyl‐4,4′‐diaminodiphenylmethane and different aromatic dianhydrides, namely 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride), 4,4′‐(hexafluoroisopropylidene)bis(phthalic anhydride), 3,3′,4,4′ benzophenonetetracarboxylic dianhydride, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride and 4,4′‐(4,4′‐hexafluoroisopropylidenediphenoxy)bis(phthalic anhydride), were synthesized and compared with regard to their thermal, mechanical and gas permeation properties. All these polymers showed high thermal stability with initial decomposition temperature in the range 475–525 °C and glass transition temperature between 208 and 286 °C. Also, the polymer films presented good mechanical characteristics with tensile strength in the range 60–91 MPa and storage modulus in the range 1700–2375 MPa. The macromolecular chain packing induced by dianhydride and diamine segments was investigated by examining gas permeation through the polymer films. The relationships between chain mobility and interchain distance and the obtained values for gas permeability are discussed. © 2014 Society of Chemical Industry  相似文献   

13.
A new indane containing unsymmetrical diamine monomer ( 3 ) was synthesized. This diamine monomer leads to a number of novel semifluorinated poly (ether imide)s when reacted with different commercially available dianhydrides like benzene‐1,2,4,5‐tetracarboxylic dianhydride (PMDA), benzophenone‐3,3′, 4,4′‐tetracarboxylic dianhydride (BTDA), 4,4′‐(hexafluoro‐isopropylidene)diphthalic anhydride (6FDA), 4,4′‐oxydiphthalic anhydride (ODPA), and 4,4′‐(4,4′‐Isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA) by thermal imidization route. All the poly(ether imide)s showed excellent solubility in several organic solvents such as N‐methylpyrrolidone (NMP), N,N‐dimethylformamide (DMF), N,N‐dimethylacetamide (DMAc), tetrahydrofuran (THF), chloroform (CHCl3) and dichloromethane (DCM) at room temperature. These light yellow poly (ether imide)s showed very low water absorption (0.19–0.30%) and very good optical transparency. Wide angle X‐ray diffraction measurements revealed that these polymers were amorphous in nature. The polymers exhibited high thermal stability up to 526°C in nitrogen with 5% weight loss, and high glass transition temperature up to 265°C. The polymers exhibited high tensile strength up to 85 MPa, modulus up to 2.5 GPa and elongation at break up to 38%, depending on the exact polymer structure. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009  相似文献   

14.
A novel aromatic diamine, 3,3′‐diisopropyl‐4,4′‐diaminophenyl‐4″‐methyltoluene with a 4‐methylphenyl pendant group and isopropyl side groups, was designed and synthesized in this study. Then it was polymerized with various aromatic dianhydrides including pyromellitic dianhydride, 3,3′,4,4′‐biphenyltetracarboxylic dianhydride, 4,4′‐oxydiphthalic anhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride and 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride via a one‐pot high temperature polycondensation procedure to produce a series of aromatic polyimides. These polyimides exhibited excellent solubility even in common organic solvents, such as chloroform and tetrahydrofuran. The flexible and tough films can be conveniently obtained by solution casting. The films were nearly colorless and exhibited high optical transparency, with the UV cutoff wavelength in the range 302–365 nm and the wavelength of 80% transparency in the range 385–461 nm. Moreover, they showed low dielectric constants (2.73–3.23 at 1 MHz) and low moisture absorption (0.13%–0.46%). Furthermore, they also possessed good thermal and thermo‐oxidative stability with 10% weight loss temperatures (T10%) in the range 489–507 °C in a nitrogen atmosphere. The glass transition temperatures of all polyimides are in the range 262–308 °C. Copyright © 2012 Society of Chemical Industry  相似文献   

15.
4,4′‐Diamino‐3,3′‐dimethyldiphenylmethane was used to prepare polyimides in an attempt to achieve good organo‐solubility and light color. Polyimides based on this diamine and three conventional aromatic dianhydrides were prepared by solution polycondensation followed by chemical imidization. They possess good solubility in aprotonic polar organic solvents such as N‐methyl 2‐pyrrolidone, N,N‐dimethyl acetamide, and m‐cresol. Polyimide from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and diphenylether‐3,3′,4,4′‐tetracarboxylic acid dianhydride is even soluble in common solvents such as tetrahydrofuran and chloroform. Polyimides exhibit high transmittance at wavelengths above 400 nm. The glass transition temperature of polyimide from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and pyromellitic dianhydride is 370°C, while that from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and diphenylether‐3,3′,4,4′‐tetracarboxylic acid dianhydride is about 260°C. The initial thermal decomposition temperatures of these polyimides are 520–540°C. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 72: 1299–1304, 1999  相似文献   

16.
A pyromellitic dianhydride (benzene‐1,2,4,5‐tetracarboxylic dianhydride) was reacted with L ‐isoleucine in acetic acid, and the resulting imide acid [N,N′‐(pyromellitoyl)‐bis‐L ‐isoleucine] (4) was obtained in a high yield. 4 was converted into N,N′‐(pyromellitoyl)‐bis‐L ‐isoleucine diacid chloride by a reaction with thionyl chloride. The polycondensation reaction of this diacid chloride with several aromatic diamines, including 1,4‐phenylenediamine, 4,4′‐diaminodiphenyl methane, 4,4′‐diaminodiphenylsulfone (4,4′‐sulfonyldianiline), 4,4′‐diaminodiphenylether, 2,4‐diaminotoluene, and 1,3‐phenylenediamine, was developed with two methods. The first method was polymerization under microwave irradiation, and the second method was low‐temperature solution polymerization, with trimethylsilyl chloride used as an activating agent for the diamines. The polymerization reactions proceeded quickly and produced a series of optically active poly(amide imide)s with good yields and moderate inherent viscosities of 0.17–0.25 dL/g. All of the aforementioned polymers were fully characterized by IR, elemental analyses, and specific rotation. Some structural characterization and physical properties of these optically active poly(amide imide)s are reported. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 951–959, 2004  相似文献   

17.
Dynamic mechanical properties have been investigated over the temperature range of?150–360°C for the quinazolone–imide copolymers, prepared by condensation of the amine-terminated quinazolone prepolymer with a stoichiometric quantity of pyromellitic dianhydride or 3,3′,4,4′-benzophenone-tetracarboxilic dianhydride. Both copolymers have, respectively, the low-temperature β-relaxation and the β*-relaxation, as well as the case of poly(4,4′-oxydiphenylene–pyromellite-imide) (Kapton) examined for comparison. These relaxations seem to contribute to toughness of the copolymers. The α-relaxations for both copolymers occurred at much the same temperature of 320°C, which can be assigned to a large scale segmental motion of the quinazolone chain sequence. The α-peak temperatures shifted into higher temperatures by heat aging. This can be explained in terms of crosslinking in the copolymers, supported by swelling test in hot m-cresol and IR spectroscopy.  相似文献   

18.
Poly(amide‐imide), PI, hybrid films are prepared by using sol–gel techniques. First, the poly(amide amic acid) with controlled block chain length of 5000 and 10,000 g/mol and uncontrolled chain length are synthesized by condensation reaction with 4,4′‐diaminodiphenyl ether (ODA), 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), trimellitic anhydride chloride (TMAC) and terminated with p‐aminopropyltrimethoxysilane (APrTMOS). And then the imidization reactions of poly (amide amic acid) are proceeded to obtain the poly (amide‐imide) hybrid film. Hybrid films with 5000 g/mol block chain length possess higher storage modulus, lower glass transition temperature and damping intensity comparing to films with 10,000 g/mol block chain length. The addition of TMAC to the poly(amide‐imide) hybrids is due to the increase of toughness and intermolecular hydrogen bonding, which is the average strength of intermolecular bonding and studied by the hydrogen‐bonded fraction (fbonded), frequency difference (Δν) and shiftment. Meanwhile, PI hybrid films containing more APrTMOS and TMAC content possess higher thermal and mechanical properties. On the other hand, hybrid films with 10,000 g/mol block chain length and more TMAC content have higher gas permeabilities than other films. The degradation temperatures of 5 wt % loss of all hybrid films are all higher than 540°C and increased as the increase of TMAC content. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007  相似文献   

19.
3,3′,4,4′‐Diphenylsulfonetetracarboxylic dianhydride ( 1 ) was reacted with L‐leucine ( 2 ) in acetic acid and the resulting imide‐acid ( 3 ) was obtained in high yield. The diacid chloride ( 4 ) was prepared from diacid derivative ( 3 ) by reaction with thionyl chloride. The polycondensation reaction of diacid chloride ( 4 ) with several aromatic diamines such as 4,4′‐sulfonyldianiline ( 5a ), 4,4′‐diaminodiphenyl methane ( 5b ), 4,4′‐diaminodiphenylether ( 5c ), p‐phenylenediamine ( 5d ), m‐phenylenediamine ( 5e ), 2,4‐diaminotoluene ( 5f ), and 1,5‐diaminonaphthalene ( 5g ) was developed by using a domestic microwave oven in the presence of a small amount of a polar organic medium such as o‐cresol. The polymerization reactions were also performed under two conventional methods: low temperature solution polycondensation in the presence of trimethylsilyl chloride, and a short period reflux conditions. A series of optically active poly(amide‐imide)s with inherent viscosity of 0.25–0.42 dL/g were obtained with high yield. All of the above polymers were fully characterized by IR, elemental analyses, and specific rotation techniques. Some structural characterizations and physical properties of these optically active poly (amide‐imide) s are reported. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91: 2992–3000, 2004  相似文献   

20.
N‐Trimellitylimido‐L ‐leucine was reacted with thionyl chloride, and N‐trimellitylimido‐L ‐leucine diacid chloride was obtained in a quantitative yield. The reaction of this diacid chloride with p‐aminobenzoic acid was performed in dry tetrahydrofuran, and bis(p‐amidobenzoic acid)‐N‐trimellitylimido‐L ‐leucine (5) was obtained as a novel optically active aromatic imide–amide diacid monomer in a high yield. The direct polycondensation reaction of the monomer imide–amide diacid 5 with 4,4′‐diaminodiphenylsulfone, 4,4′‐diaminodiphenylether, 1,4‐phenylenediamine, 1,3‐phenylenediamine, 2,4‐diaminotoluene, and benzidine (4,4′‐diaminobiphenyl) was carried out in a medium consisting of triphenyl phosphite, N‐methyl‐2‐pyrolidone, pyridine, and calcium chloride. The resulting novel poly(amide imide)s (PAIs), with inherent viscosities of 0.22–0.52 dL g?1, were obtained in high yields, were optically active, and had moderate thermal stability. All of the compounds were fully characterized with IR spectroscopy, elemental analyses, and specific rotation. Some structural characterization and physical properties of these new optically active PAIs are reported. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 35–43, 2002; DOI 10.1002/app.10181  相似文献   

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