Layered silicate nanocomposites based on various high‐functionality epoxy resins: The influence of an organoclay on resin cure

The influence of an organically modified clay on the curing behavior of three epoxy systems widely used in the aerospace industry and of different structures and functionalities was studied. Diglycidyl ether of bisphenol A (DGEBA), triglycidyl p‐amino phenol (TGAP) and tetraglycidyl diamino diphenylmethane (TGDDM) were mixed with an octadecyl ammonium ion modified organoclay and cured with diethyltoluene diamine (DETDA). The techniques of dynamic mechanical thermal analysis (DMTA), chemorheology and differential scanning calorimetry (DSC) were applied to investigate gelation and vitrification behavior, as well as catalytic effects of the clay on resin cure. While the formation of layered silicate nanocomposite based on the bifunctional DGEBA resin has been previously investigated to some extent, this paper represents the first detailed study of the cure behavior of different high performance, epoxy nanocomposite systems.     

Curing behavior,thermal, and mechanical properties of epoxy resins cured with a novel liquid crystalline dicarboxylic acid curing agent

A novel di‐carboxylic acid curing agent (DACA) was successfully synthesized and cured with three different epoxy resins: glycidyl end‐capped poly(bisphenol‐A‐co‐epichlorohydrin) (pDGEBA, M_n = 377), N,N‐diglycidyl‐4‐glycidyloxyaniline (TGAP), and 4,4′‐methylenebis(N,N‐diglycidylaniline) (TGDDM). The cured epoxy exhibited excellent thermal stability, which was indicated by high initial degradation temperature (T_id) and char yield. The T_id values of cured epoxy were in the range of 327–338°C, and the char yields increased with increasing epoxy functionality. The char yields of cured DACA/pDGEPA, DACA/TGAP, and DACA/TGDDM samples were 21.1, 60.4, and 66.9%, respectively. In addition, the cured epoxy samples also showed low coefficients of thermal expansion and high storage moduli (E′), which were around 60 ppm/°C and 2800 MPa, respectively. The failure surfaces were ductile and rough, so the cured epoxy samples are expected to have high fracture toughness and impact strength. POLYM. ENG. SCI., 54:695–703, 2014. © 2013 Society of Plastics Engineers     

Blends of epoxy resins and polyphenylene oxide as processing aids and toughening agents 2: Curing kinetics,rheology, structure and properties

The curing behaviour, chemorheology, morphology and dynamic mechanical properties of epoxy ? polyphenylene oxide (PPO) blends were investigated over a wide range of compositions. Two bisphenol A based di‐epoxides ? pure and oligomeric DGEBA ? were used and their cure with primary, tertiary and quaternary amines was studied. 4,4′‐methylenebis(3‐chloro‐2,6‐diethylaniline) (MCDEA) showed high levels of cure and gave the highest exotherm peak temperature, and so was chosen for blending studies. Similarly pure DGEBA was selected for blending due to its slower reaction rate because of the absence of accelerating hydroxyl groups. For the PPO:DGEBA340/MCDEA system, the reaction rate was reduced with increasing PPO content due to a dilution effect but the heat of reaction were not significantly affected. The rheological behaviour during cure indicated that phase separation occurred prior to gelation, followed by vitrification. The times for phase separation, gelation and vitrification increased with higher PPO levels due to a reduction in the rate of polymerization. Dynamic mechanical thermal analysis of PPO:DGEBA340/MCDEA clearly showed two glass transitions due to the presence of phase separated regions where the lower T_g corresponded to an epoxy‐rich phase and the higher T_g represented the PPO‐rich phase. SEM observations of the cured PPO:DGEBA340/MCDEA blends revealed PPO particles in an epoxy matrix for blends with 10 wt% PPO, co‐continuous morphology for the blend with 30 wt% PPO and epoxy‐rich particles dispersed in a PPO‐rich matrix for 40wt% and more PPO. © 2014 Society of Chemical Industry     

Toughening of epoxy resin systems using low‐viscosity additives

This study has evaluated three low‐viscosity epoxy additives as potential tougheners for two epoxy resin systems. The systems used were a lower‐reactive resin based upon the diglycidyl ether of bisphenol A (DGEBA) and the amine hardener diethyltoluene diamine, while the second epoxy resin was based upon tetraglycidyl methylene dianiline (TGDDM) and a cycloaliphatic diamine hardener. The additives evaluated as potential tougheners were an epoxy‐terminated aliphatic polyester hyperbranched polymer, a carboxy‐terminated butadiene rubber and an aminopropyl‐terminated siloxane. This work has shown that epoxy‐terminated hyperbranched polyesters can be used effectively to toughen the lower cross‐linked epoxy resins, i.e. the DGEBA‐based systems, with the main advantage being that they have minimal effect upon processing parameters such as viscosity and the gel time, while improving the fracture properties by about 54 % at a level of 15 wt% of additive and little effect upon the T_g. This result was attributed to the phase‐separation process producing a multi‐phase particulate morphology able to initiate particle cavitation with little residual epoxy resin dissolved in the continuous epoxy matrix remaining after cure. The rubber additive was found to impart similar levels of toughness improvement but was achieved with a 10–20 °C decrease in the T_g and a 30 % increase in initial viscosity. The siloxane additive was found not to improve toughness at all for the DGEBA‐based resin system due to the poor dispersion within the epoxy matrix. The TGDDM‐based resin systems were found not to be toughened by any of the additives due to the lack of plastic deformation of the highly cross‐linked epoxy network Copyright © 2003 Society of Chemical Industry     

Isothermal curing by dynamic mechanical analysis of three epoxy resin systems: Gelation and vitrification

Times to gelation (t_gel) and times to vitrification (t_vit) during isothermal curing for the epoxy systems diglycidyl ether of bisphenol A (DGEBA)/1,3‐bisaminomethylcyclohexane (1,3‐BAC), tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM)/4‐4′‐diaminodiphenylsulfone (DDS), and TGDDM/epoxy novolac (EPN)/DDS were measured at different curing temperatures. This article reports on a method to determine t_gel and t_vit by dynamic mechanical analysis (DMA). Gelation was determined at the onset of the storage modulus or by the peak of the loss factor. Vitrification was defined as the curve of the storage modulus as the curve reached a constant level (endset) in DMA tests. The experimental values obtained for t_gel and t_vit were compared with values obtained by other experimental methods and with theoretical values (t_gel's) or indirect determinations (t_vit's). From kinetic analysis by differential scanning calorimetry, conversions corresponding to gelation were obtained for the three systems; this yielded a constant value for each system that was higher than theoretical value. Values of the apparent activation energies of the DGEBA/1,3‐BAC, TGDDM/DDS, and TGDDM/EPN/DDS epoxy systems were obtained from plots of t_gel's against reciprocal temperatures. They were 53.2, 58.2, and 46.5 kJ/mol, respectively. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 78–85, 2002     

Fluid uptake behavior of multifunctional epoxy blends

Profound changes in network architecture from blending trifunctional (m-triglycidylaminophenol, mTGAP) or tetrafunctional (tetraglycidyldiaminodiphenylmethane, TGDDM) epoxides with diglycidyl ether of bisphenol-A (DGEBA) and a curative amine (3,3′-diaminodiphenylsulfone, 3,3′-DDS) were observed using PVT, DMA, and PALS analyses. Increasing multifunctional content, which increased the crosslink density (with the expected increase in T_g), produced a decrease in the average free volume hole size (V_h) accompanied by a counterintuitive increase in fractional free volume (FFV). This unusual inverse relationship between FFV and V_h allowed clear resolution of their respective roles in equilibrium moisture uptake vs. the rate of uptake (diffusivity). Equilibrium water uptake increased with increasing multifunctional content, concomitant with the increase in FFV. Water diffusivity, on the other hand, decreased with increasing multifunctional content, concomitant with the decrease in V_h. The decreasing V_h in the epoxy blends also had interesting consequences for organic solvent sensitivity. MEK ingress was substantial in the binary DGEBA/DDS epoxy and completely inhibited for most of the blends, implying hole size selectivity was responsible for the MEK uptake inhibition. MEK uptake was precluded in epoxies whose V_h was below a critical threshold value of ～68 Å³. A small amount of mTGAP or TGDDM was sufficient to reduce the V_h of DGEBA/DDS epoxy below the threshold and prevent MEK uptake.     

Morphology, thermal relaxations and mechanical properties of layered silicate nanocomposites based upon high-functionality epoxy resins

This paper investigates the possibility of improving the mechanical properties of high-functionality epoxy resins through dispersion of octadecyl ammonium ion-modified layered silicates within the polymer matrix. The different resins used are bifunctional diglycidyl ether of bisphenol-A (DGEBA), trifunctional triglycidyl p-amino phenol (TGAP) and tetrafunctional tetraglycidyldiamino diphenylmethane (TGDDM). All resins are cured with diethyltoluene diamine (DETDA). The morphology of the final, cured material was probed by wide-angle X-ray scattering, as well as optical and atomic force microscopy. The α- and β-relaxation temperatures of the cured systems were determined using dynamic mechanical thermal analysis. It was found that the presence of organoclay steadily decreased both transition temperatures with increasing filler concentration. Further, the effect of different concentrations of the alkyl ammonium-modified layered silicate on the toughness and stiffness of the different epoxy resins was analyzed. All resin systems have shown improvement in both toughness and stiffness of the materials through the incorporation of layered silicates, despite the fact that it is often found that these two properties cannot be simultaneously achieved.     

Investigation of the reaction mechanism of different epoxy resins using a phosphorus‐based hardener

In this work, the fundamental kinetic and structure/property information for a novel phosphorus‐based hardener, bis(4‐aminophenoxy) phosphonate is cured with a range of common epoxy resins such as diglycidyl ether of bisphenol A, tri glycidyl p‐amino phenol and tetra glycidyl diamino diphenyl methane (TGDDM) at various cure temperatures. The rate coefficients k₁ and k₂ for the primary and secondary amine epoxide addition reactions, respectively, were determined and were found to exhibit a positive substitution effect for the TGAP and TGDDM epoxy resins. Etherification or internal cyclization were shown to be important at higher levels of cure conversion, with these reactions being more significant for the TGAP/BAPP system. Some basic structure/property relationships were established between the glass transition temperature (T_g) and epoxide conversion. The master curve obtained for the superimposition of the various cure temperatures for each epoxy demonstrated the independence of the cure mechanism with temperature. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99:3288–3299, 2006     

Miscibility and mechanical properties of tetrafunctional epoxy resin/phenolphthalein poly(ether ether ketone) blends

Phenolphthalein poly(ether ether ketone) (PEK‐C) was found to be miscible with uncured tetraglycidyl 4,4′‐diaminodiphenylmethane (TGDDM), which is a type of tetrafunctional epoxy resin (ER), as shown by the existence of a single glass transition temperature (T_g) within the whole composition range. The miscibility between PEK‐C and TGDDM is considered to be due mainly to entropy contribution. Furthermore, blends of PEK‐C and TGDDM cured with 4,4′‐diaminodiphenylmethane (DDM) were studied using dynamic mechanical analysis (DMA), Fourier‐transform infrared (FTIR) spectroscopy, and scanning electron microscopy (SEM). DMA studies show that the DDM‐cured TGDDM/PEK‐C blends have only one T_g. SEM observation also confirmed that the blends were homogeneous. FTIR studies showed that the curing reaction is incomplete due to the high viscosity of PEK‐C. As the PEK‐C content increased, the tensile properties of the blends decreased slightly and the fracture toughness factor also showed a slight decreasing tendency, presumably due to the reduced crosslink density of the epoxy network. SEM observation of the fracture surfaces of fracture toughness test specimens showed the brittle nature of the fracture for the pure ER and its blends with PEK‐C. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 598–607, 2001     

Tertiary‐amine‐free,non‐planar,sulfone‐containing,tetrafunctional epoxy and its application as a high temperature matrix

Non‐amine‐derived tetrafunctional epoxies have several advantages over the amine‐derived N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenyl methane (TGDDM) in high temperature applications. Although two non‐amine‐derived tetrafunctional epoxies were developed in our laboratory, further improvements in toughness using less loading amount is still desirable. Thus, a tertiary‐amine‐free, non‐planar and triphenylmethane‐containing tetrafunctional epoxy (STFE) with a sulfone spacer was synthesized. When it was mixed with diglycidyl ether of bisphenol A (DGEBA) and cured with 4,4′‐diaminodiphenylsulfone (DDS), both thermal and mechanical performances outperformed TGDDM. Moreover, STFE modified system shows the highest toughness (35.7 kJ m^–2) among three amine‐free and triphenylmethane‐containing epoxies at merely 5 wt% loading. Molecular simulation and thermomechanical analysis results suggest that the improved mechanical properties could be related to the geometry of the molecule and larger free volume. Despite a marginal drop in T_g, the thermal degradation temperature is better than that of TGDDM/DDS. In addition, the moisture resistance of STFE/DGEBA/DDS is much better than that of TGDDM/DDS. Thus, STFE modified DGEBA could be a potential replacement for TGDDM in some high temperature applications. © 2020 Society of Chemical Industry     

Blends of epoxy–amine resins with poly(phenylene oxide) as processing aids and toughening agents: I. Uncured systems

The effect of two different bisphenol‐A‐based diepoxides—nearly pure DGEBA340 and a DGEBA381 oligomer—and an aromatic diamine curative (MCDEA) on the solubility and processability of poly(phenylene oxide) (PPO) was studied. The solubility parameters of the diepoxies and the curative calculated from Fedors's method suggest miscibility of PPO with the components, and this was observed at the processing temperature; however, some of the blends were not transparent at room temperature, indicating phase immiscibility and/or partial PPO crystallization. The steady shear and dynamic viscosities of the systems agreed well with the Cox–Merz relationship and the logarithmic viscosities decreased approximately linearly with increasing amounts of DGEBA381, DGEBA340 or MCDEA, thus causing a processability enhancement of the PPO. The dynamic rheology of intermediate PPO:DGEBA compositions at 200 °C showed gel‐like behaviour. Dynamic mechanical analysis of blends with varying PPO:DGEBA ratios showed that the main glass transition temperature (T_g) of the blends decreased continuously with increasing epoxy content, with a slightly higher plasticizing efficiency being exhibited by DGEBA340 compared to DGEBA381. However, blends with 50 and 60 wt% PPO had almost identical T_g due to the phase separation of the former blends. The blends of MCDEA and PPO were miscible over the concentration range investigated and T_g of the blends decreased with increasing MCDEA concentration. © 2013 Society of Chemical Industry     

Morphologies and mechanical properties of polyethersulfone modified epoxy blends through multifunctional epoxy composition

Thermoplastic polyethersulfone (PES) modified multifunctional tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) and triglycidyl para‐aminophenol (TGAP) epoxy prepolymers cured with 4,4′‐diaminodiphenylsulfone (44DDS) were prepared using a continuous reactor method and their reaction‐induced phase separated morphologies and mechanical properties were measured and correlated with chemical compositions. ¹H nuclear magnetic resonance (¹H NMR) and near‐infrared spectroscopy (NIR) were used to quantify the chemical network formation. Atomic force microscopy (AFM) with nanomechanical mapping was employed to resolve the nanoscale phase‐separated morphologies. The extent of phase separation in cured networks and resultant domain sizes were determined to be controllable depending upon the multifunctional epoxy compositions. The results obtained from mechanical studies further indicated that tensile modulus was not largely affected by multifunctional epoxy compositions while fracture toughness increased with increase of TGAP content. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44775.     

Modification of a two‐component system by introducing an epoxy‐reactive diluent: Construction of a time–temperature–transformation (TTT) diagram

Curing reactions of a three‐component system consisting of an epoxy resin diglycidyl ether of bisphenol A (DGEBA n = 0), 1,2‐diaminecyclohexane as curing agent, and vinylcyclohexene dioxide as a reactive diluent were studied to calculate a time–temperature–transformation isothermal cure diagram for this system. Differential scanning calorimetry (DSC) was used to calculate the vitrification times. DSC data show a one‐to‐one relationship between T_g and fractional conversion α, independent of cure temperature. As a consequence, T_g can be used as a measure of conversion. The activation energy for the polymerization overall reaction was calculated from the gel times obtained using the solubility test (58.5 ± 1.3 kJ/mol). This value was similar to the results obtained for other similar epoxy systems. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 1190–1198, 2004     

Curing kinetics and reaction‐induced homogeneity in networks of poly(4‐vinyl phenol) and diglycidylether epoxide cured with amine

Mixtures of diglycidyl ether of bisphenol‐A (DGEBA) epoxy resin with poly(4‐vinyl phenol) (PVPh) of various compositions were examined with a differential scanning calorimeter (DSC), using the curing agent 4,4′‐diaminodiphenylsulfone (DDS). The phase morphology of the cured epoxy blends and their curing mechanisms depended on the reactive additive, PVPh. Cured epoxy/PVPh blends exhibited network homogeneity based on a single glass transition temperature (T_g) over the whole composition range. Additionally, the morphology of these cured PVPh/epoxy blends exhibited a homogeneous network when observed by optical microscopy. Furthermore, the DDS‐cure of the epoxy blends with PVPh exhibited an autocatalytic mechanism. This was similar to the neat epoxy system, but the reaction rate of the epoxy/polymer blends exceeded that of neat epoxy. These results are mainly attributable to the chemical reactions between the epoxy and PVPh, and the regular reactions between DDS and epoxy. Polym. Eng. Sci. 45:1–10, 2005. © 2004 Society of Plastics Engineers.     

Cure kinetics and thermal stability of micro and nanostructured thermosetting blends of epoxy resin and epoxidized styrene‐block‐butadiene‐block‐styrene triblock copolymer systems

The compatibility of styrene‐block‐butadiene‐block‐styrene (SBS) triblockcopolymer in epoxy resin is increased by the epoxidation of butadiene segment, using hydrogen peroxide in the presence of an in situ prepared catalyst in water/dichloroethane biphasic system. Highly epoxidized SBS (epoxy content SBS >26 mol%) give rise to nanostructured blends with epoxy resin. The cure kinetics of micro and nanostructured blends of epoxy resin [diglycidyl ether of bisphenol A; (DGEBA)]/amine curing agent [4,4′‐diaminodiphenylmethane (DDM)] with epoxidized styrene‐block‐butadiene‐block‐styrene (eSBS 47 mol%) triblock copolymer has been studied for the first time using differential scanning calorimetry under isothermal conditions to determine the reaction kinetic parameters such as kinetic constants and activation energy. The cure reaction rate is decreased with increasing the concentration of eSBS in the blends and also with the lowering of cure temperature. The compatibility of eSBS in epoxy resin is investigated in detailed by Fourier transform infrared spectroscopy, optical and transmition electron microscopic analysis. The experimental data of the cure behavior for the systems, epoxy/DDM and epoxy/eSBS(47 mol%)/DDM show an autocatalytic behavior regardless of the presence of eSBS in agreement with Kamal's model. The thermal stability of cured resins is also evaluated using thermogravimetry in nitrogen atmosphere. POLYM. ENG. SCI., 2012. © 2012 Society of Plastics Engineers     

Epoxy resin containing the poly(sily ether): Preparation,morphology, and mechanical properties

The poly(sily ether) with pendant chloromethyl groups (PSE) was synthesized by the polyaddition of dichloromethylsilane (DCM) and diglycidylether of bisphenol A (DGEBA) with tetrabutylammonium chloride (TBAC) as a catalyst. This polymer was miscible with diglycidyl ether of bisphenol A (DGEBA), the precursor of epoxy resin. The miscibility is considered to be due mainly to entropy contribution because the molecular weight of DGEBA is quite low. The blends of epoxy resin with PSE were prepared through in situ curing reaction of diglycidyl ether of bisphenol A (DGEBA) and 4,4′‐diaminodiphenylmethane (DDM) in the presence of PSE. The DDM‐cured epoxy resin/PSE blends with PSE content up to 40 wt % were obtained. The reaction started from the initial homogeneous ternary mixture of DGEBA/DDM/PSE. With curing proceeding, phase separation induced by polymerization occurred. PSE was immiscible with the 4,4′‐diaminodiphenylmethane‐cured epoxy resin (ER) because the blends exhibited two separate glass transition temperatures (T_gs) as revealed by the means of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). SEM showed that all the ER/PSE blends are heterogeneous. Depending on blend composition, the blends can display PSE‐ or epoxy‐dispersed morphologies, respectively. The mechanical test showed that the DDM‐cured ER/PSE blend containing 25 wt % PSE displayed a substantial improvement in Izod impact strength, i.e., epoxy resin was significantly toughened. The improvement in impact toughness corresponded to the formation of PSE‐dispersed phase structure. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 505–512, 2003     

Thermal and mechanical properties of a hydroxyl‐functional dendritic hyperbranched polymer and trifunctional epoxy resin blends

Curing characteristics of blends of a hydroxyl‐functionalized dendritic hyperbranched polymer (HBP) and a triglycidyl p‐amino phenol (TGAP) epoxy resin have been studied. THe HBP strongly enhances the curing rate owing to the catalytic effect of the hydroxyl groups. THe thermal and dynamic viscoelastic behavior of the blends of various compositions (HBP content 0–20%) have been examined and compared to the neat TGAP matrix. THe glass transition temperature (T_g) gradually decreases with increase in HBP concentration. The blends show a higher impact strength compared to neat TGAP. Scanning electron microscopy analysis indicates a single‐phase morphology.     

Different parameters controlling the initial solubility of two thermoplastics in epoxy reactive solvents

The influence of different factors on the miscibility of diglycidyl ether of bisphenol A (DGEBA)/thermoplastic blends was studied. DGEBA/poly(ether imide) (PEI) blends exhibited upper critical solution temperature behavior. The addition of a trifunctional epoxy [triglycidyl para‐amino phenol (TGpAP)] increased the miscibility window. The addition of diamines as hardeners could also increase [4,4′‐methylene‐bis(3‐chloro‐2,6‐diethylaniline) (MCDEA)] or decrease (4,4′‐diaminodiphenylsulfone) the miscibility window. DGEBA/poly(ether sulfone) (PES) blends showed lower critical solution temperature behavior. The addition of TGpAP had an effect similar to that for PEI blends, but the presence of MCDEA as a hardener decreased the miscibility of epoxy/PES blends. The modeling of the cloud‐point curves was performed with the Flory–Huggins equation (Flory, P. J. Principles of Polymer Chemistry; Cornell University Press: Ithaca, NY, 1953; p 672) according to the procedure developed by K. Kamide, S. Matsuada, and H. Shirataki (Eur Polym J 1990, 26, 379), with the interaction parameter used as the fitting parameter. A phenomenological model that takes into account the molar mass of DGEBA and the amount of TGpAP is proposed and is found to predict the cloud‐point temperature of any TGpAP/DGEBA/PEI blend. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1385–1396, 2002     

Dielectric monitoring of curing of liquid oligomer‐modified epoxy matrices

Dielectric measurements were performed in ‘real‐time’ at several temperatures to follow polymerization reactions on blends of a diglycidyl ether of bisphenol A (DGEBA) epoxy resin with 4, 4′‐diaminodiphenylmethane (DDM) hardener and different amounts of polyoxypropylenetriamine (POPTA) oligomer. These systems exhibit phase separation induced by molar mass increasing through curing of the resin. Monitoring of phase separation and vitrification (related to the α‐relaxation) was performed by this technique. The results are compared with those for the unmodified resin–hardener mixture. The change of the main α‐relaxation with cure time, cure temperature, and amount of modifier was measured for the mixtures. This change of the main relaxation through curing in the frequency domain was indicative of the cure reaction advancement, because of its dependence on the viscosity of the medium. The change of the ionic conductivity during curing was also analysed, showing its dependence upon cure temperature. © 2001 Society of Chemical Industry     

Effect of tertiary polysiloxane on the phase separation and properties of epoxy/PEI blend

Epoxy functional siloxane (DMS-E09) was blended with epoxy resin (DGEBA) and thermoplastic polyetherimide (PEI). The results of morphology monitoring indicated that the reaction induced phase separation for all blends followed the spinodal phase separation mechanism. The microstructure changed from co-continuous of 25 wt% epoxy/PEI system to phase-inversion structure of 30 wt% epoxy/PEI system regardless of the content of the tertiary component DMS-E09. By comparing the onset time of phase separation between the two designated systems, the sequential occurrence of primary macrophase separation in co-continuous phase and secondary microphase separation in PEI-rich phase for 25 wt% epoxy/PEI system was identified. Studies of the thermomechanical properties of the DGEBA/PEI/DMS-E09 blends found that storage modulus increased with the addition of PEI but decreased with DMS-E09 monotonically. The value of T_g decreased with the addition of the tertiary DMS-E09 but was offset partially by the presence of PEI.