Electrical characteristics of 8-/spl Aring/ EOT HfO/sub 2//TaN low thermal-budget n-channel FETs with solid-phase epitaxially regrown junctions

The authors demonstrate high-performing n-channel transistors with a HfO/sub 2//TaN gate stack and a low thermal-budget process using solid-phase epitaxial regrowth of the source and drain junctions. The thinnest devices have an equivalent oxide thickness (EOT) of 8 /spl Aring/, a leakage current of 1.5 A/cm/sup 2/ at V/sub G/=1 V, a peak mobility of 190 cm/sup 2//V/spl middot/s, and a drive-current of 815 /spl mu/A//spl mu/m at an off-state current of 0.1 /spl mu/A//spl mu/m for V/sub DD/=1.2 V. Identical gate stacks processed with a 1000-/spl deg/C spike anneal have a higher peak mobility at 275 cm/sup 2//V/spl middot/s, but a 5-/spl Aring/ higher EOT and a reduced drive current at 610 /spl mu/A//spl mu/m. The observed performance improvement for the low thermal-budget devices is shown to be mostly related to the lower EOT. The time-to-breakdown measurements indicate a maximum operating voltage of 1.6 V (1.2 V at 125 /spl deg/C) for a ten-year lifetime, whereas positive-bias temperature-instability measurements indicate a sufficient lifetime for operating voltages below 0.75 V.     

Thermally stable Ge/Ag/Ni Ohmic contact for InAlAs/InGaAs/InP HEMTs

Excellent annealed ohmic contacts based on Ge/Ag/Ni metallization have been realized in a temperature range between 385 and 500/spl deg/C, with a minimum contact resistance of 0.06 /spl Omega//spl middot/mm and a specific contact resistivity of 2.62 /spl times/10/sup -7/ /spl Omega//spl middot/cm/sup 2/ obtained at an annealing temperature of 425/spl deg/C for 60 s in a rapid thermal annealing (RTA) system. Thermal storage tests at temperatures of 215 and 250/spl deg/C in a nitrogen ambient showed that the Ge/Ag/Ni based ohmic contacts with an overlay of Ti/Pt/Au had far superior thermal stabilities than the conventional annealed AuGe/Ni ohmic contacts for InAlAs/InGaAs high electron mobility transistors (HEMTs). During the storage test at 215/spl deg/C, the ohmic contacts showed no degradation after 200 h. At 250/spl deg/C, the contact resistance value of the Ge/Ag/Ni ohmic contact increased only to a value of 0.1 /spl Omega//spl middot/mm over a 250-h period. Depletion-mode HEMTs (D-HEMTs) with a gate length of 0.2 /spl mu/m fabricated using Ge/Ag/Ni ohmic contacts with an overlay of Ti/Pt/Au demonstrated excellent dc and RF characteristics.     

A high fill factor and progressive scan PtSi Schottky-barrier IR-CCD image sensor using new wiring technology

A back surface illuminated 130/spl times/130 pixel PtSi Schottky-barrier (SB) IR-CCD image sensor has been developed by using new wiring technology, referred to as CLOSE Wiring, CLOSE Wiring, designed to effectively utilize the space over the SB photodiodes, brings about flexibility in clock line designing, high fill factor, and large charge handling capability in a vertical CCD (VCCD). This image sensor uses a progressive scanned interline-scheme, and has a 64.4% fill factor in a 30 /spl mu/m/spl times/30 /spl mu/m pixel, a 3.9 mm/spl times/3.9 mm image area, and a 5.5 mm/spl times/5.5 mm chip size. The charge handling capability for the 3.3 /spl mu/m wide VCCD achieves 9.8/spl times/10/sup 5/ electrons, The noise equivalent temperature difference obtained was 0.099 K for operation at 120 frames/sec with a 50 mm f/1.3 lens.<>     

10-gb/s operation of an In/sub 0.53/Ga/sub 0.47/As p-i-n photodiode on metamorphic InGaP buffered semi-insulating GaAs substrate

The SONET OC-192 receiving performance of In/sub 0.53/Ga/sub 0.47/As p-i-n photodiode grown on linearly graded metamorphic In/sub x/Ga/sub 1-x/P buffered GaAs substrate is reported. With a low-cost TO-46 package, such a device exhibits a frequency bandwidth up to 8 GHz, a bit-error rate (BER) of 10/sup -9/ at 10 Gb/s, a sensitivity of -17.8 dBm, and a noise equivalent power of 3.4/spl times/10/sup -15/ W/Hz/sup 1/2/ owing to its ultralow dark current of 3.6/spl times/10/sup -7/ A/cm/sup 2/. Eye diagram analysis at 10 Gb/s without transimpedance amplification reveals a statistically distributed Q-factor of 8.21, corresponding to a minimum BER of 1.1/spl times/10/sup -16/ at receiving power of -6 dBm.     

A note on density model size testing

Let (F/sub k/)/sub k/spl ges/1/ be a nested family of parametric classes of densities with finite Vapnik-Chervonenkis dimension. Let f be a probability density belonging to F/sub k//sup */, where k/sup */ is the unknown smallest integer such that f/spl isin/F/sub k/. Given a random sample X/sub 1/,...,X/sub n/ drawn from f, an integer k/sub 0//spl ges/1 and a real number /spl alpha//spl isin/(0,1), we introduce a new, simple, explicit /spl alpha/-level consistent testing procedure of the hypothesis {H/sub 0/:k/sup */=k/sub 0/} versus the alternative {H/sub 1/:k/sup *//spl ne/k/sub 0/}. Our method is inspired by the combinatorial tools developed in Devroye and Lugosi and it includes a wide range of density models, such as mixture models, neural networks, or exponential families.     

Equivalent Circuit of the Bolometer Detector

A small-signal dynamic equivalent circuit is established for the output voltage of a dc-biased bolometer (barretter) detector. The circuit consists of a voltage generator /spl upsi//sub g/, whose output is an undistorted replica of the incident RF-power modulation envelope, followed by a series resistor R/sub 1/ of dynamic origin, a shunt capacitor C that represents heat storage in the bolometer wire, and a series resistor R/sub 0/ equal to the dc resistance, usually 200 ohms. The resistance R/sub 1/ is independent of signal level, and is typically about 220 ohms for an 8.75-mA bolometer and about 120 ohms for a 4.5-mA bolometer. At a modulation frequency f/sub m/ near 0 Hz, the equivalent audio source impedance of the bolometer is R/sub 1/ +R/sub 0/. The common belief that the source impedance is R/sub 0/ in the weak-signal case is, therefore, refuted. Formulas are derived giving v/sub g/ / /P/sub RF/ and R/sub 1/ as functions of basic, easily determined bolometer parameters. The time constant for open-circuit load is /spl tau//sub oc/= R/sub 1/C, where /spl tau//sub oc/ is determined best by measurement, since catalog values of /spl tau//sub oc/ often are seriously in error. The capacitance is C=/spl tau//sub oc/ / /R/sub 1/. With one type of bolometer /spl tau//sub oc/ measures about 110 /spl mu/s, while various catalogs state values of 250 to 350 /spl mu/s. The equivalent circuit is confirmed quantitatively by measurements of output voltage and source impedance versus modulation frequency.     

High breakdown voltage (Al/sub 0.3/Ga/sub 0.7/)/sub 0.5/In/sub 0.5/P/InGaAs quasi-enhancement-mode pHEMT with field-plate technology

A high breakdown voltage and a high turn-on voltage (Al/sub 0.3/Ga/sub 0.7/)/sub 0.5/In/sub 0.5/P/InGaAs quasi-enhancement-mode (E-mode) pseudomorphic HEMT (pHEMTs) with field-plate (FP) process is reported for the first time. Between gate and drain terminal, the transistor has a FP metal of 1 /spl mu/m, which is connected to a source terminal. The fabricated 0.5/spl times/150 /spl mu/m/sup 2/ device can be operated with gate voltage up to 1.6 V owing to its high Schottky turn-on voltage (V/sub ON/=0.85 V), which corresponds to a high drain-to-source current (I/sub ds/) of 420 mA/mm when drain-to-source voltage (V/sub ds/) is 3.5 V. By adopting the FP technology and large barrier height (Al/sub 0.3/Ga/sub 0.7/)/sub 0.5/In/sub 0.5/P layer design, the device achieved a high breakdown voltage of -47 V. The measured maximum transconductance, current gain cutoff frequency and maximum oscillation frequency are 370 mS/mm, 22 GHz , and 85 GHz, respectively. Under 5.2-GHz operation, a 15.2 dBm (220 mW/mm) and a 17.8 dBm (405 mW/mm) saturated output power can be achieved when drain voltage are 3.5 and 20 V. These characteristics demonstrate that the field-plated (Al/sub 0.3/Ga/sub 0.7/)/sub 0.5/In/sub 0.5/P E-mode pHEMTs have great potential for microwave power device applications.     

Efficient PDFA module using high-NA PbF/sub 2//InF/sub 3/-based fluoride fiber

The highest reported single-pass gain coefficient of 0.36 dB/mW has been achieved using a newly developed Pr/sup 3+/-doped high-NA PbF/sub 2//InF/sub 3/-based fluoride fiber, with a /spl Delta/n of 6.6%, a core diameter of 1.2 /spl mu/m and a transmission loss of 250 dB/km at 1.2 /spl mu/m. This fiber was used to construct an efficient PDFA module with a MOPA-LD. A small-signal net gain of 22.5 dB was achieved at 1.30 /spl mu/m with a pump power of 23m mW.     

A 160-GHz f/sub T/ and 140-GHz f/sub MAX/ submicrometer InP DHBT in MBE regrown-emitter technology

We report a 0.7/spl times/8 /spl mu/m/sup 2/ InAlAs-InGaAs-InP double heterojunction bipolar transistor, fabricated in a molecular-beam epitaxy (MBE) regrown-emitter technology, exhibiting 160 GHz f/sub T/ and 140 GHz f/sub MAX/. These initial results are the first known RF results for a nonselective regrown-emitter heterojunction bipolar transistor, and the fastest ever reported using a regrown base-emitter heterojunction. The maximum current density is J/sub E/=8/spl times/10/sup 5/ A/cm/sup 2/ and the collector breakdown voltage V/sub CEO/ is 6 V for a 1500-/spl Aring/ collector. In this technology, the dimension of base-emitter junction has been scaled to an area as low as 0.3/spl times/4 /spl mu/m/sup 2/ while a larger-area extrinsic emitter maintains lower emitter access resistance. Furthermore, the application of a refractory metal (Ti-W) base contact beneath the extrinsic emitter regrowth achieves a fully self-aligned device topology.     

A 50 ns 4K static DSA MOS RAM

An advanced DSA MOS (DMOS) technology is discussed as it applies to a high-speed 4K bit semiconductor static memory. It uses a polysilicon gate length of 4 /spl mu/m, a gate oxide thickness less than 800 /spl Aring/, and a shallow junction depth (<0.6 /spl mu/m) using conventional photolithographic methods. With these features, the effective channel length of the DSA MOST was reduced to 0.5 /spl mu/m and a smaller junction capacitance was obtained by the use of a high-resistivity (100-200 /spl Omega/.cm) substrate without a substrate bias generator. Combined with the depletion load transistors and selective oxidation processing, a static RAM of 50 ns access time at 630 mW power dissipation, die size of 5.24/spl times/5.36 mm/SUP 2/, and cell size of 53/spl times/62 /spl mu/m/SUP 2/ was obtained.     

Room temperature performance of low threshold 1.34-1.44-/spl mu/m GaInNAs-GaAs quantum-well lasers grown by molecular beam epitaxy

Room temperature lasing emission at 1.338 and 1.435 /spl mu/m with threshold current densities of 1518 and 1755 A/cm/sup 2/, respectively, is obtained in broad area GaInNAs-GaAs laser diodes (LDs) grown by molecular beam epitaxy. The 1.338-/spl mu/m LDs show a power output per facet up to 0.20 W/A, a characteristic temperature (T/sub 0/) of 78 K, and an external transparency current density (J/sub tr/) of 0.77 kA/cm/sup 2/. Increasing the lasing wavelength to 1.435 /spl mu/m results in a larger J/sub tr/ of 1.16 kA/cm/sup 2/ and a lower T/sub 0/ of 62 K, due to larger nonradiative recombination. However, the 1.435-/spl mu/m LDs still display a power output per facet up to 0.15 W/A, and a high internal quantum efficiency of 52%. These improved performances are achieved without the need to use strain compensation layers, Sb as a surfactant during the quantum-well growth, or a postgrowth thermal anneal cycle.     

1677 V, 5.7 m/spl Omega//spl middot/cm/sup 2/ 4H-SiC BJTs

This letter reports the development of a high-performance power 4H-SiC bipolar junction transistor (BJT) with, simultaneously, a high blocking voltage and a low specific on-resistance (R/spl I.bar//sub ON/). A single BJT cell with an active area of 0.61 mm/sup 2/ achieves an open base collector-to-emitter blocking voltage (V/sub ceo/) of 1677 V and conducts up to 3.2 A at a forward voltage drop of V/sub CE/=3.0 V, corresponding to a low R/spl I.bar//sub ON/ of 5.7 m/spl Omega//spl middot/cm/sup 2/ up to Jc=525 A/cm/sup 2/ and a record high value of V/sub B//sup 2//R/sub SP/spl I.bar/ON/ of 493 MW/cm/sup 2/.     

On minimum divergence adaptation of discrete bivariate distributions to given marginals

This correspondence considers the class P of discrete bivariate distributions p with marginals a(p), b(p) and the subclass Pa,b /spl sub/ P of distributions with given marginals a and b. For an arbitrary q /spl isin/ P we study the distributions p/spl tilde/ /spl isin/ P/sub a,b/ minimizing on P/sub a,b/ various /spl phi/-divergences D/sub /spl phi//(p, q) for convex /spl phi/ with finite /spl phi/(0).     

Si/SiGe n-MODFETs on thin SiGe virtual substrates prepared by means of He implantation

Si/SiGe n-type modulation-doped field-effect transistors grown on a very thin strain-relieved Si/sub 0.69/Ge/sub 0.31/ buffer on top of a Si(100) substrate were fabricated and characterized. This novel type of virtual substrate has been created by means of a high dose He ion implantation localized beneath a 95-nm-thick pseudomorphic SiGe layer on Si followed by a strain relaxing annealing step at 850/spl deg/C. The layers were grown by molecular beam epitaxy. Electron mobilities of 1415 cm/sup 2//Vs and 5270 cm/sup 2//Vs were measured at room temperature and 77 K, respectively, at a sheet carrier density of about 3/spl times/10/sup 12//cm/sup 2/. The fabricated transistors with Pt-Schottky gates showed good dc characteristics with a drain current of 330 mA/mm and a transconductance of 200 mS/mm. Cutoff frequencies of f/sub t/=49 GHz and f/sub max/=95 GHz at 100 nm gate length were obtained which are quite close to the figures of merit of a control sample grown on a conventional, thick Si/sub 0.7/Ge/sub 0.3/ buffer.     

Midinfrared holmium fiber lasers

The use of the high-power Tm/sup 3+/-doped silica fiber laser as a pump source for Ho/sup 3+/-doped silica and Ho/sup 3+/-doped fluoride fiber lasers for the generation of 2.1-/spl mu/m radiation is demonstrated. The Ho/sup 3+/-doped silica fiber laser produced a maximum output power of 1.5 W at a slope efficiency of /spl sim/82%; one of the highest slope efficiencies measured for a fiber laser. In a nonoptimized but similar fiber laser arrangement, a Ho/sup 3+/-doped fluoride fiber laser produced an output power of 0.38 W at 2.08 /spl mu/m at a slope efficiency of /spl sim/50%. A Raman fiber laser operating at 1160 nm was also used to pump a Ho/sup 3+/-doped fluoride fiber laser operating at a wavelength of 2.86 /spl mu/m. An output power of 0.31W was produced at a slope efficiency of 10%. The energy transfer upconversion process that depopulates the lower laser level in this case operates at a higher efficiency when the pump wavelength is closer to the absorption peak of the /sup 5/I/sub 6/ energy level, however, this energy transfer process does not impede to a great extent the performance of the Ho/sup 3+/-doped fluoride fiber laser based on the /spl sim/2.1/spl mu/m laser transition.     

Single-chip per channel codec with filters utilizing /spl Delta/-/spl Sigma/ modulation

A single-chip per channel codec with filters, fabricated using a single poly-Si NMOS technology, is discussed. In the encoder, the analog signal is converted to a 2.048 M samples/s digital signal by a /spl Delta/-/spl Sigma/ modulator. Filtering necessary for the sampling rate 8 k sample/s and compression by the /spl mu/255 law are performed digitally. In the decoder, the 8 k samples/s PCM is successively resampled and converted into the 2.048 M samples/s /spl Delta/-/spl Sigma/ signal, which is then decoded by a /spl Delta/-/spl Sigma/ demodulator. All the high-frequency images, which appear around multiples of 8 kHz, are removed by digital filters. The chip has continuous-signal antialiasing and smoothing filters for the 2.048 Samples/s sampling rate. It also has reference voltage generators for /spl Delta/-/spl Sigma/ modulation/demodulation. Some of the observed characteristics are given. The NMOS /spl Delta/-/spl Sigma/ modulator requires only two on-chip matched capacitors as precision components, and does not require a linear amplifier. A deliberate quantization step imbalance is introduced to allow a low sampling rate. The main band limiting for the 8 k samples/s is done by the recursive filter. This is realized with the serial-parallel pipeline multiplier (SPPM) in four-phase logic. The whole system is integrated on a 296 mil/spl times/342 mil chip.     

CMOS integrated silicon pressure sensor

The sensor described includes a four-arm piezoresistance bridge circuit, an amplifier, and a bridge excitation circuit. This circuit is used to stabilize changes in sensitivity due to variations in temperature and supply voltage. The sensor was fabricated using a self-aligned double-poly Si gate p-well CMOS process combined with an electrochemical etch-stop technique using N/SUB 2/H/SUB 4/-H/SUB 2/O anisotropic etchant for the thin-square diaphragm formation. The silicon wafer was electrostatically adhered to a glass plate to minimize thermally induced stress. Less than a /spl plusmn/0.5% sensitivity shift and less than a /spl plusmn/5-mV offset shift were obtained in the 0-70/spl deg/C range, with a 1-V/kg/cm/SUP 2/ pressure sensitivity. By using a novel excitation technique, a sensitivity change of less than /spl plusmn/1.5% under a /spl plusmn/10% supply voltage variation was also achieved.     

PCB-compatible optical interconnection using 45/spl deg/-ended connection rods and via-holed waveguides

In this paper, a new architecture for a chip-to-chip optical interconnection system is demonstrated that can be applied in a waveguide-embedded optical printed circuit board (PCB). The experiment used 45/spl deg/-ended optical connection rods as a medium to guide light paths perpendicularly between vertical-cavity surface-emitting lasers (VCSELs), or photodiodes (PDs) and a waveguide. A polymer film of multimode waveguides with cores of 100/spl times/65 /spl mu/m was sandwiched between conventional PCBs. Via holes were made with a diameter of about 140 /spl mu/m by CO/sub 2/-laser drilling through the PCB and the waveguide. Optical connection rods were made of a multimode silica fiber ribbon segment with a core diameter of 62.5 and 100 /spl mu/m. One end of the fiber segment was cut 45/spl deg/ and the other end 90/spl deg/ by a mechanical polishing method. These fiber rods were inserted into the via holes formed in the PCB, adjusting the insertion depth to locate the 45/spl deg/ end of rods near the waveguide cores. From this interconnection system, a total coupling efficiency of about -8 dB was achieved between VCSELs and PDs through connection rods and a 2.5 Gb/s /spl times/ 12-ch data link demonstrated through waveguides with a channel pitch of 250 /spl mu/m in the optical PCB.     

Micropositioning device using impact force of piezoelectric flying wires

In this paper, a micropositioning device for precision positioning of miniaturized parts is proposed. This device uses piezoelectric flying wires to generate impact forces for actuating a target object to be positioned. The proposed device features two main characteristics: the impact force can actuate a half-tightened object with a high degree of precision, and the thin flying wire is suitable for the actuation of miniaturized object. Fundamental properties of the proposed device were examined experimentally and theoretically based on a basic positioning unit. Furthermore, for the practical application in assembly works, the control system for a three degrees-of-freedom micropositioning device with positioning range of (/spl plusmn/250 /spl mu/m, /spl plusmn/250 /spl mu/m, /spl plusmn/30 mrad) along the X-, Y-, and /spl Theta//sub z/-axes was implemented. The target object (16/spl times/24/spl times/6 mm) was successfully positioned with positioning accuracies of (/spl plusmn/1 /spl mu/m, /spl plusmn/1 /spl mu/m, /spl plusmn/0.2 mrad), based on a derived heuristic control model.     

Interdigitated Ge p-i-n photodetectors fabricated on a Si substrate using graded SiGe buffer layers

We report an interdigitated p-i-n photodetector fabricated on a 1-/spl mu/m-thick Ge epitaxial layer grown on a Si substrate using a 10-/spl mu/m-thick graded SiGe buffer layer. A growth rate of 45 /spl Aring//s/spl sim/60 /spl Aring//s was achieved using low-energy plasma enhanced chemical vapor deposition. The Ge epitaxial layer had a threading dislocation density of 10/sup 5/ cm/sup -2/ and a rms surface roughness of 3.28 nm. The 3-dB bandwidth and the external quantum efficiency were measured on a photodetector having 1-/spl mu/m finger width and 2-/spl mu/m spacing with a 25/spl times/28 /spl mu/m/sup 2/ active area. At a wavelength of 1.3 /spl mu/m, the bandwidth was 2.2, 3.5, and 3.8 GHz at bias voltages of -1, -3, and -5 V, respectively. The dark current was 3.2 and 5.0 /spl mu/A at -3 and -5 V, respectively. This photodetector exhibited an external quantum efficiency of 49% at a wavelength of 1.3 /spl mu/m.