High-performance barrier using a dual-layer inorganic/organic hybrid thin-film encapsulation for organic light-emitting diodes

We report an inorganic/organic hybrid barrier that combines the alternating deposition of a layer of ZrO₂ using low temperature atomic layer deposition and a 16-μm-thick layer of UV-curable NOA63 epoxy using spin-coating. The effective water vapor transmission rates of single ZrO₂ film was improved by adding solution epoxy from 3.03 × 10⁻³ g/m² day to 1.27 × 10⁻⁴ g/m² day in the hybrid NOA63/ZrO₂/NOA63/ZrO₂ films at 20 °C and a relative humidity of 60%. In consequence, the organic light-emitting diodes encapsulated with inorganic/organic hybrid barriers were undamaged by environmental oxygen and moisture and their luminance decay time improved by a considerable extent.     

Influence of atomic layer deposition chemistry on high-k dielectrics for charge trapping memories

In this work we report the performance of the SiO₂/Si₃N₄/HfO₂ and SiO₂/Si₃N₄/ZrO₂ stacks with emphasis on the influence of atomic layer deposition chemistry used for forming the HfO₂ and ZrO₂ blocking layers. Two Hf precursors were employed – tetrakis(ethylmethylamino)hafnium (TEMAH) and bis(methylcyclopentadienyl)methoxymethyl hafnium (HfD-04). For ZrO₂, tetrakis(ethylmethylamino)zirconium (TEMAZ) and bis(methylcyclopentadienyl)methoxymethyl zirconium (ZrD-04) were used as metal precursors. Ozone was used as the oxygen source. The structural characteristics of the stacks were examined by transmission electron microscopy and grazing incidence X-ray diffraction. The electrical properties of the stacks were studied using platinum-gated capacitor structures. The memory performance of the stacks was evaluated by write/erase (W/E) measurements, endurance and retention testing. Endurance measurements revealed the most important difference between the stacks. The films grown from TEMAH and TEMAZ could withstand a significantly higher number of W/E pulses (>3 × 10⁵ in the 10 V/?11 V, 10 ms regime), in comparison to the stacks made from HfD-04 and ZrD-04 precursors (<5 × 10³ W/E cycles). This difference in endurance characteristics is attributed mainly to the different deposition temperatures suited for these two precursors and the nature of the layer formed at the Si₃N₄/HfO₂ and the Si₃N₄/ZrO₂ interfaces.     

Analysis of nanometer-scale InGaAs/InAs/InGaAs composite channel MOSFETs using high-K dielectrics for high speed applications

The outstanding electron transport properties of InGaAs and InAs semiconductor materials, makes them attractive candidates for future nano-scale CMOS. In this paper, the ON state and OFF state performance of 30 nm gate length InGaAs/InAs/InGaAs buried composite channel MOSFETs using various high-K dielectric materials is analyzed using Synopsys TCAD tool. The device features a composite channel to enhance the mobility, an InP spacer layer to minimize the defect density and a heavily doped multilayer cap. The simulation results show that MOSFETs with Al₂O₃/ZrO₂ bilayer gate oxide exhibits higher gm/I_D ratio and lower sub threshold swing than with the other dielectric materials. The measured values of threshold voltage (V_T), on resistance (R_ON) and DIBL for Lg = 30 nm In_0.53Ga_0.47As/InAs/In_0.53Ga_0.47As composite channel MOSFET having Al₂O₃/ZrO₂ (EOT = 1.2 nm) bilayer dielectric as gate oxide are 0.17 V, 290 Ω-µm, and 65 mV/V respectively. The device displays a transconductance of 2 mS/µm.     

Study on mobility enhancement in MOVPE-grown AlGaN/AlN/GaN HEMT structures using a thin AlN interfacial layer

Al_0.26Ga_0.74N/AlN/GaN high-electron-mobility transistor (HEMT) structures with AlN interfacial layers of various thicknesses were grown on 100-mm-diameter sapphire substrates by metalorganic vapor phase epitaxy, and their structural and electrical properties were characterized. A sample with an optimum AlN layer thickness of 1.0 nm showed a highly enhanced Hall mobility (μ_Hall) of 1770 cm²/Vs with a low sheet resistance (ρ_s) of 365 Ω/sq. (2DEG density n_s = 1.0 × 10¹³/cm²) at room temperature compared with those of a sample without the AlN interfacial layer (μ_Hall = 1287 cm²/Vs, ρ_s = 539 Ω/sq., and n_s = 0.9 × 10¹³/cm²). Electron transport properties in AlGaN/AlN/GaN structures were theoretically studied, and the calculated results indicated that the insertion of an AlN layer into the AlGaN/GaN heterointerface can significantly enhance the 2DEG mobility due to the reduction of alloy disorder scattering. HEMTs were successfully fabricated and characterized. It was confirmed that AlGaN/AlN/GaN HEMTs with the optimum AlN layer thickness show superior DC properties compared with conventional AlGaN/GaN HEMTs.     

Blocking layer optimisation of poly(3-hexylthiopene) based Solid State Dye Sensitized Solar Cells

The optimisation study of the fabrication of a compact TiO₂ blocking layer (via Spray Pyrolysis Deposition) for poly(3-hexylthiopene) (P3HT) for Solid State Dye Sensitized Solar Cells (SDSCs) is reported. We used a novel spray TiO₂ precursor solution composition obtained by adding acetylacetone to a conventional formulation (Diisopropoxytitanium bis(acetylacetonate) in ethanol). By Scanning Electron Microscopy a TiO₂ layer with compact morphology and thickness of around 100 nm is shown. Through a Tafel plot analysis an enhancement of the device diode-like behaviour induced by the acetylacetone blocking layer respect to the conventional one is observed. Significantly, the device fabricated with the acetylacetone blocking layer shows an overall increment of the cell performance with respect to the cell with the conventional one (ΔJ_sc/J_sc = +13.8%, ΔFF/FF = +39.7%, ΔPCE/PCE = +55.6%). A conversion efficiency optimum is found for 15 successive spray cycles where the diode-like behaviour of the acetylacetone blocking layer is more effective. Over three batches of cells (fabricated with P3HT and dye D35) an average conversion efficiency value of 3.9% (under a class A sun simulator with 1 sun A.M. 1.5 illumination conditions) was measured. From the best cell we fabricated a conversion efficiency value of 4.5% was extracted. This represents a significant increment with respect to previously reported values for P3HT/dye D35 based SDSCs.     

The effect of oxide layer thickness on the quantification of 1.5 MeV γ–radiation induced interface traps in the Ag/SiO2/Si MOS devices

This work presents the effect of varied thickness of oxide layer and radiation dose on electrical characteristics of Ag/SiO₂/Si MOS devices irradiated by 1.5 MeV γ–radiations of varied doses. SiO₂ layers of 50, 100, 150 and 200 nm thickness were grown on Si substrates using dry oxidation and exposed to radiation doses of 1, 10 and 100 kGy. The exposure to radiation resulted in generation of fixed charge centers and interface traps in the SiO₂ and at the Si/SiO₂ interface. Capacitance-conductance-voltage (C-G-V) and capacitance-conductance-frequency (C-G-f) measurements were performed at room temperature for all MOS devices to quantify the active traps and their lifetimes. It is shown that accumulation and minimum capacitances decreased as the thickness of SiO₂ layer increased. For the unexposed MOS devices, the flat band voltage V_FB decreased at a rate of −0.12 V/nm, density of active traps increased by 4.5 times and depletion capacitance C_DP, increased by 2.5 times with the increase of oxide layer thickness from 50 to 200 nm. The density of active traps showed strong dependence on the frequency of the applied signal and the thickness of the oxide layer. The MOS device with 200 nm thick oxide layer irradiated with 100 kGy showed density of active interface traps was high at 50 kHz and was 3.6×10¹⁰ eV⁻¹ cm⁻². The relaxation time of the interface traps also increased with the exposure of γ–radiation and reached to 9.8 µs at 32 kHz in 200 nm thick oxide MOS device exposed with a dose of 100 kGy. It was inferred that this was due to formation of continuum energy states within the band gap and activation of these defects depended on the thickness of oxide layer, applied reverse bias and the working frequency. The present study highlighted the role of thickness of oxide layer in radiation hard environments and that only at high frequency, radiation induced traps remain passivated due to long relaxation times.     

Source-drain resistance characteristics of back-channel etched amorphous InGaZnO thin film transistors with TiO2:Nb protective layer

This work investigates the source-drain (S-D) parasitic resistance (R_SD) characteristics of the back-channel-etched (BCE) a-IGZO TFTs with ultra-thin Nb doped TiO₂ (TNO) protective layer. It is shown that R_SD is strongly related to the thickness of the TNO protective layer although the electrical performances of the BCE a-IGZO TFTs with different TNO thickness are similar to each other. The BCE TFT with 3 nm TNO shows an unusually large R_SD value (300 Ω cm). It is suggested that a ~3 nm TNO depletion layer should be formed at the TNO/a-IGZO interface in the S-D region in this case. In addition, R_SD of the BCE TFTs with 1 and 5 nm TNO is 11 and 26 Ω cm, respectively. The low R_SD of these two devices is caused by much thinner TNO depletion layers in the S-D region. Besides, a moderate R_SD of 53 Ω cm for the S-D lift-off device can be ascribed to a lower a-IGZO band bending at the Mo/a-IGZO interface than that of the BCE devices at the TNO/a-IGZO interface.     

Enhanced charge storage characteristics by ZrO2 nanocrystallites precipitated from amorphous (ZrO2)0.8(SiO2)0.2 charge trapping layer

Charge trapping memory capacitors using (ZrO₂)_0.8(SiO₂)_0.2 film as charge trapping layer and amorphous Al₂O₃ as the tunneling layer and blocking layer were fabricated for nonvolatile semiconductor memory application. The ZrO₂ nanocrystallites with a size of 3–5 nm precipitated from amorphous (ZrO₂)_0.8(SiO₂)_0.2 during rapid thermal annealing at 800 °C can serve as the storage nodes, with which a large hysteresis memory window of 7.5 V at a sweeping gate voltage of 8 V has been achieved. At 150 °C bake temperature, the memory capacitor exhibited an excellent endurance up to 10⁵ write/erase cycles, after which a small charge loss of about 12% was achieved.     

Transparent conductors with an ultrathin nickel layer for high-performance photoelectric device applications

A thin nickel (Ni) layer of thickness 5 nm was inserted in between the indium tin oxide (ITO) layers of thickness 50 nm each so as to increase the conductivity of ITO without affecting much of its transmittance nature. ITO layers with and without Ni film were prepared by reactive DC sputtering on both Si and glass substrates. The influence of Ni layer on the optical and electrical properties of prepared devices was investigated. Due to the insertion of thin Ni layer, the resistivity of ITO/Ni/ITO sample (3.2×10⁻⁴ Ω cm) was reduced 10 times lesser than that of ordinary ITO layer (38.6×10⁻⁴ Ω cm); consequently it increased the mobility of ITO/Ni/ITO device. The external and internal quantum efficiencies (EQE and IQE) of ITO/Ni/ITO device exhibited better performance when compared to ITO layer that has no Ni film. At wavelengths of 350 and 600 nm, the photoresponses of ITO/Ni/ITO device were predominant than that of reference ITO device. This highly conductive and photoresponsive Ni inserting ITO layers would be a promising device for various photoelectric applications.     

Organic field-effect transistors based on single-crystalline active layer and top-gate insulator consistently fabricated by electrostatic spray deposition

An electrostatic spray deposition (ESD) method was applied to prepare both crystalline domains of 6,13-bis(triisopropylsilylethynyl) pentacene (TIPS pentacene) and insulating films of poly(methyl methacrylate) (PMMA) for fabricating top-gate single-crystal organic field-effect transistors (OFETs). The electrical characteristics of the top-gate device were compared to those of the bottom-gate one (SiO₂ bottom-gate insulator) with the same active layer, and the lower charge-trap density at the interface between the top-gate insulator and single-crystalline active layer was demonstrated. The drain current compression in the output characteristics of the top-gate device, however, occurred due to the large parasitic resistance between the source/drain electrodes and accumulation channel. Reducing the thickness of the single-crystalline active layer resulted in a high charge-carrier mobility of 0.29 cm²/V s (channel length of 5 μm).     

Ultra-thin alumina layer encapsulation of bulk heterojunction organic photovoltaics for enhanced device lifetime

Successful organic photovoltaic (OPV) device fabrication is contingent on selecting an effective encapsulation barrier layer to preserve device functionality by inhibiting atmosphere-induced degradation. In this work, ultra-thin AlO_x layers are deposited by atomic layer deposition (ALD) to encapsulate pre-fabricated OPV devices. A summary of ALD recipe effects (temperature, cycling time, and number of cycles) on AlO_x film growth and device longevity is presented. First, AlO_x film growth on the hydrophobic OPV surface is shown to occur by a 3D island growth mechanism with distinct nucleation and cluster growth regions before coalescence of a complete encapsulation layer with a thickness ⩾7 nm by 500 cycles. Encapsulated device performance testing further demonstrates that reducing ALD processing temperature to 100 °C minimizes OPV phase segregation and surface oxidation loss mechanisms as evidenced by improved short circuit current and fill factor retention when compared with the conventional 140–150 °C range. Ultra-thin AlO_x encapsulation by ALD provides significant device lifetime enhancement (∼30% device efficiency after 2000 h of air exposure), which is well beyond other ALD-based encapsulation works reported in the literature. Furthermore, the interfacial bonding strength at the OPV–AlO_x interface is shown to play a crucial role in determining film failure mode and therefore, directly impacts ultimate device lifetime.     

Structural and electrical properties of ultra-thin high-k ZrO2 film on nitride passivated Ge(100) prepared by PEALD

The study of ultrathin ZrO₂ films grown on surface passivated germanium substrates by plasma enhanced Atomic Layer Deposition (PEALD) has been carried out. Nitride passivation has been used to form an interfacial layer between ZrO₂/Ge. The ultra-thin ZrO₂ film deposited with thickness of ~5.75 nm and refractive index of ~2.05 as observed through ellipsometry. The Ge3d, Zr3d, N1s and O1s are XPS core level spectra's confirm the formation of GeON and ZrO₂ ultra-thin films. The AFM results show the roughness of deposited films as low as 0.3 nm. The effect of post metallization annealing (PMA) on electrical properties of Au/Cr/ZrO₂/GeON/Ge capacitors has been investigated. The improvement in k value (~38) and an EOT value (~0.5 nm) after PMA on Ge/GeON/ZrO₂ stack has been observed. The flat band voltage and hysteresis of post metallization annealed devices has been reduced as compared to that of without PMA GeON/ZrO₂ stack.     

Effect of AlN buffer layer thickness on the properties of GaN films grown by pulsed laser deposition

The GaN films are grown by pulsed laser deposition (PLD) on sapphire, AlN(30 nm)/Al₂O₃ and AlN(150 nm)/Al₂O₃, respectively. The effect of AlN buffer layer thickness on the properties of GaN films grown by PLD is investigated systematically. The characterizations reveal that as AlN buffer layer thickness increases, the surface root-mean-square (RMS) roughness of GaN film decreases from 11.5 nm to 2.3 nm, while the FWHM value of GaN film rises up from 20.28 arcmin to 84.6 arcmin and then drops to 31.8 arcmin. These results are different from the GaN films deposited by metal organic chemical vapor deposition (MOCVD) with AlN buffer layers, which shows the improvement of crystalline qualities and surface morphologies with the thickening of AlN buffer layer. The mechanism of the effect of AlN buffer layer on the growth of GaN films by PLD is hence proposed.     

Investigation and optimization of each organic layer: A simple but effective approach towards achieving high-efficiency hybrid white organic light-emitting diodes

A highly efficient hybrid white organic light-emitting diode based on a simple structure has been successfully fabricated and characterized. By systematically investigating the influence of the emissive layer thickness, electron transporting layer thickness, spacer and hole transporting layer, the forward-viewing current efficiency and power efficiency of the resulting device without any out-coupling schemes or n-doping strategies can be as high as 59.4 cd/A and 58.4 lm/W, respectively. Besides, a Commission International de l’Eclairage of (0.412, 0.393) and a color rendering index of 60 are obtained at the current density of 11 mA/cm². Through the optimization and investigation, the origin of this unique device is explored comprehensively. Undoubtedly, such presented results will be beneficial to the design of both material and device architecture for ultra high-performance white organic light-emitting diodes.     

Active layer thickness effect on the recombination process of PCDTBT:PC71BM organic solar cells

We investigated the effect of active layer thickness on recombination kinetics of poly[N-9″-hepta-decanyl-2,7-carbazole-alt-5,5-(4′,7′-di-2-thienyl-2′,1′,3′-benzothiadiazole)] (PCDTBT) and [6,6]-phenyl C71-butyric acid methyl ester (PC₇₁BM) based solar cells. Analysis of the fitted Lambert W-function of illuminated current density–voltage (J–V) characteristics revealed increased recombination processes with increased active layer thicknesses. The ideality factor extracted from PCDTBT:PCBM solar cells continuously increased from 1.89 to 3.88 when photoactive layer thickness was increased from 70 to 150 nm. We found that such increase in ideality factor is closely related to the defect density which is increased with increased photoactive layer thickness beyond 110 nm. Therefore, the different density of defect states in PCDTBT:PCBM solar cells causes the different recombination paths where solar cells with a thicker active layer (?110 nm) are considered to undergo coupled trap-assisted recombination processes while single-defect trap-assisted recombination is dominant for thinner (70–90 nm) PCDTBT:PCBM solar cells. As a result, we found that the optimal efficiencies of PCDTBT:PC₇₁BM solar cells were limited to the active layers between 70 and 90 nm. Particularly, when PCDTBT:PC₇₁BM solar cells were optimized with an active layer thickness of 70 nm, energy conversion efficiency reached 6.5% while an increase in thickness led to the reduction of efficiency to 4.7% at 133 nm but then an increase to 5.02% at 150 nm.     

Fine tuning hole injection for high-performance polyfluorene-based blue emitting device by adjusting work function of anode via deposition of CFx layer with proper ionization potential on indium tin oxide

By introducing CF_x thin film as hole injection layer on top of indium tin oxide (ITO) anode via plasma polymerization of CHF₃, the device with poly(9,9-dioctylfluorene) (PFO) as emitting layer, ITO/CF_x(35 W)/PFO/CsF/Ca/Al, is prepared. At the optimal C/F atom ratio using the radio frequency power 35 W, the device performance is optimal having the maximum current efficiency 3.1 cd/A and maximum brightness 8400 cd/m². This is attributed to a better balance between hole and electron fluxes, resulting from a decrease in hole injection barrier as manifested by ultraviolet photoelectron spectroscopy and scanning surface potential microscopy.     

The investigation of Al-doped ZnO as an electron transporting layer for visible-blind ultraviolet photodetector based on n-ZnO nanorods/p-Si heterojunction

An n-ZnO nanorods/p-Si heterojunction photodetector with Al-doped ZnO (AZO) as an electron transporting layer was fabricated. The heterojunction with 20 nm AZO film showed a better characteristic than that of the device without AZO, and it displays a rectification ratio of 8470 at ±3 V and a turn-on voltage of 1.8 V. Also, based on spectral responsivity measurement, the device with AZO coating showed higher responsivity and better visible-blind detectivity than those without AZO, and the peak responsivity of the photodetector with AZO was as high as ~0.49 A/W at 354 nm. Furthermore, the photodetector with AZO layer showed a bigger UV–visible responsivity ratio (R_354 nm / R_546 nm) than that of the photodetector without AZO coating at −2 V. The role of AZO layer was illustrated through energy band theory and the electron transport mechanism.     

Thickness dependent barrier performance of permeation barriers made from atomic layer deposited alumina for organic devices

Organic devices like organic light emitting diodes (OLEDs) or organic solar cells degrade fast when exposed to ambient air. Hence, thin-films acting as permeation barriers are needed for their protection. Atomic layer deposition (ALD) is known to be one of the best technologies to reach barriers with a low defect density at gentle process conditions. As well, ALD is reported to be one of the thinnest barrier layers, with a critical thickness – defining a continuous barrier film – as low as 5–10 nm for ALD processed Al₂O₃. In this work, we investigate the barrier performance of Al₂O₃ films processed by ALD at 80 °C with trimethylaluminum and ozone as precursors. The coverage of defects in such films is investigated on a 5 nm thick Al₂O₃ film, i.e. below the critical thickness, on calcium using atomic force microscopy (AFM). We find for this sub-critical thickness regime that all spots giving raise to water ingress on the 20 × 20 μm² scan range are positioned on nearly flat surface sites without the presence of particles or large substrate features. Hence below the critical thickness, ALD leaves open or at least weakly covered spots even on feature-free surface sites. The thickness dependent performance of these barrier films is investigated for thicknesses ranging from 15 to 100 nm, i.e. above the assumed critical film thickness of this system. To measure the barrier performance, electrical calcium corrosion tests are used in order to measure the water vapor transmission rate (WVTR), electrodeposition is used in order to decorate and count defects, and dark spot growth on OLEDs is used in order to confirm the results for real devices. For 15–25 nm barrier thickness, we observe an exponential decrease in defect density with barrier thickness which explains the likewise observed exponential decrease in WVTR and OLED degradation rate. Above 25 nm, a further increase in barrier thickness leads to a further exponential decrease in defect density, but an only sub-exponential decrease in WVTR and OLED degradation rate. In conclusion, the performance of the thin Al₂O₃ permeation barrier is dominated by its defect density. This defect density is reduced exponentially with increasing barrier thickness for alumina thicknesses of up to at least 25 nm.     

Electrical and optical characteristics of phosphorescent organic light-emitting device with thin-codoped layer insertion

In this paper, we demonstrated the changes of electrical and optical characteristics of a phosphorescent organic light-emitting device (OLED) with tris(phenylpyridine)iridium Ir(ppy)₃ thin layer (4 nm) slightly codoped (1%) inside the emitting layer (EML) close to the cathode side. Such a thin layer helped for electron injection and transport from the electron transporting layer into the EML, which reduced the driving voltage (0.40 V at 100 mA/cm²). Electroluminescence (EL) spectral shift at different driving voltage was observed in our blue OLED with [(4,6-di-fluoropheny)-pyridinato-N,C^2′]picolinate (FIrpic) emitter, which came from the recombination zone shift. With the incorporation of thin-codoped Ir(ppy)₃, such EL spectral shift was almost undetectable (color coordinate shift (0.000, 0.001) from 100 to 10,000 cd/m²), due to the compensation of Ir(ppy)₃ emission at low driving voltage. Such a methodology can be applied to a white OLED which stabilized the EL spectrum and the color coordinates ((0.012, 0.002) from 100 to 10,000 cd/m²).     

High-efficiency low color temperature organic light emitting diodes with solution-processed emissive layer

Low color temperature (CT) lighting provides a warm and comfortable atmosphere and shows mild effect on melatonin suppression. A high-efficiency low CT organic light emitting diode can be easily fabricated by spin coating a single white emission layer. The resultant white device shows an external quantum efficiency (EQE) of 22.8% (34.9 lm/W) with CT 2860 K at 100 cd/m², while is shown 18.8% (24.5 lm/W) at 1000 cd/m². The high efficiency may be attributed to the use of electroluminescence efficient materials and the ambipolar-transport host. Besides, proper device architecture design enables excitons to form on the host and allows effective energy transfer from host to guest or from high triplet guest to low counterparts. By decreasing the doping concentration of blue dye in the white emission layer, the device exhibited an orange emission with a CT of 2280 K. An EQE improvement was observed for the device, whose EQE was 27.4% (38.8 lm/W) at 100 cd/m² and 20.4% (24.6 lm/W) at 1000 cd/m².