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P Monthoux 《Canadian Metallurgical Quarterly》1990,41(16):11128-11139
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MR Bond RD Willett RS Rubins P Zhou CE Zaspel SL Hutton JE Drumheller 《Canadian Metallurgical Quarterly》1990,42(16):10280-10290
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Conventional and high resolution TEM observations of the precipitation scale obtained after internal reduction of (Mg,Cu)O single crystals have revealed special orientation relationships between the metal copper and the ceramic matrix MgO. The intermediate valence state of copper induces a mechanism in two steps for this internal reduction. In the first one, cuprite Cu2O forms in one of the four orientations (T, TA, D, DA); in the second step, while the reaction front penetrates further into the matrix, cuprite particles are reduced to metallic copper. The orientation of the particles within the matrix can either be maintained or evolved into a twinned orientation. 相似文献
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Effects of minor additions of Cu, Bi, and In on microstructure, melting temperature, and tensile properties of Sn-Ag-based
lead-free solders were investigated. It was found that the intermetallic compounds (IMCs) Ag2In and Cu6Sn5 are formed in In- and Cu-containing solders, respectively. At low concentration, Bi dissolved in the Sn matrix and tended
to precipitate pure Bi particles at the solubility limit of 4 wt pct Bi. The formation of large Ag3Sn precipitates from the solder matrix was suppressed when alloying bismuth into the Sn-Ag alloy. The Bi addition resulted
in a significant linear increase of the ultimate tensile strength (UTS) of solders, which is attributed to a solid-solution
hardening mechanism. Solder strengthening due to In and Cu is less pronounced and attributed to a dispersion strengthening
mechanism. The additions of Cu, Bi, and In all depressed the melting temperatures of Sn-Ag-based solders; however, In is the
most effective one. 相似文献
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