Surface acoustic wave characteristics of AlN thin films grown on a polycrystalline 3C-SiC buffer layer

In this study, AlN thin films were deposited on a polycrystalline (poly) 3C-SiC buffer layer for surface acoustic wave (SAW) applications using a pulsed reactive magnetron sputtering system. AFM, XRD and FT-IR were used to analyze structural properties and the morphology of the AlN/3C-SiC thin film. Suitability of the film in SAW applications was investigated by comparing the SAW characteristics of an interdigital transducer (IDT)/AlN/3C-SiC structure with the IDT/AlN/Si structure at 160 MHz in the temperature range 30-150 °C. These experimental results showed that AlN films on the poly (1 1 1) preferred 3C-SiC have dominant c-axis orientation. Furthermore, the film showed improved temperature stability for the SAW device, TCF = −18 ppm/°C. The change in resonance frequency according to temperature was nearly linear. The insertion loss decrease was about 0.033 dB/°C. However, some defects existed in the film, which caused a slight reduction in SAW velocity.     

Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering

We investigated in this study structural and nanomechanical properties of zinc oxide (ZnO) thin films deposited onto Langasite substrates at 200 °C through radio frequency magnetron sputtering with an radio frequency power at 200 W in an O₂/Ar gas mixture for different deposition time at 1, 2, and 3 h. Surface morphologies and crystalline structural characteristics were examined using X-ray diffraction, scanning electron microscopy, and atomic force microscopy. The deposited film featured a polycrystalline nature, with (1 0 0), (0 0 2), and (1 0 1) peaks of hexagonal zinc oxide at 31.75°, 34.35°, and 36.31°. As the deposition time increased, the ZnO film became predominantly oriented along the c-axis (0 0 2) and the surface roughness decreased. Through Berkovich nanoindentation following a continuous stiffness measurement technique, the hardness and Young’s modulus of ZnO thin films increased as the deposition time increased, with the best results being obtained for the deposition time of 3 h. In addition, surface acoustic wave properties of ZnO thin films were also presented.     

Effect of rapid thermal annealing of sputtered aluminium nitride film in an oxygen ambient

Aluminium nitride (AlN) thin films were deposited by radio frequency (RF) magnetron sputtering on p-type silicon (Si) substrate of (1 0 0) orientation using only argon (Ar) gas at substrate temperature of 300 °C. In order to achieve improved electrical properties, we performed post-deposition rapid thermal annealing (RTA). Sputtered AlN films were annealed in an oxygen ambient at temperatures of 600, 700, and 800 °C using RTA for 30 min. The orientation of the AlN crystal in the film was investigated using X-ray diffraction (XRD). The characteristic spectra by functional group were analyzed by Fourier transformation infrared (FTIR) spectroscopy. The electrical properties of the AlN thin films were studied through capacitance–voltage (C–V) characteristics in metal–insulator–semiconductor (MIS) device using the films as insulating layers. The flatband voltages (V_FB) in C–V curves were found to depend on crystal orientations. Negative V_FB was found in the case when AlN (1 0 0) peak was found. Also, when AlN (1 0 3) peak was observed upon increasing the annealing temperature, the value of V_FB was positive and after annealing at 700 °C, AlN (1 0 3) peak intensity was found to be maximum and V_FB was as high as+6.5 V.     

Influence of rapid thermal annealing on morphological and electrical properties of RF sputtered AlN films

Aluminum nitride films were deposited, at 200 °C, on silicon substrates by RF sputtering. Effects of rapid thermal annealing on these films, at temperatures ranging from 400 to 1000 °C, have been studied. Fourier transform infrared spectroscopy (FTIR) revealed that the characteristic absorption band of Al–N, around 684 cm⁻¹, became prominent with increased annealing temperature. X-ray diffraction (XRD) patterns exhibited a better, c-axis, (0 0 2) oriented AlN films at 800 °C. Significant rise in surface roughness, from 2.1 to 3.68 nm, was observed as annealing temperatures increased. Apart from these observations, micro-cracks were observed at 1000 °C. Insulator charge density increased from 2×10¹¹ to 7.7×10¹¹ cm⁻² at higher temperatures, whereas, the interface charge density was found minimum, 3.2×10¹¹ eV⁻¹cm⁻², at 600 °C.     

Synthesis of <Emphasis Type="Italic">c</Emphasis>-Axis Inclined AlN Films in an Off-Center System for Shear Wave Devices

AlN thin films are of continuing interest for excitation of acoustic waves in surface and bulk acoustic wave devices. We report herein on preparation and characterization of c-axis inclined AlN films by a new method of rotating the substrate holder plate to different angles in an off-center system. The microstructure of the c-axis inclined AlN films was investigated using x-ray diffraction, scanning electron microscopy, and transmission electron microscopy. The analyses showed that polycrystalline AlN films with c-axis inclination of up to 12° could be obtained using the off-center system. Solidly mounted resonators based on the deposited c-axis inclined and vertical AlN films were successfully realized. The frequency responses showed dual-mode resonance characteristics located at 1.12 GHz and 1.87 GHz, corresponding to shear and longitudinal resonant modes, respectively.     

Properties of high sensitivity ZnO surface acoustic wave sensors on SiO2/(1 0 0) Si substrates

The properties of ZnO/SiO₂/Si surface acoustic wave (SAW) Love mode sensors were examined and optimized to achieve high mass sensitivity. SAW devices A and B, were designed and fabricated to operate at resonant frequencies around 0.7 and 1.5 GHz. The ZnO films grown by pulsed laser deposition on SiO₂/Si demonstrated c-axis growth and the fabricated devices showed guided shear horizontal surface acoustic wave (or Love mode) propagation. Acoustic phase velocity in the ZnO layer was measured in both devices A and B and theoretical and experimental evaluation of the mass sensitivity showed that the maximum sensitivity is obtained for devices with ZnO guiding layer thicknesses of 340 nm and 160 nm for devices A and B, respectively. The performance of the SAW sensors was validated by measuring the mass of a well-characterized polystyrene–polyacrylic acid diblock copolymer film. For the optimized sensors, maximum mass sensitivity values were as high as 4.309 μm²/pg for device A operating at 0.7477 GHz, and 8.643 μm²/pg for device B operating at 1.5860 GHz. The sensors demonstrated large frequency shifts per applied mass (0.1–4 MHz), excellent linearity, and extended range in the femto-gram region. The large frequency shifts indicated that these sensors have the potential to measure mass two to three orders of magnitude lower in the atto-gram range.     

Growth of epitaxial Pr2O3 layers on Si(1 1 1)

The growth of Pr₂O₃ layers on Si(1 1 1) has been studied by X-ray diffraction, Low-energy electron diffraction (LEED) and atomic force microscopy (AFM). Pr₂O₃ starts to grow as a 0.6-nm thick layer corresponding to one unit cell of the hexagonal phase (1 ML). The X-ray results indicate that layers thicker than 0.6 nm do not grow with the hexagonal phase. Growth takes place at a sample temperature of 500–550 °C. Annealing of the monolayer in UHV at a temperature above 700 °C leads to the formation of Pr₂O₃ and PrSi₂ islands. Silicide islands are found only at annealing in UHV and do not occur at annealing in oxygen atmosphere of 10⁻⁸ mbar. The LEED pattern after heating to 730 °C shows a (2×2) and (√3×√3) superstructure and after heating to 1000 °C a (1×5) superstructure occurs. The superstructures seen in the LEED pattern arise from silicide structures in the area between the islands. The silicide remains on the surface and cannot be removed with flashing to 1100 °C. Further deposition of Pr₂O₃ on the surface covered with silicide phases does not lead to growth of ordered layers.     

Surface acoustic wave characteristics of ZnO films grown on a polycrystalline 3C-SiC buffer layer

Zinc oxide (ZnO) thin films were deposited onto a polycrystalline (poly) 3C-SiC buffer layer for surface acoustic wave (SAW) applications using a magnetron sputtering system. Atomic force microscopy (AFM) and X-ray diffraction (XRD) showed that the ZnO grown on 3C-SiC/Si had a smooth surface, a dominant c-axis orientation and a lower residual stress in ZnO thin film compared to that grown directly onto Si substrate. In order to evaluate the SAW characteristics of ZnO films on a 3C-SiC buffer layer, the two-port SAW resonators, based on inter-digital transducer (IDT)/ZnO/3C-SiC/Si and IDT/ZnO/Si structures, were fabricated and measured within a temperature range of 25-135 °C. The resulting 3C-SiC buffer layer improved the insertion loss by approximately 7.3 dB within the SAW resonator and enhanced the temperature stability with TCF = −22 ppm/°C up to 135 °C in comparison to that of TCF = −45 ppm/°C within a temperature range of 25-115 °C of the ZnO/Si structure.     

Wideband frequency and in situ characterization of aluminum nitride (AlN) in a metal/insulator/metal (MIM) configuration

This paper deals with the electrical wideband frequency and in situ characterization of aluminum nitride (AlN) material. This material is interesting for bulk acoustic wave (BAW) or surface acoustic wave (SAW) devices. In a first step, low frequency characterizations allow to know current versus voltage characteristics, leakages and temperature dependence of the electrical properties. Then, AlN properties in an integrated “metal/insulator/metal” configuration are characterized using MIM waveguide and RLCG parameters are measured up to 20 GHz. An electrical field breakdown of 7.5 MV cm⁻¹ and a relative permittivity between 9 and 10 are extracted. Acoustic resonances, validated with Mason one-dimensional simulation, occur near 5 and 12 GHz. Finally, the MIM devices performances are determined in a wideband frequency: from 1 MHz to 10 GHz.     

Molecular-beam epitaxy of a strongly lattice-mismatched heterosystem AlN/Si(111) for application in SAW devices

The results of using molecular-beam epitaxy for growing piezoelectric AlN films on Si (111) substrates suitable for device applications are reported. The technological conditions for growth of stoichiometric AlN by controlling the surface reconstruction occurring under various thermodynamic conditions on the growth surface are determined. The films of the hexagonal polytype of AlN possess high crystalline perfection and an atomically smooth epitaxial surface. The mechanism for relaxation of the AlN crystal lattice over a distance of one monolayer from the heterojunction is found. It is demonstrated that the AlN film is piezoelectric. Investigations of the temporal characteristics of a SAW attest to a low level of scattering of the wave during propagation. The electromechanical coupling constant is measured in interdigital transducer geometry (λ=16 mm) and is found to be 0.07 % at a frequency f=286 MHz, in good agreement with the theoretical value for a 1.04-μm-thick AlN film. Fiz. Tekh. Poluprovodn. 33, 1372–1378 (November 1999)     

Raman spectroscopic assessments of structural orientation and residual stress in wurtzitic AlN film deposited on (0 0 1) Si

In this paper, polarized Raman spectroscopy is applied to quantitatively assess crystallographic alteration and interfacial residual stress with a micron-scale resolution in highly 〈0 0 0 1〉 oriented (textured) polycrystalline wurtzitic AlN films grown on (0 0 1)-oriented Si substrates. Raman selection rules for the wurtzite structure of AlN were explicitly put forward and a set of Raman tensor elements determined from experimentally retrieved angular dependences of Raman band intensities upon in-plane rotation measurements. An appreciably high degree of homogeneity in the AlN film (i.e., with respect to both in-plane and out-of-plane Euler angles, retrieved according to the proposed spectroscopic algorithm) could be observed in spectral line scans randomly selected on the cross-section of the film/substrate system. These characterizations indicated negligible structural alterations, such as grain tilting and twisting during film growth. However, a non-uniform stress distribution in the AlN film along the film thickness direction was found, which remained stored during manufacturing of the AlN film. A quite remarkable magnitude of compressive residual stress (∼−1.5 GPa) could be measured at the film/substrate interface. Finally, a Raman (non-destructive) statistical characterization of the film system in terms of micromechanical homogeneity by spectral surface mapping is presented, which provides a prompt overall view of the film quality. The proposed procedure should generally be applicable in crystallographic and micromechanical quality control of electronic film devices exhibiting a Raman spectrum.     

High temperature transport kinetics in heteroepitaxial LaFeO3 thin films

Heteroepitaxial LaFeO₃(1 1 0) thin films with a thickness of 150 nm were grown on LaAlO₃(0 0 1) by reactive sputtering in an inverted cylindrical magnetron geometry. Equilibrium conductivity was measured as a function of partial pressure of oxygen at T=1000 °C, and logσ plotted vs. logP(O₂) showed a minimum in conductivity for P(O₂)=10⁻¹¹ atm and a linear response between 10⁻¹⁰ and 1 atm. This linear response makes thin films of LaFeO₃ a promising material for oxygen sensor applications. We have also measured the time response of the film conductivity upon an abrupt change in the partial pressure of ambient oxygen from 10⁻² to 10⁻³ atm, which was determined at 60 s for T=700 °C and <3.5 s at T=1000 °C.     

Improvement in Power Durability of Al Electrode Films Used in SAW Devices by Zr Additive and Ti Underlayer

In order to improve the power durability of Al electrode films and obtain fine-dimensional control in high-frequency surface acoustic wave (SAW) devices, two-layered Al-Zr/Ti electrode films were investigated on 128°Y−X LiNbO₃ substrates by sputter deposition. The results indicated that Al-Zr/Ti electrode films had improved electromigration (EM) reliability compared to Al/Ti electrode films and their lifetime was strongly dependent on the microstructure and Zr concentration. Al-Zr/Ti electrode films with a strong Al (111) texture exhibited longer EM lifetime than polycrystalline films. The Al-Zr/Ti electrode film with an ideal Zr concentration of 0.2 wt.% and a sputtering pressure of 0.25 Pa had a strong Al (111) texture, and its lifetime was approximately four times longer than that of Al/Ti films tested at a current density of 5 × 10⁷ A/cm² at 200°C. Furthermore, the Al-Zr/Ti films were easily etched in reactive ion etching and fine-dimensional control was realized during pattern replication for high-frequency SAW devices.     

Preparation of high-quality AIN films by two-step method of radio frequency magnetron sputtering

The preparation of nanometer aluminum nitrogen(AlN) films with uniform lattice arrangement is of great significance for the manufacture of high-frequency surface acoustic wave(SAW) device.We put forward the two-step growth method and the annealing treatment method for the deposition of(100) AlN thin films.The results show that when the sputtering pressure is 1.2 Pa and the ratio between N2 and Ar is 12:8,the influence of lattice thermal mismatch and anti-phase is the smallest during the nucleation growth at low-temperature stage of(100) AlN/(100) Si films.The root-mean-square(RMS) surface roughness of AlN prepared by the two-step method is reduced from 6.4 nm to 2.1 nm compared with that by common deposition process.     

X波段FBAR用AlN薄膜制备研究

采用中频磁控溅射法,在硅基上制备了X波段薄膜体声波谐振器(FBAR)滤波器用AlN压电薄膜。对AlN薄膜进行了分析表征,结果表明,AlN压电薄膜具有良好的(002)面择优取向,摇摆曲线半峰宽为2.21°,膜厚均匀性优于0.5%,薄膜应力为-5.02 MPa,应力可在张应力和压应力间进行调节。将该AlN薄膜制备工艺应用于FBAR器件的制作,研制出X波段FBAR器件,谐振频率为9.09 GHz,插入损耗为-0.38 dB。     

Epitaxial growth of LaAlO3 on Si(0 0 1) using interface engineering

In this work, the potentiality of molecular beam epitaxy techniques to prepare epitaxial lanthanum aluminate (LaAlO₃) films on Si(0 0 1) is explored. We first demonstrate that the direct growth of LaAlO₃ on Si(0 0 1) is impossible : amorphous layers are obtained at temperatures below 600 °C whereas crystalline layers can be grown at higher temperatures but interfacial reactions leading to silicate formation occur. An interface engineering strategy is then developed to avoid these reactions. SrO and SrTiO₃ have been studied as buffer for the subsequent growth of LaAlO₃. Only partial LaAlO₃ epitaxy is obtained on SrO whereas high quality layers are achieved on SrTiO₃. However both SrO and SrTiO₃ appear to be unstable with respect of Si at the growth temperature of LaAlO₃ (700 °C). This leads to the formation of relatively thick amorphous interfacial layers. Despite their instability at high temperature, these processes could be used for the fabrication of twins-free LaAlO₃ templates on Si, and for the fabrication of complex oxide/Si heterostructures for various applications.     

Dielectric tunable properties of (Ba1−xSrx)TiO3 thin films on LaAlO3 substrate

(Ba_1−xSr_x)TiO₃ (1−x=0.8, 0.7, 0.6 and 0.5) thin films were prepared on (0 0 1) LaAlO₃ substrates by sol–gel method. The films were found to be crystallized in preferential (0 0 1) orientation after post-deposition annealing at 750°C for 1.5 h and 1100°C for 2 h in air, respectively. We investigated the dependence of tunability and dissipation factor on annealing temperature and different Ba/Sr ratios. It was found that the tunability increased dramatically and dissipation factor decreased obviously with increasing annealing temperature, and Ba_0.6Sr_0.4TiO₃ thin films annealed at 1100°C for 2 h have a tunability of 46.9% at 80 kV/cm bias filed and a dissipation factor of 0.008 at 1 MHz.     

Ultra high temperature rapid thermal annealing of GaN

All of the major acceptor (Mg, C, Be) and donor (Si, S, Se and Te) dopants have been implanted into GaN films grown on Al₂O₃ substrates. Annealing was performed at 1100–1500°C, using AlN encapsulation. Activation percentages of ≥90% were obtained for Si⁺ implantation annealed at 1400°C, while higher temperatures led to a decrease in both carrier concentration and electron mobility. No measurable redistribution of any of the implanted dopants was observed at 1450°C.     

FBAR用高质量AlN薄膜制备

采用直流磁控反应溅射法,在基片表面引入RF偏置,在Si(111)衬底上成功制备了(002)向AlN薄膜。使用高分辨率X射线衍射仪(XRD)来表征薄膜质量。当RF偏置从0 W变化到20 W时,XRD测试(002)摇摆曲线的半高宽有着显著的变化。当RF偏置为15 W时,AlN薄膜表现出了良好的(002)生长取向。实验结果表明,适当的RF偏置能够提高Al原子和N原子反应时的活性,促进AlN薄膜的(002)择优生长。该溅射方案应用于薄膜体声波谐振器(FBAR)谐振器工艺加工,成功制作了Q值为300,机电耦合系数为5%的FBAR样品。     

Measuring the through-plane elastic modulus of thin polymer films in situ

Due to the ongoing increase of the transistor density on a chip, industry has replaced the silicon oxide dielectric layers, traditionally used in the back-end interconnect stack, by low-K polymer films with a thickness down to several hundred nanometers. The use of these polymer dielectric films has introduced new failure modes. To have a better understanding of these failures, knowledge of the mechanical properties is necessary. Due to surface effects, the material properties of thin films may differ in the in-plane and trough-plane direction. Most techniques available for measuring these properties are only capable of obtaining the in-plane modulus. To have an in situ measurement of the through-plane modulus, a parallel plate capacitor (PPC) under hydrostatic pressure is used in combination with an interdigitated electrode (IDE) to capture the change in dielectric constant. Since it is believed to be mechanical isotropic, a benzocyclobutene (BCB) film is used to provide a reference measurement. The through-plane elastic modulus and change in permittivity for a 1 μm thick film sandwiched by two aluminum electrodes on a silicon wafer are reported. Two circular PPCs and four IDEs were tested at a pressure of 0, 5, 7.5 and 10 MPa. An initial relative dielectric constant of the film of 2.66 ± 0.05 was obtained. This yields a change in constant equal to 1.241 × 10⁻⁴ ± 2.1 × 10⁻⁵ per MPa pressure at room temperature. The through-plane modulus showed a linear elastic behavior equal to 4.73 ± 0.46, 4.11 ± 0.39 and 3.64 ± 0.31 GPa for 20°, 50° and 75 °C, respectively. The modulus at room temperature is in good agreement with the values found in literature.