共查询到20条相似文献,搜索用时 15 毫秒
1.
Myung Jin Yim Yi Li Kyoung Sik Moon C.P. Wong 《Journal of Electronic Materials》2007,36(10):1341-1347
This paper describes the development and characterization of isotropically conductive adhesives (ICAs) incorporating copper
(Cu) powders as electrically conductive fillers, along with a silane coupling agent for oxidation protection of copper powders,
for environmentally friendly, low cost and high thermal reliability applications in microelectronics packaging. The effect
of silane coupling agent materials and concentration on the electrical conductivity, thermal stability and reliability of
Cu-filled ICAs was investigated for potential alternatives of conventional silver-filled ICAs. The surface characteristics
of silane thin films on copper surfaces, such as their hydrophobicity and thermal stability, were also evaluated to compare
the performance of antioxidant behaviors of different silane coupling agents for Cu-filled ICAs. The low contact resistance
and high thermal stability of the contact resistance of Cu-filled ICAs were achieved by addition of an optimized silane coupling
agent. Greater thermal stability and improved reliability of Cu-filled ICAs under high temperature and humidity conditions
were achieved with a silane coupling agent of high molecular weight and hydrophobicity. The bulk resistivity of ∼10−4 Ωcm of Cu-filled ICAs was achieved with bimodal filler loading. 相似文献
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通过在导电胶中直接添加短链二元羧酸已二酸对导电胶进行改性,研究了不同含量的已二酸对导电胶性能的影响规律。通过同步热分析仪对不同已二酸含量的导电胶的固化过程和固化后的热稳定性能分析表明,已二酸的添加会和环氧树脂进行反应,并且会促进导电胶的固化放热峰向低温方向偏移;同时已二酸的添加还会部分提高导电胶的热稳定性能。通过电子万能试验机对不同已二酸含量的导电胶的粘接强度进行分析表明,当已二酸质量分数低于0.5%时,随着已二酸含量的增加,导电胶的剪切强度逐步下降,当已二酸质量分数达到0.5%后,导电胶的剪切强度出现上升现象。通过四点探针测试仪对各不同导电胶的体积电阻率的测试,发现随着已二酸含量的增加,导电胶的体积电阻率逐渐减小。 相似文献
3.
基于导电性能退化数据的导电胶可靠性评估 总被引:1,自引:0,他引:1
性能退化表征的是产品的工作能力随时间逐渐降低的现象。提出用指数退化模型来描述导电胶导电性能退化过程,并根据退化数据给出了一个某型导电胶在任意时河的性能特征值的分布模型。根据这个分布模型,提出了两种可靠性评估的方法:1)相对于传统的寿命分布模型,所推导的可靠度函数中的参数易以通过实时跟踪测量性能参数时间序列数据估计得到;2)给出了针对不同样本量时的可靠性评估方法,且简便易行。最后通过试验数据对导电胶在使用环境下的可靠性进行了评估。 相似文献
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Li-Ngee Ho Hiroshi Nishikawa Naohide Natsume Tadashi Takemoto Koichi Miyake Masakazu Fujita Koyu Ota 《Journal of Electronic Materials》2010,39(1):115-123
The properties of electrically conductive adhesives (ECAs) filled with Cu and Cu alloy fillers (with alloy elements Ag, Ge,
Mg, and Zn) were investigated in terms of electrical conductivity, thermal stability, and the effects of the trace alloy elements
on the oxidation resistance of the metallic fillers. Oxidation of metallic fillers under high-temperature exposure at 125°C
was considered as the main reason that led to degradation of electrical conductivity in the ECAs. Cu fillers alloyed with
a trace amount of Ag and Mg, respectively, had significant effects on the electrical conductivity and thermal stability of
the ECAs as the electrical resistivity was substantially suppressed and a consistently high electrical conductivity could
be maintained even after aging for 1000 h at 125°C. 相似文献
6.
Masahiro Inoue Hiroaki Muta Shinsuke Yamanaka Katsuaki Suganuma 《Journal of Electronic Materials》2009,38(9):2013-2022
The electrical properties of isotropic conductive adhesives (ICAs) with two different types of silicone-based binder containing
Ag particles were examined. The ICAs were printed on glass substrates in order to prepare specimens for evaluating the electrical
properties. In the case of adhesives containing a denatured silicone binder, both the curing and cooling steps in the isothermal
curing process generated electrical conductivity. Adhesives that were cured at 120°C to 200°C exhibited similar values of
electrical resistivity regardless of the different curing temperatures. By contrast, electrical conductivity was generated
only during the cooling step when adhesives containing a dimethyl methylvinyl siloxane were isothermally cured. In this case,
adhesives cured above 160°C exhibited high electrical resistivity. In evaluating the temperature dependence of the electrical
resistivity, we found physical annealing to have significantly different effects on these specimens. In addition, we were
able to make small sensitive variations in the properties of silicone-based ICAs by controlling the isothermal annealing and
thermal cycling processes. 相似文献
7.
《Components and Packaging Technologies, IEEE Transactions on》2006,29(3):528-534
An accurate characterization for the deformation behavior of conductive particles is important: 1) to understand the anisotropic conductive adhesive (ACA) interconnection and 2) to optimize the ACA bonding parameter. This paper introduces an experimental technique, which has been developed to allow continuous monitoring of deformation characteristics of a single conductive particle. The load-deformation curve of a single conductive particle is measured, which provides the quantitative estimation of the mechanical and electrical characteristics of metal-coated polymer spheres used in ACAs. Based on the load-deformation result of a single conductive particle and the number of trapped particles on a bump, equivalent spring models are used to predict the deformation degree of conductive particles after flip chip assembly. For two kinds of conductive particles with different polymer cores, the mechanical and electrical characteristics of ACA interconnection were studied. Such results are used to further achieve a more sophisticated approach of the ACA bonding process and contact reliability. 相似文献
8.
《Advanced Packaging, IEEE Transactions on》2009,32(3):589-592
9.
目前由于电子产品中器件非线性引起的电磁可靠性问题变得越来越严重,为了准确评估不同导电胶产品在正弦信号激励下非线性特性的优劣,设计了一套基于窄带滤波器和微带线的简单且行之有效的非线性特性测试方法,在测试中使用滤波器排除测试系统固有的三次谐波。由于非线性效应会产生电压、电流的高次谐波成分,该方法以三次谐波的功率作为导电胶的非线性特性的衡量指标,通过测量不同导电胶的三次谐波功率来完成非线性特性的对比测试,为导电胶的测试评价及设计研发提供技术支撑。 相似文献
10.
导电胶主要是由环氧树脂基体和导电粒子组成的复合导电聚合物,其力学性能主要是由聚合物基体决定,基体是粘弹性材料,具有时间和温度依赖性。文章建立了一个基于时间-温度、时间-固化度的宏观粘弹性本构关系来描述导电胶在固化过程中的粘弹性行为,通过动态力学试验(DMA)表征导电胶的粘弹性行为,测定导电胶的粘弹性参数。通过对导电胶粘弹性行为表征,能更好的优化固化工艺参数。 相似文献
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The hygrothermal stability of electrical contacts made from silver and graphite electrically conductive pastes is comparatively
evaluated by measurement of the increase in contact electrical resistance during immersion in water at 15°C and 40°C. The
pastes are silver paint, silver paint with a nonconductive epoxy overcoat, silver epoxy, and graphite colloid. Each electrical
contact is made between a seven-strand tin-coated copper wire and the surface of a carbon fiber epoxy-matrix composite. Silver
paint and graphite colloid penetrate the spaces among the 130-μm-diameter strands, but silver epoxy does not. Partly due to its low penetrability and the silver flake (15 μm) preferred orientation, silver epoxy gives contacts of significantly higher resistance than silver paint. Graphite colloid
is comparable to silver epoxy in the resistance. Among the four pastes, silver paint with an epoxy overcoat is most durable,
though it gives slightly higher resistance than silver paint without epoxy. Silver epoxy is less durable than silver paint
without an epoxy overcoat, particularly at 40°C, due to the low hygrothermal stability of epoxy. Graphite colloid is even
less durable than silver epoxy, due to its being water based. 相似文献
15.
Hyung Sun Lee Choong Bum Park Kyoung Ju Noh John Sunwoo Hoon Choi Il‐Yeon Cho 《ETRI Journal》2010,32(5):713-721
E‐textile technology has earned a great deal of interest in many fields; however, existing wearable network protocols are not optimized for use with conductive yarn. In this paper, some of the basic properties of conductive textiles and requirements on wearable personal area networks (PANs) are reviewed. Then, we present a wearable personal network (WPN), which is a four‐layered wearable PAN using bus topology. We have designed the WPN to be a lightweight protocol to work with a variety of microcontrollers. The profile layer is provided to make the application development process easy. The data link layer exchanges frames in a master‐slave manner in either the reliable or best‐effort mode. The lower part of the data link layer and the physical layer of WPN are made of a fabric serial‐bus interface which is capable of measuring bus signal properties and adapting to medium variation. After a formal verification of operation and performances of WPN, we implemented WPN communication modules (WCMs) on small flexible printed circuit boards. In order to demonstrate the behavior of our WPN on a textile, we designed a WPN tutorial shirt prototype using implemented WCMs and conductive yarn. 相似文献
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Chang‐Chun Wang Jiao‐Fan Song Hui‐Min Bao Qun‐Dong Shen Chang‐Zheng Yang 《Advanced functional materials》2008,18(8):1299-1306
Conductive nanofibers are adopted to enhance the electric properties of ferroelectric polymers. Polyaniline (PANI) nanofibers doped by protonic acids have a high dispersion stability in vinylidene fluoride‐trifluoroethylene copolymers [P(VDF‐TrFE)] and lead to percolative nanocomposites with enhanced electric responses. About a 50‐fold rise in the dielectric constant of the ferroelectric polymer matrix has been achieved. Percolation thresholds of the nanocomposites are relevant to doping levels of PANI nanofibers and can be as low as 2.9 wt% for fully doped nanofibers. The interface between the conductive nanofiber and the polymer matrix plays a crucial role in the dielectric enhancement of the nanocomposites in the vicinity of the percolation threshold. Compared with other dopants, perfluorosulfonic acid resin is better at improving the performance of the nanofibers in that it serves as a surface passivation layer for the conductive fillers and suppresses leakage current at low frequency. The nanofibers drastically reduce the electric field strength required to switch spontaneous polarization of P(VDF‐TrFE). The nanocomposites can be utilized for potential applications as high energy density capacitors, thin‐film transistors, and non‐volatile ferroelectric memories. 相似文献
18.
Bin Xie Shi X.Q. Han Ding 《Components and Packaging Technologies, IEEE Transactions on》2008,31(2):361-369
In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues. 相似文献
19.
Russian Microelectronics - The approaches used to the form electrically conductive structures on aluminum and anodized aluminum substrates using such photoresists as synthesized triacrylamide... 相似文献
20.
Tomohiro Fujii Shinji Fukuda Masahiko Emoto Koudai Osada Toshio Kawahara Makoto Hamabe Hirofumi Watanabe Yury Ivanov Jian Sun Satarou Yamaguchi 《Journal of Electronic Materials》2011,40(5):691-695
Thermoelectric materials are promising candidates for use in energy-saving devices in many fields. They are also useful in
superconducting applications such as those using Peltier current leads (PCLs) to reduce system heat loss. In the case of PCLs,
consideration must be given to Joule heating. Furthermore, the performance of PCLs is intricately dependent on their thermoelectric
properties. In addition to the figure of merit Z, consideration of the electrical conductivity is also important for the design of high-performance PCLs. In this paper, we
discuss the resistivity dependence of the performance of PCLs using model parameters obtained from real devices. 相似文献