A Seventh-Order gm - C Filter with Bicubic Section for Pulse Slimming

A 7^th–order 0.05^° equiripple linear phase filter is presented which includes a bicubic section to perform the pulse slimming function required in a magnetic tape drive read channel. The g_m - C filter relies on a programmable BiCMOS transconductance amplifier to achieve a 10X programming range of the –3dB cutoff frequency (0.4-4MHz) and up to 13dB of boost.     

Optical and Dielectric Properties and Microstructures of rf-Magnetron Sputtered ZnO-Doped Zr<Subscript>0.8</Subscript>Sn<Subscript>0.2</Subscript>TiO<Subscript>4</Subscript> Films on Indium Tin Oxide/Glass Substrates

Optical and dielectric properties and microstructures of ZnO-doped (Zr_0.8Sn_0.2)TiO₄ thin films prepared by radiofrequency (rf)-magnetron sputtering on indium tin oxide/glass substrates at different rf powers and substrate temperatures have been investigated. Selected-area diffraction patterns showed that the deposited films exhibited a polycrystalline microstructure. All films exhibited the ZnO-doped (Zr_0.8Sn_0.2)TiO₄ structure with the (111) orientation perpendicular to the substrate surface. The grain size as well as the deposition rate of the film increased with an increase in both rf power and substrate temperature. At an annealing temperature of 700°C, the ZnO-doped (Zr_0.8Sn_0.2)TiO₄ film possessed a dielectric constant of 47 at 10 MHz, a dissipation factor of 0.02 at 10 MHz, a leakage current density of 7.35 × 10⁻⁹  A/cm² at an electrical field of 1 kV/cm, average transmission in the visible range of over 70%, and an optical bandgap of 3.6 eV. This film will allow fabrication of fully transparent semiconductor devices such as a resistive random-access memory (RRAM) and thin-film transistors (TFTs) completely based on ZnO-doped (Zr_0.8Sn_0.2)TiO₄ thin films.     

<Superscript>63</Superscript>Cu and <Superscript>115</Superscript>In NMR study of CuInS<Subscript>2</Subscript> semiconductor

Two CuInS₂ semiconductor samples synthesized from chemical elements with the equiatomic cation ratio (N _Cu/N _In = 1) and either an excess or stoichiometric sulfur content have been investigated by ⁶³Cu and ¹¹⁵In nuclear magnetic resonance. The spectra were recorded on a Bruker Avance-400 spectrometer at a temperature of 290 K and frequencies of 106.14 MHz (⁶³Cu) and 87.67 MHz (¹¹⁵In). Numerical simulation made it possible to determine the quadrupole coupling constants: 0.34 MHz (⁶³Cu) and 1.1 MHz (¹¹⁵In). For the samples synthesized with excess sulfur (above stoichiometry), distortions are revealed in both the ⁶³Cu and ¹¹⁵In spectra.     

Fabrication of suspended thin film resonator for application of RF bandpass filter

Characteristics of AlN thin film and thin film resonator for RF bandpass filter have been studied. AlN thin films were deposited by RF magnetron sputter system. Deposition parameters such as N₂ contents, Ar and N₂ partial pressures, and the distance between metal target and substrate were found to affect the piezoelectric response. To fabricate the suspended thin film resonator (STFR) using the piezoelectric AlN thin film, the etching of AlN and the surface micromachining process were conducted. The thickness of AlN film and membrane for the STFR are 2 and 15 μm, respectively. This membrane was fabricated by SOI technology. The device with the dimension of 160 × 160 μm² has a resonant frequency of 1.653 GHz, a K_eff² of 2.4%, a bandwidth of 17 MHz, and a quality factor of 91.7. The device with the dimension of 200 × 200 μm² has a resonant frequency of 1.641 GHz, a K_eff² of 1.2%, and a bandwidth of 9 MHz, and a quality factor of 50.2.     

Physical and electrical properties of low dielectric constant self-assembled mesoporous silica thin films

The physical and electrical properties of self-assembled mesoporous silica thin films with defined 2D hexagonal porous architectures have been evaluated in the following study. Self-assembled mesoporous silica thin (MPS) films have been prepared by evaporation-induced self-assembly (EISA) methods using the triblock copolymer (C₂H₂)₁₀₆(C₃H₃)₇₀(C₂H₂)₁₀₆ (Pluronic F127^®). The MPS films exhibit remarkably low level leakage currents (1 × 10⁻⁸–1 × 10⁻⁷ A/cm² at 1 MV/cm¹) and high breakdown voltages (>3 MV/cm¹). The films have dielectric constants of approximately 2.3, low dielectric loss factors of 0.01–0.03 and exhibit negligible frequency dispersion of dielectric constant between 100 kHz and 1 MHz. The effect of physisorbed water (humidity) upon the electrical properties of the films is also investigated using capacitance–voltage techniques.     

The microwave properties of Li doped 0.7(Ba,Sr)TiO3-0.3MgO thick film interdigital capacitors on the alumina substrates

The crystalline and electrical properties of Li doped 0.7(Ba,Sr)TiO₃-0.3MgO thick film interdigital capacitors have been investigated. Screen printing method was employed to fabricate Li doped 0.7(Ba,Sr)TiO₃-0.3MgO thick films on the alumina substrates. (Ba,Sr)TiO₃ materials have high dielectric permittivity (>500 @ 1 MHz) and low loss tangent (0.01 @ 1 MHz) in the epitaxial thin film form. To improve dielectric properties and reduce sintering temperature, MgO and Li were added, respectively. 10 μm thick films were screen printed on the alumina substrates and then interdigital capacitors with seven fingers of 200 μm finger gap were patterned with Ag electrode. Current-voltage characteristics were analyzed with elevated temperature range. Up to 50 °C, the thick films showed positive temperature coefficient of resistivity (dρ/dT) of 6.11 × 10⁸ Ω cm/°C, then film showed negative temperature coefficient of resistivity (dρ/dT) of −1.74 × 10⁸ Ω cm/°C. From the microwave measurement, the relative dielectric permittivity of Li doped 0.7(Ba,Sr)TiO₃-0.3MgO thick films interdigital capacitors were between 313 at 1 GHz and 265 at 7 GHz.     

Low-noise solar-blind AlxGa1-xN-based metal-semiconductor-metal ultraviolet photodetectors

We report the growth, fabrication, and characterization of high performance Schottky metal-semiconductor-metal solar-blind photodetectors fabricated on epitaxial Al_0.4Ga_0.6N layers grown by metalorganic chemical vapor deposition. The devices exhibited low dark current (<2 pA at 30 V) and a gain-enhanced ultraviolet (UV) photocurrent for bias voltages >40 V. The gain was corroborated by external quantum efficiency measurements reflecting a quantum efficiency as high as 49% (at=272 nm) at 90 V bias, with a corresponding responsivity R=107 mA/W. A visible-to-UV rejection factor of more than three orders of magnitude was demonstrated. Time-domain and frequency-domain speed measurements show a 3-dB bandwidth of ∼100 MHz. Low-frequency noise measurements have determined a detectivity (D^*) as high as 3.3 10¹⁰ cm·Hz^1/2/W for a 500 Hz bandwidth at 37 V bias.     

Interfacial Reaction Enhanced Liquid-Phase Sintering of Metal/Oxide Soft Magnetic Composite

Soft magnetic composites (SMCs) are ungently demanded in high-frequency power electronics for their large magnetization and high electrical resistivity. However, traditional cold-pressed SMCs are faced with low mechanical strength and insulation instability, which severely restricts their applications. In this study, liquid-phase sintering techniques to prepare FeSiAl/MoO₃ SMCs are orginally employed, where consolidation and insulation of metallic magnetic particles are achieved in one step. The redox reaction between FeSiAl and MoO₃ melt greatly reduces the interfacial energy, facilitates fully wetting of FeSiAl particles by MoO₃ melt, and promotes the densification process during sintering. In the final FeSiAl/MoO₃ SMC, FeSiAl particles are bonded covalently and insulated electrically/magnetically by the resultant Al₂O₃ transition layer, endowing the SMC with high crushing strength of 250 MPa, cut-off frequency of 110 MHz, permeability of 35 (@1 MHz), and low power loss of 962 kW m⁻³ (5 MHz, 5 mT). This study provides alternative concept for designing new SMCs, and broadens the connotation and extension of liquid-phase sintering.     

Flexible metal-insulator-metal capacitor using plasma enhanced binary hafnium-zirconium-oxide as gate dielectric layer

We have used a sol-gel spin-coating process to fabricate a new metal-insulator-metal capacitor comprising 10-nm thick binary hafnium-zirconium-oxide (Hf_xZr_1−xO₂) film on a flexible polyimide (PI) substrate. The surface morphology of this Hf_xZr_1−xO₂ film was investigated using atomic force microscopy and scanning electron microscopy, which confirmed that continuous and crack-free film growth had occurred on the PI. After oxygen plasma pre-treatment and subsequent annealing at 250 °C, the film on the PI substrate exhibited a low leakage current density of 3.22 × 10⁻⁸ A/cm² at −10 V and maximum capacitance densities of 10.36 fF/μm² at 10 kHz and 9.42 fF/μm² at 1 MHz. The as-deposited sol-gel film was oxidized when employing oxygen plasma at a relatively low temperature (∼250 °C), thereby enhancing the electrical performance.     

Dielectric properties of low loss Ba<Subscript>6−3x</Subscript>Nd<Subscript>8+2x</Subscript>Ti<Subscript>18</Subscript>O<Subscript>54</Subscript> thin films prepared by pulsed laser deposition for microwave applications

Ba_6−3xNd_8+2xTi₁₈O₅₄ with x=0.25 (BNT-0.25, or simply, BNT) dielectric thin films with a thickness of 320 nm have been prepared on Pt-coated silicon substrates by pulsed laser deposition (PLD) at the substrate temperature of 650°C in 20 Pa oxygen ambient. X-ray analysis showed that the as-deposited films are amorphous and the films remain amorphous after a postannealing at 750°C for 30 min. The dielectric constant of the BNT films has been determined to be about 80 with a low loss tan δ of about 0.006 at 1 MHz. The capacitance-voltage (C-V), capacitance-frequency, and capacitance-temperature characteristics of a BNT capacitor with Pt top electrode were measured. A low leakage-current density of 4×10⁻⁶ A/cm² at 6 V was measured, and a preliminary discussion of the leakage-current mechanism is also given. It is proposed that amorphous BNT-0.25 thin films will be a potential dielectric material for microwave applications.     

Acoustic Gain in Solids due to Piezoelectricity,Flexoelectricity, and Electrostriction

A quantitative discussion of the combined influence of three electromechanical effects: piezoelectricity, flexoelectricity, and electrostriction in solids is provided for acoustic absorption and gain. While piezoelectricity occurs in non‐centrosymmetric materials only, flexoelectricity and electrostriction exist in all materials. Two important new results are demonstrated: 1) the possibility to realize acoustic gain in all materials (centrosymmetric and non‐centrosymmetric) when the acoustic Cherenkov condition is fulfilled, and 2) realization of acoustic gain in the presence of a strong dc electric field, even when the Cherenkov condition is not fulfilled, in the case of strong cross‐coupling between piezoelectricity, flexoelectricity, and electrostriction. A simple analytical expression for the acoustic dispersion relation is derived for the combined effect of piezoelectricity, flexoelectricity, and electrostriction. At lower frequencies, the piezoelectric effect dominates for inversion‐asymmetric materials. At high frequencies (≈>1 MHz) flexoelectricity becomes increasingly important and eventually provides a major mechanism for gain and absorption in barium titanate (BaTiO₃). In the presence of strong electric fields (≈>1 MV m^?1), electrostriction provides a dominant isolated contribution to absorption/gain in BaTiO₃. Strong coupling between the three electromechanical contributions determines the total absorption/gain coefficient.     

The protective effect of thin amorphous hydrogenated carbon a-C:H films during metallisation of metal-carbon-oxide-silicon (MCOS) diodes

Capacitance-voltage (C-V) characteristics of the as-grown metal(Al)-carbon-oxide(SiO₂)-semiconductor(Si) structures are examined at the frequency of 1 MHz and compared with the C-V characteristics of the conventional metal(Al)-SiO₂-Si (MOS) structures. The density of the oxide charge Q_o/q is extracted from the experimental results. Q_o/q was found to be 1×10¹² cm⁻² for the MOS structures and 7×10¹¹ cm⁻² for the metal-carbon-oxide-silicon structures. This difference can be attributed to the presence of the carbon layer which acts as a protective coating during metallisation of the wafers.     

Observation of indium-vacancy and indium-hydrogen interactions in Hg1−xCdxTe

We have used a nuclear hyperfine technique, perturbed γγ angular correlation (PAC), to study the interactions between¹¹¹In and native defects and impurities in Hg_1−xCd_xTe. The PAC technique uses the quadrupole interaction of¹¹¹In with local electric field gradients to characterize the local environment of this donor dopant. We observed that when In was diffused into a bulk or thin film sample of Hg_1−xCd_xTe (x=0.21 and x=0.3) at 350°C and the sample was slow cooled, the In occupied sites with near-cubic symmetry, presumably the substitutional metal site. However, when the sample was quenched, a fraction of the In was incorporated into defects characterized by quadrupole interaction strengthsv _Q1 andv _Q2 and asymmetries of ν₁=ν₂=0.08. These defects are attributed to the trapping of a metal vacancy at a next-nearest neighbor site to the In atom. The introduction of hydrogen by boiling the samples in distilled water for >4h eliminated the previously observed PAC signals and created defects characterized byv _Q3=35 MHz, ν₃ <0.1 andv _Q4=MHz, ν₄ <0.1. These defects are attributed to the decoration of the In-V_Hg complex by a hydrogen atom. Hall effect measurements showed that hydrogenation increased the hole concentration in p-type quenched samples and even converted n-type indium-doped samples to p-type. A possible model for hydrogen incorporation which includes self-compensation by vacancy creation is suggested.     

Plasma-enhanced flexible metal-insulator-metal capacitor using high-k ZrO2 film as gate dielectric with improved reliability

We demonstrate a new flexible metal-insulator-metal capacitor using 9.5-nm-thick ZrO₂ film on a plastic polyimide substrate based on a simple and low-cost sol-gel precursor spin-coating process. The surface morphology of the ZrO₂ film was investigated using scan electron microscope and atomic force microscope. The as-deposited ZrO₂ film under suitable treatment of oxygen (O₂) plasma and then subsequent annealing at 250 °C exhibits superior low leakage current density of 9.0 × 10⁻⁹ A/cm² at applied voltage of 5 V and maximum capacitance density of 13.3 fF/μm² at 1 MHz. The as-deposited sol-gel film was completely oxidized when we employed O₂ plasma at relatively low temperature and power (30 W), hence enhancing the electrical performance of the capacitor. The shift (Zr 3d from 184.1 eV to 184.64 eV) in X-ray photoelectron spectroscopy of the binding energy of the electrons towards higher binding energy; clearly indicates that the O₂ plasma reaction was most effective process for the complete oxidation of the sol-gel precursor at relatively low processing temperature.     

Research of SiO2/InP structure prepared by photo-CVD

The SiO₂ film as an insulator in InP MOS structure was grown by mercury-sensitized photo induced chemical-vapor deposition (photo-CVD) utilizing gaseous mixture of monosilane (SiH₄) and nitrous oxide (N₄O) under 253.7 nm ultraviolet light irradiation. The PHOTOX SiO₂ film (i.e., SiO₂ film prepared by photo-CVD system) deposited at 250° C has a refractive index of 1.46 and breakdown field strength of 7.0 MV/cm. The 1 MHz capacitance-voltage characteristics of the InP MOS diode was measured to study the interface state densities. The minimum value is 1.2 × 10¹¹ cm⁻²eV⁻¹ for the sample prepared at a substrate temperature of 250° C.     

Broadband nuclear magnetic resonance using DC SQUID amplifiers

We have constructed two pulsed NMR spectrometers in which the signal is coupled to the input coil of a low T_c DC SQUID using a superconducting flux transformer, yielding broadband response, with bandwidth determined by the SQUID electronics. A 50 kHz bandwidth commercial system has been used to observe free induction decay signals from platinum powder, bulk platinum, ³He gas and surface monolayers of ³He in the temperature range from 1.4 to 4.2 K and at frequencies from 5 to 40 kHz. The observed signal-to-noise ratio is as calculated with the noise dominated by flux noise in the SQUID in all samples but the bulk metal. A second system, which operates in flux-locked loop mode with bandwidth of 3.4 MHz using a SQUID with additional positive feedback, has been used to observe NMR signals from platinum powder at frequencies from 38 to 513 kHz and at a temperature of 4.2 K. The advantage of this technique in the study of systems with short T₂ at frequencies below 1 MHz is discussed. In addition we discuss the benefits of both broadband and tuned input circuits for NMR detection and we describe the performance of a spectrometer with a tuned input circuit which has been used to obtain signals at 1 MHz from platinum powder at 4.2 K and from ∼2 layers of ³He absorbed on a surface area of 0.11 m² at 1.7 K. The amplifier noise temperature is predicted to be 60 mK in the ³He experiment. This demonstrates the potential of the tuned set-up for measurements at low millikelvin temperatures on systems with low spin density and with T₂ greater than several hundred microseconds.     

A low-distortion multi-bit sigma–delta ADC with mismatch-shaping DACs for WLAN applications

A low-distortion feed-forward MASH2_4b-2_4b sigma–delta analog-to-digital converter (ADC) for wireless local area network (WLAN) applications was presented. The converter exhibits improved performances than the ADCs which have been presented to date by adding a feedback factor in the second stage and employing a 2nd-order noise-shaping dynamic element matching (DEM) scheme. The feedback factor induces a zero in the noise transfer function (NTF) and therefore improves the in-band signal to noise and distortion ratio (SNDR) of the modulator. The mismatch-shaping DEM was introduced and applied to the 4-bit DACs in this paper to improve the resolution and linearity of the ADC. Fabricated in a 0.18 μm CMOS process with single 1.8 V supply voltage, the converter achieves a peak SNDR of 85.4 dB over a 10 MHz bandwidth which implies an effective number of bits (ENOB) of 13.90-bit. The spurious free dynamic range (SFDR) is –94 dB for a 1.25 MHz@–6dBFS input signal at 160 MHz sampling frequency. The occupied area is 0.44 mm² and dissipation power 23.4 mW.     

A 90-nm CMOS, 8-bit pipeline ADC with 60-MHz bandwidth and 125-MS/s or 250-MS/s sampling frequency

In this paper a dual operating mode 8-bit, 1.1-V pipeline ADC for Gigabit Ethernet applications is presented. In the two operating modes, the ADC features different sampling frequency (125 and 250 MHz) and power consumption (9.4 and 22.8 mW). Considering a signal bandwidth of 60 MHz in both operating modes, as required by the Gigabit Ethernet standard, the ADC achieves a SNDR always larger than 39.4 dB at 125 MHz and 38.7 dB at 250 MHz (6.25-bit and 6.13-bit ENOB, respectively), with a FoM of 0.84 pJ/conv at 125 MHz and 2.2 pJ/conv at 250 MHz. The ENOB achieved is mainly limited by clock jitter. The ADC is fabricated with a 90-nm CMOS technology, with an active area of 1.25 × 0.65 mm².     

Low temperature passivation of Si1−xGex alloys by dry high pressure oxidation

Thermal passivation of Si_1−xGe_x using high pressure (70 MPa) oxidation was studied for potential use in MOS-device applications. Alloys of CVD-grown Si_1−xGe_x (x = 10 and 15 at.%, 200 and 150 nm thick, respectively), were oxidized at 500 and 550°C using high purity dry oxygen at a pressure of 70 MPa. For comparative purposes, a second set of alloys were oxidized using conventional wet atmospheric pressure oxidation at 800°C. X-ray photoelectron spectroscopy (XPS), Raman spectroscopy, transmission electron microscopy (TEM), and metal-oxide semiconductor capacitance-voltage (C-V) measurements were used to characterize the as-grown oxides. Chemical analysis by XPS confirmed that under high pressure conditions compositionally congruent oxides are grown from these alloys. High resolution TEM and Raman spectroscopy show that the as-grown oxide/semiconductor interface is planar and free of Ge enrichment on a scale of 1-2 monolayers. A midgap interface state density for both the 10 and 15 at.% samples of 1 × 10¹² cm⁻² eV⁻¹ was estimated based on 1 MHz C-V measurement.     

Structural and frequency-dependent dielectric properties of PVP-SiO2-TMSPM hybrid thin films

In the present study, thin films of PVP-SiO₂-TMSPM (polyvinylpyrrolidone-silicon dioxide- 3-trimethoxysilyl propyl metacrylate) were deposited on p-type Si (111) substrates using spin coating technique. Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD), and energy dispersive X-ray spectrometry (EDS) were applied to investigate the chemical bonds and structural properties of the samples. Morphology of the hybrid thin films was studied using atomic force microscopy (AFM) and scanning electron microscopy (SEM) techniques. The frequency dependence of dielectric properties such as dielectric constant (ε^′), dielectric loss (ε″), loss tangent (tan δ) as well as the real component of electric modulus (M′), imaginary component of electric modulus (M″), and AC electrical conductivity (σ_AC) was studied in Al/PVP-SiO₂-TMSPM/PSi used as a metal-polymer-semiconductor (MPS) device. Analysis of dielectric relaxation behavior was performed in the frequency range of 0.1 KHz to 1 MHz. In the frequency range of 1 KHz to 1 MHz, the σ_AC data were varied from 6.35 × 10⁻⁶ to 9.02 × 10⁻⁶ for the sample with 0.15 wt ratios of TMSPM and equivalent values of both PVP and SiO₂. The dielectric, modulus, and AC conductivity analyses were considered the useful factors to detect the effects of the capacitance, ionic conductivity, and dielectric relaxation process.