Curing and Morphology of BPA Epoxy Resin/LC Epoxy Resin PEPEB Composites

Liquid crystalline epoxy resin (LC epoxy resin) – p-phenylene di{4-[2-(2,3-epoxypropyl)ethoxy]benzoate} (PEPEB) was synthesized. The mixture of PEPEB with bisphenol-A epoxy resin (BPAER) was cured with a curing agent 4,4-diamino-diphenylmethane (DDM). The curing process and thermal behavior of this system were investigated by differential scanning calorimeter (DSC) and torsional braid analysis (TBA). The morphological structure was measured by polarizing optical microscope (POM) and scanning electron microscope (SEM). The results show that the initial curing temperature Ticu (gel point) of this system is 68.1°C, curing peak temperature T _pcu is 102.5°C, and the disposal temperature T _fcu is 177.6°C. LC structure was fixed in the cured epoxy resin system. The curing kinetics was investigated by dynamic DSC. Results showed that the curing reaction activation energy of BEPEB/BPAER/DDM system is 22.413 kJ/mol. The impact strength is increased 2.3 times, and temperature of mechanical loss peak is increased to 23°C than the common bisphenol-A epoxy resin, when the weight ratio of BEPEB with BPAER is 6 100.     

新型双马来酰亚胺改性环氧树脂体系性能研究

用含二氮杂萘联苯结构的双马来酰亚胺(DHPZ-BM I)与4,4'-二氨基二苯砜(DDS)为复合固化剂固化环氧树脂(E-51)。采用示差扫描量热仪(DSC)研究了该体系的固化反应动力学,求得固化反应表观活化能Ea=63.28 kJ/mol,碰撞因子A=1.55×106s-1,反应级数n=0.89,该体系与链延长型双马来酰亚胺PPEK-BM I(DP=15)/DDS/E-51体系的固化反应动力学数据几乎相同,证明二者的固化反应过程相同。采用热失重分析仪(TGA)分析研究了上述2种固化体系的热分解动力学,前者的热分解活化能达215.04 kJ/mol,为后者的1.5倍以上,说明DHPZ-BM I/DDS/E-51是1种热稳定性能良好的耐高温环氧树脂体系。     

联苯酚醛环氧树脂固化动力学及热性能研究

以4,4'-二氨基二苯砜(DDS)为固化剂,采用非等温示差扫描量热法(DSC)研究了联苯酚醛环氧树脂(BPNE)的固化动力学。通过外推法确定了体系的固化工艺。采用Kissinger、Ozawa法计算出固化体系的表观活化能,根据Crane理论计算得到该体系的固化反应级数。采用DSC,热重分析(TGA)研究了固化物的耐热性。结果表明:BPNE的固化工艺为160℃/2h+200℃/2h+230℃/2h;固化反应的活化能约为61.86kJ/mol,指前因子为5.27×105min-1,反应级数为1.1;玻璃化转变温度(Tg)为167℃,其10%热失重温度为398.1℃,800℃残炭率为29.37%,与双酚A环氧树脂/DDS固化物相比,分别提高了22℃,11.71%。     

CURING KINETICS AND THERMAL PROPERTY CHARACTERIZATION OF BISPHENOL-F EPOXY RESIN AND DDS SYSTEM

The curing kinetics of bisphenol-F epoxy resin (BPFER)/4,4′-diaminodiphenyl sulfone (DDS) system were studied by isothermal experiments using a differential scanning calorimeter (DSC). Autocatalytic behavior was shown in the first stages of the cure for the system, which could be well described by the model proposed by Kamal that includes two rate constants, k ₁ and k ₂, and two reaction orders, m and n. The curing reaction at the later stages was practically diffusion-controlled due to the onset of gelation and vitrification. To consider the diffusion effect more precisely, diffusion factor, f(α), was introduced into Kamal's equation. Thus, the curing kinetics could be predicted well over the whole range of conversion covering both pre- and postvitrification stages. The glass transition temperatures (T_gs) of the BPFER/DDS system isothermally cured partially were determined by means of torsional braid analysis (TBA), and the results showed that T_gs increased with conversion up to a constant value. The highest T_g was 406.2 K. The thermal degradation kinetics of cured BPFER were investigated by thermogravimetric analysis (TGA), revealing two decomposition steps.     

Curing and Thermal Properties of PEPEB Liquid Crystalline Diepoxide/Aromatic Diamine

The liquid crystalline epoxy resin p-phenylene di[4-2-(2,3-epoxypropyl)ethoxy] benzoate (PEPEB) was synthesized. The curing behavior of the liquid crystalline epoxy resin (LCER) with 4,4-diaminodiphenylmethane (DDM) was studied by fourier transform infrared (FTIR), differential scanning calorimetry (DSC), and torsional braid analysis (TBA). Morphology of curing product was observed by polarized optical microscopy (POM) at different temperatures. Nonisothermal curing kinetics of this system were investigated by DSC. Results show that the PEPEB has a smectic liquid crystalline structure, and the melting point, T _m, is 119°C, the clearing point is 184°C. The cured-system's gel point, T _I , is 83.5°C; cure temperature, T _P , is 111.6°C; and the disposal temperature, T _f , is 145.8°C; activation energy of curing reaction is 4.84 KJ/mol. Observation by POM shows that with the upgrade of initial curing temperature, the filament structure of this system transferred from anisotropy to isotropy.     

Curing kinetics and thermal property characterization of a bisphenol‐S epoxy resin and DDS system

The kinetics of the cure reaction for a system of bisphenol‐S epoxy resin (BPSER), with 4,4′‐diaminodiphenyl sulfone (DDS) as a curing agent was investigated with a differential scanning calorimeter (DSC). Autocatalytic behaviour was observed in the first stages of the cure which can well be described by the model proposed by Kamal, using two rate constants, k₁ and k₂, and two reaction orders, m and n. The overall reaction order, m + n, is in the range 2∼2.5, and the activation energy for k₁ and k₂ was 86.26 and 65.13 kJ mol⁻¹, respectively. In the later stages, a crosslinked network was formed and diffusion control was incorporated to describe the cure. The glass transition temperature (T_g) of the BPSER/DDS samples partially cured isothermally was determined by means of torsional braid analysis (TBA) and the results showed that the reaction rate increased with increasing T_g, in terms of rate constant, but decreased with increasing conversion. It was also found that the  SO₂ group both in the epoxy resin and in the hardener increases the T_g values of the cured materials compared with that of BPAER. The thermal degradation kinetics of this system was investigated by thermogravimetric analysis (TGA). It illustrated that the thermal degradation of BPSER/DDS has nth order reaction kinetics. © 2000 Society of Chemical Industry     

Studies on the curing behavior,thermal, and mechanical properties of epoxy resin-co-amine-functionalized lead phthalocyanine

A high performance copolymer was prepared by using epoxy (EP) resin as matrix and 3,10,17,24-tetra-aminoethoxy lead phthalocyanine (APbPc) as additive with dicyandiamide as curing agent. Fourier-transform infrared spectroscopy, dynamic mechanical analysis (DMA), differential scanning calorimetric analysis (DSC), and thermogravimetric analysis (TGA) were used to study the curing behavior, curing kinetics, dynamic mechanical properties, impact and tensile strength, and thermal stability of EP/APbPc blends. The experimental results show that APbPc, as a synergistic curing agent, can effectively reduce the curing temperature of epoxy resin. The curing kinetics of the copolymer was investigated by non-isothermal DSC to determine kinetic data and measurement of the activation energy. DMA, impact, and tensile strength tests proved that phthalocyanine can significantly improve the toughness and stiffness of epoxy resin. Highest values were seen on the 20 wt% loading of APbPc in the copolymers, energy storage modulus, and impact strength increased respectively 388.46 MPa and 3.6 kJ/m², T_g decreased 19.46°C. TGA curves indicated that the cured copolymers also exhibit excellent thermal properties.     

Curing behavior and thermal properties of multifunctional epoxy resin with methylhexahydrophthalic anhydride

The curing behavior and thermal properties of bisphenol A type novolac epoxy resin (bisANER) with methylhexahydrophthalic anhydride (MHHPA) at an anhydride/epoxy group ratio of 0.85 was studied with Fourier‐transform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC), and thermogravimetry. The results showed that the FTIR absorption intensity of anhydride and epoxide decreased during the curing reaction, and the absorption peak of ester appeared. The dynamic curing energies were determined as 48.5 and 54.1 kJ/mol with Kissinger and Flynn–Wall–Ozawa methods, respectively. DSC measurements showed that as higher is the curing temperature, higher is the glass transition. The thermal degradation of the cured bisANER/MHHPA network was identified as two steps: the breaking or detaching of ? OH, ? CH₂? , ? CH₃, OC? O and C? O? C, etc., taking place between 300 and 450°C; and the carbonizing or oxidating of aromatic rings occurring above 450°C. The kinetics of the degradation reaction was studied with Coats–Redfern method showing a first‐order process. In addition, vinyl cyclohexene dioxide (VCD) was employed as a reactive diluent for bisANER (VCD/bisANER = 1 : 2 w/w) and cured with MHHPA, and the obtained network had a higher T_g and a slight lower degradation temperature than the undiluted system. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 2041–2048, 2007     

Curing Kinetics and Thermal Properties Characterization of o-Cresol-formaldehyde Epoxy Resin and MeTHPA System

The kinetics of the cure reaction for a system of o-cresol-formaldehyde epoxy resin (o-CFER) with 3-methyl-tetrahydrophthalic anhydride (MeTHPA) as a curing agent and N,N-dimethyl-benzylamine as an accelerator was investigated by means of differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure for the system, which could be well described by the model proposed by Kamal, which includes two rate constants, k₁ and k₂, and two reaction orders, m and n. The activation energy E₁ and E₂ are 195.84 and 116.54 kJmol^?1, respectively. In the later stages, the reaction is mainly controlled by diffusion, and a diffusion, factor, f(α), was introduced into Kamal's equation. In this way, the curing kinetics were predicted well over the entire range of conversion. Molecular mechanism for the curing reaction was discussed. The glass transition temperature T_g was determined by means of torsional braid analysis (TBA). The results showed that T_gs increased with curing temperature and conversion up to a constant value about 367.1 K. The thermal degradation kinetics of the system was investigated by thermogravimetric analysis (TGA), which revealed two decomposition steps.     

Studies on Cure Kinetics of Diglycidyl Ether of 4,4′-Bisphenol/4,4′-Diaminobiphenyl Using the Advanced Isoconversional Method

The cure kinetics of a rigid-rod epoxy monomer, diglycidyl ether of 4,4′-bisphenol (DGEBP), and the curing agent with the similar rigid-rod group, 4,4′-diaminebiphenyl (DABP), was studied using an advanced isoconversional method (AICM). DGEBP/DABP curing system was carried out by means of differential scanning calorimetry (DSC). Three exothermic peaks were depicted by nonisothermal DSC studies: the first two peaks were attributed to the curing reaction, and the last peak was attributed to the decomposition of the cured epoxy resin. The LC phase transformation of the curing process was observed by PLM. Using AICM, the largest activation energy of the curing reaction of DGEBP/DABP system was obtained as 108 kJ/mol. It can also be learned that LC phase transformation of the curing process affects the reaction significantly.     

Super-crosslinked ionic liquid-intercalated montmorillonite/epoxy nanocomposites: Cure kinetics,viscoelastic behavior and thermal degradation mechanism

Super-crosslinked epoxy nanocomposites containing N-octadecyl-N′-octadecyl imidazolium iodide (IM)-functionalized montmorillonite (MMT-IM) nanoplatelets were developed and examined for cure kinetics, viscoelastic behavior and thermal degradation kinetics. The structure and morphology of MMT-IM were characterized by FTIR, XRD, TEM, and TGA. Synthesized MMT-IM revealed synergistic effects on the network formation, the glass transition temperature (T_g) and thermal stability of epoxy. Cure and viscoelastic behaviors of epoxy nanocomposites containing 0.1 wt% MMT and MMT-IM were compared based on DSC and DMA, respectively. Activation energy profile as a function of the extent of cure was obtained. DMA results indicated a strong interface between imidazole groups of MMT-IM and epoxy, which caused a significant improvement in storage modulus and the T_g of epoxy. Network degradation kinetics of epoxy containing 0.5, 2.0, and 5.0 wt% MMT and MMT-IM were compared by using Friedman, Kissinger-Akahira-Sunose (KAS), Flynn-Wall-Ozawa (FWO) and the modified Coats-Redfern methods. Although addition of MMT to epoxy was detrimental to the T_g value, as featured by a fall from 94.1°C to 89.7°C detected by DMA method, and from 103.3°C to 97.9°C by DSC method, respectively. By contrast, meaningful increase in such values were observed in the same order from 94.1°C to 94.7°C and from 103.3°C to 104.7°C for super-crosslinked epoxy/MMT-IM systems.     

Synthesis of LC p-Biphenyl di{4-[2-(2,3-epoxypropyl)ethoxy] benzoate} and Curing Kinetics with Succinic Anhydride

A liquid crystalline (LC) diepoxide of p-biphenyl di{4-[2-(2,3-epoxypropyl)ethoxy] benzoate} (p-BPEPEB) was synthesized from allyl 2-hydroxyethyl ether, 4-hydroxy ethyl benzoate, 4,4-biphenol and m-chloroperoxybenzoic acid (MCPBA). Its structure was characterized by FTIR, ¹HNMR. The thermal properties and liquid crystalline behavior were investigated by using DSC, POM and XRD. The results show that the p-BPEPEB has a smectic liquid crystalline structure, and the melting point is 155°C. The curing kinetics of p-BPEPEB with succinic anhydride was investigated by nonisothermal DSC method. The results show that the cured system's initial temperature T_i is 90.8°C; peak temperature T_p is 128.4°C and finishing temperature T_f is 144.7°C. The apparent activation energy Ea is 213.69 KJ/mol, and with the increase of conversion rate the value reduces.     

Cure Kinetics and Thermal Properties of Octa(aminophenyl)-POSS/Bromobisphenol A Epoxy Resin Nanocomposites

The tetrabromobisphenol A epoxy resin (TBBPAER) was synthesized and Octa(aminophenyl) polyhedral oligomeric silsesquioxane (OAP-POSS) was used as a curing reagent of TBBPAER. The cure kinetics, the glass transition temperature, and the flame resistance of OAP-POSS/TBBPAER nanocomposites were investigated. The results show that the curing reaction could be described by the autocatalytic ?esták-Berggren (S-B) model. The average activation energy E _a is 129.59 KJ/mol, the maximal mechanical loss temperature (T _p) is 166°C, when the molar ratio (N _s) of amino group to epoxy group is 0.5. The oxygen index for fire resistance is 46 ～ 49 for different amounts of OAP-POSS.     

Studies on epoxy/calcium carbonate nanocomposites

The article describes the preparation of epoxy‐calcium carbonate nanocomposites using diaminodiphenyl sulfone (DDS) as a curing agent. The curing behavior of diglycidyl ether of bisphenol‐A (DGEBA) (1 mol) in the presence of varying amounts of nanocalcium carbonate was investigated by differential scanning calorimetry (DSC) using stoichiometric amounts of diaminodiphenyl sulphone (0.5 mol) as curing agent. The amount of calcium carbonate (～ 44 nm) was varied from 2% to 10% (w/w). In the DSC scans of these samples, a broad exothermic transition due to curing was observed in the temperature range of 110–335°C. As expected, heat of curing decreased with increasing amount of nanocalcium carbonate; however it did not affect the curing characteristics, thereby indicating that the filler did not hinder the curing reaction. Thermal stability of DGEBA in the presence of varying amounts of nano‐CaCO₃ after isothermal curing [(i.e., by heating in an air oven at 80°C (1 h), 100°C (1 h), 120°C (1.5 h), and 180°C (4 h)] was evaluated by thermogravimetry. All the samples were stable upto 350°C, and char yield at 800°C increased with increasing amount of nanocalcium carbonate. Rectangular bars were prepared by mixing DGEBA, DDS, and varying amounts of CaCO₃ using silicone mold. The nanocomposites were characterized by X‐ray, scanning electron microscopy (morphological characterization), and dynamic mechanical analysis. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

A study on the cure characteristics of epoxy/diaminodiphenylmethane system prepared at room temperature

The curing behavior and kinetics of epoxy resin with diaminodiphenylmethane (DDM) as the curing agent was studied by many researchers, however all of them prepared the system at a high‐temperature condition (i.e., T ≥ 80°C). In this study, a mixture of epoxy/DDM was prepared at ambient temperature and its curing characteristics were studied by using differential scanning calorimetry (DSC). The autocatalytic model was used to calculate the kinetic factors in the dynamic experiments. The kinetics of the curing reaction was also evaluated by two different isoconversional models; namely Friedman method and the Advanced Isoconversional method proposed by Vyazovkin to investigate the activation energy behavior during the curing reaction. The activation energy of the curing reaction was found to be in the range of 48 ± 2 kJ/mol and might be considered to be constant during the curing. In fact, our findings were different from the result reported by other researchers for the system which was prepared at elevated temperature. Therefore, it seems that the preparation temperature of the samples influenced considerably on the curing behavior of epoxy with DDM. Finally, a time–temperature–transformation (TTT) diagram was established to determine the cure process and glass transition properties of the system. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Cure Kinetics and Thermal Property of Bisphenol-S Epoxy Resin and Phthalic Anhydride

Abstract

The cure kinetics of bisphenol-S epoxy resin (BPSER) and curing agent phthalic anhydride, with N,N-dimethyl phenzylamine as an accelerator, were studied by means of differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure. The autocatalytic behavior was well described by the model proposed by Kamal including two rate constants, k1 and k2, and two reaction orders, m and n. The overall reaction order, m + n, is in the range 2～3. The activation energies for k1 and k2 were 111.69 and 80.47 KJ/mol, respectively. Diffusion control was incorporated to describe the cure in the latter stages. The glass transition temperatures (T_gS) of the BPSER/anhydride samples isothermally cured partially were determined by means of torsional braid analysis (TBA). and the results showed that the reaction rate increased with increasing T_g in terms of the rate constant, but decreased with increasing conversion. The T_g of completely cured BPSER/anhydride system is about 40 K higher than that of BPAER. The thermal degradation kinetics of this system was investigated by thermogravimetric analysis (TGA). It illustrated that the thermal degradation of the BPSER/phthalic anhydride has n-order reaction kinetics.     

环氧树脂／液晶固化剂固化反应动力学研究

通过差热分析（DSC）研究了非等温过程环氧树脂／液晶固化剂体系的固化反应动力学,研究了不同配比对固化反应的影响,固化反应转化率与固化温度的关系,计算了固化反应的活化能,确定了环氧树脂／液晶固化剂的固化工艺条件,用偏光显微镜观察了环氧树脂／液晶固化剂／4,4－二氨基二苯砜（DDS）体系在不同温度下固化时的形态。结果表明：液晶固化剂的加入量越大,固化反应速度越快;环氧树脂／液晶固化剂体系固化反应的活化能力为71.5kJ/mol,偏光显微镜观察表明：随着固化起始温度的增加,固化体系的形态由原来的具有各向异性的丝状结构变化为各向同性,液晶丝状条纹消失。     

Curing kinetics,thermal property,and stability of tetrabromo-bisphenol-A epoxy resin with 4,4′-diaminodiphenyl ether

The curing reaction of tetrabromo-bisphenol-A epoxy resin (TBBPAER) with 4,4′-diaminodiphenyl ether (DDE) was studied by isothermal differential scanning calorimetry (DSC) in the temperature range of 110–140°C. The results show that the isothermal cure reaction of TBBPAER–DDE in the kinetic control stage is autocatalytic in nature and does not follow simple nth-order kinetics. The autocatalytic behavior was well described by the Kamal equation. Kinetic parameters, including 2 rate constants, k₁ and k₂, and 2 reaction orders, m and n, were derived. The activation energies for these rate constants were 83.32 and 37.07 kJ/mol, respectively. The sum of the reaction orders is around 3. The glass transition temperatures (T_gs) were measured for the TBBPAER–DDE samples cured partially in isothermal temperature. With the degree of cure varies, different glass transition behaviors were observed. By monitoring the variation in these T_gs, it is illustrated that the network of the system is formed via different stages according to the sequence reactions of primary and second amines with epoxides. It is due to the presence of the 4 bromine atoms in the structure of TBBPAER that this curing process can be clearly observed in DSC curves. The thermal stability of this system studied by differential thermal analysis–thermogravimetric analysis illustrates that the TBBPAER–DDE material can automatically debrominate and takes the effect of flame retarding when the temperature reaches 238.5°C. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 70: 1991–2000, 1998     

Curing of epoxy systems at sub‐glass transition temperature

Three epoxy‐amine thermoset systems were cured at a low ambient temperature. Evolution of the reaction kinetics and molecular structure during cure at the sub‐glass transition temperature was followed by DSC and chemorheology experiments. The effect of vitrification and the reaction exotherm on curing and final mechanical properties of the epoxy thermosets was determined. Thermomechanical properties of the low‐temperature cured systems depend on the reaction kinetics and volume of the reaction mixture. Curing of the fast‐reacting system in a large volume (12‐mm thick layer) resulted in the material with T_g exceeding the cure temperature by 70–80°C because of an exothermal temperature rise. However, the reaction in a too large volume (50‐mm layer) led to thermal degradation of the network. In contrast, thin layers (1.5 mm) were severely undercured. Well‐cured epoxy thermosets could be prepared at sub‐T_g temperatures by optimizing reaction conditions. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3669–3676, 2006